Functional module applied to IC (Integrated Circuit) support plate test

Abstract

The utility model belongs to the field of circuit board testing equipment, and particularly relates to a functional module applied to IC (integrated circuit) carrier board testing, which comprises a base, two vertical plates are fixedly mounted at the top of the base, a same transverse plate is fixedly mounted at the tops of the two vertical plates, and testing assemblies used for IC carrier board testing are mounted at the bottoms of the transverse plates. The same test board is fixedly mounted between the two vertical plates, a placement plate is slidably mounted at the top of the test board, a plurality of placement holes for placement of the IC carrier board are formed in the top of the placement plate, the placement holes are sequentially reduced from left to right, an adjusting mechanism is arranged on the test board and connected with the placement plate, and the placement plate is connected with the adjusting mechanism. A storage groove is formed in the top of the testing table, and a top plate is placed in the storage groove. According to the utility model, the design is reasonable, the IC support plates with different sizes can be fixedly placed through the arrangement of the plurality of placing holes with different sizes, and the IC support plates can be tested through the probes in the test assembly.

Description

Technical Field

[0001] This utility model relates to the field of circuit board testing equipment technology, and in particular to a functional module for IC carrier board testing. Background Technology

[0002] IC carrier boards are mainly used to carry ICs. They have internal circuits to conduct signals between the chip and the circuit board. In addition to their carrying function, IC carrier boards also have additional functions such as protection circuits, dedicated lines, heat dissipation design, and the establishment of modular standards for components.

[0003] IC substrates require testing after production. Traditional testing equipment typically places the substrate in the testing device for positioning and fixation before performing functional tests. However, due to rapid advancements in manufacturing technology, IC substrates are becoming increasingly smaller, making it difficult to position and fix IC substrates of different sizes on the testing device during testing. Therefore, we propose a functional module for IC substrate testing to address these issues. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a functional module for IC carrier board testing.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A functional module for IC carrier board testing includes a base, two vertical plates are fixedly installed on the top of the base, and the same horizontal plate is fixedly installed on the top of the two vertical plates. Test components for IC carrier board testing are installed at the bottom of the horizontal plate.

[0007] A test platform is fixedly installed between the two vertical plates. A placement plate is slidably installed on the top of the test platform. The top of the placement plate has multiple placement holes for placing IC carrier boards, and the number of placement holes decreases from left to right. An adjustment mechanism is provided on the test platform, and the adjustment mechanism is connected to the placement plate.

[0008] The test bench has a storage slot at the top, in which a top plate is placed. A vertical rod is fixedly installed at the bottom of the top plate, and the bottom end of the vertical rod extends to the bottom of the test bench and is fixedly installed with a push plate. A compression spring is fixedly installed at the top of the push plate, and the top of the compression spring is fixedly installed on the bottom of the test bench.

[0009] Preferably, the adjustment mechanism includes a drive hole and a drive plate. The drive hole is located on the top of the test bench, and the drive plate is slidably installed inside the drive hole. The drive plate is fixedly connected to the placement plate through a disassembly mechanism.

[0010] Preferably, multiple limiting rods are fixedly installed on the inner walls of both sides of the driving hole, and the driving plate is slidably sleeved on the corresponding limiting rods.

[0011] Preferably, the disassembly mechanism includes a mounting hole, a fixing screw, and a fixing nut. The mounting hole is formed on the drive plate, the fixing screw is fixedly mounted on the placement plate, and the fixing screw passes through the corresponding mounting hole and is threaded with a fixing nut.

[0012] Preferably, a connecting seat is fixedly installed at the bottom of the test bench, and a driving mechanism for driving the drive plate is provided between the connecting seat and the vertical plate.

[0013] Preferably, the driving mechanism includes a threaded rod and a rotating plate. The same threaded rod is rotatably mounted between the connecting seat and the vertical plate. One end of the threaded rod passes through the corresponding vertical plate and is fixedly mounted on the rotating plate. The driving plate is threadedly sleeved on the threaded rod.

[0014] Preferably, the rotating plate has bolt holes, and locking bolts are installed in the internal threads of the bolt holes.

[0015] Preferably, a plurality of U-shaped seats are fixedly installed on the top of the test bench, and pressure rollers are rotatably installed on the inner walls of both sides of the U-shaped seats, and the pressure rollers are adapted to the placement plate.

[0016] The beneficial effects of this utility model are:

[0017] 1. When testing IC carrier boards of different sizes, the drive board can move the placement board by means of the rotating plate, threaded rod, threaded rod, and drive board. The placement board can place the placement holes, thereby moving the placement holes of different sizes directly under the test component, which facilitates the placement of IC carrier boards of different sizes. The IC carrier board can be tested by the probes in the test component.

[0018] 2. After the test is completed, by pushing the push plate upward, the push plate can move upward and compress the compression spring. The push plate can drive the top plate to move upward through the vertical rod. The top plate can push the IC carrier board out of the placement hole, which can facilitate the removal of the IC carrier board.

[0019] 3. By rotating the fixing bolt, the fixing bolt can be separated from the fixing screw, thereby allowing the placement plate to be removed from the drive plate and replaced. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of a functional module for IC carrier board testing proposed in this utility model;

[0021] Figure 2This is a cross-sectional three-dimensional structural diagram of a test module for IC carrier boards proposed in this utility model;

[0022] Figure 3 This is a schematic diagram of part A of a functional module for IC carrier board testing proposed in this utility model;

[0023] Figure 4 This is a schematic diagram of part B of a functional module for IC carrier board testing proposed in this utility model.

[0024] In the diagram: 1. Base; 2. Vertical plate; 3. Horizontal plate; 4. Test assembly; 501. Test platform; 502. Placement plate; 503. Placement hole; 601. Drive hole; 602. Drive plate; 603. Limiting rod; 701. Connecting seat; 702. Threaded rod; 703. Rotating plate; 704. Locking bolt; 801. Mounting hole; 802. Fixing screw; 803. Fixing nut; 901. Storage slot; 902. Top plate; 903. Vertical rod; 904. Push plate; 905. Compression spring; 1001. U-shaped seat; 1002. Pressure roller. Detailed Implementation

[0025] The technical solution of this utility model will now be clearly and completely described with reference to specific embodiments. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0026] Reference Figure 1-4A functional module for IC carrier board testing includes a base 1. Two vertical plates 2 are fixedly mounted on the top of the base 1. A horizontal plate 3 is fixedly mounted on the top of the two vertical plates 2. A test assembly 4 for IC carrier board testing is mounted on the bottom of each horizontal plate 3. More specifically, the test assembly 4 includes a telescopic arm and test probes. A test stage 501 is fixedly mounted between the two vertical plates 2. A placement plate 502 is slidably mounted on the top of the test stage 501. The top of the placement plate 502 has multiple placement holes 503 for placing the IC carrier board, and the holes 503 decrease in size from left to right. The test platform 501 is equipped with an adjustment mechanism, which is connected to the placement plate 502. By providing placement holes 503 of different sizes, IC carrier boards of different sizes can be fixedly placed. The top of the test platform 501 is provided with a storage slot 901, in which a top plate 902 is placed. A vertical rod 903 is fixedly installed at the bottom of the top plate 902. The bottom end of the vertical rod 903 extends to the bottom of the test platform 501 and is fixedly installed with a push plate 904. A compression spring 905 is fixedly installed at the top of the push plate 904, and the top of the compression spring 905 is fixedly installed on the bottom of the test platform 501.

[0027] In this embodiment, the adjustment mechanism includes a drive hole 601 and a drive plate 602. The drive hole 601 is opened on the top of the test platform 501. The drive plate 602 is slidably installed in the drive hole 601. The drive plate 602 is fixedly connected to the placement plate 502 through a disassembly mechanism. By providing the drive plate 602, the movement of the drive plate 602 can drive the placement plate 502 to move. Multiple limiting rods 603 are fixedly installed on the inner walls of both sides of the drive hole 601, and the drive plate 602 is slidably sleeved on the corresponding limiting rods 603. By providing the limiting rods 603, the drive plate 602 can be guided, thereby achieving the purpose of stable movement of the drive plate 602.

[0028] In this embodiment, the disassembly mechanism includes a mounting hole 801, a fixing screw 802, and a fixing nut 803. The mounting hole 801 is formed on the drive plate 602, and the fixing screw 802 is fixedly installed on the placement plate 502. The fixing screw 802 passes through the corresponding mounting hole 801 and is threaded with the fixing nut 803. By providing the fixing nut 803 and the fixing screw 802, the purpose of disassembling and assembling the placement plate 502 can be achieved.

[0029] In this embodiment, a connecting seat 701 is fixedly installed at the bottom of the test platform 501. A driving mechanism for driving the driving plate 602 is provided between the connecting seat 701 and the vertical plate 2. The driving mechanism includes a threaded rod 702 and a rotating plate 703. The same threaded rod 702 is rotatably installed between the connecting seat 701 and the vertical plate 2. One end of the threaded rod 702 passes through the corresponding vertical plate 2 and is fixedly installed with the rotating plate 703. The driving plate 602 is threaded onto the threaded rod 702. By providing the threaded rod 702, the rotation of the threaded rod 702 can drive the driving plate 602 to move.

[0030] In this embodiment, the rotating plate 703 is provided with bolt holes, and locking bolts 704 are installed in the internal threads of the bolt holes. By providing locking bolts 704, the rotating plate 703 can be fixed and unfixed. Multiple U-shaped seats 1001 are fixedly installed on the top of the test platform 501. Pressure rollers 1002 are rotatably installed on the inner walls of both sides of the U-shaped seats 1001, and the pressure rollers 1002 are adapted to the placement plate 502. By providing pressure rollers 1002, the placement plate 502 can be guided, thereby increasing the stability of the adjustment of the placement plate 502.

[0031] In this invention, when testing IC carrier boards of different sizes, rotating the rotating plate 703 and the threaded rod 702 causes the drive plate 602 to move, which in turn moves the placement plate 502. The placement plate 502 then places the placement holes 503, allowing the placement holes 503 of different sizes to be positioned directly below the test assembly 4. This facilitates the placement of IC carrier boards of different sizes. The probes in the test assembly 4 can then be used to test the IC carrier boards. After the test is completed, by pushing the push plate 904 upward, the push plate 904 can move upward and compress the compression spring 905. The push plate 904 can drive the top plate 902 upward through the vertical rod 903. The top plate 902 can push the IC carrier board out of the placement hole 503, which can facilitate the removal of the IC carrier board. By rotating the fixing bolt, the fixing bolt can be separated from the fixing screw 802, so that the placement plate 502 can be removed from the drive plate 602, and the placement plate 502 can be replaced.

[0032] The present invention provides a detailed description of a functional module for IC carrier board testing. Specific embodiments have been used to illustrate the principles and implementation methods of the present invention. These embodiments are merely illustrative and are intended to aid in understanding the method and core concepts of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. A functional module for testing IC carrier boards, characterized in that, Includes a base (1), on the top of which two vertical plates (2) are fixedly installed, and on the top of the two vertical plates (2) a horizontal plate (3) is fixedly installed, and at the bottom of the horizontal plate (3) a test assembly (4) for IC carrier board testing is installed. A test platform (501) is fixedly installed between the two vertical plates (2). A placement plate (502) is slidably installed on the top of the test platform (501). The top of the placement plate (502) is provided with multiple placement holes (503) for placing IC carrier boards. The multiple placement holes (503) decrease in size from left to right. An adjustment mechanism is provided on the test platform (501). The adjustment mechanism is connected to the placement plate (502). The test platform (501) has a storage slot (901) on its top. A top plate (902) is placed in the storage slot (901). A vertical rod (903) is fixedly installed at the bottom of the top plate (902). The bottom end of the vertical rod (903) extends to the bottom of the test platform (501) and a push plate (904) is fixedly installed thereon. A compression spring (905) is fixedly installed at the top of the push plate (904). The top of the compression spring (905) is fixedly installed on the bottom of the test platform (501).

2. The IC carrier board testing functional module according to claim 1, characterized in that, The adjustment mechanism includes a drive hole (601) and a drive plate (602). The drive hole (601) is located on the top of the test bench (501). The drive plate (602) is slidably installed inside the drive hole (601). The drive plate (602) is fixedly connected to the placement plate (502) through a disassembly mechanism.

3. The IC carrier board testing functional module according to claim 2, characterized in that, Multiple limiting rods (603) are fixedly installed on the inner walls of both sides of the drive hole (601), and the drive plate (602) is slidably sleeved on the corresponding limiting rods (603).

4. A functional module for IC carrier board testing according to claim 2, characterized in that, The disassembly mechanism includes a mounting hole (801), a fixing screw (802), and a fixing nut (803). The mounting hole (801) is opened on the drive plate (602), the fixing screw (802) is fixedly installed on the placement plate (502), and the fixing screw (802) passes through the corresponding mounting hole (801) and is threaded with a fixing nut (803).

5. A functional module for IC carrier board testing according to claim 1, characterized in that, A connecting seat (701) is fixedly installed at the bottom of the test bench (501), and a driving mechanism for driving the driving plate (602) is provided between the connecting seat (701) and the vertical plate (2).

6. A functional module for IC carrier board testing according to claim 5, characterized in that, The driving mechanism includes a threaded rod (702) and a rotating plate (703). The same threaded rod (702) is rotatably installed between the connecting seat (701) and the vertical plate (2). One end of the threaded rod (702) passes through the corresponding vertical plate (2) and is fixedly installed with the rotating plate (703). The driving plate (602) is threaded onto the threaded rod (702).

7. A functional module for IC carrier board testing according to claim 6, characterized in that, The rotating plate (703) has bolt holes, and locking bolts (704) are installed in the internal threads of the bolt holes.

8. A functional module for IC carrier board testing according to claim 1, characterized in that, The test bench (501) has multiple U-shaped seats (1001) fixedly installed on its top. Pressure rollers (1002) are rotatably installed on the inner walls of both sides of the U-shaped seats (1001), and the pressure rollers (1002) are adapted to the placement plate (502).

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