Laser heating module and laser heating device
By providing each chip with a separate heat sink and microchannel water cooling, the problem of local heat accumulation in the laser is solved, and the surface spot uniformity and photoelectric conversion efficiency of the laser heating module are improved.
Patent Information
- Application Number
- CN202422724699.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-08
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-11-08
AI Technical Summary
In the existing technology, as the laser power density increases, the number of chips increases, and the chips are arranged more densely, heat is easily accumulated locally, resulting in increased local chip temperature, reduced photoelectric conversion efficiency, and poor surface spot uniformity.
A separate heat sink is provided for each chip, and water cooling is performed using the microchannels of the heat sink. First and second water cooling pipes are set through the substrate, and the microchannels of the heat sink are connected to the water cooling pipes. Coolant flows through the microchannels to remove heat and avoid local heat accumulation.
The laser heating module achieves better surface spot uniformity, avoids the reduction of local chip photoelectric conversion efficiency, and improves the heat dissipation effect and overall heating effect.
Smart Images
Figure CN223487598U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of laser heating technology, and in particular to a laser heating module and a laser heating device. Background Technology
[0002] Among related technologies, vertical cavity surface-emitting lasers (VCSELs) are widely used in various fields such as military, medical, printing, communications, computers, and industrial processing. They utilize multiple chips to form an array, thereby achieving a large power density.
[0003] However, as the power density of lasers increases, the number of chips required increases, and the chips become more densely packed. This leads to the heat generated by the chips easily accumulating locally, causing localized temperature increases and reducing photoelectric conversion efficiency, resulting in poor uniformity of the laser beam. Utility Model Content
[0004] This utility model discloses a laser heating module and a laser heating device. By providing a separate heat sink for each chip and using the microchannels of the heat sink for water cooling, it is possible to avoid the situation where heat accumulates locally and reduces the photoelectric conversion efficiency of the chip in a localized area. The laser heating module has better uniformity of surface spot.
[0005] In a first aspect, this utility model discloses a laser heating module, including a substrate, a first water-cooling pipeline, a second water-cooling pipeline, a microchannel array, a chip array, and a circuit driver. The first water-cooling pipeline is disposed on the substrate and has an inlet for introducing coolant into the first water-cooling pipeline. The second water-cooling pipeline is disposed on the substrate and has an outlet for discharging coolant from the second water-cooling pipeline. The microchannel array includes multiple heat sinks disposed on the substrate, each heat sink having a microchannel. The two openings of each microchannel are respectively connected to the first water-cooling pipeline and the second water-cooling pipeline. The chip array includes multiple chips, each chip being attached to one of the heat sinks. The circuit driver is electrically connected to the multiple chips.
[0006] In this embodiment, multiple heat sinks are arranged in a microchannel array on a substrate. Multiple chips from a chip array are respectively mounted on these heat sinks, and the chips are electrically connected to a circuit driver, thereby driving the chips through the circuit driver. Simultaneously, a first and second water-cooling pipeline are arranged on the substrate. The two openings of the microchannels of the heat sinks are connected to the first and second water-cooling pipelines, respectively. Coolant is introduced into the first water-cooling pipeline through its inlet, flows through the microchannels of the heat sinks, and exits from the outlet of the second water-cooling pipeline, thus carrying away the heat generated by the chips and achieving heat dissipation for the laser heating module. Furthermore, since each chip has an individual heat sink, and water cooling is achieved using the microchannels of the heat sinks, it avoids the local accumulation of heat that could lead to a decrease in the photoelectric conversion efficiency of the chip in certain areas, resulting in better uniformity of the laser spot in the laser heating module.
[0007] As an optional implementation, the laser heating module includes a plurality of first connecting pipes and a plurality of second connecting pipes. One open end of each microchannel is connected to the first water-cooling pipeline through the first connecting pipe, and the other open end of each microchannel is connected to the second water-cooling pipeline through the second connecting pipe.
[0008] In this way, by connecting one open end of the microchannel and the first water-cooling pipe through the first connecting pipe, the coolant entering through the first water-cooling pipe can flow into the microchannel, while the second connecting pipe connects the other open end of the microchannel and the second water-cooling pipe, so that the coolant in the microchannel can flow into the second water-cooling pipe through the other open end and be discharged from the second water-cooling pipe.
[0009] As an optional implementation, in this embodiment of the present invention, a plurality of heat sinks are disposed on one side of the substrate, the first water cooling pipe and the second water cooling pipe are disposed on the side of the substrate away from the plurality of heat sinks, and the first connecting pipe and the second connecting pipe pass through from one side of the substrate to the other side of the substrate.
[0010] In this way, on the one hand, by placing multiple heat sinks and the first and second water-cooling pipes on opposite sides of the substrate, the substrate can be used for separation, avoiding heat exchange between them and thus preventing the heat dissipation effect from being affected. On the other hand, by having the first and second connecting pipes pass through from one side of the substrate to the other, the length of the first and second connecting pipes can be shortened as much as possible, thereby improving the heat exchange efficiency.
[0011] As an optional implementation, in this embodiment of the invention, the orientation of the water inlet is the same as the orientation of the water outlet, and at least one of the first water-cooling pipe and the second water-cooling pipe is configured to be curved.
[0012] In this way, on the one hand, by aligning the inlet and outlet in the same direction, external pipelines (e.g., pipelines for supplying and recovering coolant) can be connected to the inlet and outlet in the same direction, reducing operational difficulty. Furthermore, the overall structure of the laser heating module is relatively compact, which is beneficial for miniaturization design. On the other hand, when the first and second water-cooling pipelines are configured in a curved shape, the pipeline path can be extended, thereby extending the path for the coolant to dissipate heat through heat exchange, thus improving the utilization rate of the coolant and resulting in better heat exchange performance.
[0013] As an optional implementation, in this embodiment of the present invention, the first water-cooled pipeline includes a first extension and a second extension. The first extension is provided with the water inlet. The second extension and the first extension are bent and connected. The second extension is located between the first extension and the second water-cooled pipeline. The second extension is connected to an open end of the microchannel.
[0014] In this way, by bending and connecting the first extension and the second extension, the length of the first water-cooling pipe can be extended, thereby lengthening the path for the coolant to dissipate heat through heat exchange, thus improving the utilization rate of the coolant and resulting in better heat exchange performance. Furthermore, the second extension is located between the first extension and the second water-cooling pipe, which increases the distance between the inlet of the first extension and the outlet of the second water-cooling pipe, facilitating the connection of external pipes to the inlet and outlet and reducing operational difficulty in case of interference.
[0015] As an optional implementation, in this embodiment of the present invention, the laser heating module has at least two chip arrays, and the light emission directions of the chips in the at least two chip arrays are arranged at an angle to each other so that the light fields of the chips in the at least two chip arrays are superimposed.
[0016] In this way, by setting the light emission directions of at least two chip arrays at an angle, the light fields of the chips in the at least two chip arrays can be superimposed on each other, increasing the spot power and power density, and improving the heating effect of the laser heating module.
[0017] Secondly, this utility model discloses a laser heating device, including a cover, a base plate, and a laser heating module of the first aspect. The cover is disposed on the substrate. The first water-cooling pipe, the second water-cooling pipe, and the circuit driver are located in the space between the cover and the substrate. The base plate is disposed on the substrate and is located on the light-emitting side of the chip. The base plate is provided with a light-transmitting part corresponding to the chip.
[0018] The laser heating device of the second aspect has the beneficial effects of the laser heating module of the first aspect. Furthermore, by covering the substrate with a cover, the space between the cover and the substrate can protect the components (first water-cooling pipes, second water-cooling pipes, and circuit drivers, etc.) located in the space between them, and the disassembly and assembly are relatively simple, facilitating maintenance of the laser heating device. Moreover, by using a single light-transmitting section to allow light from multiple chips to pass through, the chips are separated on the side of the base plate facing the substrate, reducing the number of components and extending the service life of the laser heating device.
[0019] As an optional implementation, in this embodiment of the present invention, the laser heating device further includes a first sealing ring, which is pressed between the substrate and the base plate.
[0020] In this way, by pressing the first sealing ring between the substrate and the base plate, the connection between the substrate and the base plate is sealed, thus achieving dustproof and waterproof protection inside the laser heating device.
[0021] As an optional implementation, in this embodiment of the present invention, the light-transmitting part is a light-transmitting window, and the laser heating device further includes a light-transmitting element, which is disposed on the base plate and covers the light-transmitting window.
[0022] In this way, by placing the light-transmitting element on the base plate and covering the light-transmitting window with the light-transmitting element, the light-transmitting element can allow the light emitted by the chip to pass through while sealing the space between the base plate and the substrate, thus providing good dustproof and waterproof effects.
[0023] As an optional implementation, in this embodiment of the present invention, the laser heating device further includes a second sealing ring and a light-shielding member. The light-shielding member is disposed on the side of the light-transmitting member facing the base plate, and the second sealing ring is pressed between the light-shielding member and the base plate.
[0024] In this way, by pressing the second sealing ring between the light-shielding component and the base plate, the connection between the light-shielding component and the base plate is sealed, achieving dust and water protection inside the laser heating device. At the same time, the light-shielding component can block light, preventing light emitted from the chip from shining on the second sealing ring and causing it to age or fail.
[0025] Compared with the prior art, the embodiments of this utility model have at least the following beneficial effects:
[0026] In this embodiment of the invention, multiple heat sinks of a microchannel array are arranged on a substrate, and multiple chips of a chip array are respectively arranged on the multiple heat sinks. These chips are electrically connected to a circuit driver, thereby driving the chips through the circuit driver. Simultaneously, a first water-cooling pipe and a second water-cooling pipe are arranged on the substrate. The two openings of the microchannels of the heat sinks are respectively connected to the first and second water-cooling pipes. Coolant is introduced into the first water-cooling pipe through its inlet, flows through the microchannels of the heat sink, and exits from the outlet of the second water-cooling pipe, thus carrying away the heat generated by the chips and achieving heat dissipation for the laser heating module. Furthermore, since each chip has an individual heat sink, and water cooling is performed using the microchannels of the heat sink, it avoids the local accumulation of heat that could lead to a decrease in the photoelectric conversion efficiency of the chip in certain areas, resulting in better uniformity of the laser spot in the laser heating module. Attached Figure Description
[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0028] Figure 1 This is a schematic diagram of the structure of a laser heating module disclosed in Embodiment 1 of this utility model;
[0029] Figure 2 This is an exploded structural diagram of a laser heating module disclosed in Embodiment 1 of this utility model;
[0030] Figure 3 This is a schematic diagram of the structure of the microchannel array and chip array disclosed in Embodiment 1 of this utility model;
[0031] Figure 4 This is a schematic diagram of the structure of a laser heating module disclosed in Embodiment 1 of this utility model from another perspective;
[0032] Figure 5 This is a schematic diagram of the structure of a laser heating device disclosed in Embodiment 2 of this utility model;
[0033] Figure 6 This is an exploded structural diagram of a laser heating module disclosed in Embodiment 2 of this utility model.
[0034] Explanation of main figure symbols
[0035] 100. Laser heating module; 10. Substrate; 20. First water-cooling pipe; 20a. Water inlet; 21. First extension; 22. Second extension; 30. Second water-cooling pipe; 30a. Water outlet; 40. Microchannel array; 41. Heat sink; 41a. Microchannel; 50. Chip array; 51. Chip; 60. Circuit driver; 71. First connecting pipe; 72. Second connecting pipe; 200. Laser heating device; 201. Cover; 202. Base plate; 202a. Light-transmitting part; 203. First sealing ring; 204. Light-transmitting element; 205. Second sealing ring; 206. Light-shielding element. Detailed Implementation
[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0037] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.
[0038] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.
[0039] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.
[0040] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.
[0041] This utility model discloses a laser heating module and a laser heating device. By providing a separate heat sink for each chip and using the microchannels of the heat sink for water cooling, it can avoid the situation where heat accumulates locally and reduces the photoelectric conversion efficiency of the chip in a local area. The laser heating module has better uniformity of surface spot. Example
[0042] Please refer to the following: Figures 1 to 3 This is a schematic diagram of the structure of a laser heating module 100 provided in Embodiment 1 of the present invention. The laser heating module 100 includes a substrate 10, a first water-cooling pipe 20, a second water-cooling pipe 30, a microchannel array 40, a chip array 50, and a circuit driver 60. The first water-cooling pipe 20 is disposed on the substrate 10 and has a water inlet 20a for introducing coolant into the first water-cooling pipe 20. The second water-cooling pipe 30 is disposed on the substrate 10. The second water-cooling pipe 30 has an outlet 30a for discharging coolant from the second water-cooling pipe 30. The microchannel array 40 includes multiple heat sinks 41, which are disposed on the substrate 10. Each heat sink 41 has a microchannel 41a, and the two open ends of the microchannel 41a are respectively connected to the first water-cooling pipe 20 and the second water-cooling pipe 30. The chip array 50 includes multiple chips 51, which are respectively attached to the multiple heat sinks 41. The circuit driver 60 is electrically connected to the multiple chips 51.
[0043] In this embodiment, a plurality of heat sinks 41 of a microchannel array 40 are set on a substrate 10, and a plurality of chips 51 of a chip array 50 are respectively set on the plurality of heat sinks 41. The plurality of chips 51 are electrically connected to a circuit driver 60, thereby driving the chips 51 through the circuit driver 60. At the same time, a first water-cooling pipe 20 and a second water-cooling pipe 30 are set on the substrate 10. The two opening ends of the microchannels 41a of the heat sinks 41 are respectively connected to the first water-cooling pipe 20 and the second water-cooling pipe 30. In this way, coolant is introduced into the first water-cooling pipe 20 through the inlet 20a. The coolant can flow through the microchannels 41a of the heat sinks 41 and be discharged from the outlet 30a of the second water-cooling pipe 30, thereby removing the heat generated by the chips 51 and realizing the heat dissipation of the laser heating module 100. Furthermore, since each chip 51 is provided with an individual heat sink 41, water cooling is performed using the microchannel 41a of the heat sink 41, which can prevent heat from accumulating locally and causing a decrease in the photoelectric conversion efficiency of the local chip 51, resulting in better uniformity of the laser spot of the laser heating module 100.
[0044] In some embodiments, such as Figure 2 As shown, the laser heating module 100 includes multiple first connecting pipes 71 and multiple second connecting pipes 72. One open end of each microchannel 41a is connected to the first water-cooling pipe 20 through the first connecting pipe 71, and the other open end of each microchannel 41a is connected to the second water-cooling pipe 30 through the second connecting pipe 72. In this way, by connecting one open end of the microchannel 41a to the first water-cooling pipe 20 through the first connecting pipe 71, the coolant entering the first water-cooling pipe 20 can flow to the microchannel 41a. The second connecting pipe 72 connects the other open end of the microchannel 41a to the second water-cooling pipe 30, allowing the coolant in the microchannel 41a to flow to the second water-cooling pipe 30 through the other open end and be discharged from the second water-cooling pipe 30.
[0045] For example, such as Figure 2 and Figure 3 As shown, multiple heat sinks 41 are disposed on one side of the substrate 10, and a first water-cooling pipe 20 and a second water-cooling pipe 30 are disposed on the side of the substrate 10 opposite to the multiple heat sinks 41. A first connecting pipe 71 and a second connecting pipe 72 extend from one side of the substrate 10 to the other side. In this way, on the one hand, by distributing the multiple heat sinks 41 and the first water-cooling pipe 20 and the second water-cooling pipe 30 on opposite sides of the substrate 10, the substrate 10 can be used to separate them, preventing heat exchange between them and thus avoiding affecting the heat dissipation effect. On the other hand, by having the first connecting pipe 71 and the second connecting pipe 72 extend from one side of the substrate 10 to the other, the length of the first connecting pipe 71 and the second connecting pipe 72 can be minimized, thereby improving heat exchange efficiency.
[0046] In some embodiments, such as Figure 1 and Figure 4 As shown, the inlet 20a faces the same direction as the outlet 30a, and at least one of the first water-cooling pipe 20 and the second water-cooling pipe 30 is configured in a curved shape. This has several advantages. First, by ensuring that the inlet 20a and outlet 30a face the same direction, external pipes (e.g., pipes for supplying and recovering coolant) can be connected to both inlet 20a and outlet 30a in the same direction, reducing operational complexity. Furthermore, the overall structure of the laser heating module 100 is more compact, facilitating miniaturization. Second, the curved configuration of the first water-cooling pipe 20 and the second water-cooling pipe 30 extends the pipe length, thereby lengthening the path for the coolant to dissipate heat during heat exchange, improving coolant utilization, and resulting in better heat exchange performance.
[0047] For example, combined Figure 2 As shown, the first water-cooled pipe 20 includes a first extension 21 and a second extension 22. The first extension 21 has an inlet 20a. The second extension 22 is bent and connected to the first extension 21, and is located between the first extension 21 and the second water-cooled pipe 30. The second extension 22 is connected to an open end of the microchannel 41a. Thus, by bending and connecting the first extension 21 and the second extension 22, the length of the first water-cooled pipe 20 can be extended, thereby extending the path for the coolant to dissipate heat through heat exchange, improving the utilization rate of the coolant, and resulting in better heat exchange performance. Furthermore, the second extension 22, located between the first extension 21 and the second water-cooled pipe 30, increases the distance between the inlet 20a of the first extension 21 and the outlet 30a of the second water-cooled pipe 30, facilitating the connection of external pipes to the inlet 20a and outlet 30a and reducing operational difficulty.
[0048] In some embodiments, such as Figure 1 As shown, the laser heating module 100 has at least two chip arrays 50, and the light emission directions of the chips 51 in the at least two chip arrays 50 are arranged at an angle to each other so that the light fields of the chips 51 in the at least two chip arrays 50 are superimposed. In this way, by arranging the light emission directions of the chips 51 in the at least two chip arrays 50 at an angle, the light fields of the chips 51 in the at least two chip arrays 50 can be superimposed, increasing the spot power and power density, and improving the heating effect of the laser heating module 100.
[0049] This utility model provides a laser heating module 100. A substrate 10 is provided with multiple heat sinks 41 of a microchannel array 40. Multiple chips 51 of a chip array 50 are respectively mounted on the heat sinks 41, and the chips 51 are electrically connected to a circuit driver 60, thereby driving the chips 51. Simultaneously, a first water-cooling pipe 20 and a second water-cooling pipe 30 are provided on the substrate 10. The two open ends of the microchannels 41a of the heat sinks 41 are respectively connected to the first water-cooling pipe 20 and the second water-cooling pipe 30. Coolant is introduced into the first water-cooling pipe 20 through the inlet 20a, and the coolant flows through the microchannels 41a of the heat sinks 41 and exits from the outlet 30a of the second water-cooling pipe 30, thereby carrying away the heat generated by the chips 51 and achieving heat dissipation for the laser heating module 100. Furthermore, since each chip 51 is provided with an individual heat sink 41, water cooling is performed using the microchannel 41a of the heat sink 41, which can prevent heat from accumulating locally and causing a decrease in the photoelectric conversion efficiency of the local chip 51, resulting in better uniformity of the laser spot of the laser heating module 100. Example
[0050] Please refer to the following: Figure 5 and Figure 6 This is a schematic diagram of the structure of a laser heating device 200 provided in Embodiment 2 of the present invention. The laser heating device 200 includes a cover 201, a base plate 202, and a laser heating module 100 of Embodiment 1. The cover 201 covers the substrate 10. The first water cooling pipe 20, the second water cooling pipe 30, and the circuit driver 60 are located in the space between the cover 201 and the substrate 10. The base plate 202 is disposed on the substrate 10 and is located on the light-emitting side of the chip 51. The base plate 202 is provided with a light-transmitting part 202a corresponding to the chip 51.
[0051] In this way, by covering the substrate 10 with the cover 201, the space between the cover 201 and the substrate 10 can protect the components (such as the first water-cooling pipe 20, the second water-cooling pipe 30, and the circuit driver 60) located in the space between them. Furthermore, the disassembly and assembly are relatively simple, facilitating maintenance of the laser heating device 200. Moreover, by using a light-transmitting section 202a to allow light from multiple chips 51 to pass through, the chips 51 are separated on the side of the base plate 202 facing the substrate 10, reducing the number of components and extending the service life of the laser heating device 200.
[0052] In some embodiments, the laser heating device 200 further includes a first sealing ring 203, which is pressed between the substrate 10 and the base plate 202. Thus, by pressing the first sealing ring 203 between the substrate 10 and the base plate 202, the connection between the substrate 10 and the base plate 202 is sealed, achieving dustproof and waterproof protection inside the laser heating device 200.
[0053] Optionally, the light-transmitting part 202a can be a light-transmitting window, or the material of the light-transmitting part 202a can be a light-transmitting material. In this way, multiple different ways of realizing the light transmission of the light-transmitting part 202a are provided, and can be selected according to the actual situation. This embodiment does not make a specific limitation on this.
[0054] For example, the light-transmitting portion 202a is a light-transmitting window, and the laser heating device 200 also includes a light-transmitting element 204, which is disposed on the base plate 202 and covers the light-transmitting window. In this way, by disposing of the light-transmitting element 204 on the base plate 202 and covering the light-transmitting window, the light-transmitting element 204 can allow the light emitted by the chip 51 to pass through while sealing the space between the base plate 202 and the substrate 10, thus providing good dustproof and waterproof effects.
[0055] Optionally, at least one of the two opposing surfaces of the light-transmitting element 204 is provided with an anti-reflection film layer, which can improve the light transmittance of the light-transmitting element 204.
[0056] In some embodiments, the laser heating device 200 further includes a second sealing ring 205 and a light-shielding member 206. The light-shielding member 206 is disposed on the side of the light-transmitting member 204 facing the base plate 202, and the second sealing ring 205 is pressed between the light-shielding member 206 and the base plate 202. Thus, by pressing the second sealing ring 205 between the light-shielding member 206 and the base plate 202, the connection between the light-shielding member 206 and the base plate 202 is sealed, achieving dust and water protection inside the laser heating device 200. Simultaneously, the light-shielding member 206 can block light, preventing light emitted from the chip 51 from shining on the second sealing ring 205 and causing it to age or fail.
[0057] Embodiment 2 of this utility model provides a laser heating device 200, which can avoid the situation where heat accumulates locally and reduces the photoelectric conversion efficiency of the chip in a local area, and the laser heating module 100 has better surface spot uniformity.
[0058] The above provides a detailed description of a laser heating module and laser heating device disclosed in the embodiments of this utility model. This article uses specific examples to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the laser heating module and laser heating device of this utility model and its core idea. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.
Claims
1. A laser heating module, characterized in that, include: substrate; A first water-cooling pipeline is disposed on the substrate and has a water inlet for introducing coolant into the first water-cooling pipeline. A second water-cooling pipeline is disposed on the substrate and has an outlet for discharging coolant from the second water-cooling pipeline. A microchannel array, comprising multiple heat sinks disposed on the substrate, each heat sink having a microchannel, the two open ends of the microchannel being respectively connected to the first water-cooling pipeline and the second water-cooling pipeline; A chip array, comprising multiple chips, wherein the multiple chips are respectively attached to multiple heat sinks; as well as A circuit driver, which is electrically connected to a plurality of the chips.
2. The laser heating module according to claim 1, characterized in that, The laser heating module includes multiple first connecting pipes and multiple second connecting pipes. One open end of each microchannel is connected to the first water-cooling pipeline through the first connecting pipe, and the other open end of each microchannel is connected to the second water-cooling pipeline through the second connecting pipe.
3. The laser heating module according to claim 2, characterized in that, Multiple heat sinks are disposed on one side of the substrate, and the first water cooling pipe and the second water cooling pipe are disposed on the side of the substrate away from the multiple heat sinks. The first connecting pipe and the second connecting pipe pass through from one side of the substrate to the other side of the substrate.
4. The laser heating module according to claim 1, characterized in that, The inlet faces the same direction as the outlet, and one of the first and second water-cooling pipes is configured to be curved.
5. The laser heating module according to claim 4, characterized in that, The first water-cooled pipeline includes a first extension and a second extension. The first extension is provided with the water inlet. The second extension and the first extension are bent and connected. The second extension is located between the first extension and the second water-cooled pipeline. The second extension is connected to an opening end of the microchannel.
6. The laser heating module according to claim 1, characterized in that, The laser heating module has at least two chip arrays, and the light emission directions of the chips in the at least two chip arrays are arranged at an angle to each other so that the light fields of the chips in the at least two chip arrays are superimposed.
7. A laser heating device, characterized in that, The device includes a cover, a base plate, and a laser heating module as described in any one of claims 1 to 6. The cover is disposed over the substrate. The first water-cooling pipe, the second water-cooling pipe, and the circuit driver are located in the space between the cover and the substrate. The base plate is disposed on the substrate and is located on the light-emitting side of the chip. The base plate has a light-transmitting portion corresponding to the chip.
8. The laser heating device according to claim 7, characterized in that, The laser heating device further includes a first sealing ring, which is pressed between the substrate and the base plate.
9. The laser heating device according to claim 7, characterized in that, The light-transmitting part is a light-transmitting window, and the laser heating device also includes a light-transmitting component, which is disposed on the base plate and covers the light-transmitting window.
10. The laser heating device according to claim 9, characterized in that, The laser heating device further includes a second sealing ring and a light-shielding component. The light-shielding component is located on the side of the light-transmitting component facing the base plate, and the second sealing ring is pressed between the light-shielding component and the base plate.