Silicon wafer new material cutting device

Abstract

The utility model discloses a new silicon wafer material cutting device which comprises a machining table, a material containing groove is formed in the top of the machining table, a supporting strip is fixedly connected to the center of the bottom of the material containing groove, filter screens are fixedly connected to the two sides of the supporting strip respectively, and a set of clamping structures is installed on the two sides of the inner wall of the material containing groove respectively. An embedding groove is formed in the left side of the top of the machining table and corresponds to the material placing groove, a set of limiting clamping rods are fixedly connected to the positions, located on the two sides of the embedding groove, of the outer side of the machining table correspondingly, a material collecting box is clamped in the embedding groove, and a material pushing mechanism is installed in the material placing groove; compared with an existing cutting device, the silicon wafer cutting device has the advantages that the stability of silicon wafer materials in the cutting process can be improved through the design, the cut silicon wafer materials can be conveniently collected, and the overall practicability is enhanced.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer new material processing technology, specifically a silicon wafer new material cutting device. Background Technology

[0002] On a silicon wafer the size of a grain of rice, 160,000 transistors can be integrated, marking another milestone in scientific and technological progress. Silicon, which accounts for 25.8% of the Earth's crust, provides an inexhaustible source for the production of monocrystalline silicon. As silicon is one of the most abundant elements in the Earth's crust, its abundance is one of the reasons why silicon has become the main material for photovoltaics, especially for products like solar cells that are destined to enter the mass market.

[0003] Among them, a Chinese patent for a silicon wafer cutting device (publication number: CN218398902U) includes a connecting plate, a worktable, and a base plate. A motor A, which drives a rotating shaft A, is bolted to one side of the connecting plate. The power output end of the rotating shaft A is connected to the power input end of a lead screw. A threaded sleeve that drives a support rod is threaded to the outside of the lead screw. A fixing frame is welded below the support rod. An electric push rod that drives a sliding sleeve to slide on the outside of the sliding rod is bolted to the inside of the fixing frame. A support plate that fixes a motor B is welded to the outside of the sliding sleeve. The power output end of motor B is connected to the power input end of the rotating shaft B. This device facilitates cutting silicon wafers at different positions, improving work efficiency. However, the lack of a limiting mechanism during the cutting process causes the silicon wafer to shift position during cutting, affecting the cutting effect.

[0004] Therefore, it is particularly important to design a new silicon wafer cutting device to solve the above-mentioned defects. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention designs a new silicon wafer material cutting device. This cutting device aims to solve the technical problem that the silicon wafer material lacks a limiting mechanism during the cutting process, which leads to the position of the silicon wafer material shifting during cutting.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A new silicon wafer material cutting device includes a processing table. A material placement groove is formed on the top of the processing table. A support bar is fixedly connected to the center of the bottom of the material placement groove. Filter screens are fixedly connected to both sides of the support bar. A set of clamping structures is installed on both sides of the inner wall of the material placement groove. An embedding groove is formed on the top left side of the processing table, corresponding to the material placement groove. A set of limiting rods is fixedly connected to both sides of the embedding groove on the outer side of the processing table. A material collection box is clamped inside the embedding groove. A pushing mechanism is installed inside the material placement groove. A screw adjusting frame is fixedly connected to the top of the processing table, away from the embedding groove. A horizontal adjusting frame is slidably connected inside the screw adjusting frame above the material placement groove. A cutting machine is slidably connected to the bottom of the horizontal adjusting frame.

[0008] As a preferred embodiment of this utility model, the clamping structure consists of a telescopic rod, a return spring, and a clamping plate. Two pairs of telescopic rods are fixedly connected to both sides of the inner wall of the material placement groove, and a clamping plate is fixedly connected to one side of each telescopic rod on both sides. A return spring is sleeved on the outer side of the telescopic rod.

[0009] As a preferred embodiment of this utility model, the pushing mechanism consists of an electric push rod and a push plate. An electric push rod is installed on the back of the processing table at a position corresponding to the embedding groove, and a push plate is fixedly connected to one end of the electric push rod inside the material placement groove.

[0010] As a preferred embodiment of this utility model, the bottom of the processing table is slidably connected to a recycling drawer below the material placement trough.

[0011] As a preferred embodiment of this utility model, a set of limiting hooks is fixedly connected to both sides of the material collection box and to the corresponding positions of the limiting rods. The limiting hooks are engaged with the limiting rods. A set of sliding grooves is provided on three sides of the inner wall of the material collection box. A guide slide rod is fixedly connected inside the sliding grooves. A limiting plate is slidably connected inside the material collection box. A set of sliding holes is provided at the corresponding positions of the limiting plate and the guide slide rod. The limiting plate is slidably connected to the guide slide rod through the sliding holes. A pull rod is fixedly connected to the top of the limiting plate.

[0012] As a preferred embodiment of this utility model, an adjusting screw is rotatably connected inside the screw adjusting frame, and a motor is installed at the top of the adjusting screw at the top of the screw adjusting frame. A guide slide rod is fixedly connected inside the screw adjusting frame to one side of the adjusting screw.

[0013] As a preferred embodiment of this utility model, a threaded adjustment hole is provided at a position corresponding to the adjustment screw, and the horizontal adjustment frame is threadedly connected to the adjustment screw through the threaded adjustment hole. A sliding hole is provided at a position corresponding to the guide slide rod, and the horizontal adjustment frame is slidably connected to the guide slide rod through the sliding hole. The adjustment screw is rotatably connected to the top left side of the horizontal adjustment frame, and a motor is installed at one end of the adjustment screw on the outside of the horizontal adjustment frame. A guide slide rod is fixedly connected to the top right side of the horizontal adjustment frame.

[0014] As a preferred embodiment of this utility model, a threaded adjustment hole 2 is provided on the top of the cutting machine at a position corresponding to the adjustment screw 2, and the cutting machine is threadedly connected to the adjustment screw 2 through the threaded adjustment hole 2. A sliding hole 3 is provided on the top of the cutting machine at a position corresponding to the guide slide rod 3, and the cutting machine is slidably connected to the guide slide rod 3 through the sliding hole 3.

[0015] Compared with the prior art, the beneficial effects of this utility model are:

[0016] First, the return spring uses its own elasticity to drive the telescopic rod to push the clamping plate to clamp and fix the silicon wafer material placed on the support bar, so as to facilitate the positioning of silicon wafer materials of different sizes, avoid the silicon wafer material from shifting in position during the cutting process, and improve cutting efficiency;

[0017] Secondly, the electric push rod pushes the silicon wafer material to move during the cutting process through the push plate, and pushes the cut silicon wafer into the collection box for collection. The limiting plate slides and moves inside the collection box according to the amount of silicon wafer collected, so as to prevent the silicon wafer from falling into the collection box and affecting the collection efficiency.

[0018] Finally, motor one drives adjusting screw one to rotate, so that the horizontal adjustment frame is threadedly connected to adjusting screw one through threaded adjusting hole one, thereby driving the cutting machine to adjust its height. Motor two drives adjusting screw two to rotate, so that the cutting machine is threadedly connected to adjusting screw two through threaded adjusting hole two, thereby facilitating the free adjustment of the cutting thickness of the silicon wafer. Attached Figure Description

[0019] Figure 1 A schematic diagram of the overall three-dimensional structure of the silicon wafer new material cutting device;

[0020] Figure 2 This is a schematic diagram of the machining table structure;

[0021] Figure 3 This is a schematic diagram of the material collection box structure;

[0022] Figure 4 This is a schematic diagram of the horizontal adjustment frame structure;

[0023] Figure 5 This is a schematic diagram of the limiting plate structure;

[0024] Figure 6 This is a schematic diagram of the cutting machine structure.

[0025] In the diagram: 1. Processing table; 101. Material trough; 1011. Support bar; 1012. Filter screen; 102. Clamping structure; 1021. Telescopic rod; 1022. Return spring; 1023. Clamping plate; 103. Embedded groove; 1031. Limiting rod; 104. Pushing mechanism; 1041. Electric push rod; 1042. Push plate; 105. Recycling drawer; 2. Collection box; 201. Limiting hook; 202. Slide groove; 2021. 1. Guide slide rod 1; 203. Limiting plate; 2031. Slide hole 1; 2032. Pull rod; 3. Screw adjustment bracket; 301. Adjusting screw 1; 3011. Motor 1; 302. Guide slide rod 2; 4. Horizontal adjustment bracket; 401. Threaded adjustment hole 1; 402. Slide hole 2; 403. Adjusting screw 2; 4031. Motor 2; 404. Guide slide rod 3; 5. Cutting machine; 501. Threaded adjustment hole 2; 502. Slide hole 3. Detailed Implementation

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0027] Example:

[0028] This utility model provides a new silicon wafer material cutting device, which aims to solve the technical problem that the silicon wafer material lacks a limiting mechanism during the cutting process, resulting in the silicon wafer material shifting during cutting.

[0029] Please see Figures 1-6 This utility model provides a technical solution:

[0030] A new silicon wafer cutting device includes a processing table 1. A material placement groove 101 is formed on the top of the processing table 1. A support bar 1011 is fixedly connected to the center of the bottom of the material placement groove 101. Filter screens 1012 are fixedly connected to both sides of the support bar 1011. A set of clamping structures 102 is installed on both sides of the inner wall of the material placement groove 101. The clamping structure 102 consists of a telescopic rod 1021, a return spring 1022, and a clamping plate 1023. Two... For the telescopic rod 1021, a clamping plate 1023 is fixedly connected to one side of each side of the telescopic rod 1021. A return spring 1022 is sleeved on the outside of the telescopic rod 1021. The return spring 1022 drives the telescopic rod 1021 to push the clamping plate 1023 to clamp and fix the silicon wafer material placed on the support bar 1011 through its own elasticity. This is to facilitate the positioning of silicon wafer materials of different sizes, avoid the silicon wafer material from shifting in position during the cutting process, and improve the cutting efficiency.

[0031] Among them, see Figure 1 and Figure 2 An embedding groove 103 is provided on the top left side of the processing table 1, corresponding to the material placement groove 101. A set of limiting rods 1031 are fixedly connected to both sides of the embedding groove 103 on the outer side of the processing table 1. A pushing mechanism 104 is installed inside the material placement groove 101. The pushing mechanism 104 consists of an electric push rod 1041 and a push plate 1042. An electric push rod 1041 is installed on the back of the processing table 1, corresponding to the embedding groove 103. A push plate 1042 is fixedly connected to one end of the electric push rod 1041 inside the material placement groove 101. The electric push rod 1041 pushes the silicon wafer material to move during the cutting process through the push plate 1042, pushing the cut silicon wafer into the collection box 2 for collection. A recycling drawer 105 is slidably connected to the bottom of the processing table 1 below the material placement groove 101. The debris generated during the silicon wafer material cutting process enters the recycling drawer 105 through the filter screen 1012 for centralized collection, which is convenient for later processing.

[0032] For further details, please refer to Figure 1 , Figure 3 and Figure 5A material collection box 2 is snapped into the interior of the embedded groove 103. A set of limiting hooks 201 are fixedly connected to both sides of the material collection box 2 at positions corresponding to the limiting rod 1031. The limiting hooks 201 engage with the limiting rod 1031 to facilitate the limiting and fixing of the material collection box 2. A set of sliding grooves 202 are provided on three sides of the inner wall of the material collection box 2. A guide sliding rod 2021 is fixedly connected inside the sliding groove 202. A limiting plate 203 is slidably connected inside the material collection box 2. The limiting plate 203 and the guide rod 2021... A set of sliding holes 2031 are provided at the corresponding positions of the sliding rod 2021. The limiting plate 203 is slidably connected to the guide sliding rod 2021 through the sliding holes 2031, which improves the smoothness and stability of the movement of the limiting plate 203. A pull rod 2032 is fixedly connected to the top of the limiting plate 203. The pull rod 2032 pulls the limiting plate 203 to move. The limiting plate 203 slides and moves inside the collection box 2 according to the amount of silicon wafers collected, so as to prevent the silicon wafers from falling into the collection box 2 and affecting the collection efficiency.

[0033] For further details, please refer to Figure 1 A screw adjustment bracket 3 is fixedly connected to the top of the processing table 1 and to the side away from the embedded groove 103. An adjustment screw 301 is rotatably connected inside the screw adjustment bracket 3. A motor 3011 is installed at the top of the adjustment screw 301. A guide slide rod 302 is fixedly connected to the inside of the screw adjustment bracket 3 to the side of the adjustment screw 301.

[0034] For further details, please refer to Figure 1 and Figure 4 Inside the screw adjusting frame 3, above the material trough 101, a horizontal adjusting frame 4 is slidably connected. The horizontal adjusting frame 4 has a threaded adjusting hole 401 at a position corresponding to the adjusting screw 301. The motor 3011 drives the adjusting screw 301 to rotate, so that the horizontal adjusting frame 4 is threadedly connected to the adjusting screw 301 through the threaded adjusting hole 401, indirectly driving the cutting machine 5 to adjust its height. The horizontal adjusting frame 4 has a sliding hole 402 at a position corresponding to the guide slide rod 302. The horizontal adjusting frame 4 is slidably connected to the guide slide rod 302 through the sliding hole 402, enhancing the stability of the height adjustment of the horizontal adjusting frame 4. The top left side of the horizontal adjusting frame 4 is rotatably connected to the adjusting screw 403. One end of the adjusting screw 403 is located on the outside of the horizontal adjusting frame 4 and a motor 4031 is installed thereon. The top right side of the horizontal adjusting frame 4 is fixedly connected to the guide slide rod 404.

[0035] For further details, please refer to Figure 1 , Figure 4 and Figure 6The bottom of the horizontal adjustment frame 4 is slidably connected to the cutting machine 5. The top of the cutting machine 5, corresponding to the position of the second adjusting screw 403, is provided with a threaded adjustment hole 501. The motor 4031 drives the second adjusting screw 403 to rotate, so that the cutting machine 5 can move through the threaded adjustment hole 501 and the threaded connection of the second adjusting screw 403, which facilitates the free adjustment of the cutting thickness of the silicon wafer. The top of the cutting machine 5, corresponding to the position of the third guide slide rod 404, is provided with a sliding hole 502. The cutting machine 5 is slidably connected to the third guide slide rod 404 through the sliding hole 502, which improves the stability of the movement and adjustment of the cutting machine 5.

[0036] In addition, it should be noted that the electric push rod 1041, the motor and the cutting machine 5 are all existing technologies, and their internal working principles and operating procedures will not be described in detail here.

[0037] The working process of this utility model is as follows: First, the silicon wafer material is placed on the support bar 1011. The return spring 1022, through its own elasticity, drives the telescopic rod 1021 to push the clamping plate 1023 to clamp and fix the silicon wafer material, so as to facilitate the positioning of silicon wafer materials of different sizes and prevent the silicon wafer material from shifting during the cutting process. The collection box 2 is engaged with the limiting hook 201 and the limiting rod 1031 through the limiting hook 201, so that the collection box 2 is fixed inside the embedding groove 103. The pull rod 2032 pulls the limiting plate 203 to slide inside the collection box 2 to the side close to the material placement groove 101. The limiting plate 203 is slidably connected to the guide slide rod 2021 through the sliding hole 2031, which improves the smoothness and stability of the movement of the limiting plate 203. The motor 3011 drives the adjusting screw 301 to rotate, so that the horizontal adjustment frame 4. The height of the cutting machine 5 is indirectly adjusted by connecting the threaded adjustment hole 401 to the adjustment screw 301. The motor 4031 drives the adjustment screw 403 to rotate, allowing the cutting machine 5 to move through the threaded adjustment hole 501 and the adjustment screw 403. This facilitates free adjustment of the cutting thickness of the silicon wafer. After the cutting machine 5 cuts the silicon wafer, the electric push rod 1041 pushes the silicon wafer through the push plate 1042 to move it during the cutting process, pushing the cut silicon wafer into the collection box 2 for collection. The limiting plate 203 slides and moves inside the collection box 2 according to the amount of silicon wafer collected, preventing the silicon wafer from tipping over inside the collection box 2 and affecting the collection efficiency. The debris generated during the cutting process enters the recycling drawer 105 through the filter screen 1012 for centralized collection, which is convenient for later processing.

[0038] The entire operation process is simple and convenient. Compared with existing cutting devices, this utility model can improve the stability of silicon wafer material cutting through design, facilitate the collection of cut silicon wafer material, and enhance overall practicality.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer cutting device, comprising a processing table (1), characterized in that: The processing table (1) has a material placement groove (101) on its top. A support bar (1011) is fixedly connected to the center of the bottom of the material placement groove (101). Filter screens (1012) are fixedly connected to both sides of the support bar (1011). A set of clamping structures (102) is installed on both sides of the inner wall of the material placement groove (101). An embedding groove (103) is provided on the top left side of the processing table (1) at a position corresponding to the material placement groove (101). The outer side of the processing table (1) is located in the embedding groove (103). Both sides are fixedly connected with a set of limiting rods (1031). The inside of the embedding groove (103) is fitted with a material collection box (2). The inside of the material placement groove (101) is installed with a pushing mechanism (104). The top of the processing table (1) and the side away from the embedding groove (103) are fixedly connected with a screw adjustment frame (3). The inside of the screw adjustment frame (3) is slidably connected to a horizontal adjustment frame (4) above the material placement groove (101). The bottom of the horizontal adjustment frame (4) is slidably connected with a cutting machine (5).

2. The silicon wafer cutting device according to claim 1, characterized in that: The clamping structure (102) consists of a telescopic rod (1021), a return spring (1022), and a clamping plate (1023). Two pairs of telescopic rods (1021) are fixedly connected to both sides of the inner wall of the material trough (101). A clamping plate (1023) is fixedly connected to the corresponding side of each telescopic rod (1021). A return spring (1022) is sleeved on the outer side of the telescopic rod (1021).

3. The silicon wafer cutting device according to claim 1, characterized in that: The pushing mechanism (104) consists of an electric push rod (1041) and a push plate (1042). The electric push rod (1041) is installed on the back of the processing table (1) at a position corresponding to the embedding groove (103). One end of the electric push rod (1041) is fixedly connected to the push plate (1042) inside the material placement groove (101).

4. The silicon wafer cutting device according to claim 1, characterized in that: The bottom of the processing table (1) is slidably connected to a recycling drawer (105) located below the material storage trough (101).

5. The silicon wafer cutting device according to claim 1, characterized in that: On both sides of the collection box (2) and at positions corresponding to the limiting rods (1031), a set of limiting hooks (201) are fixedly connected. The limiting hooks (201) are engaged with the limiting rods (1031). A set of sliding grooves (202) are provided on three sides of the inner wall of the collection box (2). A guide slide rod (2021) is fixedly connected inside the sliding grooves (202). A limiting plate (203) is slidably connected inside the collection box (2). A set of sliding holes (2031) is provided at positions corresponding to the guide slide rods (2021) on the limiting plate (203). The limiting plate (203) is slidably connected to the guide slide rods (2021) through the sliding holes (2031). A pull rod (2032) is fixedly connected to the top of the limiting plate (203).

6. The silicon wafer new material cutting device according to claim 1, characterized in that: The screw adjusting bracket (3) is rotatably connected to an adjusting screw (301). The top of the adjusting screw (301) is located on the top of the screw adjusting bracket (3) and a motor (3011) is installed thereon. The screw adjusting bracket (3) is fixedly connected to a guide slide rod (302) on one side of the adjusting screw (301).

7. The silicon wafer cutting device according to claim 6, characterized in that: The horizontal adjustment frame (4) has a threaded adjustment hole (401) at a position corresponding to the adjustment screw (301). The horizontal adjustment frame (4) is threadedly connected to the adjustment screw (301) through the threaded adjustment hole (401). The horizontal adjustment frame (4) has a sliding hole (402) at a position corresponding to the guide slide rod (302). The horizontal adjustment frame (4) is slidably connected to the guide slide rod (302) through the sliding hole (402). The top left side of the horizontal adjustment frame (4) is rotatably connected to the adjustment screw (403). One end of the adjustment screw (403) is located on the outside of the horizontal adjustment frame (4) and a motor (4031) is installed thereon. The top right side of the horizontal adjustment frame (4) is fixedly connected to the guide slide rod (404).

8. The silicon wafer new material cutting device according to claim 7, characterized in that: The cutting machine (5) has a threaded adjustment hole (501) at the top corresponding to the adjusting screw (403). The cutting machine (5) is threadedly connected to the adjusting screw (403) through the threaded adjustment hole (501). The cutting machine (5) also has a sliding hole (502) at the top corresponding to the guide slide rod (404). The cutting machine (5) is slidably connected to the guide slide rod (404) through the sliding hole (502).

Images