Gluing developing machine for circuit board processing

Abstract

The utility model discloses a gluing developing machine for circuit board processing, which comprises a machine body, one end of the machine body is fixedly connected with a workbench, the top of one end, close to the machine body, of the workbench is fixedly connected with a placing disc, one end of the workbench is internally provided with a cleaning mechanism, and the top of one end of the workbench is provided with a conveying mechanism. The cleaning mechanism comprises a plurality of working barrels, the working barrels are fixedly connected to the interior of the top of the workbench, transducers are fixedly connected to the bottoms of the working barrels, and a plurality of drying boxes are fixedly connected to the outer sides of the tops of the working barrels. The conveying mechanism comprises an electric guide rail and a mounting frame, dust on the surface of a silicon wafer can be rapidly removed, the cleaning efficiency is improved, the silicon wafer is dried through the drying lamps in the drying boxes, dust is prevented from being adsorbed on the surface of the silicon wafer again, and the machining precision is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, specifically to a coating and developing machine for circuit board processing. Background Technology

[0002] Photoresist coating and developing machines are mainly used in the photoresist coating and developing processes in semiconductor photolithography. As the input and output of the photolithography machine, it uses a robotic arm to transfer and process the wafer between various systems, thereby completing the photoresist coating, curing, developing, and hardening processes of the wafer.

[0003] A search revealed Chinese patent CN220005156U, a cleaning device for a coating and developing machine, comprising a cleaning box and a coating and developing silicon wafer. The coating and developing silicon wafer is disposed inside the cleaning box, which contains a cleaning mechanism and a positioning mechanism. A drain outlet is located on the lower left side of the cleaning box. The cleaning mechanism includes a cleaning frame disposed within the inner cavity of the cleaning box. The outer wall of the coating and developing silicon wafer is located inside the cleaning frame. Multiple cleaning brushes are symmetrically fixed to both sides of the inner wall of the cleaning frame. Multiple water spray nozzles are opened on the inner wall of the cleaning frame. Synchronously electrically telescopic rods are provided on both sides of the top of the cleaning frame.

[0004] The above technical solution cleans silicon wafers by spraying. During the spraying process, the cleaning frame needs to be moved repeatedly. This method is slow and affects the subsequent processing. Furthermore, if the cleaned silicon wafers are not dried, their surfaces are more likely to attract dust, affecting the processing accuracy. Utility Model Content

[0005] The purpose of this invention is to provide a coating and developing machine for circuit board processing, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a coating and developing machine for circuit board processing, comprising a machine body, a worktable fixedly connected to one end of the machine body, a placement tray fixedly connected to the top of the worktable near the end of the machine body, a cleaning mechanism installed inside the worktable at one end, a conveying mechanism installed at the top of the worktable at one end, and a filtering mechanism installed on the outside of the worktable. The cleaning mechanism includes several working cylinders, all of which are fixedly connected to the inside of the top of the worktable. A transducer is fixedly connected to the bottom of each working cylinder, and several drying chambers are fixedly connected to the outside of the top of each working cylinder. The heating ends of each drying chamber are located inside the top of the working cylinder.

[0007] As a further preferred embodiment of this technical solution, the conveying mechanism includes an electric guide rail and a mounting frame. The electric guide rail is fixedly connected to the surface of the top of the workbench, and the bottom ends of both ends of the mounting frame are fixedly connected to the top of the electric guide rail slider.

[0008] As a further preferred embodiment of this technical solution, a cylinder is fixedly connected to the top of the mounting bracket, a horizontal plate is fixedly connected to the output end of the cylinder, and fixing rods are fixedly connected to both ends and the bottom of the middle part of the horizontal plate, with a mounting plate fixedly connected to the bottom of the fixing rods.

[0009] As a further preferred embodiment of this technical solution, an electric push rod is fixedly connected to the top of the mounting plate, and two symmetrically arranged grooves are opened on the surface of the mounting plate. A connecting rod is provided inside each of the two grooves, an arc-shaped support plate is fixedly connected to the bottom of each connecting rod, and a guide rod is fixedly connected to the outside of each connecting rod.

[0010] As a further preferred embodiment of this technical solution, the output end of the electric push rod is fixedly connected to the outside of the connecting rod, the inner bottom surface of the arc-shaped support plate is provided with a sieve hole, the inside of the groove is provided with a connecting hole, and the guide rod is disposed inside the connecting hole.

[0011] As a further preferred embodiment of this technical solution, the filtration mechanism includes a liquid pump, which is fixedly connected to one end of the workbench. The input end of the liquid pump is connected to a first connecting pipe, one end of the first connecting pipe is connected to a four-way pipe, and the other three ends of the four-way pipe are all connected to the bottom of the working cylinder. The output end of the liquid pump is connected to a second connecting pipe, and one end of the second connecting pipe is connected to a filter box.

[0012] As a further preferred embodiment of this technical solution, the filter box is equipped with a fine filter plate and a PP cotton filter plate. A third connecting pipe is connected to one side of the bottom of the filter box. The third connecting pipe passes through the working cylinder in sequence, and a water outlet hole is opened on the surface of the part of the third connecting pipe inside the working cylinder.

[0013] This utility model provides a coating and developing machine for circuit board processing, which has the following beneficial effects:

[0014] (1) This utility model uses a transducer to perform mega-sound cleaning on silicon wafers, which can quickly remove dust from the surface of silicon wafers and improve cleaning efficiency. Then, the silicon wafers are dried by the drying lamp in the drying oven to prevent dust from adsorbing on the surface of the silicon wafers again, thereby improving processing accuracy.

[0015] (2) The filtration mechanism in this utility model can filter the cleaning liquid in the working cylinder to remove the dust accumulated in the cleaning liquid and realize the reuse of the cleaning liquid. Attached Figure Description

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the working cylinder structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the mounting bracket structure of this utility model;

[0019] Figure 4 This is a schematic diagram of the mounting plate structure of this utility model.

[0020] In the diagram: 1. Machine body; 2. Workbench; 3. Placement tray; 4. Electric guide rail; 5. Mounting frame; 6. Working cylinder; 7. Liquid pump; 8. Filter box; 9. Transducer; 10. Drying box; 11. First connecting pipe; 12. Four-way pipe; 13. Second connecting pipe; 14. Fine filter plate; 15. PP cotton filter plate; 16. Third connecting pipe; 17. Cylinder; 18. Horizontal plate; 19. Fixing rod; 20. Mounting plate; 21. Electric push rod; 22. Groove; 23. Connecting rod; 24. Arc-shaped support plate; 25. Screen hole; 26. Guide rod; 27. Connecting hole. Detailed Implementation

[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0022] This utility model provides a technical solution: such as Figure 1 and Figure 2 As shown in this embodiment, a coating and developing machine for circuit board processing includes a machine body 1. A worktable 2 is fixedly connected to one end of the machine body 1. A placement tray 3 is fixedly connected to the top of the worktable 2 near the end of the machine body 1. A cleaning mechanism is installed inside one end of the worktable 2. A conveying mechanism is installed on the top of one end of the worktable 2. A filtering mechanism is installed on the outside of the worktable 2. The cleaning mechanism includes several working cylinders 6. The several working cylinders 6 are all fixedly connected to the inside of the top of the worktable 2. A transducer 9 is fixedly connected to the bottom of the working cylinder 6. The transducer 9 can emit megahertz-level high-energy sound waves to clean silicon wafers. Several drying chambers 10 are fixedly connected to the outside of the top of the working cylinder 6. The heating ends of the several drying chambers 10 are all located inside the top of the working cylinder 6. The heating ends of the drying chambers 10 are actually infrared drying bulbs.

[0023] The conveying mechanism includes an electric guide rail 4 and a mounting bracket 5, with the electric guide rail 4 fixedly connected to the surface of the top of the workbench 2.

[0024] The mounting frame 5 is moved above the working cylinder 6 by the set conveying mechanism, and the silicon wafer is put into the working cylinder 6. After the silicon wafer is immersed in the cleaning solution, the transducer 9 emits megahertz-level high-energy sound waves to clean the silicon wafer. Before leaving the working cylinder 6, the cleaned silicon wafer can be dried by the heating end of the drying oven 10 to quickly remove the surface of the silicon wafer from the cleaning solution.

[0025] The filtration mechanism includes a liquid pump 7, which is fixedly connected to one end of the workbench 2. The input end of the liquid pump 7 is connected to a first connecting pipe 11, one end of the first connecting pipe 11 is connected to a four-way pipe 12, and the other three ends of the four-way pipe 12 are all connected to the bottom of the working cylinder 6. The output end of the liquid pump 7 is connected to a second connecting pipe 13, and one end of the second connecting pipe 13 is connected to a filter box 8.

[0026] The filter box 8 is equipped with a fine filter plate 14 and a PP cotton filter plate 15. A third connecting pipe 16 is connected to one side of the bottom of the filter box 8. The third connecting pipe 16 passes through the working cylinder 6 in sequence, and the surface of the part of the third connecting pipe 16 inside the working cylinder 6 has a water outlet hole.

[0027] When the pump 7 starts working, it draws cleaning fluid from each working cylinder 6 through the first connecting pipe 11 and the four-way pipe 12, and then injects the cleaning fluid into the filter box 8 through the second connecting pipe 13. After entering the filter box 8, the cleaning fluid is filtered by the fine filter plate 14 and the PP cotton filter plate 15. The filtered cleaning fluid will be at the bottom of the filter box 8 and will be transported back to each working cylinder 6 through the third connecting pipe 16 to achieve the reuse of the cleaning fluid and reduce processing costs.

[0028] like Figure 3 and Figure 4 As shown, the bottom ends of the mounting bracket 5 are fixedly connected to the top of the slider of the electric guide rail 4. The top of the mounting bracket 5 is fixedly connected to a cylinder 17. The output end of the cylinder 17 is fixedly connected to a horizontal plate 18. The bottom ends and the middle part of the horizontal plate 18 are fixedly connected to a fixing rod 19. The bottom of the fixing rod 19 is fixedly connected to a mounting plate 20. The cylinder 17 is used to drive the mounting plate 20 to move up and down.

[0029] An electric push rod 21 is fixedly connected to the top of the mounting plate 20, and two symmetrically arranged grooves 22 are opened on the surface of the mounting plate 20. A connecting rod 23 is provided inside each of the two grooves 22. An arc-shaped support plate 24 is fixedly connected to the bottom of each connecting rod 23, and a guide rod 26 is fixedly connected to the outside of the connecting rod 23. By activating the electric push rod 21, the electric push rod 21 can push the connecting rod 23 to move, thereby increasing the distance between the arc-shaped support plates 24 and placing the silicon wafer between the arc-shaped support plates 24. Then, by using the electric push rod 21 to decrease the distance between the arc-shaped support plates 24, the silicon wafer can be clamped and fixed.

[0030] The output end of the electric push rod 21 is fixedly connected to the outside of the connecting rod 23. The inner bottom surface of the arc-shaped support plate 24 is provided with a sieve hole 25. The sieve hole 25 is used to discharge the cleaning liquid at the bottom of the silicon wafer and to allow the bottom of the silicon wafer to come into contact with hot air for drying. The groove 22 is provided with a connecting hole 27. The guide rod 26 is set inside the connecting hole 27. The guide rod 26 is used to ensure the stability of the arc-shaped support plate 24. The length of the guide rod 26 must be greater than the length of the output end of the electric push rod 21 to prevent the guide rod 26 from detaching from the connecting hole 27.

[0031] This utility model provides a coating and developing machine for circuit board processing. The specific working principle is as follows: Silicon wafers are placed between arc-shaped support plates 24, and the distance between the arc-shaped support plates 24 is reduced by electric push rod 21 to clamp and fix the silicon wafers. Then, electric guide rail 4 is activated to move the mounting frame 5 directly above the working cylinder 6. Then, cylinder 17 is activated, and cylinder 17 drives the horizontal plate 18 to move down, so that the silicon wafer enters the interior of the adjacent working cylinder 6. After the silicon wafer is immersed in the cleaning solution, the transducer 9 emits megahertz-level high-energy sound waves to clean the silicon wafer. Before the cleaned silicon wafer leaves the working cylinder 6, cylinder 17 will drive the mounting plate 20 to stop here so that the silicon wafer is dried by the heating end of the drying oven 10 to quickly remove the cleaning solution from the surface of the silicon wafer. After drying, the output end of cylinder 17 returns to its original position. At this time, electric guide rail 4 drives the mounting frame 5 to move above the placement tray 3, and electric push rod 21 will widen the distance between the arc-shaped support plates 24 to place the silicon wafer in the placement tray 3.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A coating and developing machine for circuit board processing, comprising a machine body (1), characterized in that: One end of the machine body (1) is fixedly connected to a workbench (2). A placement tray (3) is fixedly connected to the top of the workbench (2) near the end of the machine body (1). A cleaning mechanism is installed inside one end of the workbench (2). A conveying mechanism is installed on the top of one end of the workbench (2). A filtering mechanism is installed on the outside of the workbench (2). The cleaning mechanism includes several working cylinders (6). Several working cylinders (6) are fixedly connected to the inside of the top of the workbench (2). A transducer (9) is fixedly connected to the bottom of the working cylinder (6). Several drying boxes (10) are fixedly connected to the outside of the top of the working cylinder (6). The heating ends of several drying boxes (10) are all located on the inside of the top of the working cylinder (6).

2. The adhesive coating and developing machine for circuit board processing according to claim 1, characterized in that: The conveying mechanism includes an electric guide rail (4) and a mounting bracket (5). The electric guide rail (4) is fixedly connected to the surface of the top of the workbench (2), and the bottom of both ends of the mounting bracket (5) is fixedly connected to the top of the slider of the electric guide rail (4).

3. The adhesive coating and developing machine for circuit board processing according to claim 2, characterized in that: A cylinder (17) is fixedly connected to the top of the mounting bracket (5), and a horizontal plate (18) is fixedly connected to the output end of the cylinder (17). A fixing rod (19) is fixedly connected to both ends and the bottom of the middle part of the horizontal plate (18), and a mounting plate (20) is fixedly connected to the bottom of the fixing rod (19).

4. The adhesive coating and developing machine for circuit board processing according to claim 3, characterized in that: An electric push rod (21) is fixedly connected to the top of the mounting plate (20), and two symmetrically arranged grooves (22) are opened on the surface of the mounting plate (20). A connecting rod (23) is provided inside the two grooves (22), and an arc-shaped support plate (24) is fixedly connected to the bottom of the connecting rod (23). A guide rod (26) is fixedly connected to the outside of the connecting rod (23).

5. A coating and developing machine for circuit board processing according to claim 4, characterized in that: The output end of the electric push rod (21) is fixedly connected to the outside of the connecting rod (23). The inner bottom surface of the arc-shaped support plate (24) is provided with a sieve hole (25). The inside of the groove (22) is provided with a connecting hole (27). The guide rod (26) is located inside the connecting hole (27).

6. The adhesive coating and developing machine for circuit board processing according to claim 1, characterized in that: The filtration mechanism includes a liquid pump (7), which is fixedly connected to one end of the workbench (2). The input end of the liquid pump (7) is connected to a first connecting pipe (11), one end of the first connecting pipe (11) is connected to a four-way pipe (12), and the other three ends of the four-way pipe (12) are all connected to the bottom of the working cylinder (6). The output end of the liquid pump (7) is connected to a second connecting pipe (13), and one end of the second connecting pipe (13) is connected to a filter box (8).

7. A coating and developing machine for circuit board processing according to claim 6, characterized in that: The filter box (8) is equipped with a fine filter plate (14) and a PP cotton filter plate (15). A third connecting pipe (16) is connected to one side of the bottom of the filter box (8). The third connecting pipe (16) passes through the working cylinder (6) in sequence, and the surface of the part of the third connecting pipe (16) inside the working cylinder (6) is provided with a water outlet hole.

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