Laser device emitting illumination light
By adopting a compact packaging structure and a thermal, electrical, and optical spatial separation design in the laser lighting device, the problems of large size and heat dissipation difficulties are solved, and a miniaturized and efficient heat dissipation laser lighting effect is achieved.
Patent Information
- Application Number
- CN202422737208.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-08
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-11-08
AI Technical Summary
Existing semiconductor laser lighting devices have the problems of large size, difficulty in heat dissipation and heat accumulation, which makes it impossible to achieve miniaturization and efficient heat dissipation.
A compact packaging structure is adopted, and the distance between the fast-axis collimator and the laser chip is set to less than 0.3mm. The conductive pins and heat sink are set on different sides of the packaging shell to achieve spatial separation of heat, electricity and light. The phosphor sheet is directly packaged on the packaging shell, and the laser is emitted directly from the shell.
A miniaturized laser lighting device is realized, which has good heat dissipation and lighting effects, a small overall volume, and the laser beam can be directly emitted from the laser chip packaging shell, and heat is effectively conducted away through the heat sink.
Smart Images
Figure CN223487597U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of laser lighting technology, and more specifically, to a laser device that emits lighting light. Background Technology
[0002] Semiconductor lasers possess advantages such as good directionality, high efficiency, high power density, and small size, making them an indispensable new type of high-efficiency semiconductor light source for strategic emerging industries such as laser display, laser lighting, laser direct writing, laser processing, and visible light communication. In particular, laser lighting, with its advantages of high brightness and long illumination distance, is the most promising lighting source after LEDs. Although semiconductor lasers have high electro-optical conversion efficiency, they generate a significant amount of heat during operation. Simultaneously, the resistance of the various material layers also generates Joule heating, causing a large portion of electrical energy to be converted into heat energy. Furthermore, the low thermal conductivity of semiconductor laser materials makes it difficult for heat to dissipate quickly. In addition, the phosphor also generates a large amount of heat during the wavelength conversion process to produce laser light. Therefore, most current commercial applications of semiconductor lasers for lighting utilize remote excitation methods. The term "remote excitation" doesn't mean the laser and phosphor need to be extremely far apart. Rather, it means the laser chip and phosphor are farther apart than the LED emitter. This is because the phosphor layer or sheet of an LED emitter can be directly coated or attached to the LED chip surface. However, for laser lighting, the current conventional method involves first focusing the laser beam onto a wavelength conversion phosphor using a focusing lens, then collecting the beam using a collecting lens, and finally encapsulating the laser, focusing lens, and collecting lens in a single housing. This design makes it difficult to achieve a small overall size for the laser module. Utility Model Content
[0003] The present invention aims to overcome at least one of the defects of the prior art and provide a laser device for emitting illumination light. The laser device for emitting illumination light has good illumination effect and very small size. The phosphor sheet can be directly encapsulated on the encapsulation shell, the structure is very compact, and the thermo-electric-optical space is separated. While satisfying miniaturization, it also takes into account the illumination effect and heat dissipation effect.
[0004] The technical solution adopted by this utility model is:
[0005] A laser device for emitting illumination light includes a housing, a heat sink disposed within the housing, a laser chip emitting laser light disposed on the heat sink, a fast-axis collimating lens, a wavelength conversion powder, and an emitting lens arranged sequentially along the optical path of the laser light. The fast-axis collimating lens is used to reduce the divergence angle of the laser light in the fast-axis direction. The wavelength conversion powder is used to convert at least part of the laser light into a received laser light. The emitting lens is used to emit a mixture of the received laser light and the unconverted laser light to form illumination light. The housing has a through hole for emitting illumination light, and the wavelength conversion powder and the emitting lens are both disposed within the through hole. The side of the housing has conductive pins, and the conductive pins and the heat sink are respectively disposed on different surfaces of the housing. The distance between the fast-axis collimating lens and the laser chip is less than 0.3 mm.
[0006] In one embodiment, the conductive pin is disposed on the outside of the package housing, the light-emitting lens and the conductive pin are respectively located on two opposite sides of the package housing, and the heat sink is disposed on the bottom surface of the package housing.
[0007] In one embodiment, the conductive pin and the laser chip are connected by gold wire.
[0008] In one embodiment, the distance between the fast-axis collimating lens and the laser chip is 0.07 mm.
[0009] In one embodiment, the distance between the wavelength conversion powder and the laser chip is 2-3 mm.
[0010] In one embodiment, the fast axis divergence angle θ1 of the laser chip is 46° to 50°, and the slow axis divergence angle θ2 is 8° to 9°.
[0011] In one embodiment, the back focal length of the fast-axis collimating lens is 0.05–0.3 mm.
[0012] In one embodiment, the main optical axis of the laser chip's emission direction is parallel to the bottom surface of the packaging housing, and the top surface of the packaging housing is provided with a sealing cover.
[0013] In one embodiment, the wavelength conversion phosphor includes a sapphire substrate and a phosphor layer located on the sapphire substrate, with the phosphor layer located on the side opposite to the laser chip.
[0014] In one embodiment, the fast-axis collimating lens is a cylindrical lens, with the surface of the cylindrical lens near the laser chip being a plane and the surface near the wavelength conversion powder being a curved surface convex toward the wavelength conversion powder.
[0015] Compared with the prior art, the beneficial effects of this utility model are as follows: This application sets a fast-axis collimating lens near the laser chip, and sets the distance between the fast-axis collimating lens and the laser chip to be less than 0.3mm. The laser emitted by the laser chip is collimated by the fast-axis collimating lens after traveling a very short distance, and then incident on the wavelength conversion phosphor. This prevents the laser from fully diverging in the fast-axis direction, resulting in a very small laser beam and a very small spot on the wavelength conversion phosphor. This is equivalent to first diverging in the fast-axis direction and then converging it onto the wavelength conversion phosphor through a converging lens. This achieves ultra-short-distance laser excitation of the phosphor, thus enabling direct illumination from the laser chip's packaging shell, resulting in a very small overall size. Furthermore, by placing the conductive pins and the heat sink on different surfaces of the packaging shell, heat dissipation is improved, achieving spatial separation of heat, electricity, and light. Attached Figure Description
[0016] Figure 1 This is a structural diagram of the laser device that emits illumination light in Example 1.
[0017] Figure 2 This is an exploded view of the laser device that emits illumination light in Example 1.
[0018] Figure 3 This is a cross-sectional view of the laser device that emits illumination light in Example 1.
[0019] Figure 4 This is a front view of Example 1.
[0020] Reference numerals: 1. Package housing; 2. Heat sink; 3. Laser chip; 4. Fast axis collimating lens; 5. Wavelength conversion powder; 6. Conductive pin; 7. Light-emitting lens; 8. Sealing cover. Detailed Implementation
[0021] The accompanying drawings are for illustrative purposes only and should not be construed as limiting the scope of this invention. To better illustrate the following embodiments, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.
[0022] Example 1
[0023] like Figure 1As shown, a laser device for emitting illumination light includes a housing 1, a heat sink 2 disposed within the housing 1, a laser chip 3 emitting laser light disposed on the heat sink 2, a fast-axis collimating lens 4, a wavelength conversion powder 5, and an emitting lens 7 arranged sequentially along the laser's optical path. The fast-axis collimating lens 4 is used to reduce the divergence angle of the laser in the fast-axis direction. The wavelength conversion powder 5 is used to convert at least part of the laser light into a received laser light. The emitting lens 7 is used to emit a mixture of the received laser light and the unconverted laser light to form illumination light. The housing 1 has a through hole for emitting illumination light, and both the wavelength conversion powder 5 and the emitting lens 7 are disposed within the through hole. The side of the housing 1 has conductive pins 6, and the conductive pins 6 and the heat sink 2 are respectively disposed on different surfaces of the housing 1. The distance between the fast-axis collimating lens 4 and the laser chip 3 is less than 0.3 mm.
[0024] In this embodiment, the laser chip 3 is hermetically sealed using a packaging shell 1. The heat generated by the laser chip 3 is conducted and dissipated through the heat sink 2 and the packaging shell 1. A fast-axis collimating lens 4 is placed near the laser chip 3, and the distance between the fast-axis collimating lens 4 and the laser chip 3 is set to less than 0.3 mm. Thus, the laser emitted by the laser chip 3 is collimated by the fast-axis collimating lens 4 after traveling a very short distance, and then incident on the wavelength conversion phosphor 5. This prevents the laser from fully diverging in the fast-axis direction, resulting in a very small laser beam. Consequently, the spot of light incident on the wavelength conversion phosphor 5 is very small, and the fast and slow axes of the spot are approximately the same, producing a square or circular spot. This effect is equivalent to first diffusing in the fast-axis direction and then converging on the wavelength conversion phosphor through a converging lens. This achieves ultra-short-distance laser excitation of the phosphor, thus realizing direct emission of illumination light from the packaging shell 1 of the laser chip 3, which is equivalent to the laser itself emitting illumination light. The conductive pins 6 and the heat sink 2 are respectively disposed on different sides of the package housing 1, which has a good heat dissipation effect and separates the thermal, electrical and optical spaces, resulting in a very small overall volume.
[0025] Furthermore, the conductive pin 6 is disposed on the outside of the package housing 1, the light-emitting lens 7 and the conductive pin 6 are respectively located on two opposite sides of the package housing 1, and the heat sink 2 is disposed on the bottom surface of the package housing 1. Specifically, the conductive pin 6 and the laser chip 3 are connected by gold wire. More specifically, the conductive pin 6 and the package housing 1 are insulated and sealed by glass sintering.
[0026] Furthermore, the distance between the wavelength conversion powder 5 and the laser chip 3 is 2-3 mm. The short distance between the wavelength conversion powder 5 and the fast-axis collimating lens 4 and the laser chip 3 enables ultra-short-distance laser excitation.
[0027] Furthermore, the fast-axis divergence angle θ1 of the laser chip 3 is 46°–50°, and the slow-axis divergence angle θ2 is 8–9°. More specifically, the fast-axis divergence angle θ1 of the laser chip 3 is 48°, and the slow-axis divergence angle θ2 is 8.5°.
[0028] Furthermore, the fast-axis collimating lens 4 is a cylindrical lens, with the surface of the cylindrical lens near the laser chip 3 being a flat surface and the surface near the wavelength conversion powder 5 being a curved surface convex toward the wavelength conversion powder 5.
[0029] Furthermore, in this embodiment, the back focal length of the fast-axis collimating lens 4 is 0.05–0.3 mm. More specifically, in this embodiment, the distance between the fast-axis collimating lens 4 and the laser chip 3 is 0.07 mm.
[0030] Furthermore, the main optical axis of the laser chip 3 is parallel to the bottom surface of the packaging housing 1, and a sealing cover plate 8 is provided on the top surface of the packaging housing 1. The sealing cover plate 8 is hermetically sealed by processes such as parallel seam welding or soldering.
[0031] More specifically, the heat sink 2 is configured to contact the bottom surface of the encapsulation housing 1.
[0032] Furthermore, the wavelength conversion powder 5 includes a sapphire substrate and a phosphor layer located on the sapphire substrate, with the phosphor layer situated on the side facing away from the laser chip. Furthermore, an anti-reflection film is also provided on the side of the sapphire substrate facing away from the phosphor layer to increase laser transmittance.
[0033] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the technical solution of this utility model, and are not intended to limit the specific implementation of this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the claims of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A laser device for emitting illumination light, characterized in that, The device includes a package housing, a heat sink disposed within the package housing, a laser chip emitting laser light disposed on the heat sink, a fast-axis collimating lens, a wavelength conversion powder, and an emitting lens arranged sequentially along the optical path of the laser light. The fast-axis collimating lens is used to reduce the divergence angle of the laser light in the fast-axis direction. The wavelength conversion powder is used to convert at least part of the laser light into a received laser light. The emitting lens is used to emit a mixture of the received laser light and the unconverted laser light to form illumination light. The package housing has a through hole for emitting illumination light. The wavelength conversion powder and the emitting lens are both disposed within the through hole. The side of the package housing has conductive pins. The conductive pins and the heat sink are respectively disposed on different surfaces of the package housing. The distance between the fast-axis collimating lens and the laser chip is less than 0.3 mm.
2. The laser device for emitting illumination light according to claim 1, characterized in that, The conductive pins are disposed on the outside of the package housing, the light-emitting lens and the conductive pins are respectively located on two opposite sides of the package housing, and the heat sink is disposed on the bottom surface of the package housing.
3. The laser device for emitting illumination light according to claim 1, characterized in that, The conductive pins and the laser chip are connected by gold wires.
4. The laser device for emitting illumination light according to claim 1, characterized in that, The distance between the fast-axis collimating lens and the laser chip is 0.07 mm.
5. The laser device for emitting illumination light according to claim 1, characterized in that, The distance between the wavelength conversion powder and the laser chip is 2-3 mm.
6. The laser device for emitting illumination light according to claim 1, characterized in that, The laser chip has a fast-axis divergence angle θ1 of 46° to 50° and a slow-axis divergence angle θ2 of 8° to 9°.
7. The laser device for emitting illumination light according to claim 6, characterized in that, The back focal length of the fast-axis collimating lens is 0.05–0.3 mm.
8. The laser device for emitting illumination light according to claim 1, characterized in that, The main optical axis of the laser chip's emission direction is parallel to the bottom surface of the packaging shell, and the top surface of the packaging shell is provided with a sealing cover.
9. The laser device for emitting illumination light according to any one of claims 1 to 8, characterized in that, The wavelength conversion phosphor includes a sapphire substrate and a phosphor layer on the sapphire substrate, with the phosphor layer located on the side opposite to the laser chip.
10. The laser device for emitting illumination light according to any one of claims 1 to 8, characterized in that, The fast-axis collimating lens is a cylindrical lens, with the surface of the cylindrical lens near the laser chip being a flat surface and the surface near the wavelength conversion powder being a curved surface convex toward the wavelength conversion powder.