Wafer processing jig

Abstract

The utility model discloses a wafer processing jig, which relates to the technical field of wafer processing jigs, and comprises a supporting seat, an adjusting mechanism is mounted on the surface of the supporting seat, the adjusting mechanism comprises a connecting plate and a mounting seat, the connecting plate is fixedly connected to the surface of the supporting seat, one side of the connecting plate is fixedly connected with a rack, and the other side of the connecting plate is fixedly connected with the mounting seat. And one side of the rack is in engaged connection with a gear, and the surface of the mounting base is fixedly connected with a clamping mechanism. According to the utility model, the motor is started, the motor drives the gear to rotate, and the gear performs meshing movement on the rack, so that the mounting seat on one side of the connecting block is driven to perform reciprocating movement, the mounting seat performs limiting movement on the sliding column through the limiting sleeve, and the mounting seat drives the clamping mechanism to move back and forth, thereby facilitating flexible processing of a wafer; and the processing efficiency of the wafer is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing fixture technology, and specifically to a wafer processing fixture. Background Technology

[0002] A wafer is a carrier used in the production of integrated circuits, primarily referring to single-crystal silicon wafers. Single-crystal silicon wafers are produced by drawing and refining ordinary silicon sand, followed by dissolution, purification, and distillation to create single-crystal silicon ingots. After polishing and slicing, these ingots become wafers. Wafers are the most commonly used semiconductor material, and are available in diameters of 4 inches, 5 inches, 6 inches, 8 inches, etc., with recent developments including 12-inch wafers and even larger sizes (14 inches, 15 inches, 16 inches, ... 20 inches and above). Larger wafers allow for the production of more ICs on a single wafer, reducing costs; however, this requires more advanced materials and manufacturing technologies. Furthermore, wafer processing necessitates the fixing and shaping of the wafer, thus requiring the invention of a wafer processing fixture.

[0003] CN 217740498 U discloses a wafer clamping and pre-alignment mechanism, including a base, a rotating module, and a pre-alignment module. The rotating module includes a fixed frame, a connecting plate, and a wafer adsorption mechanism. The pre-alignment module includes symmetrically distributed card holder mounting brackets and card holders. A fixed base is fixedly mounted on the base, and the fixed base has two sets of positioning sliders and guide rail cylinders. The positioning sliders are fixed to the lower extension of the card holder mounting bracket by bolts. One end of the connecting plate is fixed to the lower end face of the wafer adsorption mechanism, and the other end is fixed to the side of the fixed frame. The lower end of the wafer adsorption mechanism is a motor, and the upper end is equipped with a rotating disk. The upper end of the card holder mounting bracket is fixed with a card holder by bolts. The inner side of the card holder has an arc-shaped stepped groove for storing wafers. The arc-shaped stepped groove has mounting slots for placing protective blocks at both ends and in the middle. By cooperating with the rotating module and the pre-alignment module, the wafer is aligned automatically, which improves work efficiency.

[0004] To address the wafer processing issues in the aforementioned solutions, existing technologies employ a combination of a rotating module and a pre-alignment module to align the wafer, achieving automatic wafer centering and alignment. However, this approach still encounters situations where the wafer cannot be flexibly adjusted after being clamped and fixed, thus hindering flexible wafer processing. Utility Model Content

[0005] The purpose of this invention is to provide a wafer processing fixture to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0007] A wafer processing fixture includes a support base, and an adjustment mechanism is mounted on the surface of the support base;

[0008] The adjustment mechanism includes a connecting plate and a mounting base. The connecting plate is fixedly connected to the surface of the support base. A rack is fixedly connected to one side of the connecting plate, and a gear is meshed with one side of the rack. A clamping mechanism is fixedly connected to the surface of the mounting base.

[0009] A further improvement of this utility model is that: one end of the gear is driven and connected to a motor, and one end of the motor is fixedly connected to a connecting block, and the motor drives the gear to rotate.

[0010] A further improvement of the present invention is that: a mounting base is fixedly connected to one side of the connecting block, a limiting sleeve is fixedly connected to one end of the mounting base, a sliding column is slidably connected to the surface of the limiting sleeve, and the mounting base moves on the sliding column through the limiting sleeve.

[0011] A further improvement of the present invention is that the clamping mechanism includes a motor, the motor is fixedly connected to the surface of the mounting base, the output end of the motor is fixedly connected to a connecting sleeve, one end of the connecting sleeve is fixedly connected to a placement plate, the surface of the placement plate is provided with a slot, the support plate moves on the slot, thereby driving the clamping plate to adjust according to the size of the wafer.

[0012] A further improvement of this utility model is that: a movable frame is fixedly connected to the bottom of the placement tray, a movable groove is provided inside the movable frame, and a movable block is movably connected inside the movable groove. A rotating bolt drives the support plate and the movable block to move inside the movable groove.

[0013] A further improvement of the present invention is that: a support plate is fixedly connected to one end of the movable block, a rotating bolt is threadedly connected to the surface of the support plate, a rotating motor is driven to one end of the rotating bolt, the support plate is movably connected to the surface of the slot, and the support plate moves on the slot.

[0014] A further improvement of this utility model is that: a placement groove is provided on the surface of the support plate, an electric telescopic rod is fixedly connected inside the placement groove, a clamping plate is fixedly connected to one end of the electric telescopic rod, and a pressing block is fixedly connected to the bottom of the clamping plate. The pressing block is used to strengthen the clamping plate's clamping of the wafer. The motor drives the placement disk at one end of the connecting sleeve to rotate, which facilitates the processing of the wafer.

[0015] Due to the adoption of the above technical solution, the technological progress achieved by this utility model compared to the prior art is as follows:

[0016] 1. This utility model provides a wafer processing fixture. When the motor is started, the motor drives the gear to rotate. The gear meshes and moves on the rack, thereby driving the mounting seat on one side of the connecting block to move back and forth. The mounting seat is limited to move by a limiting sleeve on the sliding column. The mounting seat drives the clamping mechanism to move back and forth, thereby facilitating flexible processing of the wafer and improving the wafer processing efficiency.

[0017] 2. This utility model provides a wafer processing fixture. The wafer is placed on a placement tray, and a rotating motor is driven to rotate a rotating bolt. The rotating bolt causes a support plate and a moving block to move inside a moving slot. The support plate moves at the slot opening, thereby causing the clamping plate to adjust according to the size of the wafer. When the adjustment is to a suitable position, an electric telescopic rod is activated, which causes the clamping plate to descend and fix the wafer on the placement tray. A pressing block is used to reinforce the clamping plate's grip on the wafer. The motor drives the placement tray at one end of the connecting sleeve to rotate, facilitating wafer processing. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram of the adjustment mechanism of this utility model;

[0020] Figure 3 This is a schematic diagram of the clamping mechanism of this utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the electric telescopic pole of this utility model.

[0022] In the diagram: 1. Support base; 2. Adjustment mechanism; 20. Connecting plate; 21. Rack; 22. Gear; 23. Motor; 24. Connecting block; 25. Mounting base; 26. Limiting sleeve; 27. Sliding column; 3. Clamping mechanism; 30. Motor; 31. Connecting sleeve; 32. Placement plate; 33. Clamping plate; 34. Groove; 35. Pressing block; 36. Electric telescopic rod; 37. Support plate; 38. Placement groove; 39. Rotating bolt; 391. Rotating motor; 392. Moving block; 393. Moving frame; 394. Moving groove. Detailed Implementation

[0023] The present invention will be further described in detail below with reference to embodiments: Example

[0024] like Figure 1-4As shown, this utility model provides a wafer processing fixture, including a support base 1. An adjustment mechanism 2 is installed on the surface of the support base 1. The adjustment mechanism 2 includes a connecting plate 20 and a mounting base 25. The connecting plate 20 is fixedly connected to the surface of the support base 1. A rack 21 is fixedly connected to one side of the connecting plate 20. A gear 22 is meshed with one side of the rack 21. A clamping mechanism 3 is fixedly connected to the surface of the mounting base 25. A motor 23 is driven to one end of the gear 22. A connecting block 24 is fixedly connected to one end of the motor 23. The mounting base 25 is fixedly connected to one side of the connecting block 24. A limit sleeve 26 is fixedly connected to one end of the mounting base 25. A sliding column 27 is slidably connected to the surface of the limit sleeve 26.

[0025] Specifically, the motor 23 is started, which drives the gear 22 to rotate. The gear 22 meshes and moves on the rack 21, thereby driving the mounting seat 25 on one side of the connecting block 24 to reciprocate. The mounting seat 25 is limited to move on the sliding column 27 by the limiting sleeve 26. The mounting seat 25 drives the clamping mechanism 3 to move back and forth, thereby facilitating flexible processing of the wafer. Example

[0026] like Figure 1-4 As shown, based on Embodiment 1, this utility model provides a technical solution: Preferably, the clamping mechanism 3 includes a motor 30, the motor 30 is fixedly connected to the surface of the mounting base 25, the output end of the motor 30 is fixedly connected to a connecting sleeve 31, one end of the connecting sleeve 31 is fixedly connected to a placement plate 32, the surface of the placement plate 32 is provided with a slot 34, the bottom of the placement plate 32 is fixedly connected to a moving frame 393, the inside of the moving frame 393 is provided with a moving groove 394, the inside of the moving groove 394 is movably connected to a moving block 392, one end of the moving block 392 is fixedly connected to a support plate 37, the surface of the support plate 37 is threadedly connected to a rotating bolt 39, one end of the rotating bolt 39 is driven to be connected to a rotating motor 391, the support plate 37 is movably connected to the surface of the slot 34, the surface of the support plate 37 is provided with a placement groove 38, the inside of the placement groove 38 is fixedly connected to an electric telescopic rod 36, one end of the electric telescopic rod 36 is fixedly connected to a clamping plate 33, the bottom of the clamping plate 33 is fixedly connected to a pressing block 35;

[0027] Specifically, the wafer is placed on the placement tray 32, and the rotating motor 391 is driven. The rotating motor 391 drives the rotating bolt 39 to rotate, and the rotating bolt 39 drives the support plate 37 and the moving block 392 to move inside the moving slot 394. The support plate 37 moves on the slot 34, thereby driving the clamping plate 33 to adjust according to the size of the wafer. When it is adjusted to a suitable position, the electric telescopic rod 36 is activated. The electric telescopic rod 36 drives the clamping plate 33 to descend and fix the wafer on the placement tray 32. The pressing block 35 is used to reinforce the clamping plate 33 to hold the wafer. The motor 30 drives the placement tray 32 at one end of the connecting sleeve 31 to rotate, which facilitates the processing of the wafer.

[0028] The working principle of this wafer processing fixture will be explained in detail below.

[0029] like Figure 1-4 As shown, the motor 23 is started, which drives the gear 22 to rotate. The gear 22 meshes and moves on the rack 21, thereby driving the mounting seat 25 on one side of the connecting block 24 to reciprocate. The mounting seat 25 is limited to move on the sliding column 27 by the limiting sleeve 26. The mounting seat 25 drives the clamping mechanism 3 to move back and forth, thereby facilitating flexible processing of the wafer. The wafer is placed on the placement tray 32, and the rotating motor 391 is driven. The rotating motor 391 drives the rotating bolt 39 to rotate, and the rotating bolt 39 drives the support plate. The support plate 37 and the moving block 392 move inside the moving slot 394, and the support plate 37 moves on the slot 34, thereby driving the clamping plate 33 to adjust according to the size of the wafer. When it is adjusted to a suitable position, the electric telescopic rod 36 is activated. The electric telescopic rod 36 drives the clamping plate 33 to descend and fix the wafer on the placement plate 32. The pressing block 35 is used to reinforce the clamping plate 33 to clamp the wafer. The motor 30 drives the placement plate 32 at one end of the connecting sleeve 31 to rotate, which facilitates the processing of the wafer.

[0030] The present invention has been described in detail above. However, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, any modifications or improvements that do not depart from the spirit of the present invention are within the protection scope of the present invention.

Claims

1. A wafer processing fixture, comprising a support base (1), characterized in that: An adjustment mechanism (2) is installed on the surface of the support base (1); The adjustment mechanism (2) includes a connecting plate (20) and a mounting base (25). The connecting plate (20) is fixedly connected to the surface of the support base (1). A rack (21) is fixedly connected to one side of the connecting plate (20). A gear (22) is meshed with one side of the rack (21). A clamping mechanism (3) is fixedly connected to the surface of the mounting base (25).

2. The wafer processing fixture according to claim 1, characterized in that: One end of the gear (22) is driven by a motor (23), and one end of the motor (23) is fixedly connected to a connecting block (24).

3. A wafer processing fixture according to claim 2, characterized in that: A mounting base (25) is fixedly connected to one side of the connecting block (24), and a limiting sleeve (26) is fixedly connected to one end of the mounting base (25). A sliding column (27) is slidably connected to the surface of the limiting sleeve (26).

4. A wafer processing fixture according to claim 1, characterized in that: The clamping mechanism (3) includes a motor (30), which is fixedly connected to the surface of the mounting base (25). The output end of the motor (30) is fixedly connected to a connecting sleeve (31), and one end of the connecting sleeve (31) is fixedly connected to a placement plate (32). The surface of the placement plate (32) is provided with a slot (34).

5. A wafer processing fixture according to claim 4, characterized in that: The bottom of the placement tray (32) is fixedly connected to a movable frame (393), and a movable slot (394) is provided inside the movable frame (393). A movable block (392) is movably connected inside the movable slot (394).

6. A wafer processing fixture according to claim 5, characterized in that: One end of the movable block (392) is fixedly connected to a support plate (37), and a rotating bolt (39) is threadedly connected to the surface of the support plate (37). One end of the rotating bolt (39) is driven to be connected to a rotating motor (391), and the support plate (37) is movably connected to the surface of the slot (34).

7. A wafer processing fixture according to claim 6, characterized in that: The surface of the support plate (37) is provided with a placement groove (38), and an electric telescopic rod (36) is fixedly connected inside the placement groove (38). One end of the electric telescopic rod (36) is fixedly connected to a clamping plate (33), and the bottom of the clamping plate (33) is fixedly connected to a pressing block (35).

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