Electrical port shielding optical module structure
By designing an electrical port shielded optical module structure with a shielded cavity inside a metal housing in the optical module, and using the wave-absorbing part to seal the gap between the circuit board and the electrical transmission port and absorb electromagnetic waves, the problem of excessive radiation noise at the gold finger end is solved, and the EMC performance is improved.
Patent Information
- Application Number
- CN202422894736.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-27
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-11-27
AI Technical Summary
Excessive radiated noise at the gold finger end of the existing optical module causes it to fail the radiated emission test.
Design a shielded optical module structure with an electrical port. The structure has a shielding cavity inside a metal shell. The gold fingers of the circuit board extend through the electrical transmission port. The gaps are sealed with wave-absorbing parts, which absorb electromagnetic waves to reduce noise leakage.
It effectively reduces radiated noise leakage at the gold finger end of the circuit board, ensures that the radiated emission test is passed, and improves EMC performance.
Smart Images

Figure CN223486240U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical module technology, and in particular to an electrical port shielded optical module structure. Background Technology
[0002] In recent years, with the rise of 6G and AI technologies, the demand for high-speed optical modules has surged. Simultaneously, with technological advancements, the requirements for the EMC performance of optical modules have become increasingly stringent.
[0003] Radiated emission testing is a mandatory test in the EMC performance requirements of optical modules. Currently, both domestic and international optical module projects require radiated emission testing of the entire optical module system, typically involving 32 or 48 modules. To ensure the overall system meets radiated emission requirements, the EMC performance of each individual optical module must also meet corresponding requirements. Because there are gaps between the upper and lower housings and the PCB at the gold fingers, radiated noise from the gold fingers is difficult to control. Utility Model Content
[0004] The main purpose of this invention is to propose an electrical port shielded optical module structure, which aims to solve the problem of excessive radiation noise at the gold finger end of existing optical modules.
[0005] To achieve the above objectives, this utility model proposes an electrical port shielded optical module structure, comprising a metal housing, a circuit board, and a wave-absorbing part. The metal housing has a shielding cavity, and one end of the metal housing has an electrical transmission port. The circuit board is disposed in the shielding cavity, and the gold finger end of the circuit board extends out from the electrical transmission port. There is a gap between the electrical transmission port and the circuit board, and the wave-absorbing part is disposed at the gap and seals the gap.
[0006] According to some embodiments of the present invention, the circuit board has a first side and a second side, and the wave-absorbing part includes two wave-absorbing blocks. The two wave-absorbing blocks are respectively disposed on the first side and the second side of the circuit board and close to the electrical transmission port to block the gap between the electrical transmission port and the first side and the second side of the circuit board.
[0007] According to some embodiments of the present invention, copper strips are laid on both sides of the circuit board corresponding to the positions of the absorbing blocks, and the copper strips are located between the circuit board and the absorbing blocks.
[0008] According to some embodiments of this utility model, the material of the absorbing block is a thermally conductive material.
[0009] According to some embodiments of the present invention, one end of the absorbing block abuts against the inner wall of the metal housing, and the other end abuts against the circuit board.
[0010] According to some embodiments of this utility model, the material of the absorbing block is an elastic material.
[0011] According to some embodiments of this utility model, the inner wall of the metal shell is provided with grooves corresponding to the position of the microwave absorbing block.
[0012] According to some embodiments of the present invention, the metal housing includes a bottom shell and a top shell. A first mounting groove is provided on the bottom shell, and the circuit board is mounted and fixed in the first mounting groove. The top shell covers the opening of the first mounting groove to form the shielding cavity. The gap between the bottom shell and the top shell at the two sides of the assembly is filled with a first conductive adhesive.
[0013] According to some embodiments of the present invention, it further includes an optical fiber interface electrically connected to the circuit board. The bottom shell is also provided with a second mounting groove for installing the optical fiber interface. A connection port for the connection wire to pass through is provided between the first mounting groove and the second mounting groove, so that the connection wire can block the connection port. The top shell covers the connection port and the groove of the second mounting groove.
[0014] According to some embodiments of this utility model, the gap between the bottom shell and the top shell at the joint on both sides of the connection port is filled with a second conductive adhesive.
[0015] This utility model has at least the following beneficial effects:
[0016] In this invention, a shielding cavity is provided within the metal housing, and an electrical transmission port is provided at one end of the metal housing. The circuit board is disposed within the shielding cavity, and the gold fingers of the circuit board extend from the electrical transmission port. A gap exists between the electrical transmission port and the circuit board, and a wave-absorbing part is disposed at the gap and seals the gap. During radiated emission testing, since the circuit board is disposed within the shielding cavity of the metal housing, it only contacts the outside world through the electrical transmission port. By providing the wave-absorbing part, the gap between the electrical transmission port and the circuit board is sealed on the one hand, and electromagnetic waves are absorbed on the other hand, thus forming a shield against electromagnetic radiation in conjunction with the metal housing, thereby reducing the noise leaked from the gold fingers of the circuit board through the electrical transmission port. The electrical port shielded optical module structure provided by this invention solves the problem of excessive radiated noise at the gold fingers of existing optical modules. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of a shielded optical module structure for an electrical port provided in an embodiment of the present invention;
[0019] Figure 2 for Figure 1 A magnified view of part 'a' in the diagram;
[0020] Figure 3 for Figure 1 Schematic diagram of the middle bottom shell;
[0021] Figure 4 for Figure 1 A schematic diagram of the circuit board structure.
[0022] Explanation of reference numerals in the attached figures:
[0023] 100 - Electrically shielded optical module structure; 1 - Metal housing; 11 - Electrical transmission port; 12 - Gap; 13 - Bottom shell; 131 - First mounting slot; 132 - Second mounting slot; 133 - Connection port; 14 - Top shell; 2 - Circuit board; 21 - Copper strip; 3 - Absorbing part; 31 - Absorbing block; 4 - First conductive adhesive; 5 - Fiber optic interface; 6 - Second conductive adhesive Detailed Implementation
[0024] The technical solutions in the embodiments of this utility model are described clearly and completely below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0025] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.
[0026] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0027] This utility model provides a shielded optical module structure for an electrical port. Figure 1 This invention provides a specific embodiment of an electrical port shielded optical module structure.
[0028] like Figure 1 and Figure 2 As shown, this utility model embodiment provides an electrical port shielded optical module structure 100, including a metal housing 1, a circuit board 2, and a wave-absorbing part 3. The metal housing 1 has a shielding cavity, and one end of the metal housing 1 has an electrical transmission port 11. The circuit board 2 is disposed in the shielding cavity, and the gold finger end of the circuit board 2 extends out from the electrical transmission port 11. There is a gap between the electrical transmission port 11 and the circuit board 2. The wave-absorbing part 3 is disposed at the gap and seals the gap.
[0029] In this invention, a shielding cavity is provided inside the metal housing 1, and an electrical transmission port 11 is provided at one end of the metal housing 1. The circuit board 2 is disposed within the shielding cavity, and the gold finger end of the circuit board 2 extends from the electrical transmission port 11. There is a gap between the electrical transmission port 11 and the circuit board 2, and the wave-absorbing part 3 is disposed at the gap and seals the gap. In radiated emission testing, since the circuit board 2 is disposed within the shielding cavity of the metal housing 1, it only contacts the outside world through the electrical transmission port 11. By setting the wave-absorbing part 3, on the one hand, the gap between the electrical transmission port 11 and the circuit board 2 is sealed, and on the other hand, electromagnetic waves are absorbed, so as to form a shield against electromagnetic radiation in conjunction with the metal housing 1, thereby reducing the noise leaked from the gold finger end of the circuit board 2 from the electrical transmission port 11. The electrical port shielded optical module structure 100 provided by this invention solves the problem of excessive radiated noise at the gold finger end of existing optical modules.
[0030] The specific structure and placement of the absorbing part 3 are not limited, as long as the absorbing part 3 can block the gap between the electrical transmission port 11 and the circuit board 2. For example, in some embodiments, such as... Figure 1 and Figure 2 As shown, the circuit board 2 has a first surface and a second surface. The wave-absorbing part 3 includes two wave-absorbing blocks 31, which are respectively disposed on the first surface and the second surface of the circuit board 2 and close to the electrical transmission port 11 to seal the gap between the electrical transmission port 11 and the first surface and the second surface of the circuit board 2. This arrangement completely seals the gap between the electrical transmission port 11 and the circuit board 2 through the two wave-absorbing blocks 31, thereby reducing the noise leaked from the gold finger tip of the circuit board 2 through the electrical transmission port 11.
[0031] Current optical modules are generally high-speed optical modules. Since there are paired high-speed traces between the absorbing block 31 and the circuit board 2, directly contacting the absorbing block 31 with these high-speed traces on the circuit board 2 will affect the high-speed signals passing through them, weakening the high-speed signals and degrading the electrical performance of the optical module, such as its eye diagram and bit error rate. Therefore, in some embodiments, such as... Figure 2 and Figure 4 As shown, copper strips 21 are laid on both sides of the circuit board 2 corresponding to the positions of the absorbing blocks 31, and the copper strips 21 are located between the circuit board 2 and the absorbing blocks 31. This arrangement allows for copper plating on the circuit board 2 at the positions corresponding to the absorbing blocks 31, isolating the absorbing blocks 31 from the high-speed traces on the circuit board 2. This avoids the absorbing blocks 31 interfering with high-speed signals, and the high-speed traces being located on an inner layer facilitates control of trace impedance. Simultaneously, the copper strips 21 improve the thermal conductivity of the circuit board 2, dissipating localized heat and ensuring the stability of the circuit board 2 during long-term operation.
[0032] Furthermore, since high-speed signal transmission generates a significant amount of heat, in some embodiments, the absorbing block 31 is made of a thermally conductive material. The absorbing block 31, made of thermally conductive material, dissipates the heat transferred from the circuit board 2 to the copper strip 21, thereby dissipating localized heat and ensuring the stability of the circuit board 2 during prolonged operation.
[0033] After the metal housing 1 is subjected to impact and compression, the absorbing block 31 may experience slight movement, making it impossible to completely seal the gap between the electrical transmission port 11 and the circuit board 2. Therefore, in some embodiments, such as Figure 2As shown, one end of the absorbing block 31 abuts against the inner wall of the metal housing 1, and the other end abuts against the circuit board 2. This arrangement serves two purposes: firstly, the inner wall of the metal housing 1 and the circuit board 2 can cooperate to hold the absorbing block 31 in place, preventing noise leakage due to slight movement of the absorbing block 31; secondly, the absorbing block 31 provides some support to the metal housing 1, enhancing its structural strength.
[0034] Furthermore, in some embodiments, the absorber block 31 is made of an elastic material. This design ensures that even if the metal housing 1 is subjected to impact or pressure, the absorber block 31 will undergo compressive deformation without fully transferring the force to the circuit board 2, thus preventing damage to the circuit board 2.
[0035] In some embodiments, as Figure 2 and Figure 3 As shown, the inner wall of the metal housing 1 has a toothed groove 12 corresponding to the position of the wave-absorbing block 31. By setting the toothed groove 12, the contact area between the inner wall of the metal housing 1 and the wave-absorbing block 31 is increased, thereby increasing the friction and making the installation of the wave-absorbing block 31 more secure.
[0036] The specific structure of the metal casing 1 is not limited, as long as the metal casing 1 can shield electromagnetic radiation. For example, in some embodiments, such as... Figure 1 and Figure 3 As shown, the metal housing 1 includes a bottom shell 13 and a top shell 14. A first mounting groove 131 is formed on the bottom shell 13, and the circuit board 2 is mounted and fixed within the first mounting groove 131. The top shell 14 covers the opening of the first mounting groove 131 to form the shielding cavity. The gap between the bottom shell 13 and the top shell 14 at their assembly points is filled with a first conductive adhesive 4. This arrangement, by filling the gap between the bottom shell 13 and the top shell 14 with the first conductive adhesive 4, ensures good conductive continuity, thereby reducing noise leakage from the side gaps of the metal housing 1.
[0037] The specific method by which the circuit board 2 is installed in the first mounting slot 131 is not limited. For example, in some embodiments, such as... Figure 3 As shown, a plurality of fixing posts are arranged on the first mounting groove 131 corresponding to the circumferential side of the circuit board 2. The circuit board 2 is fixed on the first mounting groove 131 by a plurality of screws threadedly connected to the plurality of fixing posts.
[0038] In some embodiments, as Figure 1 and Figure 3As shown, the electrical shielded optical module structure 100 also includes an optical fiber interface 5 electrically connected to the circuit board 2. The bottom shell 13 also has a second mounting slot 132 for installing the optical fiber interface 5. A connection port 133, allowing only a connecting wire to pass through, is provided between the first mounting slot 131 and the second mounting slot 132, so that the connecting wire can seal the connection port 133. The top shell 14 covers the connection port 133 and the opening of the second mounting slot 132. Since the optical fiber interface 5 is connected to the outside, to reduce noise leakage, a connection port 133, allowing only a connecting wire to pass through, is provided between the first mounting slot 131 and the second mounting slot 132. The connection portion can seal the connection port 133 to reduce noise leakage from the connection port 133.
[0039] Furthermore, in some embodiments, such as Figure 3 As shown, the gaps between the bottom shell 13 and the top shell 14 on both sides of the connection port 133 are filled with a second conductive adhesive 6. By filling the gaps between the bottom shell 13 and the top shell 14 on both sides of the connection port 133 with the second conductive adhesive 6, the first mounting groove 131 is in a sealed and shielded state, thereby reducing noise leakage.
[0040] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A shielded optical module structure with an electrical port, characterized in that, The device includes a metal housing, a circuit board, and a wave-absorbing part. The metal housing has a shielding cavity, and one end of the metal housing has an electrical transmission port. The circuit board is located inside the shielding cavity, and the gold finger end of the circuit board extends out from the electrical transmission port. There is a gap between the electrical transmission port and the circuit board. The wave-absorbing part is located at the gap and seals the gap.
2. The electrical port shielded optical module structure as described in claim 1, characterized in that, The circuit board has a first side and a second side. The absorbing part includes two absorbing blocks, which are respectively disposed on the first side and the second side of the circuit board and close to the electrical transmission port to block the gap between the electrical transmission port and the first side and the second side of the circuit board.
3. The electrical port shielded optical module structure as described in claim 2, characterized in that, Copper strips are laid on both sides of the circuit board corresponding to the positions of the absorbing blocks, and the copper strips are located between the circuit board and the absorbing blocks.
4. The electrical port shielded optical module structure as described in claim 3, characterized in that, The absorber block is made of a thermally conductive material.
5. The electrical port shielded optical module structure as described in claim 2, characterized in that, One end of the absorbing block abuts against the inner wall of the metal housing, and the other end abuts against the circuit board.
6. The electrical port shielded optical module structure as described in claim 5, characterized in that, The absorber block is made of an elastic material.
7. The electrical port shielded optical module structure as described in claim 6, characterized in that, The inner wall of the metal casing has grooves corresponding to the position of the microwave absorbing block.
8. The electrical port shielded optical module structure as described in claim 1, characterized in that, The metal housing includes a bottom shell and a top shell. A first mounting groove is provided on the bottom shell. The circuit board is installed and fixed in the first mounting groove. The top shell covers the opening of the first mounting groove to form the shielding cavity. The gap between the bottom shell and the top shell at the two sides of the assembly is filled with a first conductive adhesive.
9. The electrical port shielded optical module structure as described in claim 8, characterized in that, It also includes an optical fiber interface electrically connected to the circuit board. The bottom shell is also provided with a second mounting slot for installing the optical fiber interface. A connection port is provided between the first mounting slot and the second mounting slot for the connection cable to pass through, so that the connection cable can block the connection port. The top shell covers the connection port and the slot of the second mounting slot.
10. The electrical port shielded optical module structure as described in claim 9, characterized in that, The gap between the bottom shell and the top shell on both sides of the connection port is filled with a second conductive adhesive.