Sheet connecting device

Abstract

The utility model relates to a splicing device. The splicing device comprises a base, a first splicing platform, a second splicing platform and a positioning mechanism, the first sheet receiving platform and the second sheet receiving platform are arranged on the base in a liftable and spaced mode. The first sheet receiving platform and the second sheet receiving platform are provided with flush working faces used for receiving materials. And the positioning mechanism encloses a splicing area spanning the two working surfaces, and the splicing area is gradually expanded outwards in the direction far away from the working surfaces. When the material splicing device is used for splicing the silicon wafers, the risk that part of the silicon wafers are suspended due to the edge landing phenomenon when the silicon wafers are spliced through the splicing platform can be reduced, the risk that the silicon wafers are scratched or broken in the silicon wafer suction process is reduced, and therefore the production capacity and yield of solar cells are improved.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, and in particular to a splicing device. Background Technology

[0002] In the solar cell manufacturing process, silicon wafers are typically transported in baskets. These baskets are manually moved into automated equipment, where they are then transferred. Wafers are then manually extracted and moved to a high-speed conveyor belt, from which they are transported to their designated locations. Once at their destination, a wafer receiving platform rises to receive the wafers, and the subsequent transfer process begins.

[0003] During transportation, the actual position of the silicon wafer may deviate slightly when it reaches the designated location. This can cause overlap when the wafer assembly platform is raised for assembly, resulting in a portion of the wafer being suspended in the air. When the wafer is subsequently picked up from the assembly platform, this suspended portion can cause scratches or breakage, impacting production capacity and yield. Utility Model Content

[0004] Therefore, it is necessary to provide a wafer bonding device that can reduce the risk of silicon wafers overlapping and becoming partially suspended when the wafer bonding platform is bonding wafers, thereby reducing the risk of scratches or breakage during the wafer picking process, and thus improving the production capacity and yield of solar cells.

[0005] This application provides a bonding device, including a base, a first bonding platform, a second bonding platform, and a positioning mechanism;

[0006] The first and second receiving platforms are liftable and spaced apart on the base; the first and second receiving platforms have flush working surfaces for receiving materials.

[0007] The positioning mechanism forms a contact area spanning the two working surfaces, and the contact area gradually expands outward along the direction away from the working surfaces.

[0008] In some embodiments, the positioning mechanism includes multiple positioning elements, and at least one of the positioning elements is provided on both the first and second bonding platforms.

[0009] In some embodiments, the positioning mechanism includes at least four positioning elements; in one positioning mechanism, at least two of the positioning elements are disposed on the working surface of the first bonding platform, and at least two of the positioning elements are disposed on the working surface of the second bonding platform.

[0010] In some embodiments, the positioning element is frustum-shaped, and the larger bottom surface of the positioning element is disposed on the working surface.

[0011] In some embodiments, the positioning element has an air hole, the air outlet of which is located on the surface of the positioning element away from the working surface.

[0012] The bonding device further includes an air blowing mechanism, which is disposed on the base and is used to blow air into the air inlet end of the air hole.

[0013] In some embodiments, the bonding device further includes a detection element disposed on the working surface; the end of the detection element away from the working surface is higher than the outlet end of the air hole.

[0014] In some embodiments, the splicing device further includes a control element; the control element is electrically connected to the detection element and is capable of receiving signals from the detection element, and the control element is also used to control the air blowing mechanism.

[0015] In some embodiments, both the first bonding platform and the second bonding platform extend along a first direction, and the bonding device includes a plurality of positioning mechanisms, which are arranged at intervals along the first direction.

[0016] In some embodiments, the bonding device further includes a limiting member; the limiting member is disposed on the working surface and located at the periphery of the bonding area.

[0017] In some embodiments, the splicing device further includes a lifting mechanism and a support member;

[0018] The lifting mechanism is mounted on the base, and the support member is connected to the lifting mechanism. The lifting mechanism is used to control the lifting of the support member. The first connecting platform and the second connecting platform are both mounted on the support member.

[0019] In use, the aforementioned wafer bonding device can bond wafers through a bonding area spanning two working surfaces, enclosed by a positioning mechanism. When the material's position shifts during bonding, it may overlap with the side wall of the positioning mechanism. As the bonding area gradually expands outwards away from the working surfaces, the side wall of the positioning mechanism tilts downwards, causing the material overlapping on the side wall to slide to the bottom of the bonding area, thus repositioning the material. When used for silicon wafer bonding, the bonding device of this application reduces the risk of wafer overlap and partial suspension during bonding, thereby reducing the risk of scratches or breakage during wafer pick-up, and ultimately improving the production capacity and yield of solar cells. Attached Figure Description

[0020] Figure 1This is a schematic diagram of the structure of a splicing device provided in an embodiment of this application.

[0021] Explanation of reference numerals in the attached figures

[0022] 10. Base; 21. First connecting platform; 22. Second connecting platform; 30. Positioning mechanism; 31. Positioning component; 40. Connecting area; 50. Limiting component; 60. Lifting mechanism; 70. Support component. Detailed Implementation

[0023] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0025] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0027] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0028] Reference Figure 1 As shown, this application provides a sheet receiving device, including a base 10, a first sheet receiving platform 21, a second sheet receiving platform 22, and a positioning mechanism 30. The first sheet receiving platform 21 and the second sheet receiving platform 22 are liftable and spaced apart on the base 10. The first sheet receiving platform 21 and the second sheet receiving platform 22 have flush working surfaces for receiving materials. The positioning mechanism 30 forms a sheet receiving area 40 spanning the two working surfaces, and the sheet receiving area 40 gradually expands outward along the direction away from the working surfaces.

[0029] It is understood that the wafer-attaching device of this application can be used for receiving materials. For example, it can be used for receiving silicon wafers or solar cells during the production of photovoltaic modules. Specifically, the wafer-attaching device of this application can be used in conjunction with a conveying device. In actual use, the conveying device can be positioned between the first wafer-attaching platform 21 and the second wafer-attaching platform 22, and the initial height of the first wafer-attaching platform 21 and the second wafer-attaching platform 22 is lower than the height of the bearing surface of the conveying device. When the conveying device transfers the silicon wafer to the designated position, the first wafer-attaching platform 21 and the second wafer-attaching platform 22 are raised simultaneously, so that the silicon wafer can be received from below by connecting the two ends of the silicon wafer exposed on the conveying device.

[0030] In use, the aforementioned wafer bonding device can bond wafers through a bonding area 40 spanning two working surfaces, enclosed by a positioning mechanism 30. When the material's position shifts during bonding, it may overlap with the side wall of the positioning mechanism 30. As the bonding area gradually expands outwards away from the working surfaces, the side wall of the positioning mechanism 30 tilts downwards, causing the material overlapping with the side wall to slide to the bottom of the bonding area 40, thus repositioning the material. When used for silicon wafer bonding, the bonding device of this application reduces the risk of wafer overlap and partial suspension during bonding, thereby reducing the risk of scratches or breakage during wafer pick-up and improving the production capacity and yield of solar cells.

[0031] In some embodiments, the positioning mechanism 30 is positioned across two working surfaces.

[0032] In some embodiments, the positioning mechanism 30 includes a plurality of positioning elements 31, and at least one positioning element 31 is provided on both the first receiving platform 21 and the second receiving platform 22.

[0033] In some embodiments, the positioning mechanism 30 includes at least four positioning elements 31. In one positioning mechanism 30, at least two positioning elements 31 are disposed on the working surface of the first receiving platform 21, and at least two positioning elements 31 are disposed on the working surface of the second receiving platform 22.

[0034] In some embodiments, the positioning member 31 is frustum-shaped, and the larger bottom surface of the positioning member 31 is disposed on the working surface.

[0035] In some embodiments, the positioning member 31 has an air hole, the air outlet of which is located on the surface of the positioning member 31 away from the working surface. The connecting piece device also includes an air blowing mechanism disposed on the base 10, which is used to blow air into the air inlet of the air hole.

[0036] During material transfer, the material may deviate significantly. When the first receiving platform 21 and the second receiving platform 22 are raised to receive the material, some material may overlap the upper surface of the positioning member 31. In this case, air can be blown from the air inlet of the air hole through the air outlet on the upper surface of the positioning member 31 to adjust the position of the material, causing it to move away from the upper surface of the positioning member 31 and slide down the inclined side wall of the positioning member 31, thus completing the repositioning of the material.

[0037] In some embodiments, the vent extends through the positioning member 31 along the height direction of the positioning member 31.

[0038] In some embodiments, the bonding device further includes a detection element disposed on the working surface. The end of the detection element furthest from the working surface is higher than the outlet end of the air hole.

[0039] In some embodiments, the splicing device further includes a control element. The control element is electrically connected to the detection element and is capable of receiving signals from the detection element; the control element is also used to control the air blowing mechanism.

[0040] The detection device can detect whether any material is adhering to the upper surface of the positioning member 31. The control unit receives the signal from the detection device. If the detection device detects material adhering to the upper surface of the positioning member 31, the control unit, upon receiving the signal, can control the air blowing device to blow air and reset the material. When the material offset is large, and blowing air cannot adjust the position of the material, the detection device will detect material adhering to the upper surface of the positioning member 31 for an extended period. In this case, the detection device can send a signal to remind manual correction.

[0041] In some embodiments, the control element is disposed on the base 10.

[0042] In some embodiments, the first bonding platform 21 and the second bonding platform 22 both extend along a first direction, and the bonding device includes a plurality of positioning mechanisms 30, which are arranged at intervals along the first direction.

[0043] Refer again Figure 1 As shown, exemplarily, Figure 1 The X-direction is the first direction.

[0044] In some embodiments, the bonding device further includes a limiting member 50. The limiting member 50 is disposed on the working surface and located at the periphery of the bonding area 40.

[0045] After the positioning mechanism 30 resets the material whose position has shifted, the material will be stored in the receiving area 40. The limiting member 50 can restrict the position of the material in the receiving area 40 and protect the material.

[0046] In some embodiments, the limiting member 50 is located outside the two ends of the connecting piece area 40 in a second direction, which is perpendicular to the first direction.

[0047] Refer again Figure 1 As shown, exemplarily, Figure 1 The Y-direction is the second direction.

[0048] In some embodiments, the bonding device further includes a lifting mechanism 60 and a support member 70. The lifting mechanism 60 is disposed on the base 10, and the support member 70 is connected to the lifting mechanism 60. The lifting mechanism 60 is used to control the lifting and lowering of the support member 70. The first bonding platform 21 and the second bonding platform 22 are both disposed on the support member 70.

[0049] Refer again Figure 1As shown, in some embodiments, the receiving device includes a base 10, a first receiving platform 21, a second receiving platform 22, and a positioning mechanism 30. The first receiving platform 21 and the second receiving platform 22 are liftable and spaced apart on the base 10. The first receiving platform 21 and the second receiving platform 22 have flush working surfaces for receiving materials. The positioning mechanism 30 forms a receiving area 40 spanning the two working surfaces, and the receiving area 40 gradually expands outward along the direction away from the working surfaces. In this embodiment, one positioning mechanism 30 includes four positioning elements 31. In one positioning mechanism 30, two positioning elements 31 are disposed on the working surface of the first receiving platform 21, and two positioning elements 31 are disposed on the working surface of the second receiving platform 22. The positioning elements 31 are frustum-shaped, with the larger base surface of the positioning element 31 disposed on the working surface. The positioning element 31 has an air hole, and the air outlet of the air hole is located on the surface of the positioning element 31 away from the working surface. The bonding device also includes an air blowing mechanism mounted on the base 10, which blows air into the air inlet of the air hole. The air hole passes through the positioning member 31 along its height direction. The bonding device also includes a detection member mounted on the working surface. The end of the detection member away from the working surface is higher than the air outlet of the air hole. The bonding device also includes a control member mounted on the base 10. The control member can receive signals from the detection member and is also used to control the air blowing mechanism. The first bonding platform 21 and the second bonding platform 22 both extend along a first direction. The bonding device includes multiple positioning mechanisms 30, which are spaced apart along the first direction. The bonding device also includes a limiting member 50, which is mounted on the working surface and located on the periphery of the bonding area 40. The bonding device also includes a lifting mechanism 60 and a support member 70. The lifting mechanism 60 is mounted on the base 10, and the support member 70 is connected to the lifting mechanism 60. The lifting mechanism 60 is used to control the lifting of the support member 70. The first splicing platform 21 and the second splicing platform 22 are both mounted on the support member 70.

[0050] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0051] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims, and the specification and drawings can be used to interpret the content of the claims.

Claims

1. A splicing device, characterized in that, include: The base (10), the first splicing platform (21), the second splicing platform (22), and the positioning mechanism (30); The first receiving platform (21) and the second receiving platform (22) are liftable and spaced apart on the base (10); the first receiving platform (21) and the second receiving platform (22) have flush working surfaces for receiving materials; The positioning mechanism (30) forms a connecting area (40) spanning the two working surfaces, and the connecting area (40) gradually expands outward along the direction away from the working surfaces.

2. The splicing device according to claim 1, characterized in that, The positioning mechanism (30) includes multiple positioning elements (31), and at least one of the positioning elements (31) is provided on both the first receiving platform (21) and the second receiving platform (22).

3. The splicing device according to claim 2, characterized in that, The positioning mechanism (30) includes at least four positioning elements (31); in one positioning mechanism (30), at least two positioning elements (31) are disposed on the working surface of the first bonding platform (21), and at least two positioning elements (31) are disposed on the working surface of the second bonding platform (22).

4. The splicing device according to claim 3, characterized in that, The positioning element (31) is in the shape of a frustum, and the larger bottom surface of the positioning element (31) is disposed on the working surface.

5. The splicing device according to claim 2, characterized in that, The positioning element (31) has an air hole, and the air outlet end of the air hole is opened on the surface of the positioning element (31) away from the working surface. The splicing device also includes an air blowing mechanism, which is disposed on the base (10) and is used to blow air into the air inlet end of the air hole.

6. The splicing device according to claim 5, characterized in that, The bonding device further includes a detection element disposed on the working surface; the end of the detection element away from the working surface is higher than the air outlet end of the air hole.

7. The splicing device according to claim 6, characterized in that, The bonding device further includes a control component; the control component is electrically connected to the detection component and is capable of receiving signals from the detection component, and the control component is also used to control the air blowing mechanism.

8. The splicing device according to any one of claims 1 to 7, characterized in that, The first bonding platform (21) and the second bonding platform (22) both extend along the first direction. The bonding device includes a plurality of positioning mechanisms (30), which are arranged at intervals along the first direction.

9. The splicing device according to any one of claims 1 to 7, characterized in that, The bonding device further includes a limiting member (50); the limiting member (50) is disposed on the working surface and located on the periphery of the bonding area (40).

10. The splicing device according to any one of claims 1 to 7, characterized in that, The connecting device also includes a lifting mechanism (60) and a support member (70). The lifting mechanism (60) is disposed on the base (10), and the support member (70) is connected to the lifting mechanism (60). The lifting mechanism (60) is used to control the lifting of the support member (70). The first connecting platform (21) and the second connecting platform (22) are both disposed on the support member (70).

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