Mobile phone rear cover capable of enhancing heat dissipation

Abstract

The utility model discloses a mobile phone rear cover capable of enhancing heat dissipation. The mobile phone rear cover comprises a mobile phone rear cover main body, a water cooling plate and a water absorption gel layer, the water-cooling plate is arranged at the bottom of the mobile phone rear cover main body, and the water-absorbing gel layer is arranged between the mobile phone rear cover main body and the water-cooling plate; and the water-absorbing gel layer is provided with a protection structure. According to the utility model, the water-cooling plate is arranged to improve the contact heat dissipation effect and efficiency, and the water-absorbing gel layer is arranged to absorb water vapor in the air and then evaporate and dissipate heat, so that the heat dissipation effect and efficiency are improved, and the water-cooling plate and the mobile phone rear cover main body can be isolated because the heat conductivity coefficient of the water-absorbing gel layer is low, and the heat dissipation efficiency is improved. Therefore, the influence of the temperature of the water cooling plate on a user can be isolated, and the use comfort of the user is ensured; the protection structure is arranged to play a role in supporting and protection, so that the water-absorbing gel layer is protected and prevented from being deformed, and therefore, the covering uniformity and the heat dissipation uniformity and effect are ensured.

Description

Technical Field

[0001] This utility model relates to the technical field of heat dissipation for electronic devices, and specifically to a mobile phone back cover that enhances heat dissipation. Background Technology

[0002] 5G phones generally employ large batteries and fast charging because 5G chips consume 2.5 times more power than 4G chips. The high speed, low latency, and large capacity of 5G networks require higher spectrum utilization. Compared to the top-of-the-line 4x4 MIMO antennas in 4G phones, 5G uses Massive MIMO antenna technology, requiring at least eight built-in antennas, each with its own independent power amplifier to ensure stable signal input and output. This also increases power consumption. Furthermore, many 5G phones use external basebands, which consume more power than internal basebands. Smartphones contain many components that generate heat, and many of these components are susceptible to performance and lifespan issues due to heat. The processor is the hottest component in a smartphone, along with image sensors, light sources, and batteries, making improvements in heat dissipation technology even more urgent.

[0003] Current mobile phone back panels primarily serve a protective function. As components in close contact with the processor, image sensor, light source, battery, and external environment, improving the phone's heat dissipation performance using the back panel is a pressing issue. To address this, patent number 202020777267.2 discloses a thin and lightweight 5G mobile phone back panel structure with excellent heat dissipation. This back panel is made of alumina ceramic, and the heat sink, base plate, and frame are integrally gel-molded, resulting in high strength, rapid heat dissipation, and prevention of localized overheating. However, this back panel structure still has the following problems: 1. The heat conduction and dissipation method is singular, resulting in poor heat dissipation effect and efficiency. Furthermore, temperature changes in the back panel structure are directly reflected on the surface, affecting user experience; 2. Existing back panel structures lack protective structures. During manufacturing, factors such as gravity cause uneven distribution of internal heat-conducting materials, affecting the uniformity and efficiency of heat dissipation. Utility Model Content

[0004] This utility model addresses the shortcomings of current technology by providing an enhanced heat dissipation mobile phone back cover, aiming to solve the technical problems of poor heat dissipation effect, slow efficiency, and poor uniformity in existing mobile phone back covers.

[0005] The technical solution adopted by this utility model to achieve the above objectives is as follows:

[0006] An enhanced heat dissipation mobile phone back cover includes a mobile phone back cover body; the mobile phone back cover body is provided with a water-cooling plate and a water-absorbing gel layer; the water-cooling plate is disposed at the bottom of the mobile phone back cover body, and the water-absorbing gel layer is disposed between the mobile phone back cover body and the water-cooling plate; the water-absorbing gel layer is provided with a protective structure.

[0007] As a further improvement, the water-cooled plate is provided with pipes; the upper surface of the water-cooled plate is provided with a groove, and the hydrogel layer is disposed in the groove.

[0008] As a further improvement, the pipeline is either a pipeline groove located on the bottom surface of the water-cooled plate or a pipeline located within the water-cooled plate.

[0009] As a further improvement, the absorbent gel layer is provided with a mesh structure, which is composed of multiple mesh arrays.

[0010] As a further improvement, the protective structure is disposed on the surface of the hydrogel layer; the protective structure is a mesh-reinforced plastic structure.

[0011] As a further improvement, the water-cooled plate is one of a liquid-cooled copper plate or a flexible liquid-cooled plate containing extended copper foil; the thickness of the water-cooled plate is 0.3-3mm.

[0012] As a further improvement, the thickness of the absorbent gel layer is 0.3-5 mm.

[0013] As a further improvement, the main body of the phone back cover also has a porous structure.

[0014] Compared with the prior art, the above-mentioned one or more technical solutions in the enhanced heat dissipation mobile phone back cover provided by the embodiments of this utility model have at least one of the following technical effects:

[0015] 1. This utility model improves the heat dissipation effect and efficiency by setting a water-cooled plate and combining it with a hydrogel layer to absorb water vapor in the air and then evaporate it for heat dissipation. While improving the heat dissipation effect and efficiency, the low thermal conductivity of the hydrogel layer can isolate the water-cooled plate from the main body of the phone back cover, thereby isolating the temperature of the water-cooled plate from the user and ensuring the user's comfort.

[0016] 2. By setting up a protective structure to provide support and protection, the hydrogel layer is protected and deformation is prevented, thereby ensuring uniform coverage and heat dissipation. Attached Figure Description

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0018] Figure 1 This is a schematic diagram of the overall structure of the enhanced heat dissipation mobile phone back cover in this embodiment;

[0019] Figure 2 This is a top view of the enhanced heat dissipation back cover of the mobile phone in this embodiment;

[0020] Figure 3 for Figure 2 AA section view diagram;

[0021] Figure 4 This is a plan view of the protective structure in this embodiment. Detailed Implementation

[0022] The following description is only a preferred embodiment of the present invention and does not limit the scope of protection of the present invention.

[0023] For examples, see the appendix. Figures 1-4 A mobile phone back cover 1 with enhanced heat dissipation includes a mobile phone back cover body 2; the mobile phone back cover body 2 is provided with a water cooling plate 3 and a water-absorbing gel layer 4; the water cooling plate 3 is disposed at the bottom of the mobile phone back cover body 2, and the water-absorbing gel layer 4 is disposed between the mobile phone back cover body 2 and the water cooling plate 3; the water-absorbing gel layer 4 is provided with a protective structure 5; the mobile phone back cover body 2 is also provided with a porous structure.

[0024] The water-cooled plate 3 is provided with a pipe 30; the upper surface of the water-cooled plate 3 is provided with a groove 31, and the hydrogel layer 4 is disposed in the groove 31; the pipe 30 is either a pipe groove disposed on the bottom surface of the water-cooled plate 3 or a pipe disposed in the water-cooled plate 3, and the pipe 30 is used for positioning the pipe with micro-pump or connecting the micro-pump, thereby driving the liquid flow and realizing liquid cooling heat dissipation.

[0025] The absorbent gel layer 4 is provided with a mesh structure 40, which is composed of multiple mesh arrays. The absorbent gel layer 4 is used to absorb water vapor in the air and then evaporate it to dissipate heat, thereby improving the heat dissipation effect and efficiency. At the same time, due to the low thermal conductivity of the absorbent gel layer 4, it can isolate the water cooling plate 3 from the main body 2 of the mobile phone back cover, thereby isolating the temperature of the water cooling plate 3 from the user and ensuring the user's comfort.

[0026] The protective structure 5 is disposed on the surface of the absorbent gel layer 4; the protective structure 5 is a mesh-reinforced plastic structure; the thickness of the absorbent gel layer is 0.3-5mm; the protective structure 5 serves to support and protect the absorbent gel layer, thereby preventing deformation of the absorbent gel layer 4, thus ensuring uniform coverage and heat dissipation.

[0027] The water-cooled plate 3 is either a liquid-cooled copper plate or a flexible liquid-cooled plate containing extended copper foil; the thickness of the water-cooled plate 3 is 0.3-3mm, and the water-cooled plate 3 is used to improve the efficiency of heat dissipation.

[0028] This invention improves heat dissipation efficiency by incorporating a water-cooled plate and a hydrogel layer to absorb water vapor from the air and then evaporate it for heat dissipation. This enhances heat dissipation while simultaneously isolating the water-cooled plate from the phone's back cover due to the low thermal conductivity of the hydrogel layer, thus protecting the user from the effects of the water-cooled plate's temperature. A protective structure further supports and protects the hydrogel layer, preventing deformation and ensuring uniform coverage and effective heat dissipation.

[0029] This utility model is not limited to the above-described embodiments. Other mobile phone back covers for enhancing heat dissipation obtained by using the same or similar structures or devices as the above-described embodiments of this utility model are all within the protection scope of this utility model.

Claims

1. A mobile phone back cover with enhanced heat dissipation, characterized in that: The enhanced heat dissipation mobile phone back cover includes a mobile phone back cover body; the mobile phone back cover body is provided with a water cooling plate and a water-absorbing gel layer; the water cooling plate is disposed at the bottom of the mobile phone back cover body, and the water-absorbing gel layer is disposed between the mobile phone back cover body and the water cooling plate; the water-absorbing gel layer is provided with a protective structure.

2. The enhanced heat dissipation mobile phone back cover according to claim 1, characterized in that: The water-cooled plate is provided with pipes; the upper surface of the water-cooled plate is provided with a groove, and the hydrogel layer is disposed in the groove.

3. The enhanced heat dissipation mobile phone back cover according to claim 2, characterized in that: The pipeline is either a pipeline groove located on the bottom surface of the water-cooled plate or a pipeline located within the water-cooled plate.

4. The enhanced heat dissipation mobile phone back cover according to claim 3, characterized in that: The absorbent gel layer has a mesh structure, which is composed of multiple mesh arrays.

5. The enhanced heat dissipation mobile phone back cover according to claim 4, characterized in that: The protective structure is disposed on the surface of the hydrogel layer; the protective structure is a mesh-reinforced plastic structure.

6. The enhanced heat dissipation mobile phone back cover according to claim 5, characterized in that: The water-cooled plate is either a liquid-cooled copper plate or a flexible liquid-cooled plate containing extended copper foil; the thickness of the water-cooled plate is 0.3-3mm.

7. The enhanced heat dissipation mobile phone back cover according to claim 6, characterized in that: The thickness of the hydrogel layer is 0.3-5 mm.

8. The enhanced heat dissipation mobile phone back cover according to claim 1, characterized in that: The main body of the phone's back cover also has a porous structure.

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