Cooling device of computer case

Abstract

The utility model discloses a heat dissipation device of a computer case, which comprises a support module, a control module, a mainboard and a heat dissipation module, the control module is arranged on one side of the support module and is used for detecting or adjusting the temperature in the computer case, the mainboard is vertically arranged on the support module, the heat dissipation module is arranged at one end of the mainboard, and the heat dissipation module is arranged on the other end of the mainboard. The heat dissipation module is arranged in the computer case, electrically connected with the control module and used for conducting heat dissipation on the interior of the computer case, the control module comprises a transparent acrylic, a display adjusting panel and a panel upper cover, the display adjusting panel is installed on the top of the panel upper cover, the transparent acrylic is installed on the upper surface of the display adjusting panel, and the heat dissipation module is tightly combined with the control module, so that heat dissipation is achieved. Effective monitoring and intelligent adjustment of the internal temperature of the computer case are achieved. The fan control PCB in the heat dissipation module is matched with the PWM chip, the rotating speed of the fan can be accurately controlled, and therefore dynamic heat dissipation is conducted according to the real-time temperature in the case.

Description

Technical Field

[0001] This utility model relates to the field of chassis technology, specifically a heat dissipation device for a computer chassis. Background Technology

[0002] With the rapid development of computer technology, the performance of computer hardware has been continuously improved, bringing users unprecedented computing power and user experience. However, the operation of high-performance hardware is also accompanied by the generation of a large amount of heat, which poses a severe challenge to the cooling system of the computer case. The accumulation of heat inside the case can lead to a sharp rise in the operating temperature of the hardware, thereby affecting its performance and, in severe cases, even causing system crashes or hardware damage.

[0003] Traditional cooling solutions primarily rely on installing cooling fans inside the computer case to expel heat and achieve cooling. However, this approach has significant limitations. Firstly, a fan operating at a constant speed can only provide a fixed cooling capacity. When hardware operates under high load, the generated heat may exceed the fan's cooling limit, causing the internal temperature of the case to rise continuously. Secondly, the control module design of some devices is not intuitive enough, making it difficult for users to monitor the internal temperature and fan status in real time; some devices' fan control strategies are not flexible enough to be customized according to the user's actual needs. Therefore, to address these issues, the inventors have proposed a computer case cooling device. Utility Model Content

[0004] In view of the shortcomings of the above-mentioned technologies, this utility model provides a heat dissipation device for a computer case.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a heat dissipation device for a computer chassis, comprising a support module, a control module, a motherboard, and a heat dissipation module. The control module is installed on one side of the support module and is used to detect or adjust the temperature inside the computer chassis. The motherboard is vertically installed on the support module. The heat dissipation module is installed at one end of the motherboard and is electrically connected to the control module for dissipating heat from the inside of the computer chassis. The control module includes a transparent acrylic panel, a display adjustment panel, and a panel cover. The display adjustment panel is installed on the top of the panel cover, and the transparent acrylic panel is installed on the upper surface of the display adjustment panel.

[0006] As further explained, the upper panel cover is provided with a display screen, which is installed at one end of the transparent acrylic to facilitate the display of control data. An adjustment knob is provided extending outward from the upper panel cover, and multiple adjustment knobs are vertically installed on the upper panel cover for adjusting the heat dissipation module.

[0007] As a further explanation, an adjustment PCB board is provided at one end of the display screen, and a lower panel cover is provided extending outward from the adjustment PCB board, and the lower panel cover is connected to the upper panel cover.

[0008] As a further explanation, it also includes a power supply box, which is installed inside the support module and is used to supply power to the heat dissipation module and the control module.

[0009] As further explained, the heat dissipation module includes a fan control PCB board and a SATA power supply. The fan control PCB board is mounted on one end of the motherboard, and the SATA power supply is mounted on the fan control PCB board.

[0010] As a further explanation, one end of the fan control PCB board is provided with a fan power supply interface for electrical connection with an external power source, and a fan synchronization interface is provided on one side of the fan power supply interface. The fan synchronization interface is mounted on the fan control PCB board.

[0011] As further explained, the fan control PCB board has a PWM chip installed inside, which is vertically mounted in the middle of the fan control PCB board. A temperature probe interface is provided extending outward from the fan control PCB board and is installed at the rear of the fan control PCB board, away from the SATA power supply.

[0012] As a further explanation, it also includes a cooling fan, which is mounted on the power supply box and is used to dissipate heat from inside the chassis.

[0013] As further explained, the support module includes a base, a lower L-shaped surround plate, and a rear cover plate. The lower L-shaped surround plate is vertically mounted on the top of the base, and the rear cover plate is vertically mounted on one end of the lower L-shaped surround plate.

[0014] As further explained, the rear cover extends outward to form a chassis body, which is mounted on the rear cover. The chassis body extends outward to form side panels, which are vertically mounted on the chassis body. The motherboard is located at one end of the side panels.

[0015] In summary, this utility model has the following beneficial effects: This utility model provides a heat dissipation device for a computer chassis. Through the close integration of a heat dissipation module and a control module, it achieves effective monitoring and intelligent adjustment of the internal temperature of the computer chassis. The fan control PCB board in the heat dissipation module, in conjunction with a PWM chip, can precisely control the fan speed, thereby dynamically dissipating heat according to the real-time temperature inside the chassis. This ensures effective heat dissipation while avoiding energy waste. The control module adopts a transparent acrylic design with a display adjustment panel, allowing users to intuitively see control data on the display screen, such as temperature and fan speed, facilitating real-time monitoring and adjustment. Simultaneously, the multiple adjustment knobs allow users to easily manually control the heat dissipation module, meeting the heat dissipation needs of different usage scenarios. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of a heat dissipation device for a computer chassis according to the present invention;

[0017] Figure 2 This is a schematic diagram of the internal structure of a heat dissipation device for a computer chassis according to the present invention.

[0018] Figure 3 This is a schematic diagram of the control module structure of a heat dissipation device for a computer chassis according to the present invention;

[0019] Figure 4 This is a schematic diagram of the heat dissipation module structure of a heat dissipation device for a computer chassis according to the present invention. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] like Figure 1-4 As shown, this utility model discloses a heat dissipation device for a computer chassis, including a support module 20, a control module 10, a motherboard 1, and a heat dissipation module 30. The control module 10 is installed on one side of the support module 20 and is used to detect or adjust the temperature inside the computer chassis. The motherboard 1 is vertically installed on the support module 20. The heat dissipation module 30 is installed at one end of the motherboard 1 and is electrically connected to the control module 10 for dissipating heat from the inside of the computer chassis. The control module 10 includes a transparent acrylic 101, a display adjustment panel 102, and a panel cover 106. The display adjustment panel 102 is installed on the top of the panel cover 106, and the transparent acrylic 101 is installed on the upper surface of the display adjustment panel 102.

[0022] Specifically, transparent acrylic 101 covers the display adjustment panel 102, protecting the display screen 104 from dust and impacts while providing a clear visual effect.

[0023] The display control panel 102 has an embedded display screen 104 for real-time display of key data such as the temperature and fan speed inside the chassis. Users can use this data to understand the chassis's heat dissipation status.

[0024] The panel cover 106 extends outward and has multiple adjustment knobs 103. These knobs are connected to the heat dissipation module 30 and are used to manually adjust the fan speed and heat dissipation strategy.

[0025] The panel cover 106 has a display screen 104 inside. The display screen 104 is installed at one end of the transparent acrylic 101 to facilitate the display of control data. The panel cover 106 extends outward and has adjustment knobs 103. Multiple adjustment knobs 103 are vertically installed on the panel cover 106 and are used to adjust the heat dissipation module 30.

[0026] Specifically, the display screen 104 in the control module 10 visually displays key data such as the internal temperature and fan speed of the chassis through a transparent acrylic panel 101. This data is received and processed by the adjustment PCB board 105 and then transmitted to the display screen 104. Users can manually control the heat dissipation module 30 using multiple adjustment knobs 103 on the panel cover 106. These knobs are connected to the adjustment PCB board 105 and can adjust parameters such as fan speed and the sensitivity of the temperature control strategy.

[0027] An adjustment PCB board 105 is provided at one end of the display screen 104. A lower panel cover 107 is provided extending outward from the adjustment PCB board 105, and the lower panel cover 107 is connected to the upper panel cover 106.

[0028] Specifically, the adjustment PCB board 105 is mainly used to receive signals input by the user and convert them into control commands for the heat dissipation module 30. At the same time, the adjustment PCB board 105 is also connected to the lower cover 107 of the panel, providing stable structural support for the entire control module 10.

[0029] It also includes a power supply box 11, which is installed inside the support module 20 and is used to supply power to the heat dissipation module 30 and the control module 10.

[0030] Specifically, the power supply box 11 is installed inside the support module 20, providing a stable power supply for the entire heat dissipation device. It adopts a highly efficient and energy-saving design, which can reduce energy consumption and heat generation while ensuring stable system operation.

[0031] The heat dissipation module 30 includes a fan control PCB board 31 and a SATA power supply 32. The fan control PCB board 31 is installed at one end of the motherboard 1, and the SATA power supply 32 is installed on the fan control PCB board 31.

[0032] Specifically, the SATA power supply 32 provides a stable power supply to the fan control PCB board 31 and the cooling fan 37, ensuring that they can work continuously.

[0033] One end of the fan control PCB board 31 is provided with a fan power supply interface 34 for electrical connection with an external power source, and a fan synchronization interface 33 is provided on one side of the fan power supply interface 34. The fan synchronization interface 33 is mounted on the fan control PCB board 31.

[0034] Specifically, the PWM chip 35 adjusts the speed of the cooling fan 37 in real time according to the temperature inside the chassis to achieve the best heat dissipation effect. At the same time, the fan control PCB board 31 is also equipped with a fan power supply interface 34 and a fan synchronization interface 33 for connecting and synchronizing with external power supplies and other fans.

[0035] The fan control PCB board 31 has a PWM chip 35 installed inside. The PWM chip 35 is vertically mounted in the middle of the fan control PCB board 31. The fan control PCB board 31 extends outward to provide a temperature probe interface 36. The temperature probe interface 36 is installed at the rear of the fan control PCB board 31 and is away from the SATA power supply 32.

[0036] Specifically, the temperature probe interface 36 connects to a temperature sensor (not shown) inside the chassis to monitor the internal temperature in real time. This temperature data is transmitted to the PWM chip 35 inside the fan control PCB board 31, and is also displayed in real time on the display screen 104 in the control module 10. The display screen 104 is located below the transparent acrylic panel 101, allowing users to clearly see key information such as the current temperature and fan speed through the transparent acrylic panel.

[0037] Based on the received temperature data, the PWM chip 35 calculates the optimal speed of the cooling fan 37 using a complex algorithm and sends control signals to the fan drive circuit on the fan control PCB board 31. These control signals adjust the speed of the cooling fan 37 to cope with changes in the internal temperature of the chassis. When the temperature rises, the PWM chip 35 increases the fan speed to improve heat dissipation efficiency; when the temperature drops, it decreases the fan speed to reduce noise and energy consumption.

[0038] It also includes a cooling fan 37, which is mounted on the power supply box 11 and is used to dissipate heat from inside the chassis.

[0039] Specifically, the cooling fan 37 is installed on the power supply box 11 and uses the principle of air convection to expel heat from inside the chassis and keep the internal temperature of the chassis suitable.

[0040] The support module 20 includes a base 25, a lower L-shaped surround plate 24, and a rear cover plate 23. The lower L-shaped surround plate 24 is vertically mounted on the top of the base 25, and the rear cover plate 23 is vertically mounted on one end of the lower L-shaped surround plate 24. A chassis body 21 extends outward from the rear cover plate 23 and is mounted on the rear cover plate 23. Side plates 22 extend outward from the chassis body 21 and are vertically mounted on the chassis body 21. The motherboard 1 is located at one end of the side plate 22.

[0041] Specifically, the support module 20 consists of a base 25, a lower L-shaped panel 24, and a rear cover 23, providing a stable mounting base for the entire heat dissipation device. The chassis body 21 and side panels 22 further optimize the airflow structure inside the chassis, allowing air to flow smoothly through the chassis and effectively remove heat.

[0042] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0043] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A heat dissipation device for a computer case, characterized in that: Including support modules; A control module, which is installed on one side of the support module, is used to detect or regulate the temperature inside the computer case; The mainboard is vertically mounted on the support module; A heat dissipation module is installed at one end of the motherboard and is electrically connected to the control module for dissipating heat from the inside of the computer case. The control module includes a transparent acrylic panel, a display adjustment panel, and a panel cover. The display adjustment panel is mounted on top of the panel cover, and the transparent acrylic panel is mounted on the upper surface of the display adjustment panel.

2. The heat dissipation device for a computer chassis according to claim 1, characterized in that: The panel cover has a display screen inside, which is installed at one end of the transparent acrylic to facilitate the display of control data. The panel cover extends outward and has adjustment knobs. Multiple adjustment knobs are vertically installed on the panel cover for adjusting the heat dissipation module.

3. The heat dissipation device for a computer chassis according to claim 2, characterized in that: An adjustment PCB board is provided at one end of the display screen, and a lower panel cover is provided extending outward from the adjustment PCB board, and the lower panel cover is connected to the upper panel cover.

4. The heat dissipation device for a computer chassis according to claim 3, characterized in that: It also includes a power supply box, which is installed inside the support module and is used to supply power to the heat dissipation module and the control module.

5. A heat dissipation device for a computer chassis according to claim 4, characterized in that: The heat dissipation module includes a fan control PCB board and a SATA power supply. The fan control PCB board is mounted on one end of the motherboard, and the SATA power supply is mounted on the fan control PCB board.

6. The heat dissipation device for a computer chassis according to claim 5, characterized in that: One end of the fan control PCB board is provided with a fan power supply interface for electrical connection with an external power source, and a fan synchronization interface is provided on one side of the fan power supply interface. The fan synchronization interface is mounted on the fan control PCB board.

7. A heat dissipation device for a computer chassis according to claim 6, characterized in that: The fan control PCB board has a PWM chip installed inside, which is vertically mounted in the middle of the fan control PCB board. A temperature probe interface extends outward from the fan control PCB board and is installed at the rear of the fan control PCB board, away from the SATA power supply.

8. A heat dissipation device for a computer chassis according to claim 7, characterized in that: It also includes a cooling fan, which is mounted on the power supply box and is used to dissipate heat from inside the chassis.

9. A heat dissipation device for a computer chassis according to any one of claims 1-8, characterized in that: The support module includes a base, a lower L-shaped surround plate, and a rear cover plate. The lower L-shaped surround plate is vertically installed on the top of the base, and the rear cover plate is vertically installed on one end of the lower L-shaped surround plate.

10. A heat dissipation device for a computer chassis according to claim 9, characterized in that: The rear cover extends outward to form a chassis body, which is mounted on the rear cover. The chassis body extends outward to form side panels, which are vertically mounted on the chassis body. The motherboard is located at one end of the side panels.

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