Photoelectric conversion sensor probe packaging structure

Abstract

The utility model discloses a photoelectric conversion sensor probe packaging structure which comprises a shell and end covers installed at the two ends of the shell in a sealed mode, a photoelectric conversion circuit board is arranged in the shell, step-shaped cabin penetrating holes are formed in the end covers, and direct insertion pin headers are installed in the cabin penetrating holes. A gap between the straight pin header and the cabin penetrating hole is filled with a sealant layer, and the inner side end of the straight pin header is electrically connected with the photoelectric conversion circuit board through a cable. By adopting the photoelectric conversion sensor probe packaging structure provided by the invention, the sealing performance and the wiring convenience are improved.

Description

Technical Field

[0001] This utility model relates to the field of underwater acoustic detection technology, specifically to a photoelectric conversion sensor probe packaging structure. Background Technology

[0002] Fiber optic towed arrays measure the array's heading, pitch, and depth in water using sensors, providing a realistic representation of the array's underwater state. However, due to the significant noise from tugboats, the array and tugboat are typically separated by a long tow cable (over 1.5 km). But electrical signals are susceptible to data loss over long distances due to electromagnetic interference, battery material variations, and communication speed issues. Therefore, converting electrical signals to optical signals for transmission is considered. Currently, common photoelectric conversion sensor probe structures have shortcomings in terms of sealing and ease of wiring. Utility Model Content

[0003] In view of this, the purpose of this utility model is to provide a photoelectric conversion sensor probe packaging structure to improve its sealing performance and the convenience of wiring.

[0004] This utility model solves the above problems through the following technical means: a photoelectric conversion sensor probe packaging structure, including a shell and end caps sealed at both ends of the shell, a photoelectric conversion circuit board is provided inside the shell, a stepped through hole is opened on the end cap, a straight pin header is installed in the through hole, a sealant layer is filled in the gap between the straight pin header and the through hole, and the inner end of the straight pin header is electrically connected to the photoelectric conversion circuit board through a cable.

[0005] Furthermore, a non-metallic bracket is provided inside the housing, and the photoelectric conversion circuit board is fixedly connected to the non-metallic bracket.

[0006] Furthermore, the photoelectric conversion circuit board is fixedly connected to the non-metallic bracket by a first screw.

[0007] Furthermore, the non-metallic bracket is fixedly connected to one of the end caps.

[0008] Furthermore, the non-metallic bracket is fixedly connected to one of the end caps by a second screw.

[0009] Furthermore, the end cap is fixedly connected to the outer casing by a third screw.

[0010] Furthermore, a sealing ring is installed between the outer shell and the end cap.

[0011] The beneficial effects of this utility model are as follows: A photoelectric conversion sensor probe packaging structure of this application includes a housing and end caps sealed at both ends of the housing. A photoelectric conversion circuit board is disposed inside the housing. The end caps have stepped through-holes, and straight-through pin headers are installed within the through-holes. The gap between the straight-through pin headers and the through-holes is filled with a sealant layer. The inner ends of the straight-through pin headers are electrically connected to the photoelectric conversion circuit board via cables. Using the photoelectric conversion sensor probe packaging structure of this application improves sealing performance and ease of wiring. Attached Figure Description

[0012] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0013] Figure 1 This is a three-dimensional schematic diagram of the present invention;

[0014] Figure 2 This is a cross-sectional view of the present invention. Detailed Implementation

[0015] The present invention will now be described in detail with reference to the accompanying drawings.

[0016] like Figures 1 to 2 As shown, a photoelectric conversion sensor probe packaging structure of this embodiment includes a housing 9 and end caps 3 sealed at both ends of the housing. A sealing ring 7 is installed between the end caps and the housing. The housing is cylindrical, and the end caps are fixedly connected to the housing by a third screw 5.

[0017] The housing contains a photoelectric conversion circuit board 1 and a non-metallic bracket 2. The photoelectric conversion circuit board is fixedly connected to the non-metallic bracket by a first screw 8. Preferably, the non-metallic bracket is fixedly connected to one of the end caps by a second screw 6. Thus, the photoelectric conversion circuit board can be moved through the end cap, improving its ease of entry and exit from the housing.

[0018] The end cap has a stepped through hole, and a straight pin header 4 is installed in the through hole. The gap between the straight pin header and the through hole is filled with a sealant layer. The inner end of the straight pin header is electrically connected to the photoelectric conversion circuit board via a cable.

[0019] In use, connect the electrical signal cable to the through-hole header at one end, and connect the optical signal fiber to the through-hole header at the other end. The electrical signal is input to the photoelectric conversion circuit board from the end cover on one side of the package structure through the wire. After being converted into an optical signal by the photoelectric conversion circuit board, it is transmitted from the other end through the optical fiber.

[0020] In summary, the photoelectric conversion sensor probe packaging structure of this application has the advantages of pre-installed through-hole pins, which improves the convenience of wiring, and the sealing performance of the components is ensured by the design of sealing rings, sealing adhesive layers, and stepped through-holes.

[0021] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model and are not limiting. Although the utility model is described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A photoelectric conversion sensor probe packaging structure, characterized in that: The device includes an outer casing and end caps sealed at both ends of the casing. A photoelectric conversion circuit board is housed within the outer casing. Each end cap has a stepped through-hole, into which a through-hole header is installed. A sealant layer fills the gap between the through-hole and the through-hole. The inner end of the through-hole header is electrically connected to the photoelectric conversion circuit board via a cable. A non-metallic bracket is housed within the outer casing, and the photoelectric conversion circuit board is fixedly connected to the non-metallic bracket. The non-metallic bracket is fixedly connected to one of the end caps. A sealing ring is installed between the outer casing and the end caps.

2. The photoelectric conversion sensor probe packaging structure according to claim 1, characterized in that: The photoelectric conversion circuit board is fixedly connected to the non-metallic bracket by the first screw.

3. The photoelectric conversion sensor probe packaging structure according to claim 2, characterized in that: The non-metallic bracket is fixedly connected to one of the end caps by a second screw.

4. The photoelectric conversion sensor probe packaging structure according to claim 3, characterized in that: The end cap is fixedly connected to the outer shell by a third screw.

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