Scrap removing mechanism for die cutting device

Abstract

The utility model discloses a chip removal mechanism for a die cutting device, relates to the technical field of chip removal mechanisms for die cutting of adhesive tapes of new energy automobiles, and aims to solve the problems that a back adhesive die cutting device in the prior art is lack of a chip removal device, but the adhesive tapes are adhered to the die cutting device due to the adhesion of the adhesive tapes during die cutting, so that the die cutting efficiency is high. Therefore, the die cutting quality is influenced. Supporting plates are arranged on the two sides of the upper edge of the die cutting table correspondingly, a die cutting plate is arranged between the supporting plates, air cylinders are arranged on the tops of the supporting plates, and a first moving groove is formed in the die cutting plate. The scrap removing mechanism is arranged in the first moving groove, the scrap removing mechanism is slidably connected with the interior of the first moving groove, and scraper knives are arranged at the bottoms of the end faces of the two sides of the scrap removing mechanism; and the mounting frames are arranged on the front end face and the rear end face of the die cutting table, motors are arranged on the end faces of one sides of the mounting frames, and placing rods are arranged in the mounting frames.

Description

Technical Field

[0001] This utility model relates to the technical field of chip removal mechanisms for tape die-cutting in new energy vehicles, specifically a chip removal mechanism for a die-cutting device. Background Technology

[0002] The tape used in new energy vehicles consists of two parts: a substrate and an adhesive. It connects two or more unconnected objects together by bonding. The surface of the tape is coated with an adhesive. The earliest adhesives came from animals and plants. In the 19th century, rubber was the main component of adhesives, while in modern times, various polymers are widely used. During the production process, it needs to be die-cut to form the required shape.

[0003] For example, the Chinese authorized patent with announcement number CN116890358A (A large-size new energy vehicle battery back adhesive die-cutting device and its die-cutting process) includes a box body. Support rods are provided at both ends of the bottom of the inner wall of the box body. A base plate is provided between the two support rods. Several filter holes are opened on the surface of the base plate. An electric telescopic rod is provided on the outer wall of each of the two support rods. A hydraulic cylinder is provided at the telescopic end of the electric telescopic rod. A connecting rod is provided at one end of the hydraulic cylinder. The connecting rod has an L-shaped structure and a clamping mechanism at its bottom end. An operating box is provided on the top of the inner wall of the box body. This automated device replaces heavy, monotonous, and repetitive manual operations, significantly improving production efficiency, saving time and labor costs, and enabling large-scale, high-efficiency production. It helps improve the company's production capacity, reduce production costs, and improve product quality and reliability, thereby enhancing the company's market competitiveness and meeting customers' demands for high-quality, high-efficiency assembly.

[0004] However, the existing adhesive die-cutting devices lack chip removal devices. When die-cutting tape, the tape itself adheres to the die-cutting device due to its adhesiveness, which affects the die-cutting quality. Therefore, it does not meet the current requirements. To address this, we propose a chip removal mechanism for die-cutting devices. Utility Model Content

[0005] The purpose of this utility model is to provide a chip removal mechanism for a die-cutting device, so as to solve the problem mentioned in the background art that the prior art adhesive die-cutting device lacks a chip removal device, but when die-cutting tape, the tape itself will stick to the die-cutting device due to its own adhesiveness, thus affecting the die-cutting quality.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a chip removal mechanism for a die-cutting device, comprising a die-cutting table and a mold base, wherein support plates are provided on both sides of the die-cutting table, a die-cutting plate is provided between the support plates, a cylinder is provided on the top of the support plates, and a first moving groove is provided inside the die-cutting plate;

[0007] Also includes:

[0008] A chip removal mechanism is disposed inside the first movable groove and is slidably connected to the inside of the first movable groove. A scraper is provided at the bottom of both end faces of the chip removal mechanism.

[0009] The mounting bracket is located on the front and rear end faces of the die-cutting table. A motor is provided on one end face of the mounting bracket, a placement rod is provided inside the mounting bracket, and a fixing seat is provided on the other end face of the mounting bracket.

[0010] Preferably, the top of both end faces of the chip removal mechanism is provided with a connecting seat, and the inside of the chip removal mechanism is provided with a through groove.

[0011] Preferably, the upper surface of the mold base is provided with a mounting base.

[0012] Preferably, the mounting base has fixing plates on both sides inside.

[0013] Preferably, a limit post is provided on one end face of the fixing plate.

[0014] Preferably, a second movable groove is provided on one end face of the support plate, and the die-cutting plate is slidably connected to the inside of the second movable groove.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] This invention features a chip removal mechanism installed inside the first moving groove of the die-cutting plate. The chip removal mechanism has scrapers on both sides of its bottom, and is fixedly connected to a connecting seat via a telescopic rod. The extension and retraction of the telescopic rod causes the chip removal mechanism to move laterally within the first moving groove, allowing the scrapers to remove waste chips generated at the bottom of the die-cutting plate, preventing tape accumulation. Simultaneously, mounting brackets are installed on the front and rear ends of the die-cutting table to facilitate the winding of waste materials generated after die-cutting, thereby improving waste removal efficiency. This invention solves the problem in existing adhesive die-cutting devices that lack chip removal devices, where the tape's adhesiveness causes it to adhere to the die-cutting device, affecting die-cutting quality.

[0017] By setting a mold base on the die-cutting table, and setting fixing plates on the inner walls of the mounting base on both sides of the mold base, the die-cutting mold is fixed. At the same time, the limiting post on one end face of the fixing plate can strengthen the limiting effect on the mold and prevent displacement. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the chip removal mechanism for the die-cutting device of this utility model;

[0019] Figure 2This is an enlarged schematic diagram of a portion of the chip removal mechanism of this utility model;

[0020] Figure 3 This is an enlarged schematic diagram of the mold base structure of this utility model;

[0021] Figure 4 This is an enlarged schematic diagram of the chip removal mechanism at point A in the die-cutting device of this utility model;

[0022] In the diagram: 1. Die-cutting table; 2. Support plate; 3. Die-cutting plate; 4. Cylinder; 5. First moving groove; 6. Chip removal mechanism; 7. Second moving groove; 8. Mold base; 9. Mounting bracket; 10. Motor; 11. Placement rod; 12. Connecting seat; 13. Through groove; 14. Scraper; 15. Mounting seat; 16. Fixing plate; 17. Limiting post; 18. Fixing seat. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0024] See also Figure 1-4 An embodiment of this utility model provides a chip removal mechanism for a die-cutting device, including a die-cutting table 1 and a mold base 8. Support plates 2 are provided on both sides of the die-cutting table 1, and a die-cutting plate 3 is provided between the support plates 2. A cylinder 4 is provided on the top of the support plates 2, and a first moving groove 5 is provided inside the die-cutting plate 3.

[0025] Also includes:

[0026] The chip removal mechanism 6 is located inside the first moving groove 5 and is slidably connected to the inside of the first moving groove 5. A scraper 14 is provided at the bottom of both ends of the chip removal mechanism 6.

[0027] Mounting bracket 9 is located on the front and rear ends of the die-cutting table 1. A motor 10 is mounted on one side of mounting bracket 9, and a placement rod 11 is located inside. A fixing seat 18 is located on the other side of mounting bracket 9. During use, a chip removal mechanism 6 is installed inside the first moving groove 5 of the die-cutting plate 3. Scrapers 14 are mounted on both sides of the bottom of the chip removal mechanism 6, which is fixedly connected to the connecting seat 12 via a telescopic rod. The extension and retraction of the telescopic rod causes the chip removal mechanism 6 to move laterally within the first moving groove 5, thereby allowing the scrapers 14 to remove the waste chips generated at the bottom of the die-cutting plate 3, preventing tape accumulation on the die-cutting plate 3. Mounting brackets 9 are provided on both the front and rear ends of the die-cutting table 1 to facilitate the winding of waste generated after die-cutting, thereby improving the efficiency of waste removal. This solves the problem that existing adhesive die-cutting devices lack chip removal devices, and the adhesive tape itself adheres to the die-cutting device when die-cutting tape, thus affecting the die-cutting quality. Furthermore, a mold base 8 is provided on the die-cutting table 1, and fixing plates 16 are provided on the inner walls of the mounting base 15 inside the mold base 8 to fix the die-cutting mold. At the same time, the limiting post 17 on one end face of the fixing plate 16 can strengthen the limiting effect on the mold and prevent displacement.

[0028] Please see Figures 1-4 The chip removal mechanism 6 has connecting seats 12 on the top of both end faces. The chip removal mechanism 6 has through grooves 13 inside. The chip removal mechanism 6 has scrapers 14 on both end faces of the bottom. The scrapers are fixedly connected to the connecting seats 12 by telescopic rods. The extension and retraction of the telescopic rods causes the chip removal mechanism 6 to move laterally inside the first moving groove 5, so that the scrapers 14 can remove the waste generated at the bottom of the die-cutting plate 3, preventing the tape from accumulating on the die-cutting plate 3. At the same time, the front and rear end faces of the die-cutting table 1 are equipped with mounting brackets 9 to facilitate the winding of waste generated after die-cutting, thereby improving the waste removal efficiency. This solves the problem that the existing adhesive die-cutting device lacks a chip removal device, but the tape itself sticks to the die-cutting device when die-cutting tape, thus affecting the die-cutting quality.

[0029] Please see Figures 1-4 The upper surface of the mold base 8 is provided with a mounting base 15.

[0030] Please see Figures 1-4 The mounting base 15 has fixing plates 16 on both sides inside. The fixing plates 16 are used to fix the die-cutting mold. At the same time, the limiting post 17 on one end face of the fixing plate 16 can strengthen the limiting effect on the mold and prevent displacement.

[0031] Please see Figures 1-4 A limit post 17 is provided on one end face of the fixing plate 16.

[0032] Please see Figures 1-4The support plate 2 has a second moving groove 7 on one side end face, and the die-cutting plate 3 is slidably connected to the second moving groove 7.

[0033] Working principle: During use, a chip removal mechanism 6 is installed inside the first moving groove 5 of the die-cutting plate 3. Scrapers 14 are installed on both sides of the bottom of the chip removal mechanism 6, which is fixedly connected to the connecting seat 12 via a telescopic rod. The extension and retraction of the telescopic rod causes the chip removal mechanism 6 to move laterally inside the first moving groove 5, thereby allowing the scrapers 14 to remove the waste generated at the bottom of the die-cutting plate 3, preventing tape from accumulating on the die-cutting plate 3. Simultaneously, mounting brackets 9 are installed on the front and rear ends of the die-cutting table 1 to facilitate the winding of waste material generated after die-cutting. This improvement in operation enhances waste removal efficiency and solves the problem of existing adhesive die-cutting devices lacking chip removal mechanisms, which cause the tape to adhere to the die-cutting device due to its own adhesiveness, thus affecting the die-cutting quality. Furthermore, by setting a mold base 8 on the die-cutting table 1, and setting fixing plates 16 on the inner walls of the mounting base 15 inside the mold base 8, the die-cutting mold is fixed. At the same time, the limiting post 17 on one end face of the fixing plate 16 can strengthen the limiting effect on the mold and prevent displacement.

[0034] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A chip removal mechanism for a die-cutting device, comprising a die-cutting table (1) and a mold base (8), wherein support plates (2) are provided on both sides of the upper surface of the die-cutting table (1), a die-cutting plate (3) is provided between the support plates (2), a cylinder (4) is provided on the top of the support plates (2), and a first moving groove (5) is provided inside the die-cutting plate (3). Its features are: Also includes: The chip removal mechanism (6) is located inside the first moving groove (5) and is slidably connected to the inside of the first moving groove (5). The bottom of both ends of the chip removal mechanism (6) is provided with a scraper (14). Mounting bracket (9) is provided on the front and rear end faces of the die-cutting table (1). A motor (10) is provided on one side end face of the mounting bracket (9). A placement rod (11) is provided inside the mounting bracket (9). A fixing seat (18) is provided on the other side end face of the mounting bracket (9).

2. The chip removal mechanism for a die-cutting device according to claim 1, characterized in that: The chip removal mechanism (6) has a connecting seat (12) on the top of both end faces, and a through groove (13) is provided inside the chip removal mechanism (6).

3. The chip removal mechanism for a die-cutting device according to claim 1, characterized in that: The upper surface of the mold base (8) is provided with a mounting base (15).

4. A chip removal mechanism for a die-cutting device according to claim 3, characterized in that: Fixing plates (16) are provided on both sides inside the mounting base (15).

5. A chip removal mechanism for a die-cutting device according to claim 4, characterized in that: A limit post (17) is provided on one end face of the fixing plate (16).

6. A chip removal mechanism for a die-cutting device according to claim 1, characterized in that: The support plate (2) has a second moving groove (7) on one side end face, and the die-cutting plate (3) is slidably connected to the second moving groove (7).

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