Heating assembly with power-off protection

Abstract

The utility model relates to the technical field of power-off protection, in particular to a heating assembly with power-off protection, which comprises a base material, a conductive heating layer and a conductive protective layer, the conductive protective layer is positioned in an area between the base material and the conductive heating layer, and the conductive protective layer and the conductive heating layer are arranged at intervals. The conductive heating layer and the conductive protection layer are both located on the surface of the base material, the conductive protection layer can be electrically connected with external electric control equipment, and when the base material is damaged, the conductive protection layer is disconnected to trigger power-off protection. The conductive protective layer is arranged on the base material, the conductive protective layer is connected with an external electric control device for triggering power-off protection to form an energizing loop, when the base material is intact, the energizing loop is conducted, that is, the electric control device is in a normal use state, and when the base material is damaged, the conductive protective layer is synchronously disconnected. The power-on loop is disconnected to trigger the external electric control equipment to implement power-off protection, the response speed of the power-off protection is high, production and manufacturing can be easy on the basis of guaranteeing use safety, and use is convenient for a user.

Description

Technical Field

[0001] This utility model relates to the field of power failure protection technology, specifically a heating component with power failure protection. Background Technology

[0002] There is a wide variety of electric heating products on the market, such as heating plates for electric stoves, heating bases for electric kettles, and heating elements for baking equipment. They are very convenient to use. However, electric heating products can also pose safety hazards during use. When the heating temperature is too high or when the substrate supporting the heated object is damaged by external force, it can trigger leakage, causing electric shock to the user or short circuit to the equipment. The electric heating product may continue to conduct electricity and heat. Existing electric heating products cannot effectively disconnect the circuit in time to prevent leakage when the substrate is damaged, which affects the safety and use of the product.

[0003] To address the above shortcomings, we need to develop a heating component with power failure protection to meet the needs of a wide range of users. Utility Model Content

[0004] Regarding the aforementioned problem that existing electric heating products cannot effectively and promptly disconnect the circuit to prevent leakage when damaged, the technical solution adopted by this utility model is as follows:

[0005] A heating assembly with power failure protection includes a substrate, a conductive heating layer, and a conductive protective layer. The conductive protective layer is located in the region between the outer edge of the substrate and the outer edge of the conductive heating layer, and is spaced apart from the conductive heating layer. The conductive heating layer is located on surface E of the substrate. The conductive protective layer can be electrically connected to an external electrical control device for triggering power failure protection to form a power-on circuit and is located on surface E and / or surface F of the substrate. Surface E and surface F are independent surfaces on the substrate. When the substrate is damaged, the conductive protective layer disconnects, causing the power-on circuit to break and triggering power failure protection.

[0006] Furthermore, the conductive protective layer includes a conductive layer arranged in a circumferential manner around the outside of the conductive heating layer. One end of the conductive layer has a first endpoint, and the other end of the conductive layer has a second endpoint. There is a gap G between the first endpoint and the second endpoint. The first endpoint and the second endpoint are respectively connected to external electrical control equipment to form a power circuit.

[0007] Furthermore, the substrate is made of a brittle material. When the substrate breaks, the conductive protective layer breaks, causing the power-on circuit to be disconnected and triggering the power-off protection.

[0008] Furthermore, the conductive layer extends from one of the first endpoint and the second endpoint and passes through the region between the other of the first endpoint and the center of the substrate, and the conductive layer surrounds the center of the substrate such that there is at least one enclosing ring structure composed of the conductive layer between the center of the substrate and the outer edge of the substrate.

[0009] Furthermore, the conductive heating layer includes a heating layer for heating by electricity and an electrode layer for connecting to a power source, with at least two separate electrode layers located on both sides of the heating layer, and the heating layer including at least one heating area.

[0010] Furthermore, the substrate has mounting holes for easy installation, and the heating layer includes multiple independently arranged heating areas, which are arranged circumferentially around the mounting holes. Each heating area is connected to the first electrode and the second electrode of the electrode layer.

[0011] Furthermore, the heating layer includes independently disposed heating regions a, b, c, and d, with heating region c and heating region d located between heating region a and heating region b, and heating region c and heating region d connected by a third electrode.

[0012] Furthermore, when the conductive protective layer is located on the surface E of the substrate, at least one insulating layer is provided on the surface F of the substrate.

[0013] Furthermore, a grounding lead for conductive grounding is extended outward from the conductive protective layer toward the outside of the substrate.

[0014] Furthermore, the conductive heating layer is formed into a planar heating layer using one of the following materials: nano-metal oxide, nano-semiconductor oxide, graphene, or carbon paste.

[0015] The beneficial effects of this utility model are as follows:

[0016] 1. This utility model provides a conductive protective layer on a substrate used to contact heated objects. The conductive protective layer is located between the conductive heating layer and the outer edge of the substrate. The conductive protective layer is connected to an external electrical control device for triggering power-off protection to form a power-on circuit. When the substrate is intact, the power-on circuit is conductive, indicating normal operation. When the substrate is damaged, the conductive protective layer is simultaneously disconnected due to the damage, causing the power-on circuit to break, which indicates an abnormal operation. The disconnection of the power-on circuit triggers the external electrical control device to implement power-off protection. This protection method and structure offer fast response speed, high protection efficiency, and a simple and ingenious structure. While ensuring safe use, it is also easy to manufacture and convenient for users.

[0017] 2. The conductive heating layer of this utility model can be formed into a planar heating layer using one or more of the following materials: nano metal oxide, nano semiconductor metal oxide, graphene material, carbon paste material, etc. Nano semiconductor metal oxide is preferred. Nano semiconductor metal oxide has a smaller thickness when attached to the substrate, and its conductivity and heating performance are also better. The attachment process is simple, which reduces production costs, improves production efficiency, and can meet the needs of mass production.

[0018] 3. The base material of this utility model can be made of brittle material, which can more easily break and disconnect the conductive protective layer in the event of danger. The triggering method of disconnecting immediately after breakage makes the power-off protection response faster. At the same time, the thermal expansion coefficient of brittle material is usually low, which can play a protective effect against overheating damage when applied to heating. It also has a stable structure that does not easily bend or deform, making it convenient for users to use.

[0019] 4. The heating layer of this utility model can be set up in a partitioned manner, with multiple heating areas including heating area c, heating area d, heating area e and heating area f. Multiple dispersed heating areas connected in parallel or in series can expand the heating range and avoid the mounting holes required for the substrate, making it easier for the substrate to be installed on other equipment or devices, and also making it easier for other equipment or devices to be installed on the substrate. Attached Figure Description

[0020] Figure 1 This is a perspective view of a heating component with power failure protection according to the present invention.

[0021] Figure 2 This is one of the front views of a heating assembly with power failure protection according to the present invention.

[0022] Figure 3 This is one of the exploded perspective views of a heating component with power failure protection according to the present invention.

[0023] Figure 4 This is a second perspective view of a heating component with power failure protection according to the present invention.

[0024] Figure 5 This is a second front view of a heating assembly with power failure protection according to this utility model.

[0025] Figure 6 This is the second exploded perspective view of a heating component with power failure protection according to this utility model.

[0026] Figure 7 This is a third perspective view of a heating component with power failure protection according to the present invention.

[0027] Figure 8 This is the third front view of a heating assembly with power failure protection according to this utility model.

[0028] Figure 9 This is the third exploded perspective view of a heating component with power failure protection according to this utility model.

[0029] Figure 10 This is a perspective view of a heating component with power failure protection according to the present invention, shown in Figure 4.

[0030] Figure 11 This is the fourth front view of a heating assembly with power failure protection according to this utility model.

[0031] Figure 12 This is the fourth exploded perspective view of a heating component with power failure protection according to this utility model.

[0032] Figure 13 This is the fifth perspective view of a heating component with power failure protection according to the present invention.

[0033] Figure 14 This is the fifth front view of a heating assembly with power failure protection according to this utility model.

[0034] Figure 15 This is the fifth exploded perspective view of a heating component with power failure protection according to this utility model.

[0035] Figure 16 for Figure 2 AA section view.

[0036] Figure 17 for Figure 5 BB section view.

[0037] Figure 18 for Figure 8 CC section view.

[0038] Figure 19 for Figure 11 DD section view.

[0039] Figure 20 for Figure 14 HH section view.

[0040] Figure 21 This is a perspective view of a heating component with power failure protection according to the present invention, shown in figure six.

[0041] Figure 22 This is the sixth front view of a heating assembly with power failure protection according to this utility model. Detailed Implementation

[0042] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0043] Optionally, in some embodiments, the substrate 1 may be made of one of the following brittle materials: glass, ceramic, stone, plastic, etc. Preferably, the substrate 1 is made of glass or ceramic. Glass or ceramic has the characteristic of being brittle and easily broken. When it breaks due to external force, the conductive protective layer 3 is disconnected, which leads to the disconnection of the power supply circuit and makes it easier to trigger the power-off protection. Among them, glass has good light transmittance and aesthetics, and is more visually appealing when applied to the appearance of the product. Glass or ceramic has good resistance to most chemicals, is not easily corroded, and has high hardness, so it will not easily wear down after long-term use. Glass or ceramic has a low coefficient of thermal expansion at high temperatures, so it is not easy to expand and deform.

[0044] Optionally, in some embodiments, the conductive protective layer 3, the conductive layer 33, or the electrode layer 22 can all be made of a material with good conductivity such as gold, silver, copper, aluminum, or tin. Preferably, the conductive protective layer 3 or the electrode layer 22 is laid with silver paste made of silver material. Silver paste has high conductivity, can effectively conduct current, reduce power loss, and is easy to form on the surface of the substrate 1, which is convenient for processing and production.

[0045] Example 1:

[0046] like Figures 1 to 22 The heating assembly shown includes a substrate 1, a conductive heating layer 2, and a conductive protective layer 3. The substrate 1 is a rigid substrate that supports the conductive heating layer 2 and the conductive protective layer 3. It has good structural stability, is not easily deformed or bent, and allows users to stably place objects to be heated for subsequent heating. The surface of the substrate 1 can be divided into at least surface E and surface F. Surface E and surface F are independent surfaces on the substrate 1. Surface E is one of the front and back sides of the substrate 1, and surface F is the other of the front and back sides of the substrate 1. In this embodiment, both the conductive heating layer 2 and the conductive protective layer 3 are disposed on surface E of the substrate 1.

[0047] More specifically, the conductive protective layer 3 is a conductive material formed on the substrate 1 by means of coating, film or adhesive adhesion, and is arranged circumferentially around the heating area. It is a conductive open ring structure with non-overlapping ends. The thickness of the conductive protective layer 3 is less than 1 mm. The conductive heating layer 2 is located in the heating area surrounded by the conductive protective layer 3. The conductive protective layer 3 is located in the space or area between the outer edge of the substrate 1 and the outer edge of the conductive heating layer 2. The conductive protective layer 3 and the conductive heating layer 2 are spaced apart, that is, they are not connected or in contact with each other, so as to avoid mutual influence after the conductive protective layer 3 and the conductive heating layer 2 come into contact.

[0048] More specifically, the heating material of the conductive heating layer 2 is formed by one of the following materials: nano-metal oxide, nano-semiconductor metal oxide, graphene, carbon paste, etc., to form a planar heating layer for conductive heating. Among them, the nano-semiconductor metal oxide can be one of the following materials or a combination of multiple materials such as tin, antimony, nickel, ammonium as nanoparticles. During the fabrication, the nano-semiconductor metal oxide can be attached to the surface of the substrate 1 by one of the following methods: physical vapor deposition (PVD), chemical vapor deposition (CVD), screen printing (SS), far-infrared spectroscopy (FI). The thickness of the conductive heating layer 2 is less than 1 mm, and a fixed heating area is formed after high-temperature sintering.

[0049] In use, the conductive protective layer 3 can be electrically connected to an external electrical control device used to trigger power-off protection to form a power-on circuit. The external electrical control device can detect the integrity of the power-on circuit in real time to determine whether the substrate 1 has been damaged or broken. When the substrate 1 is intact, the power-on circuit is conductive and is in normal use. When the substrate 1 is damaged or broken, the conductive protective layer 3 is simultaneously disconnected due to the damage to the substrate 1, causing the power-on circuit to be disconnected, which can be judged as an abnormal use state. Since the conductive protective layer 3 is formed on the substrate 1 by coating, adhesion, screen printing or physical vapor deposition, the conductive protective layer 3 itself does not have toughness and ductility. Therefore, when the substrate 1 is damaged or broken and affects the normal heating of the conductive heating layer 2, the damaged or broken part will inevitably pass through the conductive protective layer 3 surrounding it first, and then enter the heating area to damage the conductive heating layer 2. On this basis, when the substrate 1 is damaged or broken, it will affect the breakage of the adhesion layer of the conductive protective layer 3. The breakage of the adhesion layer of the conductive protective layer 3 also means that the power supply circuit is broken. The power supply circuit is broken, which can immediately trigger the power-off protection mechanism of the external electrical control equipment, thereby achieving a power-off protection effect with fast response speed and high protection efficiency.

[0050] As another embodiment of Example 1, the substrate 1 can be made of one of the microcrystalline materials such as microcrystalline glass or microcrystalline ceramic. Preferably, the substrate 1 uses microcrystalline glass as the main preparation material. Microcrystalline glass has good vertical thermal conductivity and light transmittance. Vertical thermal conductivity effectively enhances the efficiency and speed of heat transfer, making the overall heating rapid and uniform. Microcrystalline glass has a low coefficient of thermal expansion and hardly deforms when the temperature changes, making it suitable for heating components with frequent temperature changes.

[0051] As another embodiment of Example 1, the heating material of the conductive heating layer 2 is a graphene film as the conductive heating material. Graphene has a high thermal conductivity and excellent electrical conductivity. During manufacturing, the graphene film is formed on the surface of the substrate 1 to form a fixed heating area.

[0052] As another embodiment of Example 1, the conductive protective layer 3 extends a grounding lead for conductive grounding towards the outside of the substrate 1. The grounding lead can guide the current when the conductive heating layer 2 or the conductive protective layer 3 leaks to the grounding position, forming independent leakage protection. On this basis, the conductive protective layer 3 can also extend a conductive lead 311 towards the conductive heating layer 2 to shorten the distance between the conductive protective layer 3 and the conductive heating layer 2. When the substrate exhibits conductive properties at a specific temperature, causing the conductive heating layer 2 to connect to the conductive lead 311 through the substrate 1, a short circuit in the power-on circuit can be triggered. The short circuit in the power-on circuit triggers the power-off protection of the external electrical control equipment, thereby achieving power-off protection to prevent the conductive heating layer 2 from overheating.

[0053] Example 2:

[0054] Based on Example 1, such as Figures 4 to 6 as well as Figure 17 The heating assembly with power failure protection shown differs from Embodiment 1 in that, in this embodiment, the conductive heating layer 2 is located on surface E of the substrate 1, and the conductive protective layer 3 is located on surface F of the substrate 1. Although the conductive heating layer 2 and the conductive protective layer 3 are located on different surfaces of the substrate 1, from the angle of unfolding (i.e., Figure 5 or Figure 11 From this perspective, the conductive protective layer 3 is still located in the space or area between the outer edge of the substrate 1 and the outer edge of the conductive heating layer 2. Therefore, when the substrate 1 is damaged or broken, affecting the normal heating of the conductive heating layer 2, the damaged or broken part will inevitably pass through the conductive protective layer 3 surrounding it first, and then enter the heating area to damage the conductive heating layer 2. On this basis, when the substrate 1 is damaged or broken, it will affect the breakage of the attachment layer of the conductive protective layer 3. The breakage of the attachment layer of the conductive protective layer 3 also means that the power circuit is broken. The power circuit is broken, which can immediately trigger the power-off protection mechanism of the external electrical control equipment. This embodiment can also achieve a power-off protection effect with fast response speed and high protection efficiency.

[0055] Example 3:

[0056] Based on the above embodiments, such as Figures 1 to 15The heating component shown has power failure protection. The conductive protective layer 3 includes a conductive layer 33 arranged in a circumferential manner around the outer side of the conductive heating layer 2. The conductive layer 33 is formed by coating, film or adhesive adhesion and other methods to form a conductive material attachment path circumferentially surrounding the heating area on the substrate 1. The conductive layer 33 adopts an open ring structure and the thickness of the conductive layer 33 is less than 1 mm. One end of the conductive layer 33 has a first endpoint 31 and the other end has a second endpoint 32. The first endpoint 31 and the second endpoint 32 are both connection terminals for connecting the conductive layer 33 to external electrical control equipment. After connecting to the external electrical control equipment, the first endpoint 31, the conductive layer 33, the second endpoint 32 and the external electrical control equipment form a power circuit. When the conductive layer 33 is disconnected due to damage or breakage of the substrate 1, the power circuit will be broken. After the circuit is broken, the power failure protection mechanism of the external electrical control equipment can be triggered.

[0057] More specifically, there is a gap G between the first endpoint 31 and the second endpoint 32. The size of the gap G determines the separation distance between the first endpoint 31 and the second endpoint 32. The gap G is set to prevent the power-on circuit from short-circuiting under normal conditions.

[0058] As another embodiment 301 of embodiment 3, such as Figures 1 to 15 As shown, the substrate 1 can be made of one of the following microcrystalline materials: microcrystalline glass or microcrystalline ceramic. Preferably, the substrate 1 is made of microcrystalline glass as the main material. At high temperatures, electrostatic ions will appear on the surface of the microcrystalline glass. When the temperature of the microcrystalline glass exceeds 300 degrees, the microcrystalline glass may have conductive properties. Based on this, the first end 31 extends a conductive lead 311 toward the conductive heating layer 2 to shorten the distance between the conductive protective layer 3 and the conductive heating layer 2. When the microcrystalline glass has conductive properties at a specific temperature, the conductive heating layer 2 is connected to the conductive lead 311 through the substrate 1, which can trigger a short circuit in the power-on circuit. The short circuit in the power-on circuit triggers the power-off protection of the external electrical control equipment, thereby achieving power-off protection to prevent the conductive heating layer 2 from overheating.

[0059] In another embodiment 302 of embodiment 3, since there is a gap G in the conductive protective layer 3 of the power-conducting circuit, when the substrate 1 is damaged or broken, the path of damage or breakage happens to pass through the gap G, making it difficult for the conductive protective layer 3 to break. There is a possibility that the conductive protective layer 3 may be bypassed, preventing the power-off protection from being triggered. Figure 11The power-off protection switch shown has a conductive layer 33 extending from the first end point 31 and passing through the area between the second end point 32 and the center of the substrate 1. The conductive layer 33 surrounds the center of the substrate 1, so that there is at least one surrounding ring structure composed of the conductive layer 33 between the center of the substrate 1 and the outer edge of the substrate 1. More specifically, by adopting a surrounding ring structure around the center of the substrate 1, the conductive layer 33 can form a protective ring structure without obvious gaps to the outside. There are no longer straight or nearly straight through gaps between the center of the substrate 1 and the outer edge of the substrate 1. This avoids the situation where the damage or breakage path of the substrate 1 manages to avoid the conductive protective layer 3, thus preventing the power-off protection from being triggered. It can effectively avoid the problem of the breakage path managing to avoid the conductive protective layer 3, and ensure that when the substrate 1 is damaged or broken, the conductive protective layer 3 can be disconnected to trigger the disconnection of the power-on circuit and realize the power-off protection.

[0060] As another embodiment 303 (not shown), which is different from embodiment 302, the conductive layer 33 extends from the second end point 32 and passes through the area between the first end point 31 and the center of the substrate 1. The conductive layer 33 surrounds the center of the substrate 1 so that there is at least one surrounding ring structure composed of the conductive layer 33 between the center of the substrate 1 and the outer edge of the substrate 1.

[0061] Example 4:

[0062] In practical use, since there must be a gap G in the power-conducting circuit, if the gap G is located between the outer edge of the conductive heating layer 2 and the substrate 1 and can be directly connected, that is, the conductive heating layer 2 can be directly connected to the outside through the gap G, when the substrate 1 is damaged or broken, the path of the damage or breakage happens to pass through the gap G, which will not easily cause the conductive protective layer 3 to break. There may be a situation where the conductive protective layer 3 is avoided and the power-off protection fails to be triggered.

[0063] Based on Example 3, such as Figures 13 to 15 as well as Figure 20 The heating assembly shown has a power failure protection. The first endpoint 31 is located between the second endpoint 32 and the conductive heating layer 2. By defining the position of the first endpoint 31, it is ensured that the path of damage or breakage will not easily pass directly through the gap G. More specifically, the second endpoint 32 and the outer side of the conductive heating layer 2 form a fictitious straight line segment with the shortest distance. The first endpoint 31 is located along the path of this fictitious straight line segment. Based on this, since both the first endpoint 31 and the second endpoint 32 have a certain outer diameter laying range, the path of damage or breakage of the substrate 1 is difficult to directly avoid the conductive protective layer 3 and only pass through the gap G. This greatly reduces the possibility of the power failure protection failing to be triggered due to the failure to bypass the conductive protective layer 3. This achieves the effect that the power failure protection can be stably triggered when the substrate 1 is damaged.

[0064] As another embodiment of Example 4, when the conductive layer 33 surrounds the conductive heating layer 2 clockwise or counterclockwise from the first endpoint 31 and connects to the second endpoint 32, the surrounding path of the conductive layer 33 can adopt a spiral structure that surrounds the conductive heating layer 2 from the inside out by at least two layers. This minimizes the possibility that the path of damage or breakage of the substrate 1 might miss the conductive protective layer 3, thus preventing the power-off protection from being triggered. This achieves the effect that the power-off protection can be triggered more stably when the substrate 1 is damaged.

[0065] Example 5:

[0066] Based on the above embodiments, such as Figures 1 to 20 The heating component shown has power failure protection. The conductive heating layer 2 includes a heating layer 21 for heating by electricity and an electrode layer 22 for connecting to the power supply. The heating layer 21 can be formed into a planar heating layer using one of the following materials: nano-metal oxide, nano-semiconductor metal oxide, graphene, carbon paste, etc. Preferably, the heating layer 21 uses nano-semiconductor metal oxide as the conductive heating material. The thickness of both the heating layer 21 and the electrode layer 22 is less than 1 mm. The nano-semiconductor metal oxide can be one or a combination of materials such as tin, antimony, nickel, and ammonium as nanoparticles. During fabrication, the nano-semiconductor metal oxide can be deposited through physical vapor deposition. The electrode layer 21 is attached to the surface E of the substrate 1 by methods such as vapor deposition (PVD), chemical vapor deposition (CVD), screen printing (SS), and far-infrared spectroscopy (FI). After high-temperature sintering, a fixed heating area is formed. At least two separate electrode layers 22 are located on both sides of the heating layer 21. The electrode layer 22 includes a first electrode 221 and a second electrode 222. The first electrode 221 and the second electrode 222 are respectively disposed on both sides of the heating layer 21 to facilitate connection to external electrical control equipment for power supply and heating. Preferably, the electrode layer 22 can also use silver paste as a conductive material. Silver paste has high conductivity, can effectively conduct current, reduce power loss, and is easy to form on the surface of the substrate 1, which is convenient for processing and production.

[0067] Example 6:

[0068] Based on Example 5, such as Figures 7 to 12 as well as Figure 18 and Figure 19 The heating assembly shown has power failure protection. The substrate 1 has mounting holes 11 for easy installation. The mounting holes 11 can be set at any position on the substrate 1. The mounting holes 11 can be used to install the substrate 1 on other equipment or devices, or to install other equipment or devices on the substrate 1. For example, it can be used to install a temperature probe on the substrate 1 through the mounting holes 11, or to fix the placement position of heated objects.

[0069] More specifically, for ease of installation, the mounting hole 11 may also have one of the following connection structures to enhance installation stability: straight hole wall, tapered hole wall, curved hole wall, thread, snap, or undercut.

[0070] More specifically, the heating layer 21 includes multiple independently arranged heating areas, which are arranged circumferentially around the mounting hole 11 to avoid the dispersed heating positions of the mounting hole 11, ensuring sufficient heating range without affecting installation. Each heating area is connected to the first electrode 221 and the second electrode 222 of the electrode layer 22 to form a parallel connection. Multiple dispersed and parallel connected heating areas can expand the heating range of the heating layer 21.

[0071] Based on Embodiment 6, unlike Embodiment 6, each heating region can also be connected in series with the first electrode 221 and the second electrode 222 of the electrode layer 22. Multiple dispersed and parallel connected heating regions can expand the heating range of the heating layer 21.

[0072] Example 7:

[0073] Based on Example 5, such as Figures 7 to 12 The heating assembly shown has power failure protection. The heating layer 21 includes independently arranged heating areas a, b, c and d. Heating areas c and d are located between heating areas a and b. The electrode layer 22 includes a third electrode 223. Heating areas c and d are connected through the third electrode 223. The third electrode 223 is used to bypass the mounting hole 11 to ensure the circuit connection between heating areas c and d, so as to ensure that heating areas c and d can be connected and achieve conductive heating.

[0074] More specifically, the two ends of heating region a are connected to the first electrode 221 and the second electrode 222, respectively. The two ends of heating region b are connected to the first electrode 221 and the second electrode 222, respectively. Heating region c and heating region d are connected by the third electrode 223 to form a middle heating region. The end of heating region c away from the third electrode 223 is connected to one of the first electrode 221 and the second electrode 222. The end of heating region d away from the third electrode 223 is connected to the other of the first electrode 221 and the second electrode 222. At this time, heating region a, heating region b and the middle heating region are connected in parallel.

[0075] As another embodiment of Example 7, heating zones c, d, a and b can also be connected in series. More specifically, current flows into one of the first electrode 221 and the second electrode 222 and passes through heating zones a, c, the third electrode 223, d and b in sequence, and then flows out from the other of the first electrode 221 and the second electrode 222, forming a series circuit.

[0076] As another embodiment of Example 7, the shapes of heating areas a, b, c and d can be the shapes of the area outlines formed by straight lines and / or curves, in order to meet the heating contact surface requirements of different users.

[0077] As another embodiment of Example 7, the length of heating region c and the length of heating region d are added together to equal the length of heating region a. This structural design is more aesthetically pleasing in terms of partitioning.

[0078] As another embodiment of Example 7, the length of heating region c and the length of heating region d are added together to equal the length of heating region b. This structural design is more aesthetically pleasing in terms of partitioning.

[0079] As another embodiment of Example 7, the area of ​​heating region c is the same as the area of ​​heating region d. This structural design is more aesthetically pleasing in terms of partitioning.

[0080] As another embodiment of Example 7, the shape of heating area c is the same as that of heating area d, and this structural design is more aesthetically pleasing in terms of partitioning.

[0081] As another embodiment of Example 7, the shape of heating area c and the shape of heating area d are symmetrically arranged with the mounting hole 11 as the center. This structural design is more aesthetically pleasing and visually symmetrical in terms of partitioning.

[0082] As another embodiment of Example 7, the shape of heating area a is the same as that of heating area b. This structural design is more aesthetically pleasing in terms of partitioning.

[0083] As another embodiment of Example 7, the shape of heating area a and the shape of heating area b are symmetrically arranged with the mounting hole 11 as the center. This structural design is more aesthetically pleasing and visually symmetrical in terms of partitioning.

[0084] As another embodiment of embodiment 7, the shape of heating area a is symmetrical to that of heating area b with respect to the mounting hole 11, and the shape of heating area c is symmetrical to that of heating area d with respect to the mounting hole 11. The center line of symmetry of heating area a and heating area b is perpendicular to the center line of symmetry of heating area c and heating area d. This design is more aesthetically pleasing and visually symmetrical in terms of partitioning.

[0085] Example 8:

[0086] Based on Example 301, substrate 1 uses glass-ceramic as the main preparation material. When the temperature of the glass-ceramic exceeds 300 degrees Celsius, the glass-ceramic may exhibit conductive properties. Based on this, such as... Figure 15 The heating component shown has power failure protection. When the conductive protective layer 3 is located on the surface E of the substrate 1, at least one insulating layer 4 is provided on the surface F of the substrate 1. When the insulating layer 3 is located on the surface F, in order to further improve the insulation effect and avoid safety hazards caused by the high temperature conductivity of the microcrystalline glass, at least one insulating layer 4 is provided on the surface F of the substrate 1. On this basis, it can also be one of two, three, four, or five layers. Preferably, the effect of using two insulating layers 4 is better. By increasing the number of insulating layers 4, the insulation effect of the insulating layer 4 is improved to adapt to the use scenarios with higher current and voltage, and to ensure user safety.

[0087] Example 9:

[0088] Based on the above embodiments, such as Figures 1 to 15 The heating component shown has power failure protection. The panel structure of the substrate 1 can be a flat panel structure or a curved panel structure. The panel structure can be a panel shape formed by straight lines and / or curves. Surface E is one of the front and back of the panel structure, and surface F is the other of the front and back of the panel structure. Using a flat panel structure in the panel structure makes it easier for users to place the heated object stably, so that the heated object can be in stable contact with the conductive heating layer 2, improving heating stability and heating efficiency.

[0089] More specifically, the planar plate structure of the substrate 1 can adopt a shape composed of straight lines and / or curves, such as a circle, ellipse, rectangle, trapezoid, etc.

[0090] As another embodiment of Example 9, compared with the flat surface structure, when the heated object has an irregular bottom, the contact area between the flat surface structure and the heated object is limited, and the heat transfer function is not better utilized. Therefore, the panel structure of the substrate 1 can also adopt a curved panel structure, and the surface used to place the heated object adopts a curved and uneven curved surface structure to adapt to the irregular bottom of individual heated objects.

[0091] Example 10:

[0092] Based on the above embodiments, a heating component with power failure protection is provided. The substrate 1 adopts a cylindrical structure (not shown). The cylindrical structure can be a hollow through-structure, a hollow blind hole structure, or a solid cylindrical structure. The cylindrical structure can be a cylindrical structure with a different cross-sectional profile, such as a cylinder or a square cylinder. In this case, when the cylindrical structure is hollow, surface E is one of the outer and inner surfaces of the cylindrical structure, and surface F is the other of the outer and inner surfaces of the cylindrical structure. The cylindrical structure makes it easy for users to insert liquid items for heating. The conductive end of the conductive heating layer 2 is protected by a waterproof layer, leaving only the heating end in contact with the liquid. This allows the heated object to be in stable contact with the conductive heating layer 2, improving heating stability and heating efficiency.

[0093] like Figures 1 to 3 as well as Figure 16 As shown, one specific embodiment of this utility model is as follows:

[0094] During manufacturing, the substrate 1 is made of an insulator. The outer shape of the substrate 1 is first processed to form surface E. The conductive heating layer 2 and the conductive protective layer 3 are both attached and formed on surface E. Electrode layers 22 are provided on both sides of the heating layer 21 of the conductive heating layer 2. The conductive protective layer 3 is located in the space or area between the outer edge of the substrate 1 and the outer edge of the conductive heating layer 2. The conductive protective layer 3 and the conductive heating layer 2 are spaced apart. The spaced positions are not connected to each other and do not contact each other, so as to avoid mutual influence after the conductive protective layer 3 and the conductive heating layer 2 come into contact.

[0095] The conductive protective layer 3 includes a conductive layer 33 arranged in a ring around the outside of the conductive heating layer 2. The conductive layer 33 has an open ring structure. The first end 31 and the second end 32 of the conductive layer 33 are both used to connect to external electrical control equipment. After connecting to the external electrical control equipment, the first end 31, the conductive layer 33, the second end 32 and the external electrical control equipment form a power circuit.

[0096] In use, the first electrode 221 and the second electrode 222 of the electrode layer 22 are electrically connected to an external power source to conduct current through the heating layer 21, and the heating layer 21 generates heat to achieve normal heating effect.

[0097] When the conductive protective layer 3 is disconnected due to damage or breakage of the substrate 1, the power supply circuit will be broken. After the circuit is broken, the power-off protection mechanism of the external electrical control equipment will be triggered to achieve power-off protection.

[0098] like Figures 4 to 6 as well as Figure 17 As shown, another specific embodiment of this utility model is as follows:

[0099] Unlike one of the specific embodiments, the conductive heating layer 2 is located on the surface E of the substrate 1, and the conductive protective layer 3 is located on the surface F of the substrate 1.

[0100] like Figures 7 to 9 as well as Figure 18 As shown, the third specific embodiment of this utility model is as follows:

[0101] Unlike one of the specific embodiments, the substrate 1 has mounting holes 11 for easy installation, and the heating layer 21 includes multiple independently arranged heating areas. The heating areas are arranged around the mounting holes 11 in a circumferential manner to avoid the dispersed heating positions of the mounting holes 11, and to ensure sufficient heating range without affecting installation.

[0102] The heating layer 21 includes independently arranged heating areas a, b, c and d. Heating areas c and d are located between heating areas a and b. Heating areas c and d are connected by a third electrode 223. The third electrode 223 is used to bypass the mounting hole 11 to ensure the circuit connection between heating areas c and d, so as to ensure that heating areas c and d can be connected and achieve conductive heating.

[0103] Each heating region is connected to the first electrode 221 and the second electrode 222 of the electrode layer 22 to form a parallel connection. Multiple dispersed and parallel connected heating regions can expand the heating range of the heating layer 21. Heating region a, heating region b and the central heating region are in a parallel connection relationship.

[0104] like Figures 10 to 12 as well as Figure 19 As shown, the fourth specific embodiment of this utility model is as follows:

[0105] Unlike the third specific embodiment, the conductive heating layer 2 is located on the surface E of the substrate 1, and the conductive protective layer 3 is located on the surface F of the substrate 1.

[0106] like Figures 13 to 15 as well as Figure 20 As shown, the fifth specific embodiment of this utility model is as follows:

[0107] During manufacturing, substrate 1 is made of materials that may be conductive, such as microcrystalline materials. The outer structure of substrate 1 is first processed to form surface E and surface F. One of surface E and surface F is the front side, and the other of surface E and surface F is the back side. The conductive heating layer 2 and the conductive protective layer 3 are both attached and formed on surface E. An insulating layer 4 is attached and formed on surface F of the substrate. The first end 31 of the conductive protective layer 3 extends a conductive lead 311 toward the conductive heating layer 2.

[0108] In use, the first electrode 221 and the second electrode 222 of the electrode layer 22 are electrically connected to an external power source to conduct current through the heating layer 21, and the heating layer 21 generates heat to achieve normal heating effect.

[0109] When the conductive protective layer 3 is disconnected due to damage or breakage of the substrate 1, the power circuit will be broken. After the circuit is broken, the power-off protection mechanism of the external electrical control equipment will be triggered to achieve power-off protection.

[0110] When the substrate 1 exhibits conductive properties at a specific temperature, the insulating layer 4 provides insulation to prevent user contact.

[0111] When the substrate 1 exhibits conductivity at a specific temperature, causing the conductive heating layer 2 to connect to the conductive lead 311 via the substrate 1, a short circuit in the power-on circuit can be triggered. The short circuit in the power-on circuit triggers the power-off protection of the external electrical control equipment, thereby achieving power-off protection to prevent the conductive heating layer 2 from overheating.

[0112] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A heating assembly with power failure protection, characterized in that: The material includes a substrate (1), a conductive heating layer (2), and a conductive protective layer (3). The conductive protective layer (3) is located in the area between the outer edge of the substrate (1) and the outer edge of the conductive heating layer (2). The conductive protective layer (3) and the conductive heating layer (2) are spaced apart. The conductive heating layer (2) is located on surface E of the substrate (1). The conductive protective layer (3) can be electrically connected to an external electrical control device for triggering power-off protection to form a power-on circuit and is located on surface E and / or surface F of the substrate (1). Surface E and surface F are independent surfaces on the substrate (1). When the substrate (1) is damaged, the conductive protective layer (3) is disconnected, causing the power-on circuit to be disconnected to trigger power-off protection.

2. A heating assembly with power failure protection according to claim 1, characterized in that: The conductive protective layer (3) includes a conductive layer (33) arranged in a ring around the outside of the conductive heating layer (2). One end of the conductive layer (33) has a first endpoint (31), and the other end of the conductive layer (33) has a second endpoint (32). There is a gap G between the first endpoint (31) and the second endpoint (32). The first endpoint (31) and the second endpoint (32) are respectively connected to external electrical control equipment to form a power circuit.

3. A heating assembly with power failure protection according to claim 1, characterized in that: The substrate (1) is made of a brittle material. When the substrate (1) breaks, the conductive protective layer (3) is disconnected, causing the power-on circuit to be disconnected and triggering the power-off protection.

4. A heating assembly with power failure protection according to claim 2, characterized in that: The conductive layer (33) extends from one of the first endpoint (31) and the second endpoint (32) and passes through the region between the other of the first endpoint (31) and the center of the substrate (1). The conductive layer (33) surrounds the center of the substrate (1) such that there is at least one enclosing ring structure consisting of the conductive layer (33) between the center of the substrate (1) and the outer edge of the substrate (1).

5. A heating assembly with power failure protection according to claim 1, characterized in that: The conductive heating layer (2) includes a heating layer (21) for heating by electricity and an electrode layer (22) for connecting to a power source. At least two separate electrode layers (22) are located on both sides of the heating layer (21), and the heating layer (21) includes at least one heating area.

6. A heating assembly with power failure protection according to claim 5, characterized in that: The substrate (1) has mounting holes (11) for easy installation. The heating layer (21) includes multiple heating areas that are independently arranged. The heating areas are arranged around the mounting holes (11) in a circumferential manner. Each heating area is connected to the first electrode (221) and the second electrode (222) of the electrode layer (22).

7. A heating assembly with power failure protection according to claim 5, characterized in that: The heating layer (21) includes heating regions a, b, c and d, which are independently provided. Heating region c and heating region d are located between heating region a and heating region b, and heating region c and heating region d are connected by a third electrode (223).

8. A heating assembly with power failure protection according to claim 1, characterized in that: When the conductive protective layer (3) is located on the surface E of the substrate (1), at least one insulating layer (4) is provided on the surface F of the substrate (1).

9. A heating assembly with power failure protection according to claim 1, characterized in that: The conductive protective layer (3) extends a grounding lead for conductive grounding to the outside of the substrate (1).

10. A heating assembly with power failure protection according to any one of claims 1-9, characterized in that: The conductive heating layer (2) is formed into a planar heating layer using one of the following materials: nano metal oxide, nano semiconductor metal oxide, graphene material, or carbon paste material.

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