Material base and resin plate curing and buffering device

Abstract

The utility model provides a material seat and resin plate curing and caching device, which is used in the field of bonding and curing of silicon single crystal rods and comprises a caching library, a feeding mechanism and a discharging mechanism, the caching library is provided with a plurality of independently arranged storage layers, and each storage layer is provided with a plurality of independent curing mechanisms; the curing mechanism comprises a fixed supporting plate, a pressing assembly, a first alignment assembly and a second alignment assembly; the feeding mechanism and the discharging mechanism are oppositely arranged in the cache warehouse and each provided with a lifting assembly and a translation assembly, and the translation assemblies are connected to the lifting assemblies and can be connected with the curing mechanism in an aligned mode. According to the utility model, a curing process is combined with storage, so that the bonding quality of the material seat and the resin plate is ensured; the storage capacity is high, each curing mechanism operates independently, and the overall curing efficiency is improved; the resin plate can be accurately aligned with the material seat, so that the bonding accuracy of the material seat and the resin plate is improved; automatic control is achieved, linkage is accurate, response is rapid, and the cost is further saved.

Description

Technical Field

[0001] This utility model belongs to the field of bonding and curing of single crystal silicon rods, and in particular relates to a material holder and resin plate curing buffer device. Background Technology

[0002] The bonding of the substrate to the resin plate is a crucial step in bonding monocrystalline silicon rods and ensuring silicon wafer cutting. Unstable bonding or misalignment between the substrate and resin plate will severely affect the bonding quality of the monocrystalline silicon rod, consequently impacting the cutting quality. Currently, bonding and curing of the substrate and resin plate are typically performed together. However, complete curing of the substrate and resin plate often takes time, directly affecting production continuity and efficiency. Furthermore, after bonding and curing, the substrate and resin plate need to be moved back to the warehouse for later use. Frequent movement inevitably negatively impacts the bonding effect, and this method also consumes a lot of space. The entire process involves multiple warehousing, retrieval, and transfer operations, resulting in low overall efficiency and high costs, thus hindering overall production progress and cost. Utility Model Content

[0003] To solve the above-mentioned technical problems, this utility model provides a material holder and resin plate curing buffer device with strong storage capacity and high curing efficiency, ensuring the bonding quality of the material holder and resin plate.

[0004] The technical solution adopted by this utility model is: a material holder and resin plate curing buffer device, comprising:

[0005] The cache library has several independently configured storage layers, and each storage layer is provided with several independent curing mechanisms for pressing the adhesive between the material base and the resin board to cure it.

[0006] The feeding mechanism is located in the buffer and is equipped with a lifting component and a translation component; the translation component is connected to the lifting component and can be aligned and connected with the curing mechanism.

[0007] Furthermore, the lifting assembly includes a lifting drive and a lifting moving component. The lifting moving component is connected to the drive end of the lifting drive and moves up and down along the buffer under the action of the lifting drive. The translation component is connected to the lifting moving component.

[0008] Furthermore, the translation component includes: a translation drive, a telescopic guide rail, and a translation tray. The translation drive and the telescopic guide rail are disposed on the lifting moving component. The translation tray is connected to the telescopic guide rail, which is connected to the drive end of the translation drive. The telescopic guide rail can extend and retract relative to the lifting moving component, facilitating the delivery of the adhesive body between the material seat and the resin board to the curing mechanism.

[0009] Furthermore, several of the curing mechanisms are arranged sequentially along the telescopic guide rail, including oppositely arranged fixed trays with a gap between them for the translational tray to pass between them.

[0010] Furthermore, the curing mechanism also includes a pressing assembly, which includes a counterweight plate and a counterweight drive component. The counterweight plate is connected to the drive end of the counterweight drive component and is located above the fixed support plate. Under the action of the counterweight drive component, it moves closer to or further away from the fixed support plate.

[0011] Furthermore, the curing mechanism also includes a positioning element, which is disposed opposite to the fixed support plate and is used to position the material seat in the width direction.

[0012] Furthermore, the curing mechanism also includes a first alignment component arranged opposite to each other, including a stop member and a stop driving member. The stop member is connected to the driving end of the stop driving member and is used to adjust the position of the resin board in the length direction.

[0013] Furthermore, the curing mechanism also includes a second alignment component arranged opposite to each other, including alignment strips and alignment drive members. The alignment strips are arranged opposite to the drive end of the alignment drive member and move closer or further apart from each other under the control of the alignment drive member to adjust the position of the resin board in the width direction.

[0014] Furthermore, it also includes a feeding mechanism, which is disposed opposite to the feeding mechanism on both sides of the buffer library, including the lifting component and the translation component, for removing the cured material seat and resin plate from the buffer library.

[0015] Furthermore, it also includes a control device and several position sensors, wherein the control device is electrically connected to the lifting assembly, the translation assembly, the curing mechanism and the position sensors respectively.

[0016] The advantages and positive effects of this utility model are:

[0017] 1. By combining the curing process with storage, the accumulation of resin can be avoided, which may affect the operation of the production line. At the same time, the material base and resin plate do not need to be transferred multiple times, thus ensuring the bonding effect of the material base and resin plate.

[0018] 2. The cache library proposed in this utility model can be set with multiple storage layers as needed, and each storage layer can be set with multiple solidification mechanisms, which has strong storage capacity and maximizes space utilization; each solidification mechanism operates independently, which improves the overall solidification efficiency.

[0019] 3. The curing mechanism fixes the material seat in a preset position by setting positioning components, adjusts the position of the resin board in the length direction by the first alignment component, and adjusts the position of the resin board in the width direction by the second alignment component, so that the resin board can be accurately aligned with the material seat, thereby improving the bonding accuracy between the material seat and the resin board.

[0020] 4. By setting up feeding and unloading mechanisms, the pre-cured material plates and resin plates are taken out from the buffer first, ensuring the curing time of the material base and resin plates. This allows for rapid curing and transfer of the material base and resin plates, providing high flexibility.

[0021] 5. The feeding mechanism, curing mechanism, and unloading mechanism are all automatically controlled, with precise linkage and rapid response, ensuring the curing and bonding quality of the material base and resin board. This enables effective and reasonable control of both the curing and storage processes, improving the curing and storage efficiency of the material base and resin board, and further saving costs. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a specific embodiment of the present utility model;

[0023] Figure 2 This is a schematic diagram of the cache library structure of a specific embodiment of this utility model;

[0024] Figure 3 This is a schematic diagram of the feeding mechanism and unloading mechanism of a specific embodiment of this utility model;

[0025] Figure 4 This is a schematic diagram of the operation of the translation component according to a specific embodiment of this utility model;

[0026] Figure 5 This is a schematic diagram of the curing mechanism structure of a specific embodiment of this utility model.

[0027] In the picture:

[0028] 100, Cache library; 110, Storage layer; 111, Inlet.

[0029] 112. Discharge port; 113. Crossbeam; 200. Feeding mechanism.

[0030] 210. Lifting assembly; 211. Lifting drive component; 212. Lifting moving component.

[0031] 220. Translation component; 221. Translation drive component; 222. Telescopic guide rail

[0032] 223, translation pallet 300, unloading mechanism 400, curing mechanism

[0033] 410. Fixed support plate; 420. Pressing assembly; 421. Counterweight plate

[0034] 422, counterweight drive component 430, positioning component 440, first alignment assembly

[0035] 441. Abutting component; 442. Abutting drive component; 450. Second alignment assembly.

[0036] 451. Alignment clip; 452. Alignment drive component; 500. Adhesive for material holder and resin plate. Detailed Implementation

[0037] The embodiments of this utility model will now be described with reference to the accompanying drawings.

[0038] like Figure 1 As shown, this utility model proposes a material holder and resin board curing buffer device, including a buffer library 100 and a feeding mechanism 200: wherein the buffer library 100 has several independently arranged storage layers 110, each storage layer 110 is provided with several independent curing mechanisms 400, used to press the adhesive body 500 of the material holder and resin board to cure it; the feeding mechanism 200 is arranged in the buffer library 100, and is provided with a lifting component 210 and a translation component 220, the translation component 220 is connected to the lifting component 210, and can be aligned and connected with the curing mechanism 400.

[0039] In this application, the material base and the resin plate are initially bonded before entering the curing chamber, and are bonded together by adhesive to form an adhesive body 500 of the material base and the resin plate. Before the adhesive is fully cured, it is placed in the feeding mechanism 200 of this application by a transfer mechanism or manual operation. The feeding mechanism 200 transports the adhesive body 500 of the material base and the resin plate to a curing mechanism 400 of a certain storage layer 110. By applying a downward preset pressure to the resin plate, the material base and the resin plate are fully cured and bonded.

[0040] Specifically, the adhesive 500 between the material holder and the resin board is placed on the translation component 220. The translation component 220 is driven by the lifting component 210 to reach a storage layer 110. Through the movement of the translation component 220, the adhesive 500 between the material holder and the resin board is transferred to an empty curing mechanism 400 for pressing and left to stand for a preset time to achieve complete curing. Then it is stored in the buffer library 100 for use in the next process.

[0041] In one specific embodiment, the feeding mechanism 200 is also used to remove the cured material base and resin plate; specifically, the lifting component 210 drives the translation component 220 to a storage layer 110, the translation component 220 is aligned and connected with the curing mechanism 400, and the cured material base and resin plate are moved out of the curing mechanism 400. Then, under the action of the lifting component 210, the cured material base and resin plate are moved to a set position, and the cured material base and resin plate are removed manually or by a robot in the next process.

[0042] like Figure 2 As shown, the cache library 100 is a frame structure formed by connecting several horizontal beams 113 and several vertical beams. It includes several storage layers 110 arranged along the height direction. Each storage layer 110 is detachably provided with several curing mechanisms 400. One end of each storage layer 110 is provided with a feeding port 111. The feeding mechanism 200 is located at the feeding port 111 and can reach any storage layer 110 through the feeding port 111.

[0043] like Figure 3 and Figure 4 As shown, the lifting assembly 210 includes a lifting drive 211 and a lifting moving component 212. The lifting moving component 212 is connected to the drive end of the lifting drive 211 and moves up and down along the buffer 100 under the action of the lifting drive 211. A translation component 220 is connected to the lifting moving component 212 so that the translation component 220 drives the adhesive body 500 of the material seat and the resin board to a storage layer 110. The lifting assembly 210 can be a pneumatic guide rail drive, a gear and rack drive, or other lifting and moving device. No specific requirements are specified here. Preferably, the lifting assembly 210 is a gear and rack drive, the lifting drive 211 is a servo motor, and the lifting assembly 210 also includes a guide rail. The guide rail is arranged along the height direction of the buffer 100 and is provided with a rack. The lifting drive 211 is provided on the lifting moving component 212, and its drive end is provided with a gear that cooperates with the rack. Under the drive of the servo motor, it moves up and down along the guide rail.

[0044] In a specific implementation, to achieve smooth movement of the lifting moving component 212, the above-mentioned guide rail consists of two parallel guide rails, each with a rack. The lifting drive component 211 is located between the two guide rails, and a servo motor is located in the middle of the lifting drive component 211. Its drive shaft extends horizontally to both sides and is connected to gears, which mesh with the racks on both sides. The guide rail is also equipped with several limiting devices to prevent the lifting moving component 212 from disengaging from the racks or exceeding the set movement range.

[0045] like Figure 3 and Figure 4As shown, the aforementioned translation component 220 is mounted on the lifting moving member 212 and can move horizontally relative to the lifting moving member 212, facilitating the transport of the adhesive body 500 of the material seat and resin board to the curing mechanism 400. The translation component 220 can be a pneumatic guide rail, a cylinder drive, or a chain gear drive; no limitation is made here. Preferably, the translation component 220 uses a chain gear drive and includes a translation bracket, a translation drive member 221, a telescopic guide rail 222, and a translation tray 223. The translation bracket is mounted on the lifting moving member 212. 2. A translation drive 221 and a telescopic guide rail 222 are mounted on the translation bracket. A translation tray 223 is connected to the telescopic guide rail 222 and located on its upper part, used to hold the material holder and the adhesive body 500 of the resin board. The telescopic guide rail 222 is connected to the drive end of the translation drive 221 via a chain and includes several telescopic joints. It can extend or retract under the control of the translation drive 221 to move the translation tray 223 closer to or further away from the curing mechanism 400, thus completing the transfer of the material holder and the adhesive body 500 of the resin board. In this embodiment, the telescopic guide rail 222 and the translation drive 221 are similar to telescopic forks; their specific structure is prior art and will not be described in detail here.

[0046] In one specific embodiment, the top of the translation tray 223 is provided with a limiting block to limit the position of the adhesive body of the material seat and the resin plate, and to prevent it from moving relative to the translation tray 223 during the movement.

[0047] Preferably, the telescopic guide rail 222 has sufficient telescopic length to allow the translational tray 223 to move between the outside of the buffer 100 and any curing mechanism 400, so as to facilitate the placement of the adhesive body 500 of the material seat and resin plate onto the translational tray 223 from the outside of the buffer 100.

[0048] like Figure 4 As shown, several curing mechanisms 400 are arranged sequentially along the telescopic guide rail 222 in the direction of telescopic extension and retraction, including fixed trays 410 arranged opposite each other, with a gap between the fixed trays 410 for translating the tray 223 through the gap between them.

[0049] The fixed support plate 410 is used to place the adhesive body of the material base and resin board for curing operations. It is detachably mounted on the crossbeam 113 of the buffer 100. In one specific embodiment, the distance between the two fixed support plates 410 is less than the length of the material base, so that both ends of the material base in the length direction can be placed on the two opposing fixed support plates 410. At the same time, the length of the fixed support plate 410 is not less than the width of the material base to ensure stable support for the material base. In use, the adhesive body 500 of the material base and resin board is placed on the translation support plate 223. The translation support plate 223 passes through several curing mechanisms 400 in its transmission direction. First, the adhesive body 500 of the material base and resin board is placed at the farthest curing point in the transmission direction. On the mechanism 400, another adhesive 500 of the material seat and resin plate is then placed on another curing mechanism 400 adjacent to the previous curing mechanism 400. In this way, the adhesive 500 of the material seat and resin plate is placed on different curing mechanisms 400 in the same storage layer 110 for curing operations, so as to achieve full and effective utilization of the curing mechanism 400, to cure and store multiple adhesive 500 of the material seat and resin plate without affecting each other. When it is necessary to remove the cured material seat and resin plate, the cured material seat and resin plate on the curing mechanism 400 closest in the transmission direction are first removed by the translation component 220, and then the cured material seat and resin plate on the curing mechanism 400 relatively far away are removed in sequence.

[0050] In a preferred embodiment, the fixing trays 410 on the same side of different curing mechanisms 400 in the same storage layer 110 are connected as a whole and are detachably connected to the crossbeam 113 of the cache library 100, which makes installation and disassembly easier.

[0051] like Figure 5 As shown, the curing mechanism 400 also includes a pressing assembly 420, which includes a counterweight plate 421 and a counterweight drive member 422. The counterweight plate 421 is connected to the drive end of the counterweight drive member 422 and is located above the fixed support plate 410. Under the action of the counterweight drive member 422, it moves closer to or further away from the fixed support plate 410 to press the adhesive body 500 of the material seat and the resin plate on the fixed support plate 410 to cure it.

[0052] Specifically, the counterweight drive component 422 can be driven by a cylinder or other transmission methods, preferably by a cylinder. The two counterweight drive components 422 are arranged opposite to each other, and can be respectively set on the crossbeam 113 of the buffer 100 near the fixed support plate 410, or respectively set on the two fixed support plates 410. The counterweight plate 421 is connected to the push rod of the counterweight drive component 422. Each counterweight drive component 422 can be connected to one counterweight plate 421. The two counterweight plates 421 are respectively pressed against the upper surfaces of the two ends of the resin plate in the length direction, so that the resin plate is cured on the material seat. Preferably, the push rods of the two counterweight drive components 422 are connected to the two ends of the same counterweight plate 421. The width and length of the counterweight plate 421 are both greater than the width and length of the vertical plate. Under the action of the counterweight drive component 422, it is pressed against the upper surface of the resin plate, so as to maximize the contact area between the counterweight plate 421 and the resin plate, thereby improving the uniformity of curing of various parts of the resin plate.

[0053] Furthermore, the curing mechanism 400 also includes a positioning element 430, which is disposed opposite to the fixed support plate 410 and is used to position the material seat in the width direction.

[0054] Specifically, the shape of the positioning element 430 matches the shape of the bottom of the material seat and also matches the translational support plate 223 to achieve positioning of the material seat; in a preferred embodiment, when placing the adhesive body 500 between the material seat and the resin plate, the center of the material seat in the length direction is aligned with the center of the translational support plate 223, and the center of the translational support plate 223 is preset to be aligned with the center of the line connecting the two fixed support plates 410, so that when the material seat moves to the fixed support plate 410, its center in the length direction is at a preset position; there are at least four limiting blocks, arranged in two rows, and the distance between the two rows of limiting blocks matches the width of the material seat. The adhesive body 500 between the material seat and the resin plate is fixed to the translational support plate 223 by the limiting blocks; in use, the adhesive body between the material seat and the resin plate... Driven by the translation pallet 223, 500 moves above the positioning member 430. At this time, the positioning member 430 is located on both sides of the translation pallet 223. The top of the positioning member 430 is provided with a limiting recess, and the bottom of the material seat can engage with the limiting recess. Then, the lifting component 210 operates to drive the translation pallet 223 to descend, so that the material seat falls onto the limiting recess of the positioning member 430, realizing the transfer of the material seat and the adhesive 500 of the resin board. Each fixed pallet 410 is provided with at least two positioning members 430 along its length direction to clamp the two sides of the material seat in the width direction, so that the center of the material seat in the width direction is in a preset position. At the same time, the positioning member 430 also makes the material seat more firmly fixed, preventing it from moving during the curing process.

[0055] Preferably, the shape of the limiting recess matches the shape of the four corners of the bottom of the material seat. When the adhesive body 500 of the material seat and the resin board falls onto the limiting recess, the four corners of the bottom of the material seat are engaged with the limiting recess, so that the length and width directions of the material seat are both in the set position, which facilitates the positioning of the material seat.

[0056] Furthermore, such as Figure 5 The curing mechanism 400 shown also includes a first alignment component 440 disposed opposite to each other, including a pusher 441 and a pusher drive 442. The pusher 441 is connected to the drive end of the pusher drive 442 and is used to push against both ends of the resin plate above the material seat in the length direction, so that the length direction of the resin plate is aligned with the length direction of the material seat.

[0057] After curing, the material holder and resin plate are used to attach silicon rods. Normally, the attachment of silicon rods is based on the center of the resin plate, while the cutting of silicon rods is based on the center of the material holder. Therefore, the higher the center alignment accuracy of the material holder and resin plate, the more beneficial it is to the accuracy of subsequent attachment and cutting of silicon rods. Therefore, it is necessary to adjust the relative position of the material holder and resin plate during the curing process to align their centers. In this application, the positioning member 430 is set to position the material holder, and the first alignment component 440 is set to make two oppositely arranged abutting members 441 abut against the two ends of the resin plate in the length direction, so that the two ends of the resin plate in the length direction are aligned with the two ends of the material holder in the length direction.

[0058] Specifically, the abutting drive component 442 is preferably a cylinder, which is respectively set on the two fixed support plates 410, preferably in the middle of the fixed support plate 410. The abutting component 441 is connected to the push rod of the cylinder, and its height is set according to the height of the resin plate. The cylinder controls the abutting component 441 to move closer to the resin plate by adjusting the push rod. The two abutting drive components 442 operate synchronously. When there is a misalignment between the material seat and the resin plate in the length direction, one of the abutting components 441 contacts the end of the resin plate that protrudes from the material seat and pushes it to the other side until both abutting components 441 abut against the resin plate. At this time, the length direction of the resin plate is aligned with the length direction of the material seat.

[0059] Furthermore, the curing mechanism 400 also includes a second alignment component 450 disposed opposite to each other, including an alignment strip 451 and an alignment drive 452. The alignment strip 451 is disposed opposite to the drive end of the alignment drive 452, and moves closer or further away from each other under the control of the alignment drive 452, for adjusting the position of the resin board in the width direction.

[0060] Specifically, the alignment drive 452 is preferably a cylinder with two push rods. The alignment clips 451 are connected to the two push rods. The alignment drive 452 controls the two alignment clips 451 to move closer or further apart through the push rods. Preferably, the alignment drive 452 is respectively located in the middle of the two fixed support plates 410 and is offset from the abutment drive 442. The alignment clips 451 extend towards the relative inner side of the two fixed support plates 410, and their height is set according to the height of the resin plate. In use, the alignment clips 451 are located on both sides of the width direction of the resin plate. The alignment drive 452 drives the two push rods to retract synchronously, so that the two alignment clips 451 move closer to each other. When there is a misalignment between the material seat and the resin plate in the width direction, one pair of alignment clips 451 contacts the end of the resin plate that protrudes from the material seat and pushes it to the other side until both alignment clips 451 clamp the resin plate. At this time, the width direction of the resin plate is aligned with the width direction of the material seat.

[0061] In another specific embodiment, the material holder and resin plate curing buffer device of this application further includes a feeding mechanism 300. The feeding mechanism 300 and the feeding mechanism 200 are disposed opposite to each other on both sides of the buffer 100. Its structure is the same as that of the feeding mechanism 200, both including a lifting component 210 and a translation component 220, used to remove the cured material holder and resin plate from the buffer 100; in this embodiment, as Figure 3 As shown, the buffer 100 is a frame structure formed by connecting several horizontal beams 113 and several vertical beams. It includes several storage layers 110 arranged along the height direction. Each storage layer 110 is provided with several curing mechanisms 400. One end of the storage layer 110 is provided with an inlet 111. A feeding mechanism 200 is provided at the inlet 111. The other end of the storage layer 110 is provided with an outlet 112. A discharging mechanism 300 is provided at the outlet 112. In use, the feeding mechanism 200 sequentially places the adhesive body 500 of the material base and the resin board onto the curing mechanism 400 closer to the outlet 112. The discharging mechanism 300 sequentially removes the cured material base and the resin board from the curing mechanism 400 closer to the outlet 112. This allows the feeding and discharging to be carried out separately without interference. At the same time, the material board and the resin board that are cured first are taken out of the buffer 100 first.

[0062] Furthermore, the material holder and resin board curing buffer device in this application also includes a control device and several position sensors. The control device is electrically connected to the lifting assembly 210, the translation assembly 220, the curing mechanism 400, and the position sensors respectively, so as to receive the signals transmitted by the position sensors and control the lifting assembly 210, the translation assembly 220, and the curing mechanism 400 to move. The control device is a programmable controller with a pre-edited program inside, so that the lifting assembly 210, the translation assembly 220, and the curing mechanism 400 move according to the pre-edited program, automatically completing the feeding, curing, and unloading of the adhesive body 500 of the material holder and resin board, realizing integrated control, improving the curing efficiency of the material holder and resin board, and reducing labor intensity and production costs.

[0063] In this example, when the adhesive 500 between the material holder and the resin board is placed on the translational tray 223 of the feeding mechanism 200, the control device automatically matches the empty curing mechanism 400 in the buffer 100 and compares it to identify the empty curing mechanism 400 in the same storage layer 110 that is relatively close to the discharge port 112 and has no obstructions on the movement path of the translational tray 223. This empty curing mechanism 400 is then selected as the target for placement. Subsequently, the lifting drive 211 is controlled to move, causing the lifting moving part 212 to reach the corresponding storage layer 110. After the lifting moving part 212 stabilizes, the translational drive 221 is controlled to move, causing the telescopic guide rail 222 to... The extension mechanism moves the translational pallet 223 between the fixed pallet 410 of the curing mechanism 400 to be placed. When the position sensor at the curing mechanism 400 detects that the material holder and resin plate are at a preset position above the fixed pallet 410, it transmits a signal to the control device. The control device sends a command to the lifting drive 211, which lowers the translational pallet 223, thereby lowering the adhesive 500 between the material holder and the resin plate onto the positioning element 430 of the fixed pallet 410. Subsequently, the translational drive 221 is activated, causing the telescopic guide rail 222 to reset and moving the translational pallet 223 outside the buffer 100. On the other side; after another position sensor monitors that the adhesive body 500 between the material holder and the resin board is in the correct position, it transmits a signal to the control device. The control device sends a command to the alignment drive 452 of the second alignment assembly 450. The alignment drive 452 moves to bring the alignment clips 451 connected to it closer together until the alignment clips 451 clamp the two sides of the resin board in the width direction. After the position sensor monitors that the alignment clips 451 are in the preset position, it transmits a signal to the control device. Then the control device sends a command to the abutting drive 442 of the first alignment assembly 440. The abutting drive 442 moves to bring the abutting parts 441 closer together until they abut... At both ends of the resin plate along its length; after the position sensor monitors that the abutment member 441 is in a preset position, it transmits a signal to the control device. The control device then sends a command to the pressing drive, which moves the counterweight plate 421 downwards until it contacts the resin plate. The pressing drive applies downward pressure to the resin plate and maintains this pressure for a preset time, ensuring that the adhesive between the material plate and the resin plate is squeezed evenly, guaranteeing uniform distribution of the adhesive between the resin plate and the material base, thereby increasing the adhesive bonding strength. After the preset time expires, the control system sends a command to the pressing drive to reset the counterweight plate 421. The cured material plate and resin plate are then placed on the fixed support plate 410 of the curing mechanism 400. The next material base and resin plate bond 500 repeat the above operation for curing, which will not be described in detail here.

[0064] When it is necessary to retrieve the cured material and resin plates, the control device will automatically match the curing mechanism 400 that stores the cured material and resin plates in the buffer 100, and compare it to the curing mechanism 400 in the same storage layer 110 that is relatively close to the discharge port 112 and has no obstructions on the movement path of the translation pallet 223. The cured material and resin plates in that mechanism will be selected as the retrieval target. Then, the lifting drive 211 will be controlled to operate, so that the lifting moving part 212 reaches the corresponding storage layer 110. After the lifting moving part 212 stabilizes, the translation drive 221 will be controlled to operate, so that the telescopic guide rail 222 will extend, driving the translation pallet 223 to move between the fixed pallets 410 of the curing mechanism 400, and to be located under the cured material and resin plates. When the position sensor at the curing mechanism 400 detects that the translation tray 223 is at a preset position below the fixed tray 410, it transmits a signal to the control device. The control device then sends a command to the lifting drive 211, which moves the translation tray 223 upwards, thereby lifting the cured material base and resin plate. Another position sensor detects that the cured material base and resin plate are on the translation tray 223 and transmits a signal to the control device. The control device then sends a command to the translation drive 221, causing the telescopic guide rail 222 to reset and move the translation tray 223 to the outside of the buffer 100. The lifting drive 211 then operates, bringing the cured material base and resin plate to a set height for easy access, allowing them to proceed to the next process. The same operation is repeated for the next cured material base and resin plate to be retrieved; details are omitted here.

[0065] The advantages and positive effects of this utility model are:

[0066] 1. By combining the curing process with storage, the accumulation of materials can be avoided, which may affect the operation of the production line. At the same time, the material holder and resin plate do not need to be transferred multiple times, thus ensuring the bonding quality of the material holder and resin plate.

[0067] 2. The cache library proposed in this utility model can be set with multiple storage layers as needed, and each storage layer can be set with multiple solidification mechanisms, which has strong storage capacity and maximizes space utilization; each solidification mechanism operates independently, which improves the overall solidification efficiency.

[0068] 3. The curing mechanism fixes the material seat in a preset position by setting positioning components, adjusts the position of the resin board in the length direction by the first alignment component, and adjusts the position of the resin board in the width direction by the second alignment component, so that the resin board can be accurately aligned with the material seat, thereby improving the bonding accuracy between the material seat and the resin board.

[0069] 4. By setting up feeding and unloading mechanisms, the pre-cured material plates and resin plates are taken out from the buffer first, ensuring the curing time of the material base and resin plates. This allows for rapid curing and transfer of the material base and resin plates, providing high flexibility.

[0070] 5. The feeding mechanism, curing mechanism, and unloading mechanism are all automatically controlled, with precise linkage and rapid response, ensuring the curing and bonding quality of the material base and resin board. This enables effective and reasonable control of both the curing and storage processes, improving the curing and storage efficiency of the material base and resin board, and further saving costs.

[0071] The embodiments of this utility model have been described in detail above, but the content described is only a preferred embodiment of this utility model and should not be considered as limiting the scope of implementation of this utility model. All equivalent changes and improvements made in accordance with the claims of this utility model should still fall within the patent coverage of this utility model.

Claims

1. A material holder and resin plate curing buffer device, characterized in that, include: The cache library has several independently configured storage layers, and each storage layer is provided with several independent curing mechanisms for pressing the adhesive between the material base and the resin board to cure it. The feeding mechanism is located in the buffer and is equipped with a lifting component and a translation component; the translation component is connected to the lifting component and can be aligned and connected with the curing mechanism.

2. The material holder and resin plate curing buffer device according to claim 1, characterized in that: The lifting assembly includes a lifting drive and a lifting moving part. The lifting moving part is connected to the drive end of the lifting drive and moves up and down along the buffer under the action of the lifting drive. The translation component is connected to the lifting and moving component.

3. The material holder and resin plate curing buffer device according to claim 2, characterized in that: The translation component includes: a translation drive, a telescopic guide rail, and a translation tray. The translation drive and the telescopic guide rail are mounted on the lifting and moving component. The translation tray is connected to the telescopic guide rail, which is connected to the drive end of the translation drive. The telescopic guide rail can extend and retract relative to the lifting and moving component to facilitate the delivery of the adhesive body between the material base and the resin board to the curing mechanism.

4. The material holder and resin plate curing buffer device according to claim 3, characterized in that: Several curing mechanisms are arranged sequentially along the telescopic guide rail, including oppositely arranged fixed trays with a gap between them for the translational tray to pass between them.

5. The material holder and resin plate curing buffer device according to claim 4, characterized in that: The curing mechanism further includes a pressing assembly, which includes a counterweight plate and a counterweight drive component. The counterweight plate is connected to the drive end of the counterweight drive component and is located above the fixed support plate. Under the action of the counterweight drive component, it moves closer to or further away from the fixed support plate.

6. The material holder and resin plate curing buffer device according to claim 4 or 5, characterized in that: The curing mechanism also includes a positioning element, which is disposed opposite to the fixed support plate and is used to position the material seat in the width direction.

7. The material holder and resin plate curing buffer device according to claim 4 or 5, characterized in that: The curing mechanism further includes a first alignment component arranged opposite to each other, including a stop member and a stop driving member. The stop member is connected to the driving end of the stop driving member and is used to adjust the position of the resin board in the length direction.

8. The material holder and resin plate curing buffer device according to claim 7, characterized in that: The curing mechanism further includes a second alignment component arranged opposite to each other, including alignment strips and alignment drive components. The alignment strips are arranged opposite to the drive end of the alignment drive components and move closer or further apart from each other under the control of the alignment drive components to adjust the position of the resin board in the width direction.

9. The material holder and resin plate curing buffer device according to any one of claims 1-5, characterized in that: It also includes a feeding mechanism, which is disposed opposite to the feeding mechanism on both sides of the buffer, including the lifting component and the translation component, for removing the cured material seat and resin plate from the buffer.

10. The material holder and resin plate curing buffer device according to claim 9, characterized in that: It also includes a control device and several position sensors, wherein the control device is electrically connected to the lifting assembly, the translation assembly, the curing mechanism and the position sensors respectively.

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