High-temperature and high-humidity aging test box for electronic components

Abstract

The utility model belongs to the technical field of aging test, and provides a high-temperature and high-humidity aging test box for electronic components, which comprises a test box body, a box door and at least one group of test units, and is characterized in that one end of the test box body is open and is matched with the box door to form a closed space for accommodating a to-be-tested device and providing a high-temperature and high-humidity test environment; the testing unit comprises an aging plate, a driving plate and a connecting assembly, and the aging plate is arranged on the inner side face, close to the testing box body, of the box door and used for being connected with a to-be-tested device for aging testing; the driving plate is arranged on the outer side surface, far away from the test box body, of the box door and connected with the burn-in board through a connecting assembly. The driving plate is arranged on the side, away from the test box body, of the box door, the driving plate can be placed in a normal-temperature environment, the service life of the driving plate is prolonged, the driving plate can be directly detached and replaced outside the box door when needing to be maintained, the driving plate can be rapidly and conveniently replaced and recovered, working procedures and working hours are saved, and the maintenance efficiency is improved.

Description

Technical Field

[0001] This application belongs to the field of aging test technology, and more specifically, relates to a high temperature and high humidity aging test chamber for electronic components. Background Technology

[0002] With the continuous development of cutting-edge technology industries such as optical communication and 5G communication, the importance of electronic components such as chips and optical modules, which are widely used in these industries, is becoming increasingly prominent. Reliability testing has become an essential quality testing step before these electronic components leave the factory. It mainly tests the power-on operation status and performance indicators of electronic components in high temperature and high humidity environments, and monitors their electrical variables, performance indicators, and chemical or physical changes during operation, so as to screen out defective products in advance.

[0003] In traditional reliability testing, the driver board and aging board are connected together and placed in a high-temperature and high-humidity aging test chamber. During testing, the driver board is subjected to the impact of the high-temperature and high-humidity test environment, causing damage and short circuits to the module.

[0004] CN218213231U discloses an aging test device for TO lasers under high temperature and high humidity conditions. This patent features an inner chamber within a high temperature and high humidity test chamber, with a drive board sealed inside. The drive board is electrically connected to an aging board outside the inner chamber via an adapter plate. During testing, electronic components are mounted on the aging board and placed in the high temperature and high humidity environment, while the drive board is isolated from the test environment, extending its lifespan. The adapter plate, instead of the drive board, withstands the environmental impact of the high temperature and high humidity test and, as a consumable, can be quickly replaced, reducing maintenance costs. However, this patent also has some drawbacks. When the drive board requires maintenance, the inner chamber must be completely removed from the test chamber, and the bottom plate of the inner chamber must be removed to extract the drive board. During this process, the connecting lines and ventilation ducts between the inner chamber and the test chamber must also be disconnected, and the drive board must be replaced before reassembly. The disassembly and reassembly procedures are complex, cumbersome, technically demanding, and time-consuming. Utility Model Content

[0005] In response to the deficiencies or improvement needs of existing technologies, this application provides a high-temperature and high-humidity aging test chamber for electronic components, which aims to solve the problem of difficult maintenance of the drive board of existing aging test equipment.

[0006] This application provides a high-temperature and high-humidity aging test chamber for electronic components, including a test chamber body, a door, and at least one set of test units, wherein: one end of the test chamber body is open and cooperates with the door to form a sealed space for accommodating the device under test and providing a high-temperature and high-humidity test environment; the test unit includes an aging board, a drive board, and a connecting assembly; the aging board is disposed on the inner side of the door near the test chamber body for connecting with the device under test to perform aging tests; the drive board is disposed on the outer side of the door away from the test chamber body and is connected to the aging board through the connecting assembly.

[0007] Compared with the prior art, the above-described technical solution conceived in this application not only allows the drive board to be placed in a normal temperature environment, thus improving its service life, but also allows the drive board to be disassembled and replaced directly outside the door when maintenance is required, effectively simplifying the drive board maintenance process.

[0008] As a further preferred embodiment, the connection assembly includes a first connection module, a second connection module, and a connection plate connecting the first connection module and the second connection module. The first connection module is disposed on the outer side of the door and includes a first adapter plate and a first connector and a second connector disposed on both sides of the first adapter plate and connected by the first adapter plate. The first connector is used to insert a drive board, and the second connector is used to insert the front end of the connection plate. The connection plate passes through the door and has a third connector at the rear end for inserting an aging board. The second connection module is disposed on the inner side of the door and includes a mounting base. One end of the mounting base is connected to the third connector, and the other end is used to accommodate the aging board.

[0009] As a further preferred embodiment, the door has an adapter window, and the connecting assembly further includes a drive mounting plate and an aging mounting plate. The drive mounting plate and the aging mounting plate are arranged opposite to each other and respectively cover the outer and inner sides of the adapter window. The drive mounting plate has a through hole for the second connector to pass through and is fixedly connected to the first adapter plate. The aging mounting plate has a through hole for the connecting plate to pass through.

[0010] As a further preferred embodiment, the connection assembly includes a first connection module, a second connection module, and wires connecting the first connection module and the second connection module. The first connection module is disposed on the outer side of the door and includes a first adapter plate and a first connector and a second connector disposed on both sides of the first adapter plate and connected through the first adapter plate. The first connector is used to insert a drive board, and the second connector is connected to the wires. The second connection module is disposed on the inner side of the door and includes a second adapter plate and a fourth connector and a fifth connector disposed on both sides of the second adapter plate and connected through the second adapter plate, as well as a mounting base. The fourth connector is connected to the wires, the fifth connector is used to insert an aging board, and one end of the mounting base is fixedly connected to the second adapter plate, while the other end is used to accommodate the aging board.

[0011] As a further preferred embodiment, the door has an adapter window, and the connection assembly further includes a drive mounting plate and an aging mounting plate. The drive mounting plate and the aging mounting plate are arranged opposite to each other and respectively cover the outer and inner sides of the adapter window. The drive mounting plate has a through hole for the second connector to pass through and is fixedly connected to the first adapter plate. The aging mounting plate has a through hole for the fourth connector to pass through and is fixedly connected to the second adapter plate.

[0012] As a further preferred embodiment, the high temperature and high humidity aging test chamber for electronic components also includes a protective cover, which is disposed on the outer side of the chamber door and covers the outside of the drive board.

[0013] As a further preferred embodiment, the bottom of the protective cover is hollowed out, and a fan is installed on the top of the protective cover.

[0014] As a further preferred embodiment, the aging board is provided with at least one test station, and the test station is provided with an aging test socket for connecting to the device under test.

[0015] As a further preferred embodiment, the drive board is arranged longitudinally to facilitate heat dissipation.

[0016] In summary, compared with the prior art, the technical solutions conceived in this application have the following main technical advantages:

[0017] 1. This application fixes the drive board to the door on the side away from the test chamber. This not only allows the drive board to be placed in a normal temperature environment, thus improving its service life, but also allows the drive board to be disassembled and replaced directly outside the door when maintenance is required. This enables quick and convenient replacement and restoration of the drive board, saving process time and improving maintenance efficiency.

[0018] 2. At the same time, this application optimizes the structure of the connecting components, which can facilitate mass production while achieving stable installation of the drive board and aging board. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the high temperature and high humidity aging test chamber for electronic components provided in the embodiments of this application;

[0020] Figure 2 This is a schematic diagram of the door structure of the high temperature and high humidity aging test chamber for electronic components provided in the embodiments of this application;

[0021] Figure 3 This is a schematic diagram showing the connection between the drive board and the aging board in the high temperature and high humidity aging test chamber for electronic components provided in this application embodiment;

[0022] Figure 4 This is an exploded schematic diagram of the connecting components and the door in the high temperature and high humidity aging test chamber for electronic components provided in this application embodiment;

[0023] Figure 5 This is a schematic diagram showing the connection between the drive board and the aging board in a high-temperature and high-humidity aging test chamber for electronic components provided in another embodiment of this application.

[0024] In all the accompanying drawings, the same reference numerals are used to denote the same elements or structures, wherein:

[0025] 1-Box door, 2-Test box, 3-Aging board, 4-Drive board, 5-Connecting assembly, 51-First connecting module, 511-First adapter board, 512-First connector, 513-Second connector, 52-Second connecting module, 521-Mounting base, 522-Fourth connector, 523-Fifth connector, 524-Second adapter board, 53-Connecting board, 531-Third connector, 54-Wire, 6-Test station, 7-Aging mounting plate, 8-Drive mounting plate, 9-Adapter window, 10-Protective cover, 11-Fan. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0027] like Figure 1 , 2 As shown, this application provides a high-temperature and high-humidity aging test chamber for electronic components, specifically including a test chamber body 2, a door 1, and at least one set of test units, wherein:

[0028] One end of the test chamber 2 is open and cooperates with the door 1 to form a sealed space. The test chamber 2 is used to accommodate the device under test and provide a high temperature and high humidity test environment. Figure 1This is a schematic diagram of the door 1 in the open state. The test chamber 2 has a hollow cavity to accommodate the device under test.

[0029] The test unit includes an aging plate 3, a drive plate 4, and a connecting component 5. The aging plate 3 is located on the inner side of the door 1 near the test chamber 2 and is used to connect with the device under test for aging testing. The drive plate 4 is located on the outer side of the door 1 away from the test chamber 2 and is connected to the aging plate 3 through the connecting component 5.

[0030] During aging tests, the chamber door 1 is closed, and the aging board 3 is sealed in the high temperature and high humidity environment inside the test chamber 2 for testing, while the drive board 4 is placed in the normal temperature environment outside the test chamber 2, which can effectively improve its service life. When the drive board 4 needs maintenance, it can be directly disassembled and replaced outside the chamber door 1, saving process time and improving maintenance efficiency, thereby effectively simplifying the drive board maintenance process.

[0031] According to a preferred embodiment of this application, such as Figure 3 As shown, the connecting component 5 includes a first connecting module 51, a second connecting module 52, and a connecting plate 53 connecting the first connecting module 51 and the second connecting module 52. The first connecting module 51 is disposed on the outer side of the door 1 and includes a first adapter plate 511 and a first connector 512 and a second connector 513 disposed on both sides of the first adapter plate 511 and connected by the first adapter plate 511. The first connector 512 is used to insert the drive board 4, and the second connector 513 is used to insert the front end of the connecting plate 53. The connecting plate 53 passes through the door 1 and has a third connector 531 at the rear end for inserting the aging board 3. The second connecting module 52 is disposed on the inner side of the door 1 and includes a mounting base 521. One end of the mounting base 521 is connected to the third connector 531 by a screw, and the other end is used to accommodate the aging board 3. The aging board 3 is inserted into the mounting base 521 and finally inserted into the third connector 531 for fixation.

[0032] More preferably, such as Figure 4 As shown, the door 1 has an adapter window 9. The connecting assembly 5 also includes a drive mounting plate 8 and an aging mounting plate 7. The drive mounting plate 8 and the aging mounting plate 7 are arranged opposite to each other and respectively cover the outer and inner sides of the adapter window 9. The drive mounting plate 8 has a through hole for the second connector 513 to pass through. The first adapter plate 511 is fixedly mounted on the drive mounting plate 8 by screws. The second connector 513 extends into the adapter window 9 through the through hole. The aging mounting plate 7 has a through hole for the connecting plate 53 to pass through. The connecting plate 53 extends into the adapter window 9 through the through hole and is inserted into the second connector 513.

[0033] In another preferred embodiment of this application, such as Figure 5As shown, the connecting component 5 includes a first connecting module 51, a second connecting module 52, and a wire 54 connecting the first connecting module 51 and the second connecting module 52. The first connecting module 51 is located on the outer side of the door 1 and includes a first adapter plate 511 and a first connector 512 and a second connector 513 located on both sides of the first adapter plate 511 and connected through the first adapter plate 511. The first connector 512 is used to insert the drive board 4, and the second connector 513 is connected to the wire 54. The second connecting module 52 is located on the inner side of the door 1 and includes a second adapter plate 524 and a fourth connector 522 and a fifth connector 523 located on both sides of the second adapter plate 524 and connected through the second adapter plate 524, as well as a mounting base 521. The fourth connector 522 is connected to the wire 54, and the fifth connector 523 is used to insert the aging board 3. One end of the mounting base 521 is fixedly connected to the second adapter plate 524, and the other end is used to accommodate the aging board 3.

[0034] More preferably, the door 1 has an adapter window 9, and the connecting assembly 5 also includes a drive mounting plate 8 and an aging mounting plate 7. The drive mounting plate 8 and the aging mounting plate 7 are arranged opposite to each other and respectively cover the outer and inner sides of the adapter window 9. The drive mounting plate 8 has a through hole for the second connector 513 to pass through. The first adapter plate 511 is fixedly mounted on the drive mounting plate 8 with screws. The second connector 513 passes through the through hole and extends into the adapter window 9 and connects to the wire 54. The aging mounting plate 7 has a through hole for the fourth connector 522 to pass through. The second adapter plate 524 is fixedly mounted on the aging mounting plate 7 with screws. The fourth connector 522 passes through the through hole and extends into the adapter window 9 and connects to the wire 54.

[0035] Furthermore, the high-temperature and high-humidity aging test chamber for electronic components also includes a protective cover 10. The protective cover 10 is located on the outer side of the chamber door 1 and covers the outside of the drive board 4 to protect the drive board 4. In order to maintain a normal temperature environment around the drive board 4, the bottom of the protective cover 10 is hollowed out, and a fan 11 is installed on the top of the protective cover 10. The drive boards 4 are arranged longitudinally, so that airflow flows from top to bottom through each drive board 4, carrying away the heat generated by the operation of the drive board 4 and maintaining a normal temperature environment around the drive board 4.

[0036] Furthermore, the aging board 3 is provided with at least one test station 6, and the test station 6 is provided with an aging test socket for connecting to the device under test to perform aging tests on the device under test.

[0037] Furthermore, the high-temperature and high-humidity aging test chamber for electronic components includes two or more test units, enabling batch aging tests. Only one set of aging board mounting plate 7 and driver mounting plate 8 is required. Figure 4 This is a schematic diagram of the chamber door for batch aging tests.

[0038] It should be understood that expressions such as "comprising" and "may include" as used in this application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In this application, terms such as "comprising" and / or "having" may be interpreted as indicating a specific characteristic, number, operation, constituent element, component, or combination thereof, but should not be interpreted as excluding the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.

[0039] It should be understood that the terms “center,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0040] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0041] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0042] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A high-temperature and high-humidity aging test chamber for electronic components, characterized in that, The test chamber includes a test chamber (2), a door (1), and at least one set of test units, wherein: one end of the test chamber (2) is open and cooperates with the door (1) to form a sealed space for accommodating the device under test and providing a high temperature and high humidity test environment; the test unit includes an aging board (3), a drive board (4), and a connecting component (5); the aging board (3) is located on the inner side of the door (1) near the test chamber (2) for connecting with the device under test to perform aging tests; the drive board (4) is located on the outer side of the door (1) away from the test chamber (2) and is connected to the aging board (3) through the connecting component (5).

2. The high-temperature and high-humidity aging test chamber for electronic components as described in claim 1, characterized in that, The connecting component (5) includes a first connecting module (51), a second connecting module (52), and a connecting plate (53) connecting the first connecting module (51) and the second connecting module (52). The first connecting module (51) is disposed on the outer side of the door (1) and includes a first adapter plate (511) and a first connector (512) and a second connector (513) disposed on both sides of the first adapter plate (511) and connected by the first adapter plate (511). The first connector (512) is used to insert the drive board (4), and the second connector (513) is used to insert the front end of the connecting plate (53). The connecting plate (53) passes through the door (1) and has a third connector (531) at the rear end for inserting the aging board (3). The second connecting module (52) is disposed on the inner side of the door (1) and includes a mounting base (521). One end of the mounting base (521) is connected to the third connector (531), and the other end is used to accommodate the aging board (3).

3. The high-temperature and high-humidity aging test chamber for electronic components as described in claim 2, characterized in that, The door (1) has a transfer window (9). The connecting assembly (5) also includes a drive mounting plate (8) and an aging mounting plate (7). The drive mounting plate (8) and the aging mounting plate (7) are arranged opposite to each other and respectively cover the outer and inner sides of the transfer window (9). The drive mounting plate (8) has a through hole for the second connector (513) to pass through and is fixedly connected to the first adapter plate (511). The aging mounting plate (7) has a through hole for the connecting plate (53) to pass through.

4. The high-temperature and high-humidity aging test chamber for electronic components as described in claim 1, characterized in that, The connection assembly (5) includes a first connection module (51), a second connection module (52), and a wire (54) connecting the first connection module (51) and the second connection module (52). The first connection module (51) is disposed on the outer side of the door (1) and includes a first adapter plate (511), a first connector (512) disposed on both sides of the first adapter plate (511) and a second connector (513) connected by the first adapter plate (511). The first connector (512) is used to insert the drive board (4), and the second connector (513) is used to connect the wire. (54) Connection; The second connection module (52) is disposed on the inner side of the door (1), including a second adapter plate (524) and a fourth connector (522) and a fifth connector (523) disposed on both sides of the second adapter plate (524) and connected by the second adapter plate (524) and a mounting base (521). The fourth connector (522) is connected to the wire (54), the fifth connector (523) is used to insert the aging board (3), one end of the mounting base (521) is fixedly connected to the second adapter plate (524), and the other end is used to accommodate the aging board (3).

5. The high-temperature and high-humidity aging test chamber for electronic components as described in claim 4, characterized in that, The door (1) has a transfer window (9). The connecting assembly (5) also includes a drive mounting plate (8) and an aging mounting plate (7). The drive mounting plate (8) and the aging mounting plate (7) are arranged opposite to each other and respectively cover the outer and inner sides of the transfer window (9). The drive mounting plate (8) has a through hole for the second connector (513) to pass through and is fixedly connected to the first adapter plate (511). The aging mounting plate (7) has a through hole for the fourth connector (522) to pass through and is fixedly connected to the second adapter plate (524).

6. The high-temperature and high-humidity aging test chamber for electronic components as described in any one of claims 1 to 5, characterized in that, The high temperature and high humidity aging test chamber for electronic components also includes a protective cover (10), which is located on the outer side of the door (1) and covers the outside of the drive plate (4).

7. The high-temperature and high-humidity aging test chamber for electronic components as described in claim 6, characterized in that, The bottom of the protective cover (10) is hollowed out, and a fan (11) is installed on the top of the protective cover (10).

8. The high-temperature and high-humidity aging test chamber for electronic components as described in any one of claims 1 to 5, characterized in that, The aging board (3) is provided with at least one test station (6), and the test station (6) is provided with an aging test socket for connecting to the device under test.

9. The high-temperature and high-humidity aging test chamber for electronic components as described in any one of claims 1 to 5, characterized in that, The drive board (4) is arranged longitudinally.

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