Laser processing device

Abstract

The utility model provides a laser processing device. The laser processing device comprises a first laser mechanism, a second laser mechanism, an analysis mechanism, a focusing mechanism, a transflective element and a beam combining mechanism. The first laser mechanism is used for emitting first light beams. The second laser mechanism is used for emitting second light beams. The focusing mechanism comprises a plurality of identical or different lenses which are sequentially arranged. The transflective element is in butt joint with the focusing mechanism. The first light beam sequentially passes through the beam combining mechanism, the focusing mechanism and the transflective element and then is used for processing materials. The second light beam sequentially passes through the beam combining mechanism and the focusing mechanism and then is reflected by the transflective element to form a detection light beam, and the detection light beam is reflected back, sequentially passes through the focusing mechanism and the beam combining mechanism and then is emitted to the analysis mechanism; the analysis mechanism is used for detecting whether thermal deformation of any lens in the focusing mechanism exceeds the standard or not. According to the laser processing device provided by the embodiment of the invention, whether the thermal deformation of the lens in the laser working module exceeds the standard or not can be effectively determined, and the production quality of the production process can be improved.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, specifically to a laser processing device. Background Technology

[0002] With the advancement of production technology, high-power laser technology is being used more and more widely, especially in the processing fields of automobile manufacturing, lithium batteries, and shipbuilding. For example, high-power laser welding / cutting equipment is used to manufacture automotive parts. However, due to the high energy concentration of lasers, a large amount of heat is often generated during processing, which can easily cause thermal deformation of the lenses in high-power laser processing equipment. This can lead to optical path deviation, resulting in abnormalities in the quality of the workpiece and affecting production quality. Conventional detection methods cannot detect the degree of lens deformation throughout the entire high-power laser processing equipment in real time. Utility Model Content

[0003] In view of the above, it is necessary to provide a laser processing device that can detect in real time whether the thermal deformation of any lens in the focusing mechanism exceeds the standard.

[0004] A laser processing apparatus, comprising:

[0005] The first laser mechanism is used to emit the first laser beam;

[0006] A second laser mechanism is used to emit a second beam;

[0007] Analysis institutions;

[0008] A focusing mechanism, comprising multiple identical or different lenses arranged sequentially;

[0009] Transparent and reflective elements, docked to the focusing mechanism; and

[0010] The beam combining mechanism is respectively connected to the first laser mechanism, the second laser mechanism, the focusing mechanism, and the analysis mechanism;

[0011] The first beam passes sequentially through the beam combining mechanism, the focusing mechanism, and the reflective element before being used to process materials.

[0012] The second beam passes through the beam combining mechanism and the focusing mechanism in sequence and is reflected by the transflective element to form a detection beam. The detection beam is refracted and then passes through the focusing mechanism and the beam combining mechanism in sequence before being emitted to the analysis mechanism. The analysis mechanism is used to detect whether the thermal deformation of any of the lenses in the focusing mechanism exceeds the standard.

[0013] The laser processing apparatus provided in this application embodiment comprises a second laser mechanism, a beam combining mechanism, a focusing mechanism, a transmission-reflection element, and an analysis mechanism. The second laser mechanism emits a second beam, which passes sequentially through the beam combining mechanism and the focusing mechanism before being reflected by the transmission-reflection element to form a detection beam. The detection beam is then reflected back and passes sequentially through the focusing mechanism and the beam combining mechanism before exiting to the analysis mechanism. The analysis mechanism can effectively detect whether any lens in the focusing mechanism has thermal deformation exceeding the standard, enabling real-time monitoring of any lens in the focusing mechanism. This helps avoid quality abnormalities in the workpiece due to optical path abnormalities in the laser processing apparatus, thereby improving the production quality of the production process.

[0014] In one embodiment, the beam combining mechanism includes a first beam combining element and a second beam combining element;

[0015] The first beam combining element is connected to the second laser mechanism. The first beam combining element is used to receive the second beam emitted from the second laser mechanism and reflect the second beam to the second beam combining element.

[0016] The second beam combining element is respectively connected to the first laser mechanism, the first beam combining element and the focusing mechanism. The second beam combining element is used to receive the first beam and the second beam, and to reflect the first beam and transmit the second beam to the focusing mechanism.

[0017] In one embodiment, the first light combining element is a semi-reflective half-lens, which is used to reflect a portion of the second light beam and transmit a portion of the second light beam;

[0018] The second light combining element is a reflective lens; the second light combining element is used to reflect the first light beam and transmit the second light beam.

[0019] In one embodiment, the second laser mechanism includes a second light source, a first lens, and a second lens;

[0020] The second light source is used to emit the second beam of light;

[0021] The first lens is respectively connected to the second light source and the second lens. The second lens can move relative to the first lens along the optical path direction of the second beam; or the first lens can move relative to the second lens along the optical path direction of the second beam to adjust the divergence angle of the second beam transmitted through the second lens.

[0022] In one embodiment, the first lens and the second lens, together with the focusing mechanism, form a Kepler system to collimate and expand the second beam.

[0023] In one embodiment, the first lens is a biconvex lens, and the second lens is a crescent-shaped lens.

[0024] In one embodiment, the analysis mechanism includes a third lens and a fourth lens; the third lens is respectively connected to the beam combining mechanism and the fourth lens, the third lens is used to receive and transmit the detection beam emitted from the beam combining mechanism, and the fourth lens is used to receive and transmit the detection beam emitted from the third lens;

[0025] The third lens can be moved relative to the fourth lens along the optical path direction of the detection beam, or the fourth lens can be moved relative to the third lens along the optical path direction of the detection beam, so as to adjust the divergence angle of the detection beam transmitted through the fourth lens.

[0026] In one embodiment, the third lens and the fourth lens, together with the focusing mechanism, form a Kepler system to collimate and expand the detection beam emitted from the transflective element.

[0027] In one embodiment, the third lens is a crescent-shaped lens, and the fourth lens is a biconvex lens.

[0028] In one embodiment, the analysis mechanism further includes a dimming element, a detector, and a processor;

[0029] The dimming element is connected to the fourth lens, and the dimming element is used to receive and focus the detection beam emitted from the fourth lens;

[0030] The detector is connected to the dimming element, and the detector is used to acquire the focal point information of the detection beam emitted from the dimming element;

[0031] The processor is electrically connected to the detector and is used to compare the real-time acquired focal point information with preset standard focal point information to determine whether the thermal deformation of any lens in the focusing mechanism exceeds the standard. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the structure of the laser processing device in the embodiments of this application.

[0033] Figure 2 This is a schematic diagram of the optical path of the second laser mechanism in the embodiments of this application.

[0034] Figure 3 This is a schematic diagram of the optical path of the analysis mechanism in an embodiment of this application.

[0035] Figure 4 This is a schematic diagram of the standard focal point information and the second focal point information acquired by the detector in an embodiment of this application.

[0036] Figure 5 for Figure 4 A magnified view of the schematic diagram of the focal point information.

[0037] Figure 6 This is a schematic diagram of standard focus information in the embodiments of this application.

[0038] Figure 7 This is a schematic diagram showing the focal point information of the lens when it undergoes thermal deformation in an embodiment of this application.

[0039] Description of main component symbols

[0040] Laser processing equipment: 100

[0041] First laser mechanism: 1

[0042] First light source: 11

[0043] First beam: L1

[0044] Second laser mechanism: 2

[0045] Second light source: 21

[0046] Second beam: L2

[0047] Detection beam: L3

[0048] First lens: 23

[0049] Second lens: 25

[0050] Focusing on 3 institutions

[0051] Galvanometer module: 31

[0052] Lens: 33

[0053] Transparent and reflective elements: 4

[0054] Bundle-jointing mechanism: 5

[0055] First optical combining element: 51

[0056] Second optical combining element: 53

[0057] Analysis institutions: 6

[0058] Third lens: 61

[0059] Fourth lens: 63

[0060] Dimming element: 65

[0061] Detector: 67

[0062] Processor: 69

[0063] Standard focus information: P1

[0064] Focus information: P2

[0065] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0066] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0067] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application's specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0068] To further illustrate the technical means and effects adopted by this application in achieving its intended purpose, the following detailed description of this application is provided in conjunction with the accompanying drawings and preferred embodiments.

[0069] Please also refer to Figure 1 and Figure 2 The laser processing apparatus 100 of this application embodiment includes a first laser mechanism 1, a second laser mechanism 2, a focusing mechanism 3, a reflective element 4, a beam combining mechanism 5, and an analysis mechanism 6. The first laser mechanism 1 emits a first laser beam L1. The second laser mechanism 2 emits a second laser beam L2. The focusing mechanism 3 includes a plurality of identical or different lenses 33 arranged sequentially. The reflective element 4 is connected to the focusing mechanism 3. The beam combining mechanism 5 is connected to the first laser mechanism 1, the second laser mechanism 2, the focusing mechanism 3, and the analysis mechanism 6, respectively. The first laser beam L1 passes sequentially through the beam combining mechanism 5, the focusing mechanism 3, and the reflective element 4 before being used to process materials. The second laser beam L2 passes sequentially through the beam combining mechanism 5 and the focusing mechanism 3, is reflected by the reflective element 4 to form a detection beam L3, and the detection beam L3 is reflected back, passes sequentially through the focusing mechanism 3 and the beam combining mechanism 5, and then exits to the analysis mechanism 6. The analysis mechanism 6 is used to detect whether any lens 33 in the focusing mechanism 3 has thermal deformation exceeding a standard.

[0070] The first laser mechanism 1 includes a first light source 11, which emits a first beam L1. The first light source 11 can be any one of a gas laser, solid-state laser, semiconductor laser, liquid laser, chemical laser, and free-electron laser; this application is not limited to any of these. In this embodiment, the wavelength range of the first beam L1 is 800nm-1100nm; the wavelength of the first beam L1 can be any value within the range of 800nm-900nm, 900nm-1000nm, or 1000nm-1100nm. In other embodiments, the wavelength range of the first beam L1 can also be 600nm-800nm; this application is not limited to this either.

[0071] The second laser mechanism 2 includes a second light source 21, a first lens 23, and a second lens 25. The second light source 21 is used to emit a second beam L2. The second light source 21 can be any one of a gas laser, a solid-state laser, a semiconductor laser, a liquid laser, a chemical laser, and a free-electron laser, and this application is not limited thereto. Specifically, the wavelength range of the second beam L2 is 500nm-700nm, and more specifically, the wavelength of the second beam L2 can be any value within the range of 500nm-550nm, 550nm-600nm, 600nm-650nm, or 650nm-700nm. Compared with using blue laser with a wavelength range of 360nm-480nm, selecting the above wavelength range for the second beam L2 helps to avoid the phenomenon of reflected blue light and improves the stability of the laser processing device 100.

[0072] The first lens 23 is respectively connected to the second light source 21 and the second lens 25. The second lens 25 can move relative to the first lens 23 along the optical path direction of the second beam L2, or the first lens 23 can move relative to the second lens 25 along the optical path direction of the second beam L2, so as to adjust the divergence angle of the second beam L2 transmitted through the second lens 25. By adjusting the relative distance between the first lens 23 and the second lens 25 in the second laser mechanism 2, the divergence angle of the second beam L2 after passing through the second lens 25 can be changed, thereby adjusting the focal position formed by the second beam L2 after passing through the first lens 23 and the second lens 25 in sequence, so as to compensate for the assembly errors generated during the assembly of the second laser mechanism 2 and the first laser mechanism 1.

[0073] The first lens 23 is a biconvex lens. The second lens 25 is a crescent-shaped lens. Specifically, the second lens 25 is a negative meniscus lens. The first lens 23 and the second lens 25, together with the focusing mechanism 3, form a Kepler system to collimate and expand the second beam L2. Since the first lens 23 is a biconvex lens and the second lens 25 is a crescent-shaped lens, the first lens 23 and the second lens 25 constitute an aberration-reducing system, which helps to reduce the spherical aberration generated by the second beam L2 after collimation and expansion. That is, it helps to keep the divergence angle of the second beam L2 after collimation and expansion by the focusing mechanism 3 consistent with that of the first beam L1, thereby facilitating the subsequent detection of the detection beam L3 by the analysis mechanism 6.

[0074] The focusing mechanism 3 includes a galvanometer module 31 and a plurality of identical or different lenses 33 arranged sequentially. The galvanometer module 31 is used to receive the first beam L1 emitted from the beam combining mechanism 5 and reflect the first beam L1 to the lenses 33. In this embodiment, the focal lengths of the plurality of lenses 33 are different; in other embodiments, the focal lengths of the plurality of lenses 33 may be the same, and this application does not impose any limitation. The plurality of lenses 33 are used to focus the first beam L1 before it is emitted, for example, the lenses 33 are used to focus the first beam L1 emitted from the galvanometer module 31 to form a processing spot. The processing spot is the focal point of the first beam L1 after it has been focused by the plurality of lenses 33. The first beam L1 passes sequentially through the focusing mechanism 3 and the transmission and reflection element 4 before it is used to process materials. For example, it can be used to weld or cut the workpiece to be processed, and this application does not impose any limitation.

[0075] The transflective element 4 transmits the first beam L1 emitted from the focusing mechanism 3 and reflects the second beam L2 emitted from the focusing mechanism 3 to form the detection beam L3. The detection beam L3 emitted from the focusing mechanism 3 is reflected back and then passes through the focusing mechanism 3 and the beam combining mechanism 5 before exiting to the analysis mechanism 6. Specifically, the transflective element 4 is an optical element that transmits the first beam L1 and reflects the second beam L2. For example, the transflective element 4 can be an optical element with a film layer coated on one side that has high transmittance for the wavelength of the first beam L1 and high reflectivity for the wavelength of the second beam L2, or other optical elements that can transmit the first beam L1 and reflect the second beam L2. This application does not impose any limitations.

[0076] The beam combining mechanism 5 includes a first beam combining element 51 and a second beam combining element 53. The first beam combining element 51 is coupled to the second laser mechanism 2. The first beam combining element 51 is used to receive the second beam L2 emitted from the second laser mechanism 2 and reflect the second beam L2 to the second beam combining element 53. The first beam combining element 51 is a semi-reflective mirror 33, which is used to reflect part of the second beam L2 and transmit part of the second beam L2. Specifically, the first beam combining element 51 is a semi-reflective mirror 33 that reflects part of the second beam L2 (detection beam L3) and transmits part of the second beam L2 (detection beam L3). For example, the first beam combining element 51 can be a semi-reflective mirror 33 with 50% transmittance and 50% reflectance for the 532nm second beam L2 (detection beam L3).

[0077] The second beam combining element 53 is respectively connected to the first laser mechanism 1, the first beam combining element 51, and the focusing mechanism 3. The second beam combining element 53 is used to receive the first beam L1 and the second beam L2, and to reflect the first beam L1 and transmit the second beam L2 to the focusing mechanism 3. The second beam combining element 53 is a transmissive lens 33; the second beam combining element 53 is used to reflect the first beam L1 and transmit the second beam L2. For example, the second beam combining element 53 can be an optical element with a high transmittance film for the second beam L2 deposited on one side near the second laser mechanism 2 and a high reflectance film for the first beam L1 deposited on the other side, or other optical elements that can reflect the first beam L1 and transmit the second beam L2 (detection beam L3). This application does not impose any limitations.

[0078] Please also refer to Figure 1 , Figure 2 and Figure 3 The analysis mechanism 6 includes a third lens 61 and a fourth lens 63. The third lens 61 is respectively connected to the beam combining mechanism 5 and the fourth lens 63. The third lens 61 is used to receive and transmit the detection beam L3 emitted from the beam combining mechanism 5, and the fourth lens 63 is used to receive and transmit the detection beam L3 emitted from the third lens 61. The third lens 61 can move relative to the fourth lens 63 along the optical path direction of the detection beam L3, or the fourth lens 63 can move relative to the third lens 61 along the optical path direction of the detection beam L3, so as to adjust the divergence angle of the detection beam L3 transmitted through the fourth lens 63. By adjusting the relative distance between the third lens 61 and the fourth lens 63 in the analysis mechanism 6, the divergence angle of the detection beam L3 after passing through the fourth lens 63 can be changed, thereby adjusting the focal position formed by the detection beam L3 after passing through the third lens 61 and the fourth lens 63 in sequence, so as to compensate for the assembly error generated during the assembly of the analysis mechanism 6.

[0079] The third lens 61 and the fourth lens 63, together with the focusing mechanism 3, form a Kepler system to collimate and expand the detection beam L3 emitted from the transflective element 4. The third lens 61 is a crescent-shaped lens, and the fourth lens 63 is a biconvex lens. Specifically, the third lens 61 and the fourth lens 63 constitute an aberration-reducing system, which helps to reduce the spherical aberration generated by the detection beam L3 after collimation and expansion, thereby facilitating the subsequent detection of the detection beam L3 by the analysis mechanism 6.

[0080] The analysis unit 6 also includes a dimming element 65, a detector 67, and a processor 69. Specifically, the dimming element 65 is coupled to the fourth lens 63 and is used to receive and focus the detection beam L3 emitted from the fourth lens 63. In this embodiment, the dimming element 65 is a compound eye lens, which includes multiple compound eye units (not shown). Each compound eye unit is equivalent to an independent convex lens, and each compound eye unit can focus an incident detection beam L3 individually and converge the detection beam L3 to the detector 67, thereby forming focal point information P2 on the detector 67. In other embodiments, the dimming element 65 can also be other optical elements with individual converging function, which is not limited in this application.

[0081] Please also refer to Figure 1 , Figure 4 and Figure 5 Detector 67 is connected to dimming element 65. Detector 67 is used to acquire the focus point information P2 of the detection beam L3 emitted from dimming element 65. Detector 67 is disposed in the optical path of the detection beam L3 and located on the side of dimming element 65 away from beam combining mechanism 5. The focus point information P2 is used by processor 69 to determine whether any lens 33 in focusing mechanism 3 has thermally deformed beyond the standard. In this embodiment, detector 67 is a charge-coupled device (CCD). Detector 67 is used to convert the optical signal of the detection beam L3 transmitted by dimming element 65 into an electrical signal of the detection beam L3 with focus point information P2. In other embodiments, detector 67 can also be a complementary metal-oxide-semiconductor (CMOS). This application does not impose any limitations.

[0082] Please also refer to Figure 1 , Figure 6 and Figure 7The processor 69 is electrically connected to the detector 67 and is used to compare the real-time acquired focus information P2 with the preset standard focus information P1 to determine whether any lens 33 in the focusing mechanism 3 has thermally deformed beyond the standard. Specifically, when the second beam L2 works alone, the detector 67 is used to acquire the focus information P2 of the detection beam L3 emitted from the dimming element 65; the processor 69 stores the focus information P2 when the second beam L2 works alone and presets it as the standard focus information P1. When the first beam L1 and the second beam L2 work together, the detector 67 is used to acquire the focus information P2 of the detection beam L3, and the processor 69 is used to compare the real-time acquired focus information P2 with the standard focus information P1 to determine whether any lens 33 in the focusing mechanism 3 has thermally deformed beyond the standard. For example, if the real-time acquired focus information P2 has a large offset compared to the standard focus information P1, such as 5% of the focus points have shifted, it can be determined whether any lens 33 in the focusing mechanism 3 has thermally deformed beyond the standard. It should be noted that the "standard" is a value set by the user. The degree of deviation of the focus information P2 relative to the standard focus information P1 reflects the degree of deformation of any lens 33 in the focusing mechanism 3. The strictness of the "standard" setting is determined by the user. In other embodiments, the processor 69 can also determine whether 10% of the focus points have shifted. This application does not impose any restrictions.

[0083] The processor 69 can be any one of a central processing unit (CPU) or a microcontroller (e.g., an STM32 microcontroller, a 51 microcontroller, a TMS microcontroller, a PIC microcontroller, or an AVR microcontroller), and this application is not limited thereto. Specifically, the processor 69 can compare the obtained focus information P2 and the standard focus information P1 through image processing. In other embodiments, the obtained focus information P2 and the standard focus information P1 can also be compared manually.

[0084] The laser processing apparatus 100 provided in this application embodiment includes a second laser mechanism 2, a beam combining mechanism 5, a focusing mechanism 3, a reflective element 4, and an analysis mechanism 6. The second laser mechanism 2 emits a second beam L2, which passes through the beam combining mechanism 5 and the focusing mechanism 3 in sequence and is reflected by the reflective element 4 to form a detection beam L3. The detection beam L3 is then reflected back and passes through the focusing mechanism 3 and the beam combining mechanism 5 in sequence before exiting to the analysis mechanism 6. The analysis mechanism 6 can effectively detect whether any lens 33 in the focusing mechanism 3 has thermal deformation exceeding the standard. It can realize real-time monitoring of any lens 33 in the focusing mechanism 3, which helps to avoid quality abnormalities of the workpiece to be processed due to optical path abnormalities in the laser processing apparatus 100 and improves the production quality of the production process.

[0085] Those skilled in the art should recognize that the above embodiments are only used to illustrate this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of protection claimed in this application.

Claims

1. A laser processing apparatus, characterized in that, include: The first laser mechanism is used to emit the first laser beam; A second laser mechanism is used to emit a second beam; Analysis institutions; A focusing mechanism, comprising multiple identical or different lenses arranged sequentially; A reflective element is connected to the focusing mechanism; as well as The beam combining mechanism is respectively connected to the first laser mechanism, the second laser mechanism, the focusing mechanism, and the analysis mechanism; The first beam passes sequentially through the beam combining mechanism, the focusing mechanism, and the reflective element before being used to process materials. The second beam passes through the beam combining mechanism and the focusing mechanism in sequence and is reflected by the transflective element to form a detection beam. The detection beam is refracted and then passes through the focusing mechanism and the beam combining mechanism in sequence before being emitted to the analysis mechanism. The analysis mechanism is used to detect whether the thermal deformation of any of the lenses in the focusing mechanism exceeds the standard.

2. The laser processing apparatus as described in claim 1, characterized in that, The beam combining mechanism includes a first beam combining element and a second beam combining element; The first beam combining element is connected to the second laser mechanism. The first beam combining element is used to receive the second beam emitted from the second laser mechanism and reflect the second beam to the second beam combining element. The second beam combining element is respectively connected to the first laser mechanism, the first beam combining element and the focusing mechanism. The second beam combining element is used to receive the first beam and the second beam, and to reflect the first beam and transmit the second beam to the focusing mechanism.

3. The laser processing apparatus as described in claim 2, characterized in that, The first beam combining element is a semi-reflective half-lens, which is used to reflect part of the second beam and transmit part of the second beam; The second light combining element is a reflective lens; the second light combining element is used to reflect the first light beam and transmit the second light beam.

4. The laser processing apparatus as described in claim 1, characterized in that, The second laser mechanism includes a second light source, a first lens, and a second lens; The second light source is used to emit the second beam of light; The first lens is respectively connected to the second light source and the second lens. The second lens can move relative to the first lens along the optical path direction of the second beam; or the first lens can move relative to the second lens along the optical path direction of the second beam to adjust the divergence angle of the second beam transmitted through the second lens.

5. The laser processing apparatus as described in claim 4, characterized in that, The first lens and the second lens, together with the focusing mechanism, form a Kepler system to collimate and expand the second beam.

6. The laser processing apparatus as described in claim 5, characterized in that, The first lens is a biconvex lens, and the second lens is a crescent-shaped lens.

7. The laser processing apparatus as described in claim 1, characterized in that, The analysis mechanism includes a third lens and a fourth lens; the third lens is respectively connected to the beam combining mechanism and the fourth lens, the third lens is used to receive and transmit the detection beam emitted from the beam combining mechanism, and the fourth lens is used to receive and transmit the detection beam emitted from the third lens; The third lens can be moved relative to the fourth lens along the optical path direction of the detection beam, or the fourth lens can be moved relative to the third lens along the optical path direction of the detection beam, so as to adjust the divergence angle of the detection beam transmitted through the fourth lens.

8. The laser processing apparatus as described in claim 7, characterized in that, The third lens and the fourth lens, together with the focusing mechanism, form a Kepler system to collimate and expand the detection beam emitted from the transflective element.

9. The laser processing apparatus as described in claim 8, characterized in that, The third lens is a crescent-shaped lens, and the fourth lens is a biconvex lens.

10. The laser processing apparatus as described in claim 7, characterized in that, The analysis unit also includes a dimming element, a detector, and a processor; The dimming element is connected to the fourth lens, and the dimming element is used to receive and focus the detection beam emitted from the fourth lens; The detector is connected to the dimming element, and the detector is used to acquire the focal point information of the detection beam emitted from the dimming element; The processor is electrically connected to the detector and is used to compare the real-time acquired focal point information with preset standard focal point information to determine whether the thermal deformation of any lens in the focusing mechanism exceeds the standard.

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