Silicon light modulator monitoring equipment

Abstract

The utility model relates to the technical field of silicon light modulator components, and discloses silicon light modulator monitoring equipment, which comprises a modulator shell, wiring ports arranged at two ends of the modulator shell, a communication port arranged at the bottom of the modulator shell, a sliding chute arranged at the bottom of the modulator shell, and an equipment plate connected with the sliding chute in a sliding manner, the equipment plate is made of a heat conduction material and is attached to the surface of the modulator shell, an equipment groove matched with the communicating opening in position is formed in the equipment plate and communicates with the communicating opening, and thermosensitive coatings are arranged on the upper end face and the lower end face of the outer side of the equipment groove correspondingly; fixing plates capable of sliding relative to the upper end face and the lower end face of the inner side of the equipment groove are arranged on the two sides of the inner side of the equipment groove respectively, and adjusting bolts are arranged at the two ends of the equipment groove and abut against the fixing plates; according to the utility model, when the monitoring equipment is replaced, the modulator shell does not need to be disassembled, the installation process of the monitoring module is simplified, and meanwhile, a user can select or replace the monitoring module according to actual requirements, so that the cost is saved.

Description

Technical Field

[0001] This utility model relates to the technical field of silicon photonic modulator components, specifically a silicon photonic modulator monitoring device. Background Technology

[0002] A silicon photonic modulator (SPD) is an optical device based on silicon photonics principles, also known as a silicon optical modulator. It is a key component of silicon photonics, capable of converting electrical signals into optical signals for various information technology applications such as data transmission, interconnection, processing, and computation. A SPD typically consists of core components such as an electrical modulator, optical waveguide, and electrodes, with the electrical modulator and chip playing a decisive role in its performance. As a high-performance optical device, the SPD plays an increasingly important role in the field of information technology.

[0003] In some testing stages, existing silicon photonic modulators require the measurement of various parameters of the modulator. However, existing silicon photonic modulators have a sealed casing. When it is necessary to measure physical data (such as internal temperature), traditional silicon photonic modulators need to frequently disassemble the casing, which leads to damage to the modulator during frequent disassembly and makes the replacement process cumbersome. Utility Model Content

[0004] (I) Technical problem to be solved: In view of the shortcomings of the existing technology, this utility model provides a silicon photonic modulator monitoring device, which has the advantages of quick installation and removal of monitoring equipment without disassembling the silicon photonic modulator housing and without the need for other tools. It solves the problem that the traditional silicon photonic modulator is cumbersome to disassemble when installing monitoring equipment and is prone to damage during the disassembly process.

[0005] (II) Technical Solution: To achieve the above-mentioned goal of quickly assembling and disassembling monitoring equipment without disassembling the silicon photonic modulator housing and without the need for other tools, this utility model provides the following technical solution: A silicon photonic modulator monitoring device includes a modulator housing, with wiring ports at both ends of the modulator housing and a communication port at the bottom of the modulator housing. A sliding groove is also provided at the bottom of the modulator housing, and a device plate is slidably connected to the sliding groove. The device plate is made of thermally conductive material and is attached to the surface of the modulator housing. A device slot is provided on the device plate that matches the position of the communication port. The device slot is connected to the communication port, and a thermal coating is provided on the upper and lower outer surfaces of the device slot. Fixing plates that can slide relative to the upper and lower inner surfaces of the device slot are also provided on both sides of the inner side of the device slot. Adjusting bolts are provided at both ends of the device slot, and the adjusting bolts are tightened against the fixing plates.

[0006] Preferably, a monitoring module is installed in the equipment slot, and the two ends of the monitoring module are clamped and fixed by the fixing plate.

[0007] Preferably, the shape of the equipment slot matches the size of the communication port, and the area of ​​the equipment slot is smaller than the area of ​​the communication port.

[0008] Preferably, the device board has the same shape and size as the bottom surface of the modulator housing.

[0009] Preferably, the equipment slot is further provided with an installation slot, and a transparent cover is provided in the installation slot.

[0010] (III) Beneficial Effects: Compared with the prior art, this utility model provides a silicon photonic modulator monitoring device, which has the following beneficial effects:

[0011] 1. This silicon photonic modulator monitoring device, through the cooperation of the device board structure and the monitoring module, eliminates the need to disassemble the modulator housing. It can be fixed simply by tightening the adjusting bolts, which improves the versatility and flexibility of the device, simplifies the installation process of the monitoring module, reduces the difficulty of operation and the cost of required tools, and allows users to select or replace the monitoring module according to actual needs to monitor different parameters of the silicon photonic modulator. This flexibility enables the device to adapt to various application scenarios and changing needs without replacing the entire monitoring device, thereby saving costs.

[0012] 2. This silicon photonic modulator monitoring device, through the combined use of the device slot structure and the thermosensitive coating structure, causes a change in the color of the thermosensitive coating on the device board when the temperature inside the modulator housing changes, thereby enabling real-time visual observation of the temperature on the surface of the modulator housing. This reduces equipment costs because there is no need to purchase a monitoring module with temperature monitoring function. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural schematic diagram of the silicon photonic modulator monitoring device of this utility model.

[0014] Figure 2 A three-dimensional schematic diagram of the monitoring module structure of the silicon photonic modulator monitoring device of this utility model;

[0015] Figure 3 This is a three-dimensional structural diagram of the equipment board of the silicon photonic modulator monitoring device of this utility model;

[0016] Figure 4 This is a top view of the silicon photonic modulator monitoring device of this utility model;

[0017] Figure 5 This is a front view of the silicon photonic modulator monitoring device of this utility model.

[0018] In the diagram: 1. Modulator housing; 2. Wiring port; 3. Connecting port; 4. Slide groove; 5. Equipment plate; 6. Equipment slot; 7. Thermosensitive coating; 8. Fixing plate; 9. Adjusting bolt; 10. Monitoring module; 11. Transparent cover. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-Figure 5 A silicon photonic modulator monitoring device includes a modulator housing 1, with wiring ports 2 at both ends and a communication port 3 at the bottom. The bottom of the modulator housing 1 also has a sliding groove 4, which provides a convenient installation and disassembly mechanism, allowing a device plate 5 to be easily slidably mounted on the modulator housing 1 without the need for complex tools or cumbersome disassembly operations. The device plate 5 is slidably connected to the sliding groove 4, allowing for easy position adjustment. The device plate 5 is made of a thermally conductive material and is attached to the surface of the modulator housing 1. The use of thermally conductive material effectively transfers heat from the modulator housing 1, allowing the temperature changes of the modulator housing 1 to be reflected in real time through a thermally sensitive coating 7. Attachment to the surface of the modulator housing 1 ensures efficient and accurate heat transfer. The device plate 5 has a device slot 6 that matches the position of the communication port 3, ensuring that the monitoring module 10 can be accurately installed near the communication port 3, thereby effectively monitoring the operating status of the silicon photonic modulator. The device slot 6 is connected to the communication port 3. This connection allows the monitoring module 10 to directly contact the interior of the silicon photonic modulator or related components for accurate monitoring. The upper and lower outer surfaces of the device slot 6 are coated with a thermal coating 7 to reflect real-time temperature changes in the modulator housing 1, providing a visual temperature monitoring function. This design helps to detect temperature anomalies promptly, ensuring the stable operation of the silicon photonic modulator. Two sliding fixing plates 8 are located on the inner sides of the device slot 6, and adjusting bolts 9 are located at both ends of the device slot 6. These adjusting bolts tighten the fixing plates 8, ensuring the monitoring module 10 is securely fixed within the device slot 6. This design simplifies the installation process of the monitoring module 10, reducing operational difficulty and the cost of required tools.

[0021] Please see Figure 1-Figure 5 The equipment slot 6 houses a monitoring module 10, which is secured at both ends by fixing plates 8. Adjusting bolts 9 tighten the fixing plates 8, allowing for the clamping and securing of monitoring modules 10 of different sizes, improving the equipment's versatility and flexibility. The shape of the equipment slot 6 matches the connection port 3, and the area of ​​the equipment slot 6 is smaller than that of the connection port 3, ensuring that the monitoring module 10 can be accurately installed near the connection port 3, thereby effectively monitoring the operating status of the silicon photonic modulator. This also prevents interference between the monitoring module 10 and other parts of the modulator housing 1 during installation. The equipment plate 5 has the same shape and size as the bottom surface of the modulator housing 1, achieving good heat transfer, which is reflected by the thermal coating 7, enabling real-time visual temperature monitoring. The equipment slot 6 also has an installation slot containing a transparent cover 11. The transparent cover 11 provides a visual observation window, allowing users to easily observe the operating status and temperature changes of the monitoring module 10. The transparent cover 11 also serves as a dustproof and waterproof barrier.

[0022] Working Principle: When using this equipment, first determine the parameters to be monitored. Simultaneously, slide the equipment plate 5 onto the modulator housing 1 via the slide groove 4. Then, install the monitoring module 10 for monitoring parameters into the equipment slot 6. Tighten the adjusting bolts 9 at both ends of the equipment slot 6 to secure the fixing plate 8 against the monitoring module 10. During installation, the monitoring components on the monitoring module 10 need to be positioned on the silicon photonic modulator. Subsequently, the monitoring module 10 monitors the silicon photonic modulator to promptly detect problems during its operation. Specifically, when the temperature inside the modulator housing 1 changes, it causes a change in the color of the thermal coating 7 on the equipment plate 5, allowing for real-time visual observation of the surface temperature of the modulator housing 1. This reduces equipment costs because there is no need to purchase a monitoring module 10 with temperature monitoring capabilities.

[0023] The sliding of the fixing plate 8 allows the device to clamp monitoring modules 10 of different sizes. The fixing plate 8 also avoids complex installation of the monitoring modules 10; the device does not require disassembling the modulator housing 1, only tightening the adjusting bolts 9 is needed for fixation. This improves the device's versatility and flexibility, simplifies the installation process of the monitoring modules 10, and reduces operational difficulty and tool costs. Setting up the monitoring modules 10 enables real-time monitoring of the silicon photonic modulator. By setting different monitoring modules 10, different parameters can be monitored. Users can select or replace the monitoring modules 10 according to actual needs to monitor different parameters of the silicon photonic modulator. This flexibility allows the device to adapt to various application scenarios and changing requirements without replacing the entire monitoring equipment, thus saving costs.

[0024] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0025] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A silicon photonics modulator monitoring device, comprising a modulator housing (1), wherein wiring ports (2) are provided at both ends of the modulator housing (1), characterized in that: The modulator housing (1) has a communication port (3) at the bottom and a sliding groove (4) at the bottom. A device plate (5) is slidably connected to the sliding groove (4). The device plate (5) is made of thermally conductive material and is attached to the surface of the modulator housing (1). A device slot (6) matching the position of the communication port (3) is provided on the device plate (5). The device slot (6) is connected to the communication port (3). The upper and lower surfaces of the outer side of the device slot (6) are provided with a thermal coating (7). Fixing plates (8) that can slide relative to the upper and lower surfaces of the inner side of the device slot (6) are provided on both sides of the inner side of the device slot (6). Adjusting bolts (9) are provided at both ends of the device slot (6). The adjusting bolts (9) are tightened against the fixing plates (8).

2. The silicon photonic modulator monitoring device according to claim 1, characterized in that: The monitoring module (10) is installed in the equipment slot (6), and the two ends of the monitoring module (10) are clamped and fixed by the fixing plate (8).

3. The silicon photonic modulator monitoring device according to claim 1, characterized in that: The shape of the device slot (6) matches the size of the connecting port (3), and the area of ​​the device slot (6) is smaller than the area of ​​the connecting port (3).

4. The silicon photonic modulator monitoring device according to claim 1, characterized in that: The device board (5) has the same shape and size as the bottom surface of the modulator housing (1).

5. A silicon photonic modulator monitoring device according to claim 1, characterized in that: The equipment slot (6) is also provided with an installation slot, and a transparent cover (11) is provided in the installation slot.

Images