Semiconductor diamond dust-free packaging box

Abstract

The utility model discloses a semiconductor diamond dust-free packaging box, and belongs to the technical field of packaging boxes. A semiconductor diamond dust-free packaging box comprises a box body and a cover body, one end of the box body and one end of the cover body are hinged, the other end of the box body and the other end of the cover body are buckled, packaging bag grooves are formed in the end faces, close to each other, of the box body and the cover body, and an anti-static packaging bag is clamped between the box body and the cover body. A packaging groove used for storing diamond wafers is formed in the anti-static packaging bag, and an opening is formed in the end, close to the buckling end of the box body, of the packaging groove. The utility model has the advantages that the diamond wafer is far away from static electricity, the diamond wafer is prevented from contacting dust, and the shock-resistant effect is good.

Description

Technical Field

[0001] This utility model relates to the field of packaging box technology, and in particular to a semiconductor diamond dust-free packaging box. Background Technology

[0002] Diamond is an indirect bandgap semiconductor material with a bandgap of approximately 5.2 eV and a thermal conductivity as high as 22 W / (cm•K). Its room-temperature electron and hole mobilities are as high as 4500 cm² / (Vs) and 3380 cm² / (Vs), respectively, far exceeding those of third-generation semiconductor materials GaN and SiC. Therefore, diamond has broad application prospects in high-power power electronic devices operating at high temperatures and high-frequency, high-power microwave devices. Furthermore, due to its large exciton binding energy (80 meV), diamond can achieve high-intensity free exciton emission at room temperature (emission wavelength approximately 235 nm), showing great potential in the fabrication of high-power deep ultraviolet light-emitting diodes. It also plays an important role in the development of extreme ultraviolet, deep ultraviolet, and high-energy particle detectors.

[0003] The processing of diamond wafers requires grinding, polishing and other processes. After processing, the diamond wafers have a smooth mirror surface and are very fragile. If they are not protected or isolated during transportation, airborne particles will settle on the surface of the diamond wafers, causing contamination and reducing the yield of the diamond wafers.

[0004] A utility model with publication number CN217075263U discloses a diamond wafer packaging box, comprising: an openable and closable box body, the box body including a pair of symmetrically hinged lids, each lid having a buffer cavity, and each buffer cavity having a flexible fixing film on opposite sides. The fixing film, moving away from each other, sequentially includes a fixing layer, an adsorption layer, and an electrostatic layer, the electrostatic layer being fixedly disposed to the inner wall of the corresponding lid. The adsorption layer is electrostatically adsorbed onto the electrostatic layer, and several diamond wafers are electrostatically adsorbed between the electrostatic layer and the fixing layer. The diamond wafer packaging box provided by this utility model can prevent damage to the diamond wafers caused by shaking within the packaging box when subjected to external forces during transportation, ensuring the safe storage and transportation of the diamond wafers.

[0005] However, special attention needs to be paid to anti-static treatment during wafer transportation. Firstly, electrical charges attract dust particles, and secondly, electrical charges tend to attract oppositely charged particles. Excessive dust particles and cations / anions can negatively impact the yield of subsequent photolithography. In the aforementioned invention, the electrostatic layer, adsorption layer, and fixing layer are mainly connected by electrostatic adsorption. The wafer is stored between the adsorption layer and the fixing layer, which is not conducive to keeping the wafer away from static electricity. Utility Model Content

[0006] The purpose of this invention is to solve the problem that existing diamond wafer packaging boxes are not conducive to keeping the wafers away from static electricity, and to propose a clean packaging box for semiconductor diamonds.

[0007] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0008] A cleanroom packaging box for semiconductor diamonds includes a box body and a cover. One end of the box body and the cover are hinged, and the other end is fastened. Packaging bag grooves are provided on the end faces of the box body and the cover that are close to each other. An antistatic packaging bag is sandwiched between the box body and the cover. The interior of the antistatic packaging bag has a packaging groove for storing diamond wafers. The packaging groove has an opening at the end near the fastening end of the box body.

[0009] Furthermore, the packaging groove has a U-shaped cross-section, and one end of the packaging groove near the hinge end of the box body is an arc groove. The radial dimension of the arc groove is the same as the radial dimension of the diamond wafer, and the other end of the packaging groove near the snap-fit ​​end of the box body is a straight groove.

[0010] Furthermore, the packaging bag groove has a wafer groove inside, and the radial dimension of the wafer groove is larger than the radial dimension of the diamond wafer.

[0011] Furthermore, an airbag is provided in the middle of the wafer slot.

[0012] Furthermore, the airbag is a spherical structure with a high center and low edges, and the top of the airbag is at the same height as the top of the packaging bag groove.

[0013] Furthermore, a limiting pad is provided at the bottom of the wafer slot, and the two limiting pads are located inside the wafer slot on the side away from the hinge end of the housing, and the two limiting pads are symmetrical about the central axis of the housing.

[0014] Furthermore, a clamping pad is provided inside the packaging bag groove on the side near the limiting pad, the inner edge of the clamping pad is aligned with the edge of the wafer groove, and the top of the clamping pad is at the same height as the top of the packaging bag groove.

[0015] Compared with the prior art, this utility model provides a dust-free packaging box for semiconductor diamond, which has the following beneficial effects:

[0016] This utility model discloses a cleanroom packaging box for semiconductor diamonds. In use, diamond wafers are placed into the packaging slot, and then the cover and box are closed. The diamond wafers and anti-static packaging bags are both located in the packaging bag slot. The anti-static packaging bags separate the diamond wafers from the box, cover, and external environment, achieving the purpose of anti-static protection. At the same time, the box and cover provide structural support and protection, preventing external impacts and squeezing. Compared with the prior art, this is beneficial for keeping diamond wafers away from static electricity.

[0017] Other advantages, objectives and features of this invention will be set forth in part in the description which follows; and in part will be apparent to those skilled in the art upon examination of the following description; or may be taught from practice of this invention. Attached Figure Description

[0018] Figure 1 This is a three-dimensional schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a schematic diagram showing the overall structure of this utility model when opened.

[0020] Figure 3 For the present utility model Figure 2 Enlarged schematic diagram of section A in the middle;

[0021] Figure 4 This is a three-dimensional cross-sectional view of the box structure of this utility model;

[0022] Figure 5 This is a front view schematic diagram of the box structure cross-section of this utility model;

[0023] Figure 6 This is a schematic diagram of the packaging groove structure of this utility model.

[0024] In the picture:

[0025] 1. Box body; 2. Lid body; 3. Antistatic packaging bag; 4. Packaging bag slot; 5. Chip slot; 6. Airbag; 7. Limiting soft pad; 8. Clamping pad; 9. Packaging slot. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0027] Reference Figure 1-6This utility model discloses a cleanroom packaging box for semiconductor diamonds, comprising a box body 1 and a cover body 2. One end of the box body 1 and the cover body 2 are hinged, and the other end is fastened. Packaging bag grooves 4 are provided on the end faces of the box body 1 and the cover body 2 that are close to each other. An antistatic packaging bag 3 is sandwiched between the box body 1 and the cover body 2. The antistatic packaging bag 3 has a packaging groove 9 for storing diamond wafers inside. The packaging groove 9 has an opening at the end near the fastening end of the box body 1.

[0028] Both the box body 1 and the cover body 2 are anti-static rigid shell structures that provide external protection for the diamond wafers. The anti-static packaging bag 3 is made of dust-free anti-static polyethylene, and the end of the anti-static packaging bag 3 away from the opening is connected to the box body 1.

[0029] After the cover 2 and the box 1 are closed, the cover 2 and the box 1 clamp the opening of the packaging slot 9, so that the packaging slot 9 changes from a semi-open structure to a closed structure, thereby isolating the diamond wafer inside the packaging slot 9 from the external environment, achieving the effect of dust prevention and anti-static, and creating a dust-free environment inside the packaging slot 9.

[0030] The packaging groove 9 has a U-shaped cross-section. The end of the packaging groove 9 near the hinge end of the box body 1 is an arc groove. The radial dimension of the arc groove is the same as the radial dimension of the diamond wafer. The end of the packaging groove 9 near the snap-fit ​​end of the box body 1 is a straight groove.

[0031] The width of the straight groove can be the same as the radial dimension of the diamond wafer (e.g., Figure 6 As shown in the figure, it can be larger than the radial dimension of the diamond wafer (not shown in the figure) to facilitate the placement of the diamond wafer into the packaging slot 9.

[0032] When the diamond wafer is placed at the bottom of the packaging groove 9, the arc groove effectively wraps around the wafer from one side, providing a limiting and supporting function.

[0033] In this application, the packaging bag groove 4 is a square groove, and there are gaps between the outer side of the arc groove and the side wall, top and bottom of the packaging bag groove 4, so that the side of the diamond wafer close to the arc groove does not come into direct contact with the packaging bag groove 4, further reducing collisions.

[0034] The packaging bag groove 4 has a wafer groove 5 inside, and the radial dimension of the wafer groove 5 is larger than the radial dimension of the diamond wafer.

[0035] The wafer slot 5 is a circular slot. When the box body 1 and the cover body 2 are closed, the diamond wafer is located in the middle of the wafer slot 5 and suspended. There is a gap between the top and bottom surfaces of the antistatic packaging bag 3 and the top and bottom surfaces of the wafer slot 5. There is also a gap between the edge of the diamond wafer and the side wall of the wafer slot 5, so that the antistatic packaging bag 3 has a shock absorption effect with the box body 1 and the cover body 2.

[0036] An air bladder 6 is provided in the middle of the wafer slot 5, and the radial dimension of the air bladder 6 is the same as the dimension of the diamond wafer.

[0037] The airbag 6 can be filled with helium as an inert protective gas.

[0038] After the box 1 and the cover 2 are closed, the upper and lower airbags 6 provide support and limit the diamond wafer from the top and bottom surfaces respectively, preventing the diamond wafer from shaking up and down during movement.

[0039] The airbag 6 has a spherical structure with a high center and low edges, and the top of the airbag 6 is at the same height as the top of the packaging bag groove 4.

[0040] When the two airbags 6 press on the diamond wafer, they provide support from the center of the top and bottom surfaces of the diamond wafer, respectively. This ensures that most of the structure of the diamond wafer remains suspended under the protection of the antistatic packaging bag 3, thus improving the cushioning and shock absorption effect.

[0041] The bottom of the wafer slot 5 is provided with limiting pads 7. The two limiting pads 7 are located inside the wafer slot 5 on the side away from the hinge end of the housing 1. The two limiting pads 7 are symmetrical about the central axis of the housing 1.

[0042] The limiting pad 7 is located in the gap between the side wall of the wafer slot 5 and the air bag 6. When the limiting pad 7 on the cover 2 and the box 1 are pressed together, the limiting pad 7 undergoes slight deformation, and the inner side of the limiting pad 7 abuts against the edge of the diamond wafer.

[0043] After the box body 1 and the cover body 2 are closed, the limiting soft pad 7 cooperates with the arc groove to limit the diamond wafer from all sides in the horizontal direction, preventing the diamond wafer from swaying horizontally in the packaging groove 9.

[0044] A clamping pad 8 is provided inside the packaging bag groove 4 on the side near the limiting soft pad 7. The inner edge of the clamping pad 8 is aligned with the edge of the wafer groove 5, and the top of the clamping pad 8 is at the same height as the top of the packaging bag groove 4.

[0045] After the box body 1 and the cover body 2 are closed, the clamping pads 8 on the box body 1 and the cover body 2 clamp the opening and corners of the antistatic packaging bag 3, preventing the antistatic packaging bag 3 from swinging in the packaging bag groove 4. At the same time, it can also press the opening of the packaging groove 9, so that a sealed space is formed in the packaging groove 9, preventing dust particles from entering the packaging groove 9.

[0046] Working principle: This packaging box is used in a cleanroom where diamond wafers are produced. When using it, open the cover 2, open the opening of the packaging slot 9, put the diamond wafer into the anti-static packaging bag 3, and then close the cover 2 and fasten it to the box body 1.

[0047] After the cover 2 is closed with the box 1, the airbag 6 presses the center of the diamond wafer from the top and bottom surfaces of the antistatic packaging bag 3, the arc groove and the limiting pad 7 constrain the diamond wafer from all sides, and the clamping pad 8 clamps the opening of the packaging groove 9.

[0048] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

[0049] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0050] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A cleanroom packaging box for semiconductor diamond, comprising a box body (1) and a cover (2), wherein one end of the box body (1) and the cover (2) are hinged and the other end is fastened together, characterized in that, Packaging bag grooves (4) are provided on the end faces of the box body (1) and the cover body (2) that are close to each other. An antistatic packaging bag (3) is sandwiched between the box body (1) and the cover body (2). The antistatic packaging bag (3) has a packaging groove (9) for storing diamond wafers inside. The packaging groove (9) has an opening at one end near the fastening end of the box body (1).

2. The semiconductor diamond dust-free packaging box according to claim 1, characterized in that, The packaging groove (9) has a U-shaped cross section. The end of the packaging groove (9) near the hinge end of the box body (1) is an arc groove. The radial dimension of the arc groove is the same as the radial dimension of the diamond wafer. The end of the packaging groove (9) near the snap-fit ​​end of the box body (1) is a straight groove.

3. A semiconductor diamond dust-free packaging box according to claim 2, characterized in that, The packaging bag groove (4) has a wafer groove (5) inside, and the radial dimension of the wafer groove (5) is larger than the radial dimension of the diamond wafer.

4. A semiconductor diamond dust-free packaging box according to claim 3, characterized in that, An airbag (6) is provided in the middle of the wafer slot (5).

5. A semiconductor diamond dust-free packaging box according to claim 4, characterized in that, The airbag (6) is a spherical structure with a high center and low edges, and the top of the airbag (6) is at the same height as the top of the packaging bag groove (4).

6. A semiconductor diamond dust-free packaging box according to claim 5, characterized in that, The bottom of the wafer slot (5) is provided with a limiting pad (7). The two limiting pads (7) are located inside the wafer slot (5) on the side away from the hinge end of the box (1). The two limiting pads (7) are symmetrical about the central axis of the box (1).

7. A semiconductor diamond dust-free packaging box according to claim 6, characterized in that, A clamping pad (8) is provided inside the packaging bag groove (4) on the side near the limiting pad (7). The inner edge of the clamping pad (8) is aligned with the edge of the wafer groove (5), and the top of the clamping pad (8) is at the same height as the top of the packaging bag groove (4).

Images