Circuit board module for terminal equipment and terminal equipment

Abstract

The utility model provides a circuit board module for terminal equipment and the terminal equipment. The circuit board module comprises a cavity structure and a plugging structure, a material filling hole is formed in the wall of the cavity structure, a cavity is filled with a heat conduction material, and the cavity is communicated with the external space of the cavity structure through the material filling hole. The plugging structure comprises a mounting part and a hole plugging part which are fixedly connected to the exterior of the cavity structure, the mounting part covers the filling hole, a through hole is formed in the area, right opposite to the filling hole, of the mounting part, and the hole plugging part can plug the through hole or can be switched between the through hole plugging state and the filling hole plugging state; and the filling hole is communicated with the external space of the cavity structure through the plugging structure. According to the invention, the heat conduction material can be prevented from overflowing from the material filling hole in the cavity structure to pollute the circuit board module and the surrounding devices thereof, so that the reliable performance of the terminal equipment can be ensured, and the plugging structure is simple in structure, facilitates the realization of miniaturization design, and facilitates the realization of miniaturization of the circuit board module and the terminal equipment.

Description

Technical Field

[0001] This application relates to the field of terminal equipment, and in particular to a circuit board module for a terminal equipment and a terminal equipment. Background Technology

[0002] As the performance of terminal devices improves, the application of high-frequency, high-power components is becoming more widespread, leading to increasingly complex functions and a growing number of devices that the circuit board modules in these devices must support. The motherboard (also known as the main circuit board) of mobile phones and other terminal devices houses high-power chips (also known as heat sources), such as charging chips, System-on-a-Chip (SoC), and UFS (Universal Flash Storage) chips. These chips generate a significant amount of heat during operation, placing high demands on the heat dissipation performance of the circuit board module. Furthermore, the circuit board module has one or more cavity structures. These cavities can accommodate specific electronic components, enabling modular and highly integrated circuit designs and improving the functionality of the circuit board module. Moreover, filling the cavities with thermally conductive materials can more effectively conduct heat away from the heat sources, further enhancing the heat dissipation performance of the circuit board module.

[0003] Currently, circuit board modules in terminal devices often employ a sandwich structure, where multiple sub-circuit boards are stacked. Adjacent sub-circuit boards are supported and electrically connected by a frame plate, enabling specific functions such as improving the structural strength of the internal space, enhancing thermal management, or providing electromagnetic shielding. The sandwich cavity can accommodate a number of electronic components, allowing for stacking of these components along the thickness direction of the circuit board module. Given a fixed area (the area occupied by the circuit board module refers to the layout area of ​​the circuit board within the terminal device; if the thickness direction of the circuit board module aligns with the thickness direction of the terminal device, the area occupied by the circuit board module can be understood as the area of ​​the circuit board in a plane perpendicular to its thickness direction), a larger number of electronic components can be arranged. To address the heat dissipation requirements of the circuit board module, in one exemplary scenario, a thermally conductive material (e.g., thermally conductive gel) is filled into the sandwich cavity to reduce thermal resistance, allowing heat generated by the heat source to be effectively conducted away. Alternatively, it can be understood that two adjacent sub-circuit boards and the frame plate between them form a cavity structure filled with thermally conductive material. In another exemplary scenario, the circuit board module further includes a shielding cover over the sub-circuit board, the shielding cover and the sub-circuit board forming a cavity structure, at least some of the electronic components of the sub-circuit board being housed within the cavity structure, and by filling the cavity structure with a thermally conductive material, the heat generated by the heat source is effectively conducted away through the thermally conductive material within the cavity structure.

[0004] Thermal conductive materials are divided into curable thermal conductive materials and non-curable thermal conductive materials. Curable thermal conductive materials have a certain fluidity at high temperatures and cure into solid adhesives at room temperature, which can specifically dissipate heat from high-power electronic components. Non-curable thermal conductive materials have fluidity and adhesion. When flowing in the sandwich cavity, they fill the gaps between electronic components and dissipate heat from each electronic component, resulting in better overall heat dissipation performance.

[0005] Filling the cavity structure of a circuit board module with a non-curable thermally conductive material requires creating filling holes and vents in the cavity structure walls (e.g., sub-circuit boards or shielding covers). The thermally conductive material is injected into the cavity structure through the filling holes, while air inside the cavity can escape through the vents. At this point, the thermally conductive material can fill and encapsulate the electronic components within the cavity and conform to the walls of the circuit board module, achieving good heat conduction. However, in the assembled circuit board module, some filling holes on the cavity structure (e.g., filling holes on sub-circuit boards and / or filling holes on shielding covers) are open. Because the non-curable thermally conductive material has a certain degree of fluidity, it is easily deformed within the cavity structure after slight heating or stress, causing it to overflow from the open filling holes, contaminating the circuit board module itself and surrounding components, thus affecting the reliability of the circuit board module and the terminal device.

[0006] Therefore, the thermally conductive material in the cavity structure of the existing circuit board module is very easy to overflow from its open filling hole, contaminating the circuit board module itself and its surrounding components, and affecting the performance of the terminal device. Utility Model Content

[0007] The circuit board module and terminal device provided in this application solve the problem that the thermally conductive material in the cavity structure of the circuit board module in the prior art is prone to overflow from its open filling hole, contaminating the circuit board module itself and surrounding devices, and affecting the performance of the terminal device.

[0008] The first aspect of this application provides a circuit board module, including a cavity structure. The cavity structure is filled with a thermally conductive material, and the cavity structure has a filling hole on its wall. The cavity is connected to the external space of the cavity structure through the filling hole.

[0009] The circuit board module also includes a sealing structure, which includes a mounting component and a plugging component. The mounting component is fixedly connected to the outside of the cavity structure and covers the filling hole. The area of ​​the mounting component facing the filling hole is provided with a through hole so that the filling hole can communicate with the external space of the cavity structure through the through hole.

[0010] The plugging component is installed on the mounting component and is configured to: block the through hole, or switch between blocking the through hole and blocking the filling hole, so as to prevent the filling hole from communicating with the external space of the cavity structure through the plugging structure.

[0011] The circuit board module provided in this application includes a cavity structure, wherein a filling hole is provided on one side wall of the cavity structure, and thermally conductive material (e.g., non-curable thermally conductive gel) can be injected through the filling hole and filled into the cavity of the cavity structure to reduce the heat dissipation thermal resistance in the cavity and achieve better heat conduction function.

[0012] The circuit board module also includes a sealing structure, which prevents the filling hole from communicating with the external space of the cavity structure. In other words, the sealing structure can block the heat-conducting material in the cavity structure at the filling hole, preventing the heat-conducting material from overflowing from the cavity structure and contaminating the circuit board module itself and its surrounding components. This ensures the normal production and reliable use of the circuit board module and terminal equipment.

[0013] Furthermore, the sealing structure includes an mounting component and a plugging component, or it can be understood as being configured as a split structure (e.g., a two-piece structure). The mounting component is fixedly disposed outside the cavity structure and covers the filling hole, or it can be understood as the mounting component being fixedly connected to the outer surface of the portion of the cavity structure located around the filling hole, preventing the thermally conductive material inside the cavity from overflowing from the connection between the mounting component and the cavity structure. The projection of the through-hole on the mounting component onto the wall of the cavity structure at least partially covers the filling hole, allowing the interior of the cavity to communicate with the external space of the cavity structure through the filling hole and the through-hole on the mounting component. Therefore, during the assembly of the circuit board module, the mounting component can be fixed to the outer wall of the cavity structure first. Then, thermally conductive material is injected into the cavity structure through the through-hole of the mounting component and the filling hole. Finally, the plugging component is placed on the mounting component to seal the filling hole or the through-hole on the mounting component, so that the interior of the cavity is not connected to the external space of the cavity structure. At this time, the thermally conductive material will not overflow from the filling hole or the through-hole on the mounting component, thus preventing the thermally conductive material in the cavity structure of the circuit board module from overflowing. Furthermore, the two-piece sealing structure is simple in structure and can achieve miniaturization while ensuring the sealing function. This helps to arrange the sealing structure in a limited space, thereby facilitating the miniaturization of the circuit board module and terminal equipment.

[0014] Furthermore, because the thermal conductivity of thermally conductive materials decreases significantly at high temperatures, to ensure its performance, high-temperature processing techniques cannot be used to fix the sealing structure to the cavity structure after the material is poured into it. This is to prevent the thermally conductive material inside the cavity from overflowing from the filling hole into the external space of the cavity structure. This limits the methods for fixing the sealing structure to the cavity structure. Fixing methods that meet this requirement typically cannot satisfy the need to arrange the sealing structure within a small space while ensuring the reliability of its fixation.

[0015] In this embodiment, before injecting the thermally conductive material into the cavity structure, the mounting component can be fixed to the outer wall of the cavity structure. This eliminates the need to consider the thermal impact of the high temperature generated during the fixing process of the mounting component to the cavity structure on the thermally conductive material inside the cavity structure. This makes the fixing method between the sealing structure and the cavity structure more flexible. For example, the size of the mounting component can be reasonably set in a small space, and a suitable fixing method (e.g., welding) can be selected to fix the mounting component to the cavity structure, ensuring the reliability of its fixing. This simplifies the circuit board module assembly process, saves costs, and improves production efficiency.

[0016] After filling the cavity structure with thermally conductive material, the plugging component is then installed on the mounting component to achieve the sealing function. This avoids the potential damage to the surrounding structure of the filling hole caused by directly and rigidly inserting the plugging component into it. Furthermore, it allows for more diverse plugging component types, making the sealing structure design more flexible. For example, when the plugging component seals a through hole, the upper surface of the mounting component fits snugly against the plugging component, ensuring good sealing reliability. The various mating methods between the mounting component and the plugging component allow for better consideration of production costs and time for specific scenarios and production methods. When the plugging component can switch between sealing the filling hole and sealing the through hole on the mounting component, it ensures the sealing of the thermally conductive material under normal conditions. It also considers the structural deformation caused by thermal expansion and contraction of the cavity structure, sealing structure, and thermally conductive material under extreme conditions (such as high temperature or external force), which could affect the reliability of the sealing structure. Therefore, it can switch to sealing the through hole on the mounting component while simultaneously sealing the filling hole, providing sufficient safety space for deformation of the thermally conductive material and sealing structure.

[0017] Therefore, the circuit board module provided in this application embodiment can prevent the thermally conductive material inside the cavity structure from overflowing from the filling hole and contaminating the circuit board module itself and surrounding components, thereby ensuring the reliable performance of the terminal device. Furthermore, the two-piece sealing structure is simple in structure, which helps to achieve miniaturization, thus facilitating the miniaturization of both the circuit board module and the terminal device. At the same time, the fixing method between the sealing structure and the cavity structure is relatively flexible, which can simplify the circuit board module assembly process, save costs, and improve production efficiency while ensuring reliable fixing.

[0018] In one possible implementation, the mounting component is fixedly connected to the outer surface of the portion of the cavity structure located around the filling hole by welding. The welding process allows for a more reliable fixation of the mounting component to the surface of the cavity structure, improving reliability. Simultaneously, it simplifies the manufacturing process, saves costs, and increases production efficiency.

[0019] In one possible implementation, the plug is detachably connected to the mounting element.

[0020] Using the above solution, the plugging component achieves the sealing function by connecting to the mounting component. On the one hand, this avoids the structural instability that may occur in the area around the filling hole when the plugging component is directly placed at the filling hole. On the other hand, it can provide more types of plugging components, making the sealing structure design more flexible.

[0021] In one possible implementation, the plugging component is a fastener that snaps or threads onto the mounting component, sealing the through-hole. By tightening the fastener to the mounting component, the through-hole is closed, preventing the previously open filling hole from communicating with the external space of the cavity structure, thus providing a good sealing effect. Furthermore, unlocking the fastener from the mounting component allows for its removal without affecting the pouring of the thermally conductive material. In the manufacturing process, the fastener's design is easy to implement, simple, and efficient.

[0022] In one possible implementation, the fastener includes a shank that passes through a through hole. The outer wall of the shank has an external thread, and the inner wall of the through hole has an internal thread; the external thread and the internal thread are threaded together to allow the fastener to be threadedly connected to the mounting component. Alternatively, the outer wall of the shank has a snap-fit ​​portion, and the inner wall of the through hole has a snap-fit ​​portion; the snap-fit ​​portion engages with the snap-fit ​​portion to engage the fastener with the mounting component. One of the snap-fit ​​portion and the snap-fit ​​portion is a latch, and the other is a groove.

[0023] Using the above solution, the fastener has a shank with external threads or a snap-fit ​​portion on its outer wall. This ensures that the through-hole on the mounting component is closed, preventing communication between the internal cavity structure and the external space. Furthermore, this connection method guarantees the reliability of the connection between the fastener and the mounting component, and is simple and easy to operate. Moreover, the fasteners come in various forms, allowing for selection based on production processes and needs, which facilitates the production flow.

[0024] In one possible implementation, the end of the fastener furthest from the cavity structure has a positioning groove. The fastener can be positioned and installed through the positioning groove, making it easier to connect to the mounting part, saving processing time and facilitating production.

[0025] In one possible implementation, the fastener further includes a head, one end of which is connected to the end of the rod away from the cavity structure, and the head protrudes from the outer wall surface of the rod, and the other end of the head is recessed inward to form a positioning groove; and / or, the rod is entirely located outside the filling hole.

[0026] By adopting the above solution, when the fastener has a head, there is a larger contact area between the fastener and the mounting part, which can enhance the connection strength between the fastener and the mounting part, making the sealing structure more reliable. Furthermore, the head can also be equipped with a positioning groove, which, while ensuring the structural strength of the rod itself, also facilitates gripping and installation during the production process. Moreover, the entire rod of the fastener is located outside the cavity structure, avoiding the sealing structure's occupation of the cavity space within the cavity structure and reducing the potential impact of the sealing structure on the functionality of the circuit board module itself.

[0027] In one possible implementation, the fastener includes a sleeve portion with openings at both ends and a cover portion. The cover portion is connected to one end of the sleeve portion and closes the opening at that end. The sleeve portion is fitted onto the outer wall surface of the mounting member and is snap-fitted or threadedly connected to the mounting member. The cover portion is located at the end of the mounting member away from the cavity structure and covers the through hole.

[0028] Using the above solution, the fastener can be a sleeve with one end closed. In this case, the fastener is connected to the end of the mounting part away from the cavity structure, so that the inside of the cavity structure is no longer connected to the outside space, sealing the heat-conducting material and preventing the heat-conducting material inside the cavity structure from overflowing from the filling hole through the through hole on the mounting part. Furthermore, the fastener has a variety of forms and high design flexibility.

[0029] In one possible implementation, the inner wall of the sleeve is provided with an internal thread, and the outer wall of the mounting part is provided with an external thread. The internal thread and the external thread are threadedly connected to each other so that the fastener is threadedly connected to the mounting part.

[0030] Alternatively, the inner wall of the sleeve is provided with a snap-fit ​​part, and the outer wall of the mounting part is provided with a snap-fit ​​part. The snap-fit ​​part and the snap-fit ​​part are snapped together to make the fastener snap-fit ​​with the mounting part. In this case, one of the snap-fit ​​part and the snap-fit ​​part is a buckle, and the other is a groove.

[0031] Using the above scheme, when the fastener is designed as a sleeve with one end closed, the fastener form is different. It can be a threaded connection or a snap-fit ​​connection. At this time, the fastener design is highly flexible.

[0032] In one possible implementation, the cover abuts against the end of the mounting member away from the cavity structure to close the end of the through hole away from the filling hole. The end face of the cover away from the sleeve portion is recessed inward to form a positioning groove.

[0033] By adopting the above solution, the cover of the fastener fits snugly against the end of the mounting part away from the cavity structure, which can better seal the heat-conducting material at the end of the through hole away from the filling hole and prevent it from overflowing.

[0034] In one possible implementation, the plugging component includes an elastomer disposed within a through-hole of the mounting component. The elastomer is configured to switch between a first position and a second position relative to the mounting component. When the elastomer is in the first position, it elastically compresses against the wall of the filling hole to block the filling hole. When the elastomer is in the second position, it elastically compresses against the wall of the end of the through-hole away from the cavity structure to block the through-hole.

[0035] Using the above scheme, the elastomer is located inside the through-hole of the mounting component. Under the action of gravity, the elastomer can elastically compress and seal the filling hole, preventing the thermally conductive material from overflowing. When a small amount of thermally conductive material inside the cavity structure flows from the filling hole to the through-hole through the filling hole, the elastomer moves from the filling hole to the through-hole under the buoyancy and impact force of the thermally conductive material. Furthermore, the elastomer can elastically compress and seal the through-hole on the mounting component, preventing the thermally conductive material from overflowing. On the other hand, the elastomer itself has a certain amount of elastic deformation, allowing it to enter the through-hole of the mounting component with the aid of external force, facilitating assembly.

[0036] In one possible implementation, the elastomer contains a magnetic material or a metallic material that can be attracted by the magnetic material.

[0037] Using the above solution, the magnetic material or the metal material that can be attracted by the magnetic material in the elastomer has a certain weight, which can better seal the filling hole. Furthermore, the magnetic material or the metal material that can be attracted by the magnetic material can be attracted by the production tool by the magnetic properties, which facilitates the gripping and installation of the plugging part.

[0038] In one possible implementation, the plugging component also includes a magnetic component, which is enclosed within an elastic body. The magnetic component is made of a magnetic material or a metal material that can be attracted by a magnetic material.

[0039] Using the above scheme, magnetic components are installed inside the elastic body, and their forms vary, allowing for high design flexibility.

[0040] In one possible implementation, the elastomer is made of rubber or foam.

[0041] In one possible implementation, the orthographic projection of the through hole onto the cavity structure is entirely located within the filling hole, or the orthographic projection of the through hole onto the cavity structure completely coincides with the filling hole.

[0042] The mounting component is designed as a cylindrical structure.

[0043] Using the above solution, during the pouring of thermally conductive material, the pouring tool (e.g., a pouring needle) can pass through the through-hole and be aligned with the pouring hole without needing to extend into it. This reduces or avoids potential damage to the circuit board around the pouring hole and to components within the cavity structure. Furthermore, the end face of the mounting component near the cavity structure can partially cover the pouring hole, allowing the end of the mounting component near the cavity structure to naturally provide a first layer of sealing for the thermally conductive material during pouring.

[0044] In one possible implementation, the thermally conductive material is a paste-like material. This material has a certain degree of fluidity, allowing it to uniformly and fully encapsulate the electronic components within the cavity structure, thus facilitating heat dissipation and exhibiting good thermal conductivity.

[0045] In one possible implementation, the thermally conductive material is a non-curable thermally conductive gel.

[0046] In one possible implementation, the circuit board module further includes a first shielding cover, which is disposed outside the cavity structure and on the same side as the sealing structure. The height of the sealing structure is less than or equal to the height of the first shielding cover. In this case, the sealing structure will not occupy excessive internal stacking space in the height direction of the circuit board module, thus reducing the impact on the internal stacking design.

[0047] In one possible implementation, the circuit board module further includes a heat source, which comprises at least one electronic component. The heat source is mounted in the cavity structure, and the entire heat source is either encased in a thermally conductive material or thermally coupled to the thermally conductive material through the wall of the cavity structure. Alternatively, a portion of the heat source is encased in the thermally conductive material, and another portion is thermally coupled to the thermally conductive material through the wall of the cavity structure.

[0048] Using the above solution, the thermally conductive material not only transfers the heat generated by the heat source wrapped in the thermally conductive material within the cavity structure, but also conducts the heat coupled between itself and the wall of the cavity structure, as well as the heat energy transferred by the heat source that may not be wrapped. This ensures that the heat within the cavity structure of the circuit board module can be transferred through the thermally conductive material, achieving a good heat dissipation effect.

[0049] In one possible implementation, at least one electronic component of the heat source includes a chip, which includes any one or more of a central processing unit, an image processor, a charging chip, a system-on-a-chip, and a general-purpose flash memory chip.

[0050] In one possible implementation, the circuit board module further includes a first sub-circuit board, a frame board, and a second sub-circuit board stacked sequentially along the thickness direction of the circuit board module. The frame board is configured as a hollow frame structure, such that the first sub-circuit board, the second sub-circuit board, and the frame board surround each other to form a cavity structure. A filling hole is provided on the second sub-circuit board or the frame board, and the second sub-circuit board or the frame board is provided with a vent hole spaced apart from the filling hole.

[0051] When the circuit board module also includes a heat source, the heat source is entirely mounted on the surface of the first sub-circuit board facing or away from the second sub-circuit board, or a portion of the heat source is mounted on the surface of the first sub-circuit board facing the second sub-circuit board, and another portion is mounted on the surface of the first sub-circuit board away from the second sub-circuit board.

[0052] When the circuit board module also includes a first shielding cover, the first shielding cover is integrally mounted on the surface of the second sub-circuit board that is opposite to the first sub-circuit board.

[0053] Using the above scheme, the first sub-circuit board, the frame board, and the second sub-circuit board form a sandwich cavity. Electronic components can be mounted on both sides of each sub-circuit board, and some electronic components can be accommodated within the cavity structure, resulting in high space utilization. The cavity structure is provided with vent holes, which allow air inside the cavity structure to escape when filling with thermally conductive material. On the other hand, the flow of the thermally conductive material can also be observed through the vent holes, thereby controlling the amount of thermally conductive material injected.

[0054] The filling hole can be set on the second sub-circuit board. The thermally conductive material enters the cavity structure through the filling hole, which can better wrap the heat source for heat conduction and ensure heat dissipation. Alternatively, the filling hole can also be set on the frame board. Generally, no electronic components are installed on the frame board, and there are fewer internal traces. Opening a hole on the frame board will not occupy the installation area of ​​the circuit board, thus improving the space utilization of the circuit board module.

[0055] The second aspect of this application provides a terminal device, including the circuit board module provided by the first aspect above and any possible implementation thereof.

[0056] The terminal device provided in this application embodiment has a circuit board module where the thermally conductive material is less likely to overflow from the filling hole, thus preventing contamination of the circuit board module itself and surrounding components and ensuring the reliable performance of the terminal device. Furthermore, the circuit board module's design to address the issue of thermally conductive material overflow is simple, allowing for arrangement within a limited space, which is beneficial for miniaturizing the terminal device. On the other hand, the circuit board module design in the terminal device is flexible and diverse, simplifying the assembly process, saving costs, and improving production efficiency while ensuring reliable performance.

[0057] In one possible implementation, the terminal device also includes a housing, to which the circuit board module is fixedly connected.

[0058] When the circuit board module includes a first sub-circuit board, a second sub-circuit board, and a frame board, the circuit board module is installed in the housing through the first sub-circuit board. Both the first and second sub-circuit boards are PCBs. The first sub-circuit board is an application processor board, and the second sub-circuit board is an RF board. Attached Figure Description

[0059] Figure 1 This is a schematic diagram of the structure of a circuit board module;

[0060] Figure 2a This is a three-dimensional structural diagram of the terminal device according to an embodiment of this application;

[0061] Figure 2b for Figure 2a Cross-sectional view along the AA direction;

[0062] Figure 3a This is a schematic diagram of one implementation of the circuit board module according to an embodiment of this application;

[0063] Figure 3b This is a schematic diagram of another implementation of the circuit board module in the embodiments of this application;

[0064] Figure 4 This is a top view of the circuit board module according to an embodiment of this application;

[0065] Figure 5a This is a schematic diagram illustrating the cavity structure and sealing structure in the circuit board module of this application embodiment;

[0066] Figure 5b This is a schematic diagram of the cavity structure and sealing structure of the circuit board module in the first reference design;

[0067] Figure 5c This is a schematic diagram of the cavity structure and sealing structure of the circuit board module in the second reference design;

[0068] Figure 5d This is a schematic diagram illustrating one implementation method of the cavity structure and sealing structure in the circuit board module according to an embodiment of this application;

[0069] Figure 5e for Figure 5d A schematic diagram illustrating the disassembly of the mounting components and plugging components of the central sealing structure;

[0070] Figures 6a to 6c This is a schematic diagram showing the positional relationship between the filling holes and through holes in the circuit board module of an embodiment of this application;

[0071] Figure 7aThis is a cross-sectional schematic diagram of the first embodiment of the circuit board module of this application;

[0072] Figure 7b for Figure 7a A schematic diagram of the exploded structure of the area where the central blocking structure is located;

[0073] Figure 8a This is a cross-sectional schematic diagram of the sealing structure in the first embodiment of the circuit board module of this application;

[0074] Figure 8b This is a cross-sectional schematic diagram of another implementation of the sealing structure in the circuit board module of the present application embodiment;

[0075] Figure 9a This is a cross-sectional schematic diagram of the sealing structure in the second embodiment of the circuit board module of this application;

[0076] Figure 9b This is a cross-sectional schematic diagram of another implementation of the sealing structure in the second embodiment of the circuit board module of this application;

[0077] Figure 10a This is a cross-sectional schematic diagram showing the elastic body of the sealing structure in the first position in the third embodiment of the circuit board module of this application.

[0078] Figure 10b This is a cross-sectional schematic diagram showing the elastic body of the sealing structure in the second position in the third embodiment of the circuit board module of this application.

[0079] Figure 10c This is a cross-sectional schematic diagram of another structure of the elastic body of the sealing structure in the third embodiment of the circuit board module of this application;

[0080] Figure 10d This is a cross-sectional schematic diagram of another structure of the elastic body of the sealing structure in the third embodiment of the circuit board module of this application.

[0081] Explanation of reference numerals in the attached figures:

[0082] One option:

[0083] 200', Circuit board module;

[0084] 31', First sub-circuit board;

[0085] 32', Second sub-circuit board; 323', Filling hole; 324', Vent hole;

[0086] 33', Heat source; 330', Electronic component; 331', First electronic component;

[0087] 4', Frame plate; 40', Cavity structure; 402', Thermally conductive material;

[0088] Z1', the thickness direction of the circuit board module.

[0089] First reference design:

[0090] 323”, filling hole;

[0091] 40”, cavity structure; 402”, thermally conductive material;

[0092] 6”, sealing structure;

[0093] Second reference design:

[0094] 323”’、 Filling hole;

[0095] 40”’, cavity structure; 402”’, thermally conductive material;

[0096] 6”’、Blocking structure.

[0097] This application:

[0098] 100. Terminal equipment;

[0099] 1. Display screen; 2. Housing; 20. Mounting cavity; 21. Mid-frame; 211. Base plate; 212. Outer frame; 22. Back cover;

[0100] 200. Circuit board module; 201. Sandwich cavity;

[0101] 3. Sub-circuit board; 31. First sub-circuit board; 311. First board surface; 312. Second board surface;

[0102] 32. Second sub-circuit board; 321. First board surface; 322. Second board surface; 323. Filling hole; 324. Vent hole;

[0103] 33. Heat source; 330. Electronic component; 331. First electronic component; 331A. SOC; 331B. DDR; 331C. PMU; 332. Rectangular shape; 333. Solder ball;

[0104] 4. Frame panel;

[0105] 40. Cavity structure; 401. Chamber; 402. Thermally conductive material;

[0106] 51. Fastener; 52. First shielding cover; 520. First shielding space; 53. Second shielding cover; 530. Second shielding space; 531. First part; 532. Second part;

[0107] 6. Sealing structure; 61. Mounting component; 610. Through hole; 611. First end; 612. Second end; 613. First through hole portion; 614. Second through hole portion;

[0108] 62. Plug; 621. Fastener; 6211. Rod; 6212. Head; 6213. Positioning groove; 6214. Sleeve;

[0109] 6215. Cover;

[0110] 6221. Internal thread; 6222. External thread; 6223. Snap-fit ​​part; 6224. Snapped part; 6225. Snap fastener; 6226. Snap groove;

[0111] 6227. Guiding part; 6228. Guided part;

[0112] 623. Elastomer; 6231. Magnetic component; 6232. Magnetic material; 6233. Metallic material that can be attracted by magnetic material;

[0113] Z1, thickness direction of the circuit board module; Z2, thickness direction of the terminal device. Detailed Implementation

[0114] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application will be presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. To provide a thorough understanding of this application, many specific details will be included in the following description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0115] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0116] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," "top," and "bottom," etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0117] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0118] In the description of this application, it should be understood that "electrical connection" can be understood as physical contact and electrical conduction between components; it can also be understood as the form in which different components in a circuit structure are connected through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB).

[0119] In the description of this application, it should be noted that the mutual perpendicularity in this application is not absolute perpendicularity. Approximate perpendicularity due to processing and assembly errors (e.g., an angle of 89° between two structural features) is also within the scope of mutual perpendicularity in this application. Similarly, the mutual parallelism in this application is not absolute parallelism. Approximate parallelism due to processing and assembly errors (e.g., an angle of 1° between two structural features) is also within the scope of mutual parallelism in this application. The axial symmetry in this application is not absolute axial symmetry. Approximate axial symmetry due to processing and assembly errors (e.g., a partial structure offset by a certain distance or angle relative to the axis of symmetry) is also within the scope of axial symmetry in this application. The central symmetry in this application is not absolute central symmetry. Approximate central symmetry due to processing and assembly errors (e.g., a partial structure offset by a certain distance or angle relative to the axis of symmetry) is also within the scope of central symmetry in this application. This application does not impose specific limitations in these respects.

[0120] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0121] Circuit board modules in terminal devices typically house high-power chips (also known as heat sources), such as charging chips, System-on-a-Chip (SoC), and UFS (Universal Flash Storage) chips. These chips generate significant heat during operation, placing high demands on the heat dissipation performance of the circuit board module. Circuit board modules usually have one or more cavity structures. These cavities can accommodate specific electronic components, enabling modular and highly integrated circuit designs and improving the functionality of the circuit board module. Furthermore, by creating filling holes in the walls of the cavity structures and filling the cavities with non-curable thermally conductive materials, the heat generated by the heat sources can be more effectively conducted away, improving the heat dissipation performance of the circuit board module. However, because non-curable thermally conductive materials have a certain degree of fluidity, they are prone to deformation within the cavities after slight heating or stress, causing them to overflow from the open filling holes, contaminating the circuit board module itself and surrounding components, thus affecting the reliability of the circuit board module and the terminal device. The following describes a detailed description of an exemplary circuit board module structure.

[0122] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of a circuit board module.

[0123] like Figure 1 As shown, the circuit board module 200' includes a first sub-circuit board 31', a frame board 4', and a second sub-circuit board 32' stacked sequentially along the thickness direction Z1' of the circuit board module. The frame board 4' is configured as a hollow frame structure, so that the first sub-circuit board 31', the second sub-circuit board 32', and the frame board 4' surround to form a cavity structure 40'. Electronic components 330' are disposed within the cavity structure 40'. A portion of the electronic components 330' is a high-power first electronic component 331' (which constitutes a heat source 33'). The first electronic component 331' can be a charging chip, SOC, UFS chip, etc., to realize the corresponding functions in the terminal device. During use, the heat source 33' will generate a large amount of heat. Designers should consider the heat conduction and heat dissipation requirements of this heat to ensure the normal operation of the terminal device.

[0124] like Figure 1 As shown, the cavity structure 40' contains a thermally conductive material 402', which reduces heat dissipation thermal resistance and enables heat conduction. The second sub-circuit board 32' has a filling hole 323' and a vent hole 324', allowing the flowing thermally conductive material 402' to be injected into the cavity structure 40' through the filling hole 323', fully enveloping each electronic component 330', while the air inside the cavity structure 40' is discharged through the vent hole 324'.

[0125] However, due to the fluidity of the thermal conductive material 402', the thermal conductive material 402' filled in the cavity structure 40' is very easy to deform in the cavity under slight heating and stress. The thermal conductive material 402' is easy to overflow from the open filling hole 323'. The overflowing thermal conductive material 402' will stick to the circuit board module itself and its surrounding devices, which may cause the contaminated circuit board module or devices to malfunction and affect the performance of the terminal device.

[0126] Therefore, the thermally conductive material in the cavity structure of the existing circuit board module is very easy to overflow from its open filling hole, contaminating the circuit board module itself and its surrounding components, and affecting the performance of the terminal device.

[0127] To address the aforementioned issues, this application provides a circuit board module for a terminal device. By installing a sealing structure at the area where the external filling hole of the cavity structure is located, the thermally conductive material inside the cavity structure is prevented from overflowing from the filling hole. Therefore, it avoids contamination of the circuit board module itself and surrounding components by the thermally conductive material, ensuring the reliable performance of the circuit board module. Furthermore, the two-piece sealing structure is simple in design, facilitating miniaturization and thus enabling miniaturization of both the circuit board module and the terminal device. Simultaneously, the fixing method between the sealing structure and the cavity structure is flexible, simplifying the circuit board module assembly process, saving costs, and improving production efficiency while ensuring reliable fixing.

[0128] This application also provides a terminal device, which can be a common terminal such as a mobile phone, computer, or tablet computer. The circuit board module provided in this application can be used as the motherboard or sub-board of the terminal device, and this application does not impose any limitations on this. The structure of the terminal device is described below using a mobile phone as an example.

[0129] Please see Figure 2a and Figure 2b , Figure 2a This is a three-dimensional structural diagram of the terminal device according to an embodiment of this application; Figure 2b for Figure 2a A cross-sectional view along the AA direction.

[0130] like Figure 2a and Figure 2bAs shown, the terminal device 100 includes a display screen 1, a housing 2, and a circuit board module 200. The housing 2 and the display screen 1 form a mounting cavity 20. The circuit board module 200 is installed in the mounting cavity 20 and fixedly connected to the housing 2. The structure of the housing 2 is not limited. In one possible implementation, the housing 2 includes a middle frame 21 and a back cover 22. The middle frame 21 includes a base plate 211 and an outer frame 212 connected to the outer periphery of the base plate 211. The outer frame 212 can be configured as an annular outer frame surrounding the outer periphery of the base plate 211. In the thickness direction Z2 of the terminal device, the display screen 1 and the back cover 22 are respectively disposed on both sides of the outer frame 212. The base plate 211 is located between the display screen 1 and the back cover 22. The circuit board module 200 is installed on the base plate 211, and the thickness direction Z1 of the circuit board module is consistent with the thickness direction Z2 of the terminal device.

[0131] In other possible implementations, the housing 2 may consist only of a middle frame 21, the base plate 211 of which is used as the rear cover 22 of the terminal device 100. The terminal device 100 may also be configured with other structures, which will not be listed in this application.

[0132] Those skilled in the art will understand that the mounting cavity 20 may also house devices such as batteries, camera modules, speakers, and FPCs. The display screen 1 and other devices can be electrically connected to the circuit board module 200 to control various functions of the terminal device 100 through the circuit board module 200.

[0133] The above mainly introduced the basic structural composition of the terminal device 100. The following will illustrate the implementation methods that the circuit board module 200 can adopt with reference to the attached drawings.

[0134] Please see Figure 3a and Figure 3b , Figure 3a This is a schematic diagram of one implementation of the circuit board module according to an embodiment of this application; Figure 3b This is a schematic diagram of another implementation of the circuit board module in the embodiments of this application.

[0135] like Figure 2b and Figure 3aAs shown, the circuit board module 200 includes a first sub-circuit board 31, a frame plate 4, and a second sub-circuit board 32, which are sequentially stacked along the thickness direction Z1 of the circuit board module. The frame plate 4 is configured as a hollow frame structure, so that the first sub-circuit board 31, the second sub-circuit board 32, and the frame plate 4 surround each other to form a cavity structure 40. Alternatively, it can be understood that the first sub-circuit board 31, the frame plate 4, and the second sub-circuit board 32 form a sandwich structure, and the cavity 401 of the cavity structure 40 is a sandwich cavity 201. It should be noted that the cavity structure 40 can be an integral structure or a split structure, and the specific form of the cavity structure 40 will be explained in detail later.

[0136] Those skilled in the art will understand that the installation method of the circuit board module 200 in the terminal device 100 is not limited. For example... Figure 2b As shown, in one possible implementation, the circuit board module 200 is fixedly connected to the housing 2 via a first sub-circuit board 31. Specifically, the first sub-circuit board 31 is fixedly connected to the base plate 211 of the middle frame 21, and the second sub-circuit board 32 is located on the side of the base plate 211 near the rear cover 22.

[0137] Those skilled in the art will understand that the number of sub-circuit boards 3 in the circuit board module 200 is not limited, and can be two, three, four, or more. Similarly, the number of frame boards 4 in the circuit board module 200 is also not limited, and can be determined according to the number of sub-circuit boards 3. For example, the circuit board module 200 may include three sub-circuit boards 3 stacked along the thickness direction Z1 of the circuit board module, with a frame board 4 disposed between each pair of adjacent sub-circuit boards 3.

[0138] like Figure 2b and Figure 3a As shown, in one possible implementation, the circuit board module 200 further includes a fixing member 51. The fixing member 51 passes sequentially through corresponding openings on the second sub-circuit board 32, the frame plate 4, and the first sub-circuit board 31. Alternatively, it can be understood that the fixing member 51, passing through the second sub-circuit board 32, the frame plate 4, and the first sub-circuit board 31, fixes the various structures in the circuit board module 200 together along the thickness direction Z1 of the circuit board module. It should be noted that the number of fixing members 51 is not limited; it can be one, two, three, etc. Furthermore, in one possible implementation, the fixing member 51 can also pass through the bottom plate 211 of the middle frame 21 to fix the circuit board module 200 to the middle frame 21.

[0139] like Figure 3aAs shown, the first sub-circuit board 31 and the second sub-circuit board 32 are used to mount electronic components 330 and to set up wiring. Specifically, the first sub-circuit board 31 has a first surface 311 and a second surface 312 in the thickness direction Z1 of the circuit board module, and the second sub-circuit board 32 has a first surface 321 and a second surface 322 in the thickness direction Z1 of the circuit board module. The first surface 311 of the first sub-circuit board 31 and the second surface 322 of the second sub-circuit board 32 are opposite to each other. Electronic components 330 can be mounted on each surface of each sub-circuit board, or they can be mounted on only a portion of the surfaces of each sub-circuit board; this application does not impose any limitations on this. The electronic components 330 mounted on the first surface 311 of the first sub-circuit board 31 can be partially located inside the sandwich cavity 201, partially located outside the sandwich cavity 201, or entirely located inside or outside the sandwich cavity 201; this application does not impose any limitations on this. Similarly, the electronic components 330 mounted on the second surface 322 of the second sub-circuit board 32 can be partially located inside the sandwich cavity 201, partially located outside the sandwich cavity 201, or entirely located inside or outside the sandwich cavity 201; this application does not impose any restrictions on this. It should be noted that this application does not impose any restrictions on the number or location of the electronic components 330 on each sub-circuit board 3; the figures are for illustrative purposes only and do not represent the actual structure of the circuit board module 200. Any electronic component 330 in the circuit board module 200 can be a charging module, memory, control module, etc.; this application does not impose any restrictions on this. The connection method between the electronic components 330 and the sub-circuit board 3 is not limited; for example, they can be mounted on the sub-circuit board 3 via SMT (Surface Mount Technology).

[0140] Those skilled in the art will understand that the traces on the sub-circuit board 3 can be disposed on its surface or inside the sub-circuit board 3. In one possible implementation, both the first sub-circuit board 31 and the second sub-circuit board 32 are PCB boards, and the PCB boards have trace layers. The number of trace layers is not limited, and different trace layers can be electrically connected through metal vias. In other possible implementations, the first sub-circuit board 31 and the second sub-circuit board 32 can also be other types of circuit boards, such as integrated circuit boards, aluminum substrates, copper substrates, single-sided boards, double-sided boards, etc., and this application does not impose any restrictions on them.

[0141] Those skilled in the art will understand that different sub-circuit boards 3 can carry different functions. Depending on the type of electronic components 330 on the sub-circuit board 3, any one sub-circuit board 3 can be a radio frequency (RF) board or an application processor (AP) board. The RF board is equipped with radio frequency integrated circuits (RF ICs), radio frequency power amplifiers (RFPAs), wireless fidelity (WIFI) chips, and other radio frequency components. The AP board is equipped with system-on-chip (SOCs), double data rate (DDR) memory (also known as general-purpose flash memory chips), power management units (PMUs), and other components. In one possible implementation, the first sub-circuit board 31 is an AP board, and the second sub-circuit board 32 is an RF board. In other possible implementations, the first sub-circuit board 31 can also be an RF board or a board with other functions, and the second sub-circuit board 32 can also be an AP board or a board with other functions; this application does not impose any limitations on this.

[0142] Furthermore, such as Figure 3a As shown, the frame plate 4 is disposed between the first sub-circuit board 31 and the second sub-circuit board 32. On one hand, it supports the first and second sub-circuit boards 31 and 32, forming a closed cavity structure 40 between them to shield external signals. On the other hand, the first and second sub-circuit boards 31 and 32 can be electrically connected through the frame plate 4. Those skilled in the art will understand that the method of electrical connection between the first and second sub-circuit boards 31 and 32 is not limited. For example, metal vias can be provided on the frame plate 4, and the circuit traces between the first and second sub-circuit boards 31 and 32 can be electrically connected through these metal vias. For example, the frame plate 4 can also be configured as a circuit board, with circuitry embedded within it. The first and second sub-circuit boards 31 and 32 can be connected to the circuitry inside the frame plate 4, thereby achieving electrical connection. Besides the two examples mentioned above, the first and second sub-circuit boards 31 and 32 can also be electrically connected in other ways, and this application does not limit this.

[0143] like Figure 3aAs shown, in one possible implementation, the circuit board module 200 may further include a first shielding cover 52. The first shielding cover 52 is integrally mounted on the surface of the second sub-circuit board 32 facing away from the first sub-circuit board 31. That is, the first shielding cover 52 is disposed on the first surface 321 of the second sub-circuit board 32 and forms a first shielding space 520 with the second sub-circuit board 32. Alternatively, it can be understood that the first shielding cover 52 and the second sub-circuit board 32 are connected to form a cavity structure 40, and the cavity 401 of the cavity structure 40 is the first shielding space 520.

[0144] In one possible implementation, the circuit board module 200 may further include a second shielding cover 53. The second shielding cover 53 is integrally mounted on the surface of the first sub-circuit board 31 facing away from the second sub-circuit board 32. That is, the second shielding cover 53 is disposed on the second surface 312 of the first sub-circuit board 31 and surrounds the first sub-circuit board 31 to form a second shielding space 530. Alternatively, it can be understood that the second shielding cover 53 and the first sub-circuit board 31 are connected to form a cavity structure 40, and the cavity 401 of the cavity structure 40 is the second shielding space 530.

[0145] It should be noted that this application does not limit the specific structure of the first shielding cover 52 and the second shielding cover 53. The first shielding cover 52 can be a one-piece structure (see...). Figure 3a Alternatively, a split structure can be used (not shown in the diagram). For example... Figure 3a As shown, in one possible implementation, the second shielding cover 53 is a split structure, specifically including a first part 531 and a second part 532 fixedly connected. The first part 531 covers the second surface 312 of the first sub-circuit board 31, forming a second shielding space 530 around the first sub-circuit board 31. A cutout is provided on the wall of the first part 531 away from the first sub-circuit board 31, allowing communication between the interior of the second shielding space 530 and the external space. The second part 532 covers the first part 531 and closes the cutout. Figure 3b As shown, in another possible implementation, the second shield 53 is an integral structure.

[0146] Furthermore, the electronic components 330 on the first surface 321 of the second sub-circuit board 32 may be partially located within the first shielding space 520, partially located outside the first shielding space 520, or entirely located within or outside the first shielding space 520; this application does not impose any restrictions on this. Similarly, the electronic components 330 on the second surface 312 of the first sub-circuit board 31 may be partially located within the second shielding space 530, partially located outside the second shielding space 530, or entirely located within or outside the second shielding space 530; this application does not impose any restrictions on this. The first shielding cover 52 and the second shielding cover 53 provide protection and signal shielding for the electronic components 330 within their shielding spaces, making the electronic components 330 less susceptible to damage or falling due to external forces and unaffected by external signal interference. Those skilled in the art will understand that shielding covers may also be omitted from the first sub-circuit board 31 and the second sub-circuit board 32, depending on the type of electronic component 330.

[0147] like Figure 3a As shown, the circuit board module 200 also includes a heat source 33, which includes at least one electronic component 330. The electronic component included in the heat source 33 is referred to below as the first electronic component 331. The number of first electronic components 331 is not limited; it can be one, two, three, etc. The type of the first electronic component 331 is not limited. In one possible implementation, the first electronic component 331 includes a chip, which includes any one or more of a central processing unit (CPU), an image processor (GPU), a charging chip, a system-on-a-chip (SoC), and a general-purpose flash memory chip. Among these, the CPU, GPU, charging chip, SoC, and general-purpose flash memory chip are all high-power chips that dissipate a significant amount of heat during operation. Alternatively, it can be understood that the first electronic component 331 is a high-power, heat-generating component. Concentrating the first electronic component 331 in one area to form a module (i.e., heat source 33) can concentrate heat dissipation for the heat-generating electronic component, improving the heat dissipation efficiency of the circuit board module 200.

[0148] Those skilled in the art will understand that the specific arrangement of the heat source 33 is not limited. In one possible implementation, a portion of the heat source 33 is mounted on the surface of the first sub-circuit board 31 facing the second sub-circuit board 32, and another portion is mounted on the surface of the first sub-circuit board 31 away from the second sub-circuit board 32. Alternatively, it can be understood that a portion of the first electronic component 331 of the heat source 33 is mounted on the first surface 311 of the first sub-circuit board 31 and located within the sandwich cavity 201, while the other portion of the first electronic component 331 of the heat source 33 is mounted on the second surface 312 of the first sub-circuit board 31 and located within the second shielding space 530.

[0149] In another possible implementation, the heat source 33 is entirely mounted on the surface of the first sub-circuit board 31 facing the second sub-circuit board 32. This can be understood as all the first electronic components 331 of the heat source 33 being mounted on the first surface 311 of the first sub-circuit board 31 and located within the sandwich cavity 201. In yet another possible implementation, the heat source 33 is entirely mounted on the surface of the first sub-circuit board 31 facing away from the second sub-circuit board 32. This can be understood as all the first electronic components 331 of the heat source 33 being mounted on the second surface 312 of the first sub-circuit board 31 and located within the second shielding space 530.

[0150] Please see Figure 4 , Figure 4 This is a top view of the circuit board module according to an embodiment of this application.

[0151] It should be noted that some of the accompanying drawings in this application have simplified the depiction of heat source 33, for example... Figure 3a The heat source 33 is simplified as a solid structural block. In fact, the heat source 33 contains one or more first electronic components 331, and there can be gaps between different first electronic components 331. Figure 4 As shown, in one embodiment, the heat source 33 is rectangular 332 in a plane perpendicular to the thickness direction Z1 of the circuit board module. The rectangle 332 can be understood as a region shared by all the first electronic components 331 within the heat source 33. Simplifying the heat source 33 into a rectangle 332 can serve as a reference for the coverage area of ​​the thermally conductive material 402 mentioned below, and also facilitates determining the locations of the filling holes 323 and vent holes 324 mentioned below.

[0152] Furthermore, the first electronic component 331 of the heat source 33 can be fixedly connected to the sub-circuit board 3 (e.g., the first sub-circuit board 31) (e.g., via solder balls 333). Different first electronic components 331 of the heat source 33 can also be stacked and fixed to each other in the thickness direction Z1 of the circuit board module (e.g., via solder balls 333), which helps save stacking space in the circuit board module 200, improves space utilization, and the solder balls 333 have good electrical and thermal signal conduction performance, better ensuring telecommunication connections and heat conduction, and guaranteeing the reliable performance of the circuit board module 200. Figure 3a As shown, in one example, heat source 33 includes PMU331C, SOC331A and DDR331B. PMU331C is mounted on the first surface 311 of the first sub-circuit board 31, and SOC331A and DDR331B are stacked on the second surface 312 of the first sub-circuit board 31.

[0153] The preceding text mainly introduced the basic structure of the circuit board module 200. It can be understood that the circuit board module 200 is equipped with a heat source 33. The first electronic component 331 in the heat source 33 is a high-power electronic component, which often generates a large amount of heat during use. To prevent the heat source 33 from being damaged due to excessively high temperatures, a heat-conducting structure (which can be understood as the structure composed of the heat-conducting material 402 mentioned below) needs to be set in the circuit board module 200. This heat-conducting structure conducts the heat generated by the heat source 33 to a cooler location within the circuit board module 200, thus achieving heat dissipation. Therefore, heat dissipation of the circuit board module 200 in the terminal device 100 is a major focus. The following text will elaborate on the implementation of the heat dissipation function of the circuit board module 200 in this application and the heat-conducting structure used.

[0154] Please see Figure 5a , Figure 5a This is a schematic diagram illustrating the principle of the cooperation between a cavity structure and a sealing structure in a circuit board module according to an embodiment of this application.

[0155] like Figure 3a and Figure 5a As shown above, based on the basic structural composition of the circuit board module 200, the circuit board module 200 has one or more cavity structures 40. For example, the first sub-circuit board 31, the frame board 4, and the second sub-circuit board 32 are sequentially connected and surround each other to form a cavity structure 40, the chamber 401 of which is a sandwich cavity 201. The first shielding cover 52 is connected to the second sub-circuit board 32 to jointly form a cavity structure 40, the chamber 401 of which is a first shielding space 520. The second shielding cover 53 is connected to the first sub-circuit board 31 to jointly form a cavity structure 40, the chamber 401 of which is a second shielding space 530. It should be noted that, in addition to the cavity structures 40 mentioned in the examples above, the circuit board module 200 may also include cavity structures 40 at other locations, which will not be described in detail in this embodiment. Figure 5a This diagram represents only any cavity structure 40 in the circuit board module 200 and does not specifically refer to a cavity structure 40 at a particular location.

[0156] like Figure 3a and Figure 5aAs shown, in order to improve the heat dissipation performance of the circuit board module 200, thermally conductive material 402 can be filled in the chambers 401 of some cavity structures 40. The thermally conductive material 402 has a high thermal conductivity, which reduces the heat dissipation thermal resistance in the chambers 401 and achieves better heat conduction function. Through the thermally conductive material 402, heat from the high-temperature location in the cavity structure 40 (e.g., the location of the heat source 33, or the location corresponding to the heat source 33) can be transferred to the low-temperature location, thereby achieving efficient heat dissipation of the heat source 33 (i.e., the high-power electronic component 330) in a targeted manner.

[0157] like Figure 3a and Figure 5a As shown, those skilled in the art will understand that the thermally conductive material filling the chamber 401 of the cavity structure 40 can be a curable thermally conductive material (e.g., a curable thermally conductive gel) or a non-curable thermally conductive material 402 (e.g., a non-curable thermally conductive gel). The types of thermally conductive materials filling the chambers 401 of different cavity structures 40 can be the same or different, and this application embodiment does not limit this. In one possible implementation, the thermally conductive material filling the chambers 401 of some cavity structures 40 (e.g., the sandwich cavity 201) is a paste-like thermally conductive material 402 (e.g., a paste-like thermally conductive gel, or can be understood as a non-curable thermally conductive gel), which has a certain fluidity and can uniformly and fully wrap the electronic components 330 inside the cavity structure 40, eliminate air, a poor conductor of heat, form a continuous thermally conductive channel, improve heat transfer efficiency, and dissipate heat from the electronic components 330. The paste-like thermally conductive material 402 is typically made of a silicone resin-based composite material (e.g., thermally conductive gel) with added thermally conductive particles and binders. The thermally conductive particles can be, for example, alumina particles, aluminum nitride particles, etc., and this application does not impose any limitations on this.

[0158] like Figure 3a and Figure 5a As shown, it should be noted that in order to fill the cavity 401 of the cavity structure 40 with thermally conductive material 402, a filling hole 323 needs to be opened on the wall of the cavity structure 40 (e.g., the first sub-circuit board 31). The thermally conductive material 402 can be poured into the cavity structure 40 through the filling hole 323. At this time, the cavity 401 of the cavity structure 40 is connected to the external space of the cavity structure 40 through the filling hole 323. It should be noted that the specific location of the filling hole 323 is not limited in the embodiments of this application, and will be described in detail below with reference to the specific location of each cavity structure 40.

[0159] To avoid excessive air bubbles in the thermally conductive material 402 poured into the cavity structure 40, vent holes 324 are typically provided on the wall of the cavity structure 40. Air inside the cavity structure 40 can be discharged through the vent holes 324 during the filling of the thermally conductive material 402. It should be noted that the relative positions of the vent holes 324 and the filling holes 323 on the wall of the cavity structure 40 are not limited. They can be two independent holes spaced apart from each other, or they can share a large hole. This application does not impose any restrictions on this, and a detailed explanation will be provided below in conjunction with the specific cavity structure 40 in the circuit board module 200.

[0160] Those skilled in the art will understand that when the thermally conductive material 402 filling the cavity structure 40 is a non-curable thermally conductive material 402 (e.g., a paste-like thermally conductive material 402), because this material lacks curing properties and has fluidity, it is easily deformed within the cavity structure 40 after slight heating or stress, thus easily overflowing from the open filling hole 323, contaminating the circuit board module 200 itself and surrounding devices, thereby affecting the reliability of the circuit board module 200 and the terminal device 100. Especially during the production and testing phases of the terminal device 100, the circuit board module 200 typically faces high heat and compression, at which time the risk of thermally conductive material 402 overflowing is significantly increased. Figure 3a As shown, in an exemplary scenario, if the thermally conductive material 402 in the sandwich cavity 201 overflows from the open filling hole 323, the thermally conductive material 402 will flow over the covered portion of the second sub-circuit board 32 and around the first shield 52, and even flow to adjacent devices outside the circuit board module 200. This overflowing thermally conductive material 402 will not only contaminate the circuit board module 200 itself and its surrounding devices, but may also obstruct the view during production and installation, interfere with the test structure, and affect the performance reliability of the circuit board module 200 and the terminal device 100. During the use of the terminal device 100, if the thermally conductive material 402 overflows from the sandwich cavity 201 in the circuit board module 200, some devices may malfunction, significantly reducing the user experience.

[0161] like Figure 3a and Figure 5aAs shown, to prevent the thermally conductive material 402 filled in the cavity structure 40 from overflowing from the open filling hole 323 and contaminating the circuit board module 200 and its surrounding components, thereby affecting the reliability of the circuit board module 200 and the terminal device 100, this application embodiment provides a circuit board module 200. By additionally setting a sealing structure 6 at the position corresponding to the filling hole 323 on the outside of the cavity structure 40, after the thermally conductive material 402 is filled, the sealing structure 6 prevents the filling hole 323 from communicating with the external space of the cavity structure 40. Alternatively, it can be understood that the sealing structure 6 can seal the thermally conductive material 402 in the cavity structure 40 at the filling hole 323, preventing the thermally conductive material 402 in the cavity structure 40 from overflowing from the filling hole 323 and contaminating the circuit board module 200 and its surrounding components, thereby ensuring the normal production and reliability of the circuit board module 200 and the terminal device 100.

[0162] It should be noted that the sealing structure 6 is also applicable to scenarios where the thermally conductive material 402 filled in the cavity structure 40 is a curable thermally conductive material. For example, under the action of a large external force, the curable thermally conductive material 402 may also overflow from the filling hole 323. Under high temperature, the curable thermally conductive material 402 will soften or even melt, and may also overflow from the filling hole 323.

[0163] Those skilled in the art will understand that, for the cavity structure 40 in the circuit board module 200 filled with thermally conductive material 402, and the wall of the cavity structure 40 is provided with a filling hole 323 for filling the thermally conductive material 402 into the cavity structure 40, after the assembly process of the circuit board module 200 is completed, the filling hole 323 on the cavity structure 40 is in an open state, and the sealing structure 6 provided in the embodiment of this application can be set.

[0164] The above text provides a brief introduction to the heat-conducting structure of the general cavity structure 40. The following will combine... Figure 3a and Figure 3b The heat-conducting structures provided in the cavity structure 40 where the sandwich cavity 201 is located in the circuit board module 200 and the cavity structure 40 where the second shielding space 530 is located are illustrated with examples.

[0165] The following first combines Figure 3a Several implementation forms of the heat-conducting structure that can be set for the cavity structure 40 where the sandwich cavity 201 is located are described.

[0166] like Figure 3aAs shown, in one possible implementation, the sandwich cavity 201 is filled with a thermally conductive material 402, which is attached to the first surface 311 of the first sub-circuit board 31 and the second surface 322 of the second sub-circuit board 32. In other possible implementations, the thermally conductive material 402 may be attached to the first surface 311 of the first sub-circuit board 31 but not to the second surface 322 of the second sub-circuit board 32. Alternatively, the thermally conductive material 402 may also be attached to the first surface 311 of the first sub-circuit board 31, the second surface 322 of the second sub-circuit board 32, and the inner surface of the frame plate 4 (i.e., the side surface of the frame plate 4 located inside the cavity structure 40).

[0167] It should be noted that the heat source 33 is installed in the cavity structure 40 where the sandwich cavity 201 is located. The relative positional relationship between the area where the heat-conducting material 402 is located in the sandwich cavity 201 and the heat source 33 is not limited, as long as the heat generated by the heat source 33 can be transferred out through the heat-conducting material 402 in the sandwich cavity 201, it falls within the protection scope of this application embodiment. The relative positional relationship between the two is illustrated below with reference to the accompanying drawings.

[0168] like Figure 3a As shown, in one possible implementation, the projection of the area containing the thermally conductive material 402 within the sandwich cavity 201 onto the first sub-circuit board 31 (hereinafter referred to as the "first projection") at least partially overlaps with the projection of the area containing the heat source 33 (e.g., the area containing the rectangle 332 mentioned above) onto the first sub-circuit board 31 (hereinafter referred to as the "second projection"). In one example, the first projection completely covers the second projection. In another example, the first projection partially covers the second projection.

[0169] like Figure 3aAs shown, in one possible implementation, a portion of the heat source 33 is encased within the thermally conductive material 402 in the sandwich cavity 201, while another portion is thermally coupled to the thermally conductive material 402 in the sandwich cavity 201 through the wall of the cavity structure 40. Alternatively, it can be understood that a portion of the heat source 33, the first electronic component 331, is located in the sandwich cavity 201 and encased within the thermally conductive material 402, allowing the heat generated by this portion of the first electronic component 331 to be directly conducted through the thermally conductive material 402 to a lower-temperature location, thereby achieving efficient heat dissipation. The lower-temperature location could be, for example, the side wall of the frame plate 4, the lower-temperature electronic component 330 within the sandwich cavity 201, the second sub-circuit board 32, or the cavity structure 40 where the first shielding space 520 is located. Another part of the heat source 33, the first electronic component 331, is thermally coupled to the thermally conductive material 402 in the sandwich cavity 201 through the first sub-circuit board 31, so that the heat generated by this part of the first electronic component 331 can be transferred to the thermally conductive material 402 through the first sub-circuit board 31, and then conducted to a lower temperature location through the thermally conductive material 402.

[0170] In another possible implementation, the heat source 33 can also be entirely enclosed within the thermally conductive material 402 of the sandwich cavity 201. This can be understood as the first electronic component 331 of the heat source 33 being entirely located within the sandwich cavity 201. That is, when no first electronic component 331 is located outside the cavity 401, the heat source 33 is entirely enclosed within the thermally conductive material 402, allowing the heat it generates to be directly transferred to a lower temperature location through the thermally conductive material 402, achieving efficient heat dissipation. In yet another possible implementation, the heat source 33 can also be entirely located outside the sandwich cavity 201, achieving heat dissipation through thermal coupling with the wall of the cavity structure 40. This application does not impose any limitations on this implementation.

[0171] It should be noted that thermal coupling refers to the ability to transfer heat between two components, and the specific method of heat transfer is not limited. In one possible implementation, thermal coupling can involve the surfaces of the two components being bonded together, with heat transferred through the bonding area. In another possible implementation, an intermediate component can be provided between the two components, and heat can be transferred through this intermediate component; this application does not impose any limitations on this aspect.

[0172] Furthermore, in order to fill the cavity 401 of the cavity structure 40 with thermally conductive material 402, a filling hole 323 needs to be opened on the wall of the cavity structure 40 for pouring the thermally conductive material 402. It should be noted that the location of the filling hole 323 is not limited in this application. Figure 3aAs shown, in one possible implementation, the filling hole 323 is located on the second sub-circuit board 32, extending from the first surface 321 of the second sub-circuit board 32 to the second surface 322. In other possible implementations, the filling hole 323 can be located on the frame plate 4. In this case, the thermally conductive material 402 can still enter the cavity structure 40 from the filling hole 323 on the frame plate 4, encapsulating the electronic component 330 to achieve the function of heat conduction.

[0173] It is understood by those skilled in the art that, as Figure 3a As shown, the filling hole 323 may or may not contain thermally conductive material, and this application does not impose any restrictions on this. For example, the filling hole 323 on the cavity structure 40 where the sandwich cavity 201 is located contains thermally conductive material 402, while the filling hole 323 on the cavity structure 40 where the second shielding space 530 is located does not contain thermally conductive material 402.

[0174] It should be noted that this application does not impose any restrictions on the specific size of the filling hole 323. The size of the filling hole 323 can be selected according to the specific characteristics of the thermally conductive material 402 to ensure that the thermally conductive material 402 can be smoothly poured into the cavity structure 40, wrapping the electronic component 330 to achieve heat conduction. Moreover, it can occupy as little area as possible on the sub-circuit board 3, leaving enough installation space for other devices, which is conducive to the miniaturization design of the circuit board module 200 and the terminal device 100.

[0175] It should be noted that this application does not limit the specific shape of the filling hole 323. In one possible implementation, the filling hole 323 is circular, while in other possible implementations, the shape of the filling hole 323 can be square, elliptical, etc., and this application does not limit this.

[0176] To prevent excessive air bubbles from forming in the thermally conductive material 402 poured into the cavity structure 40, vent holes 324 are provided on the wall of the cavity structure 40. This allows air to escape from the cavity structure 40 during the pouring of the thermally conductive material 402, while preventing the thermally conductive material from flowing out of the cavity structure through the vent holes. It should be noted that this application does not limit the specific size of the vent holes 324. In one possible implementation, the size of the vent holes 324 is smaller than the size of the filling hole 323. In this case, the thermally conductive material 402 is less likely to overflow from the vent holes 324.

[0177] Those skilled in the art will understand that in other possible implementations, the vent 324 may not be provided, or the vent 324 may be reused with the filling hole 323. That is, the vent 324 and the filling hole 323 share a large hole. In this case, the air in the cavity structure 40 can be discharged from the large hole while the thermally conductive material 402 is being injected. This will be explained in detail later.

[0178] Furthermore, in one possible implementation, the vent 324 and the filling hole 323 are arranged independently and at intervals. It should be noted that this application does not limit the relative positions of the filling hole 323 and the vent 324; the accompanying drawings are for illustrative purposes only. Figure 4 As shown, in one possible implementation, the filling hole 323 and the vent hole 324 are spaced apart on the second sub-circuit board 32. The projection of the filling hole 323 along the thickness direction Z1 of the circuit board module on the first sub-circuit board 31 is located in the area where the thermally conductive material 402 is located, and the projection of the vent hole 324 along the thickness direction Z1 of the circuit board module on the first sub-circuit board 31 is located in the area where the thermally conductive material 402 is located or close to the thermally conductive material 402. In other possible implementations, the filling hole 323 can also be located on the frame plate 4, and the vent hole 324 can also be located on the frame plate 4. It is understood that the thermally conductive material 402 is poured into the cavity 401 of the cavity structure 40 through the filling hole 323, and therefore, the thermally conductive material 402 is generally located below the filling hole 323. The vent 324 is used for ventilation, and there may not be a heat-conducting material 402 below it. Therefore, the projection of the vent 324 along the thickness direction Z1 of the circuit board module on the first sub-circuit board 31 can be located in the area where the heat-conducting material 402 is located, or it can be located near the heat-conducting material 402.

[0179] like Figure 3a As shown, in one possible implementation, the thermally conductive material 402 filling the sandwich cavity 201 is a non-curable thermally conductive material. In one example, the thermally conductive material 402 is a non-curable thermally conductive gel.

[0180] The circuit board module 200 also includes a sealing structure 6, which is disposed in the area where the filling hole 323 is located on the outer wall of the cavity structure 40. In one example, the sealing structure 6 is disposed on the first surface 321 of the second sub-circuit board 32. In this case, the sealing structure 6 can block the thermally conductive material 402, preventing it from overflowing from the filling hole 323 and contaminating the circuit board module 200 itself and surrounding components. Those skilled in the art will understand that this application does not limit the specific form or number of sealing structures 6, or it can be understood that sealing structures 6 can be disposed in some or all of the areas where the filling holes 323 are located in the circuit board module 200 to prevent the thermally conductive material 402 from overflowing from the cavity structure 40.

[0181] like Figure 3aAs shown, in one possible implementation, a first shielding cover 52 is provided on one side of the circuit board module 200 where the sealing structure 6 is located. The height of the sealing structure 6 is less than or equal to the height of the first shielding cover 52. Alternatively, it can be understood that when the sealing structure 6 and the first shielding cover 52 are simultaneously located on the first surface 321 of the second sub-circuit board 32, the height of the sealing structure 6 in the thickness direction Z1 of the circuit board module will not be higher than the first shielding cover 52. With this structure, the sealing structure 6 will not occupy excessive internal stacking space in the thickness direction Z1 of the circuit board module, thus reducing the impact on the internal stacking design. Those skilled in the art will understand that the height of the sealing structure 6 can also be greater than the height of the first shielding cover 52; this application does not limit this.

[0182] It should be noted that, in other possible implementations, the thermally conductive material 402 inside the sandwich cavity 201 can also be a curable thermally conductive material or a thermally conductive pad.

[0183] It should be noted that if the heat-conducting material 402 inside the sandwich cavity 201 is a curable heat-conducting material or a heat-conducting pad, the sealing structure 6 may not be provided outside the cavity structure 40 where the sandwich cavity 201 is located. This application does not impose any restrictions on this.

[0184] The above mainly described the specific form of the heat conduction structure within the cavity structure 40 where the sandwich cavity 201 is located. The following will first combine... Figure 3a and Figure 3b The following describes several possible implementations of the heat-conducting structure provided for the cavity structure 40 where the second shielding space 530 is located.

[0185] like Figure 3a As shown, in one possible implementation, the second shielding space 530 is filled with a thermally conductive material 402, which encloses part of the electronic components 330. Alternatively, the thermally conductive material 402 can be selectively filled according to the heat dissipation requirements of the electronic components 330, and some of the electronic components 330 can be located outside the thermally conductive material 402. In other possible implementations, the second shielding space 530 may not be filled with a thermally conductive material 402, and this application does not impose any restrictions on this.

[0186] In one possible implementation, the second shielding cover 53 is a split structure, specifically including a first part 531 and a second part 532. During the assembly stage of the circuit board module 200, the first part 531 of the second shielding cover 53 can be fixed to the second surface 312 of the first sub-circuit board 31 first, and the heat-conducting material 402 can be poured in through the hollow part of the first part 531. Alternatively, the hollow part on the first part 531 can be understood as a filling hole 323. After the heat-conducting material 402 fully covers the electronic components 330 that need heat dissipation (it should be noted that at least some of the electronic components 330 can be the first electronic components 331 of the heat source 33), the second part 532 is then installed on the first part 531. At this time, the second shielding cover 53 and the first sub-circuit board 31 are connected to form a closed cavity structure 40. The chamber 401 of this cavity structure 40 is the second shielding space 530, and there is no problem of heat-conducting material 402 overflowing. Furthermore, the large cutout in the first part 531 allows for clear observation of the amount of thermally conductive material 402 being poured. During the pouring process, the cutout in the first part 531 can also be reused as a vent 324 to expel air from the first part 531 during pouring. In this case, the cutout is reused as both a filling hole 323 and a vent 324, or it can be understood that the filling hole 323 and the vent 324 share a large opening. It should be noted that the thermally conductive material 402 can be attached to the second surface 312 of the first sub-circuit board 31 and the inner surface of the second part 532 of the second shield 53, or it can be attached to one or both inner surfaces of the first part 531. Alternatively, the thermally conductive material 402 can be attached to the second surface 312 of the first sub-circuit board 31, but may not be attached to the inner surface of the second part 532 or the inner surface of the first part 531. This application does not impose any restrictions on this.

[0187] Those skilled in the art will understand that the second shielding space 530 may be filled with either a non-curable thermally conductive gel or a curable thermally conductive gel, and this application makes no limitation in this regard.

[0188] like Figure 3bAs shown, in one possible implementation, the second shielding cover 53 is configured as an integral structure, or it can be understood that the second shielding cover 53 is fixedly connected to the second plate surface 312 of the first sub-circuit board 31, forming a second shielding space 530 around the first sub-circuit board 31. That is, in one possible implementation, when an electronic component 330 that needs to dissipate heat is provided in the second shielding space 530, it is necessary to fill it with a thermally conductive material 402 to dissipate heat. In one example, the second shielding space 530 can be filled with a non-curable thermally conductive material (e.g., thermally conductive gel). Considering that the non-curable thermally conductive material has a certain fluidity, it is necessary to first fix the second shielding cover 53 to the second plate surface 312 of the first sub-circuit board 31. Furthermore, it is necessary to provide a filling hole 323 on the side of the second shielding cover 53 away from the circuit board module 200 for filling the thermally conductive material 402 to form a thermally conductive structure. Furthermore, to prevent the thermally conductive material 402 from overflowing from the cavity structure 40 (i.e., the second shielding space 530), a sealing structure 6 can be provided at the filling hole 323 on the second shielding cover 53 to seal the thermally conductive material 402. In other possible implementations, the second shielding space 530 can be filled with a curable thermally conductive material or a thermally conductive pad. In this case, a thermally conductive structure can be specifically set for the electronic component 330 before the second shielding cover 53 is installed on the second surface 312 of the first sub-circuit board 31. For this purpose, the second shielding cover 53 can be provided with a filling hole or not. Those skilled in the art can set the filling hole and sealing structure according to the actual application scenario, and this application does not impose any restrictions.

[0189] The above text mainly introduced the specific heat dissipation structure in the circuit board module 200 with reference to the attached drawings. The following text will explain the basic structure and design principle of the sealing structure 6 with reference to the attached drawings.

[0190] Because the thermal conductivity of the thermally conductive material 402 decreases significantly at high temperatures, to ensure its thermal conductivity, after filling the cavity structure 40 with the thermally conductive material 402, high-temperature processing techniques cannot be used to fix the sealing structure 6 to the cavity structure 40. This is to prevent the thermally conductive material 402 inside the cavity 401 from overflowing from the filling hole 323 into the external space of the cavity structure 40. This would limit the fixing method between the sealing structure 6 and the cavity structure 40. Fixing methods that meet this requirement typically cannot satisfy the need to arrange the sealing structure 6 in a small space while ensuring the reliability of its fixation. The following section will first briefly introduce the sealing structure 6 of two reference designs.

[0191] Please see Figures 5b to 5c , Figure 5b This is a schematic diagram of the circuit board module cavity structure and sealing structure in the first reference design; Figure 5cThis is a schematic diagram of the cavity structure and sealing structure of the circuit board module in the second reference design.

[0192] like Figure 5b As shown, the sealing structure 6” outside the cavity structure 40” is an integral structure, which is fixed to the area where the filling hole 323” is located, covering the entire filling hole 323”. For example, the cavity structure 40” and the sealing structure 6” can be glued (e.g., glued) so that the sealing structure 6” is fixedly connected to the area around the filling hole 323” in the cavity structure 40”. Although this can prevent the heat-conducting material 402” from overflowing from the cavity structure 40”, the sealing structure 6” fixed by glue is at risk of falling off the cavity structure 40” under stress and heat, affecting its reliability.

[0193] like Figure 5c As shown, a sealing structure 6”’, such as a screw, is provided at the filling hole 323”’ of the cavity structure 40”’. The sealing structure 6”’ is forcibly inserted into the filling hole 323”’ through a threaded connection. Although this can seal the heat-conducting material 402”’ inside the cavity structure 40”’, the sealing structure 6”’ may partially extend into the interior of the cavity structure 40”’, occupying the internal space of the cavity structure”’. Furthermore, there is a risk of short circuit due to contact with electronic components inside the cavity structure. At the same time, the sealing structure 6”’ forcibly inserted into the filling hole 323”’ through a threaded connection is very likely to damage the structural strength of the cavity structure 40”’, affecting the performance reliability of the cavity structure 40”’.

[0194] Based on this, this application provides a split-type sealing structure 6, which, while sealing the thermally conductive material 402, also ensures the stability of the sealing structure 6 within the circuit board module 200 and meets the miniaturization design goal. The following, in conjunction with... Figure 5d and Figure 5e Detailed explanation follows.

[0195] Please see Figure 5d and Figure 5e , Figure 5d This is a schematic diagram illustrating one implementation method of the cavity structure and sealing structure in the circuit board module according to an embodiment of this application. Figure 5e for Figure 5d A schematic diagram illustrating the disassembly of the mounting components and plugging components of the sealing structure.

[0196] like Figure 5d and Figure 5eAs shown, the sealing structure 6 includes a mounting component 61 and a plugging component 62, or it can be understood that the sealing structure 6 is a split structure (in one example, it adopts a two-piece structure). This allows the mounting component 61 to be fixedly connected to the outer surface of the cavity structure 40. After the thermal conductive material 402 is poured in, the plugging component 62 is connected to the mounting component 61. At this point, the entire sealing structure 6 completely covers the filling hole 323, preventing communication between the interior and exterior spaces of the cavity structure 40 and preventing the overflow of the thermal conductive material 402. With this structure, the fixing method of the mounting component 61 is diverse, and the specific form of the plugging component 62 is not limited. Therefore, the sealing structure 6 of this application can ensure the stability of its own structure, ensure the performance reliability of the circuit board module 200 and the terminal device 100, and provide multiple optional forms of the sealing structure 6 for specific selection in different scenarios.

[0197] The mounting component 61 is fixedly disposed outside the cavity structure 40 and covers the filling hole 323. Alternatively, it can be understood that the mounting component 61 is fixedly connected to the outer side of the portion of the cavity structure 40 surrounding the filling hole 323, i.e., the mounting component 61 is fixedly connected to the first surface 321 of the second sub-circuit board 32. The projection of the mounting component 61 on the second sub-circuit board 32 in the thickness direction Z1 of the circuit board module completely covers the filling hole 323. In this case, the mounting component 61 can prevent the heat-conducting material 402 in the cavity 401 from overflowing from the connection between the mounting component 61 and the cavity structure 40. It should be noted that this application does not limit the specific structure of the mounting component 61. In one possible implementation, the mounting component 61 is configured as a cylindrical structure.

[0198] Please see Figures 6a to 6c , Figures 6a to 6c This is a schematic diagram showing the positional relationship between the filling holes and through holes in the circuit board module of this application embodiment.

[0199] like Figures 5d to 5e As shown, the mounting member 61 has a through hole 610, which extends through the mounting member 61 from the side surface of the mounting member 61 closest to the cavity structure 40, that is, the through hole 610 extends from the end face of the first end 611 of the mounting member 61 to the end face of the second end 612. The first end 611 of the mounting member 61 is the end of the mounting member 61 facing the cavity structure 40, and the second end 612 of the mounting member 61 is the end of the mounting member 61 away from the cavity structure 40. Furthermore, one end of the through hole 610 connects to the filling hole 323 of the cavity structure 40, and the other end connects to the external space of the cavity structure 40.

[0200] like Figures 5d to 6cIt should be noted that the projection of the through hole 610 on the wall of the cavity structure 40 at least partially covers the filling hole 323, so that the interior of the cavity 401 can communicate with the external space of the cavity structure 40 through the filling hole 323 and the through hole 610 on the mounting member 61. Furthermore, the outer periphery of the mounting member 61 surrounds the outer periphery of the filling hole 323, so that the sidewall of the mounting member 61 located around the through hole 610 cooperates with the outer surface of the cavity structure 40 opposite to it (e.g., fits together), which can prevent the thermally conductive material 402 in the cavity structure 40 from overflowing outward from the filling hole 323 through the space between the mounting member 61 and the cavity structure 40.

[0201] like Figure 6a As shown, in one possible implementation, the projection of the through-hole 610 on the second sub-circuit board 32 along the thickness direction Z1 of the circuit board module includes all the areas where the filling hole 323 opens on the second sub-circuit board 32. Figure 6b As shown, in another possible implementation, the projection of the through-hole 610 on the second sub-circuit board 32 along the thickness direction Z1 of the circuit board module is entirely located within the opening of the filling hole 323 on the second sub-circuit board 32. Figure 6c As shown, in another possible implementation, the projection of the through-hole 610 on the second sub-circuit board 32 along the thickness direction Z1 of the circuit board module overlaps with, but does not overlap with, the opening of the filling hole 323 on the second sub-circuit board 32. In these implementations, the interior of the cavity 401 can communicate with the external space of the cavity structure 40 through the filling hole 323 and the through-hole 610 on the mounting member 61, and the thermally conductive material 402 can also be injected or overflowed through the filling hole 323 and the through-hole 610. Thus, during the assembly process, such as Figure 5e As shown, the mounting component 61 can be fixed to the outer wall of the cavity structure 40 (e.g., the first surface 321 of the second sub-circuit board 32) first, and then the heat-conducting material 402 can be injected into the cavity structure 40 through the through hole 610 of the mounting component 61 from the filling hole 323. Finally, the plugging component 62 is placed on the mounting component 61 so that the interior of the cavity 401 is not connected to the external space of the cavity structure 40. At this time, the heat-conducting material 402 will not overflow from the filling hole 323 or the through hole 610 on the mounting component 61, so that the heat-conducting material 402 in the cavity structure 40 will not overflow.

[0202] It should be noted that this application does not limit the specific structure of the through hole 610. In one possible implementation, the through hole 610 is set as a circular through hole. In other possible implementations, the shape of the through hole 610 can be square, elliptical, etc.

[0203] like Figure 5d and Figure 5eAs shown, the plugging component 62 is disposed on the mounting component 61. By connecting the plugging component 62 to the side of the mounting component 61 away from the cavity structure 40, the plugging component 62 can block the filling hole 323 on the cavity structure 40, so that the heat-conducting material 402 of the cavity structure 40 will not overflow from the filling hole 323; or, the plugging component 62 can switch between blocking the through hole 610 and blocking the filling hole 323, blocking the heat-conducting material 402 in the cavity structure 40. At this time, the sealing structure 6 composed of the mounting component 61 and the plugging component 62 makes the filling hole 323 not connected to the external space of the cavity structure 40.

[0204] It should be noted that the structure of the plugging component 62 is not limited. In one possible implementation, the plugging component 62 is set as a fastener 621 (see...). Figures 7a to 9b The sealing structure 6, in conjunction with the through hole 610 on the mounting member 61, allows the sealing structure 6 to seal the filling hole 323 on the cavity structure 40, preventing the thermally conductive material 402 inside the cavity structure 40 from overflowing from the filling hole 323. In other possible implementations, the plugging member 62 is configured as an elastic member 623 (see [link to relevant documentation]). Figures 10a to 10d The elastomer 623 is located in the through hole 610 of the mounting part 61. It can switch between blocking the through hole 610 and blocking the filling hole 323 to block the heat-conducting material 402 in the cavity structure 40. The following text will explain in detail the possible implementation of the hole-blocking part 62 with reference to the attached drawings.

[0205] In this embodiment, before injecting the heat-conducting material 402 into the cavity structure 40, the mounting component 61 can be fixed to the outer wall of the cavity structure 40. That is, there is no need to consider the thermal impact of the high temperature generated by the process of fixing the mounting component 61 to the cavity structure 40 on the heat-conducting material 402 inside the cavity structure 40. This makes the fixing method of the sealing structure 6 to the cavity structure 40 more flexible. For example, the size of the mounting component 61 can be reasonably set in a small space and a suitable fixing method (e.g., welding) can be selected to fix the mounting component 61 to the cavity structure 40. The welding process is adopted. Furthermore, the sealing structure 6 adopts a two-piece structure, which is simple in structure and can achieve miniaturization design while ensuring the sealing function. This helps to arrange the sealing structure 6 in a limited space, which is conducive to the miniaturization design of the circuit board module 200 and the terminal device 100.

[0206] Therefore, the circuit board module 200 provided in this embodiment can prevent the thermally conductive material 402 from overflowing from the filling hole 323 inside the cavity structure 40 and contaminating the circuit board module 200 itself and its surrounding components, thereby ensuring the reliable performance of the terminal device 100. Furthermore, the two-piece sealing structure 6 has a simple structure, which helps to achieve miniaturization, thus facilitating the miniaturization of both the circuit board module 200 and the terminal device 100. At the same time, the fixing method between the sealing structure 6 and the cavity structure 40 is relatively flexible. While ensuring the reliability of the fixing, the fixing and installation process of the sealing structure 6 can be integrated into the relevant processes during the production of the circuit board module 200. In one example, the sealing structure 6 can be welded simultaneously with the electronic component 330, which can simplify the assembly process of the circuit board module 200, save costs, and improve production efficiency.

[0207] Those skilled in the art will understand that this application does not limit the method of fixing the mounting component 61 to the cavity structure 40. In one possible implementation, the mounting component 61 is fixedly connected to the outer side of the portion of the cavity structure 40 located around the filling hole 323 by welding. The welding process can make the mounting component 61 more reliably fixed to the surface of the cavity structure 40. For example, it can be mounted on the first board surface 321 of the second sub-circuit board 32 by SMT (Surface Mount Technology). Moreover, the manufacturing process can be consistent with the process used for mounting the circuit board module 200 and mounting the surrounding devices (for example, the fixing process of assembling the mounting component 61 to the second sub-circuit board 32 can be consistent with the fixing process of some electronic components 330 on the second sub-circuit board 32), which not only ensures the reliability of its fixation, but also simplifies the assembly process of the circuit board module 200, saves costs, and improves production efficiency.

[0208] like Figure 5d and Figure 5e As shown, in one possible implementation, the orthographic projection of the through-hole 610 on the cavity structure 40 is entirely located within the filling hole 323, or the orthographic projection of the through-hole 610 on the cavity structure 40 completely coincides with the filling hole 323. Alternatively, it can be understood that the projection of the through-hole 610 on the second sub-circuit board 32 along the thickness direction Z1 of the circuit board module is contained by the opening of the filling hole 323 on the first surface 321 of the second sub-circuit board 32 (see...). Figure 6b Alternatively, the projection of the through-hole 610 on the second sub-circuit board 32 along the thickness direction Z1 of the circuit board module coincides with the opening of the filling hole 323 on the first surface 321 of the second sub-circuit board 32 (see...). Figure 5eDuring the pouring of the thermally conductive material 402, the filling needle of the mounting component 61 can pass through the through hole 610 and be aligned with the filling hole 323 without having to extend into the filling hole 323. This reduces or avoids potential damage to the sub-circuit board around the filling hole 323 and to the components inside the cavity structure 40. Furthermore, the end face of the mounting component 61 near the cavity structure 40 can partially cover the filling hole 323, so that when the thermally conductive material 402 is poured, the end of the mounting component 61 near the cavity structure 40 naturally provides the first layer of sealing for the thermally conductive material 402.

[0209] Furthermore, the plugging component 62 is detachably connected to the mounting component 61. This can be understood as follows: during the pouring of the thermally conductive material 402, a pouring tool (e.g., a pouring needle) passes through the through-hole 610 on the mounting component 61 at the pouring hole 323 to pour the thermally conductive material 402 into the cavity structure 40. After the pouring of the thermally conductive material 402 is completed, the plugging component 62 can be installed at the through-hole 610 of the mounting component 61 to seal the thermally conductive material 402 at either the through-hole 610 or the pouring hole 323. This structure avoids the potential damage to the structure surrounding the pouring hole 323 when the plugging component 62 is directly and rigidly inserted into it. Furthermore, it allows for more variations of the plugging component 62, making the design of the sealing structure 6 more flexible. For example, when the plugging component 62 blocks the through hole 610, the upper surface of the mounting component 61 fits snugly against the plugging component 62, ensuring good sealing reliability. Furthermore, the mounting component 61 and the plugging component 62 can be configured in various ways, allowing for better consideration of production costs and time for specific scenarios and production methods. When the plugging component 62 can switch between blocking the filling hole 323 and blocking the through hole 610 on the mounting component 61, it ensures the normal function of blocking the thermally conductive material 402. It also considers that under extreme conditions (such as high temperature or external force), structural deformation of the sub-circuit boards, the blocking structure 6, and the thermally conductive material 402 due to thermal expansion and contraction could compromise the reliability of the blocking structure 6. Therefore, while blocking the filling hole 323, it can also switch to blocking the through hole 610 on the mounting component 61, providing sufficient safety space for the deformation of the thermally conductive material 402 and the blocking structure 6.

[0210] The above mainly introduces the basic structure and design principle of the sealing structure 6 in the circuit board module 200 with reference to the attached drawings. The following will describe in detail several specific forms that the sealing structure 6 can take, taking the cavity structure 40 where the sandwich cavity 201 in the circuit board module 200 is located as an example, with reference to the attached drawings.

[0211] It should be noted that, Figures 7a to 10dThe cavity structure 40 in the circuit board module 200 of this application, where the sandwich cavity 201 is located, is described as an example. Those skilled in the art will understand that the specific form of the sealing structure 6 described below is also applicable to any cavity structure 40 mentioned above.

[0212] Please see Figure 7a and Figure 7b , Figure 7a This is a cross-sectional view of the first embodiment of the circuit board module of this application. Figure 7b for Figure 7a A schematic diagram of the exploded structure of the area where the central sealing structure is located.

[0213] like Figure 7a and Figure 7b As shown, a sealing structure 6 is provided at the filling hole 323 on the cavity structure 40 where the sandwich cavity 201 is located in the circuit board module 200. The attached figure is only for illustration. Those skilled in the art will understand that the specific form of the sealing structure 6 can be selected according to production needs. The following will first explain the sealing structure 6 when the plugging part 62 is a fastener 621 (i.e., the first embodiment) with reference to the attached figure.

[0214] like Figure 7b As shown, the mounting component 61 is fixedly connected to the filling hole 323 of the second sub-circuit board 32, and the filling hole 323 can communicate with the outside through the through hole 610 on the mounting component 61. Figure 7a and Figure 7b As shown, the plugging component 62 can be connected to the mounting component 61 through the through hole 610. In other words, the plugging component 62 can block the through hole 610 on the mounting component 61, thereby blocking the filling hole 323. At this time, the filling hole 323 is not connected to the outside.

[0215] It should be noted that this application does not limit the structural form of the plugging component 62. In one possible implementation, such as... Figure 7b As shown, the plugging component 62 is configured as a fastener 621, which is snap-fitted or threaded onto the mounting component 61 and seals the through hole 610. Alternatively, the fastener 621 is locked to the mounting component 61 via a snap-fit ​​or threaded connection, keeping the through hole 610 of the mounting component 61 closed. The previously open filling hole 323 is no longer connected to the external space of the cavity structure 40, and the plugging structure 6 has a good sealing effect. When the circuit board module 200 malfunctions and requires repair, the fastener 621 can be unlocked from the mounting component 61, allowing the fastener 621 to be removed from the mounting component 61 to inspect the electronic components 330 and the heat-conducting material 402 inside the cavity structure 40. At this time, the fastener 621 can take various forms, which can be selected according to the production process and needs, facilitating the production flow.

[0216] Furthermore, in one possible implementation, the fastener 621 includes a rod 6211 that passes through the through hole 610. Alternatively, the rod 6211 can be understood as being entirely located within the through hole 610 of the mounting member 61, with the outer surface of the rod 6211 closely fitting the inner surface of the through hole 610 to ensure that the thermally conductive material 402 does not leak or overflow between the rod 6211 and the through hole 610.

[0217] Please see Figure 8a and Figure 8b , Figure 8a This is a cross-sectional schematic diagram of one implementation of the sealing structure in the circuit board module of the present application embodiment; Figure 8b This is a cross-sectional schematic diagram of another implementation of the sealing structure in the circuit board module of the present application embodiment.

[0218] like Figure 7b and Figure 8a As shown, in one possible implementation, the end face of the rod 6211 near the cavity structure 40 can be connected to one end opening of the filling hole 323. Alternatively, in other possible implementations, the end of the rod 6211 near the cavity structure 40 can be located inside the through hole 610 (see...). Figure 8b This application does not impose any limitations on this. It should be noted that the rod 6211 is entirely located outside the filling hole 323. This ensures that the rod 6211 does not extend into the cavity structure 40, and also ensures that the sealing structure 6 is entirely located outside the cavity structure 40, avoiding the sealing structure 6 occupying space in the cavity 401 within the cavity structure 40, and reducing the potential impact of the sealing structure 6 on the functionality of the circuit board module 200. Furthermore, in one possible implementation, the rod 6211 can be configured as a solid structure (see...). Figure 8a Alternatively, the rod 6211 can also be configured as a hollow structure (see...). Figure 8b This application does not impose any restrictions on this.

[0219] like Figure 7b As shown, in one possible implementation, the outer wall surface of the rod 6211 is provided with an external thread 6222, and the inner wall surface of the through hole 610 is provided with an internal thread 6221. The external thread 6222 and the internal thread 6221 are threadedly connected to each other, so that the fastener 621 is threadedly connected to the mounting part 61. In one example, the fastener 621 is a screw, in which case the fastener 621 has an external thread 6222. Correspondingly, a matching internal thread 6221 is provided inside the through hole 610 of the mounting part 61, so that the fastener 621 is locked onto the mounting part 61, effectively sealing the heat-conducting material 402 in the cavity structure 40 and preventing overflow. It is understandable that screw fastening is a common process in end products, and there are no additional equipment or technical difficulties, meeting the goal of simplicity and efficiency.

[0220] Furthermore, in one possible implementation, the fastener 621 also includes a head 6212, one end of which is connected to the end of the rod 6211 away from the cavity structure 40, and the head 6212 protrudes from the outer wall surface of the rod 6211. With this structure, the fastener 621 and the mounting member 61 have a larger contact area, and the head 6212 can strengthen the connection between the fastener 621 and the mounting member 61, making the sealing structure 6 more reliable. It should be noted that in other possible implementations, the fastener 621 may not have a head.

[0221] Furthermore, the end of the fastener 621 furthest from the cavity structure 40 is provided with a positioning groove 6213. During production and assembly, this groove can be used in conjunction with the assembly of the circuit board module 200, eliminating the need for other processing steps and saving processing time. Additionally, the positioning groove 6213 allows for the positioning and installation of the fastener 621, making it easier to connect to the mounting component 61 and facilitating production. Figure 8a As shown, in one possible implementation, the head 6212 can also be provided with a positioning groove 6213. That is, the positioning groove 6213 is formed by an inward recess at the end of the head 6212 away from the rod 6211. This ensures the structural strength of the rod 6211 itself and also facilitates gripping and installation during the production process. Those skilled in the art will understand that this application does not limit the specific form of the positioning groove 6213; it can be cross-shaped, or have a flat head, hexagonal head, square head, etc., and those skilled in the art can choose according to the production tools and processing technology.

[0222] In one possible implementation, such as Figure 8b As shown, the outer wall surface of the rod 6211 is provided with a snap-fit ​​portion 6223, and the inner wall surface of the through hole 610 is provided with a snap-fit ​​portion 6224. The snap-fit ​​portion 6223 and the snap-fit ​​portion 6224 engage to engage the fastener 621 with the mounting part 61. One of the snap-fit ​​portion 6223 and the snap-fit ​​portion 6224 is a latch 6225, and the other is a slot 6226. Please refer to... Figure 8bIn one example, a radially outwardly protruding buckle 6225 is formed on the outer wall surface of the rod 6211. The buckle 6225 serves as a locking part 6223, and the locking part 6223 is located at one end near the cavity structure 40. Correspondingly, the inner wall surface of the through hole 610 on the mounting member 61 has an inwardly recessed groove 6226, which serves as a locked part 6224, allowing the fastener 621 to be fastened onto the mounting member 61. A closed structure is formed at the through hole 610 or the filling hole 323 of the mounting member 61, preventing the heat-conducting material 402 from overflowing at that location. At this time, a guide part 6227 is provided at one end of the locking part 6223 near the cavity structure 40, and a guided part 6228 is provided at the other end of the through hole 610 on the mounting member 61. This helps to ensure the realization of the function of the buckle 6225 and ensures the reliability of the buckle 6225 structure.

[0223] It should be noted that, in another example, the snap-fit ​​portion 6223 on the rod 6211 can be a slot 6226, and the snap-fit ​​portion 6224 on the inner wall of the through hole 610 can be a buckle 6225. This application does not limit this. The buckle 6225 and the slot 6226 cooperate with each other to fasten and lock the mounting piece 61 and the fastener 621. Furthermore, this application does not limit the specific form of the buckle 6225 and the slot 6226. In one possible implementation, the buckle 6225 can be a ring of protrusions on the outer wall of the rod 6211 relative to other parts of the outer wall, or it can be one, two or more protrusions. Correspondingly, the slot 6226 is designed to cooperate with the specific form of the buckle 6225.

[0224] Please see Figure 9a and Figure 9b , Figure 9b This is a cross-sectional view of one implementation of the sealing structure in the second embodiment of the circuit board module of this application. Figure 9b This is a cross-sectional view of another implementation of the sealing structure in the second embodiment of the circuit board module of this application.

[0225] like Figure 9a , Figure 9bAs shown, in one possible implementation, the fastener 621 includes a sleeve portion 6214 with openings at both ends and a cover portion 6215. The cover portion 6215 is connected to one end of the sleeve portion 6214 and closes the opening at that end. The sleeve portion 6214 is fitted onto the outer wall surface of the mounting member 61. This can be understood as follows: the fastener 621 is configured as a sleeve with one end closed, including a sleeve portion 6214 and a cover portion 6215. The inner wall surface of the sleeve portion 6214 can be designed to fit with the outer wall surface of the mounting member 61, so that the fastener 621 can be fixedly connected to the mounting member 61. The cover portion 6215 is disposed on the end surface of the sleeve portion 6214 away from the cavity structure 40, and covers the through hole 610, and abuts against the end of the mounting member 61 away from the cavity structure 40. That is, the side surface of the cover portion 6215 near the cavity structure 40 and the end surface of the mounting member 61 away from the cavity structure 40 fit together, which can block the end of the through hole 610 away from the filling hole 323, so that the heat-conducting material 402 in the cavity structure 40 will not overflow from the through hole 610. It is understood that those skilled in the art can, according to actual production needs, provide a positioning groove 6213 on the end face of the cover portion 6215 away from the sleeve portion 6214, and this application does not impose any restrictions on this. It should be noted that the sleeve portion 6214 and the cover portion 6215 can be an integral structure or a separate structure.

[0226] Furthermore, the connection method between the fastener 621 and the mounting part 61 is not limited; it can be a snap-fit ​​connection or a threaded connection. For example... Figure 9a As shown, in one possible implementation, the inner wall surface of the sleeve portion 6214 is provided with an internal thread 6221, and the outer wall surface of the mounting member 61 is provided with an external thread 6222. The internal thread 6221 and the external thread 6222 are threadedly connected to each other so that the fastener 621 is threadedly connected to the mounting member 61.

[0227] like Figure 9bAs shown, in one possible implementation, the inner wall surface of the sleeve portion 6214 is provided with a snap-fit ​​portion 6223, and the outer wall surface of the mounting member 61 is provided with a snap-fit ​​portion 6224. The snap-fit ​​portion 6223 and the snap-fit ​​portion 6224 are snapped together so that the fastener 621 is snapped together with the mounting member 61. One of the snap-fit ​​portion 6223 and the snap-fit ​​portion 6224 is a buckle 6225, and the other is a slot 6226. In one example, a snap-fit ​​portion 6223 is provided at one end of the sleeve portion 6214 near the cavity structure 40. Correspondingly, a snap-fit ​​portion 6224 is provided on the outer wall surface of the mounting member 61 that mates with the snap-fit ​​portion 6223. Specifically, the portion of the sleeve portion 6214 near the cavity structure 40 protrudes to form a latch 6225, and the outer wall surface of the mounting member 61 corresponding to the latch is recessed inward relative to other areas to form a groove 6226, so that the fastener 621 is fastened onto the mounting member 61. It should be noted that in another example, the snap-fit ​​portion 6223 on the sleeve portion 6214 can be a groove 6226, and the snap-fit ​​portion 6223 on the outer wall surface of the mounting member 61 can be a latch 6225. This application does not limit this.

[0228] Furthermore, this application does not limit the specific form of the buckle 6225 and the slot 6226. In one possible implementation, the buckle 6225 can be a ring of protrusions, or one, two or more protrusions. Correspondingly, the slot 6226 is designed to fit the specific form of the buckle 6225.

[0229] Please see Figures 10a to 10d , Figure 10a This is a cross-sectional view of the first state of the sealing structure in the third embodiment of the circuit board module of this application; Figure 10b This is a cross-sectional view of the sealing structure in the second state of the third embodiment of the circuit board module in this application. Figure 10c This is a cross-sectional schematic diagram of another structure of the elastic body of the sealing structure in the third embodiment of the circuit board module of this application; Figure 10d This is a cross-sectional schematic diagram of another structure of the elastic body of the sealing structure in the third embodiment of the circuit board module of this application.

[0230] like Figure 10a and Figure 10b As shown, in one possible implementation, the plugging component 62 includes an elastic body 623, which is disposed within the through hole 610. With this structure, because the elastic body 623 itself has a certain amount of elastic deformation, it can be inserted into the through hole 610 of the mounting component 61 with the aid of external force during installation, facilitating assembly. It should be noted that this application does not limit the specific material and structure of the elastic body 623. In one possible implementation, such as... Figure 10cAs shown, the elastomer 623 is designed as a small rubber ball. Utilizing the elastic deformation capability of the rubber material, it is inserted into the through hole 610 of the mounting part 61 by external force, thereby achieving the purpose of sealing after assembly.

[0231] Understandably, in order to prevent the elastomer 623 from freely entering and exiting the through hole 610 on the mounting member 61, in one possible implementation, the through hole 610 of the mounting member 61 is set as a stepped structure, specifically including a first through hole portion 613 and a second through hole portion 614 that are connected and interconnected. The end of the second through hole portion 614 away from the first through hole portion 613 constitutes one end of the through hole 610, and the end of the first through hole portion 613 away from the second through hole portion 614 constitutes the other end of the through hole 610. The elastomer 623 is located in the second through hole portion 614 and can move within the second through hole portion 614 so as to switch between the position of blocking the filling hole 323 and the position of blocking the through hole 610.

[0232] In one example, the diameter of the first through-hole portion 613 is smaller than that of the second through-hole portion 614, and the projection of the first through-hole portion 613 on the second sub-circuit board 32 along the thickness direction Z1 of the circuit board module is covered by the second through-hole portion 614. In this case, the elastic body 623 inside the second through-hole portion 614 needs to be subjected to a large force to be squeezed out from the first through-hole portion 613. This force is often not provided by the circuit board module itself. Therefore, in this form, the stability of the elastic body 623 in sealing the overflowing thermal conductive material 402 at the filling hole 323 can be ensured. Specifically, the shape of the first through-hole portion 613 can be the same as or different from that of the second through-hole portion 614. This application does not limit this.

[0233] Furthermore, during the sealing process of the thermally conductive material 402, the elastomer 623 exists in two states. The first state (see...) Figure 10a Under its own weight, the elastomer 623 elastically presses against the wall of the filling hole 323, sealing the filling hole 323 at the first position shown in the figure to prevent the heat-conducting material 402 from overflowing. In the second state (see...), Figure 10bDuring this process, the thermally conductive material 402 may partially overflow from the filling hole 323. Simultaneously, the elastic body 623, under the buoyancy and impact of the thermally conductive material 402, moves to the second position shown in the figure. That is, the elastic body 623 moves from the filling hole 323 to the first through-hole portion 613, where it elastically compresses against the wall of the second through-hole portion 614 away from the cavity structure 40. This seals the through-hole 610 on the mounting component 61, preventing the thermally conductive material 402 from overflowing. It should be noted that the first and second positions can be switched under specific conditions. This is because the thermally conductive material 402 is easily deformed after slight heating and stress, potentially causing some of it to overflow and fill the filling hole 323. Accordingly, the sealing structure 6 switches from the first state to the second state, fully considering the reliability of the sealing structure 6 itself and providing sufficient safety space for the deformation of the thermally conductive material 402 and the sealing structure 6.

[0234] like Figure 10a and Figure 10b As shown, in one possible implementation, the plugging component 62 may further include a magnetic component 6231, which is enclosed within the elastic body 623. The magnetic component 6231 is made of a magnetic material or a metal material that can be attracted by a magnetic material. Those skilled in the art will understand that the magnetic component 6231 can be a small metal ball, a metal column, or a magnet; this application does not limit this.

[0235] It should be noted that, as Figure 10c and Figure 10d As shown, the plugging component 62 may also omit the magnetic attraction component; this application does not impose any restrictions on this. Figure 10d As shown, in one possible implementation, the elastomer 623 contains a magnetic material 6232 or a metal material 6233 that can be attracted by a magnetic material. With this structure, the magnetic material 6232 or the metal material 6233 in the elastomer 623 has a certain weight, which better achieves the first state of sealing the filling hole 323. On the other hand, the magnetic material 6232 or the metal material 6233 can be attracted by the production tool due to its magnetic properties, facilitating the gripping and installation of the elastomer 623 and meeting the goal of high efficiency in the terminal equipment production process.

[0236] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A circuit board module (200) for a terminal device (100), characterized in that, Includes a cavity structure (40), the cavity (401) of the cavity structure (40) is filled with a thermally conductive material (402), the wall of the cavity structure (40) is provided with a filling hole (323), and the cavity (401) is connected to the external space of the cavity structure (40) through the filling hole (323); The circuit board module (200) further includes a sealing structure (6), the sealing structure (6) comprising: Mounting component (61) is fixedly connected to the outside of the cavity structure (40) and covers the filling hole (323). The mounting component (61) has a through hole (610) in the area facing the filling hole (323) so that the filling hole (323) can communicate with the external space of the cavity structure (40) through the through hole (610). A plugging component (62) is disposed on the mounting component (61) and configured to: block the through hole (610), or switch between blocking the through hole (610) and blocking the filling hole (323), so that the filling hole (323) is not connected to the external space of the cavity structure (40) through the plugging structure (6).

2. The circuit board module (200) as described in claim 1, characterized in that, The mounting component (61) is fixedly connected to the outer side of the portion of the cavity structure (40) located around the filling hole (323) by welding.

3. The circuit board module (200) as described in claim 1, characterized in that, The plug (62) is detachably connected to the mounting (61).

4. The circuit board module (200) as described in claim 3, characterized in that, The plugging component (62) is configured as a fastener (621), which is snapped or threaded to the mounting component (61) and blocks the through hole (610).

5. The circuit board module (200) as described in claim 4, characterized in that, The fastener (621) includes a rod (6211) that passes through the through hole (610); wherein: The outer wall surface of the rod (6211) is provided with an external thread (6222), and the inner wall surface of the through hole (610) is provided with an internal thread (6221). The external thread (6222) and the internal thread (6221) are threadedly connected so that the fastener (621) is threadedly connected to the mounting part (61). Alternatively, the outer wall of the rod (6211) is provided with a snap-fit ​​part (6223), and the inner wall of the through hole (610) is provided with a snap-fit ​​part (6224). The snap-fit ​​part (6223) and the snap-fit ​​part (6224) are snapped together so that the fastener (621) is snapped together with the mounting part (61). In this case, one of the snap-fit ​​part (6223) and the snap-fit ​​part (6224) is a buckle (6225), and the other is a slot (6226).

6. The circuit board module (200) as described in claim 5, characterized in that, The fastener (621) has a positioning groove (6213) at the end away from the cavity structure (40).

7. The circuit board module (200) as described in claim 6, characterized in that, The fastener (621) further includes a head (6212), one end of which is connected to the end of the rod (6211) away from the cavity structure (40), and the head (6212) protrudes from the outer wall surface of the rod (6211), and the other end of the head (6212) is recessed inward to form the positioning groove (6213); And / or, the entire rod portion (6211) is located outside the filling hole (323).

8. The circuit board module (200) as described in claim 4, characterized in that, The fastener (621) includes a sleeve portion (6214) with openings at both ends and a cover portion (6215). The cover portion (6215) is connected to one end of the sleeve portion (6214) and closes the opening at that end. The sleeve portion (6214) is fitted onto the outer wall surface of the mounting member (61) and is snapped or threaded to the mounting member (61). The cover portion (6215) is located at the end of the mounting member (61) away from the cavity structure (40) and covers the through hole (610).

9. The circuit board module (200) as described in claim 8, characterized in that, The inner wall of the sleeve (6214) is provided with an internal thread (6221), and the outer wall of the mounting part (61) is provided with an external thread (6222). The internal thread (6221) and the external thread (6222) are threadedly connected to each other so that the fastener (621) is threadedly connected to the mounting part (61). Alternatively, the inner wall of the sleeve portion (6214) is provided with a snap-fit ​​portion (6223), and the outer wall of the mounting member (61) is provided with a snap-fit ​​portion (6224). The snap-fit ​​portion (6223) and the snap-fit ​​portion (6224) are snapped together so that the fastener (621) is snapped together with the mounting member (61). In this case, one of the snap-fit ​​portion (6223) and the snap-fit ​​portion (6224) is a buckle (6225), and the other is a slot (6226).

10. The circuit board module (200) as described in claim 8, characterized in that, The cover (6215) abuts against the end of the mounting member (61) away from the cavity structure (40) to close the end of the through hole (610) away from the filling hole (323); The end face of the cover (6215) away from the sleeve (6214) is recessed inward to form a positioning groove (6213).

11. The circuit board module (200) as described in claim 3, characterized in that, The plugging member (62) includes an elastic body (623), which is disposed in the through hole (610) of the mounting member (61); The elastomer (623) is configured to be switchable between a first position and a second position relative to the mounting member (61). When the elastomer (623) is in the first position, the elastomer (623) elastically presses against the wall of the filling hole (323) to block the filling hole (323). When the elastomer (623) is in the second position, the elastomer (623) elastically presses against the wall of the end of the through hole (610) away from the cavity structure (40) to block the through hole (610).

12. The circuit board module (200) as described in claim 11, characterized in that, The elastomer (623) contains a magnetic material (6232) or a metallic material (6233) that can be adsorbed by the magnetic material.

13. The circuit board module (200) as described in claim 11, characterized in that, The plugging component (62) further includes a magnetic attraction component (6231), which is enclosed within the elastic body (623). The magnetic attraction component (6231) is made of a magnetic material or a metal material that can be attracted by a magnetic material.

14. The circuit board module (200) as described in claim 1, characterized in that, The orthographic projection of the through hole (610) on the cavity structure (40) is entirely located within the filling hole (323), or the orthographic projection of the through hole (610) on the cavity structure (40) completely coincides with the filling hole (323); The mounting component (61) is configured as a cylindrical structure.

15. The circuit board module (200) as described in claim 1, characterized in that, The thermally conductive material (402) is a paste-like thermally conductive material.

16. The circuit board module (200) as described in claim 1, characterized in that, The circuit board module (200) also includes a first shield (52), which is disposed outside the cavity structure (40) and on the same side as the sealing structure (6); The height of the sealing structure (6) is less than or equal to the height of the first shielding cover (52).

17. The circuit board module (200) as described in claim 1, characterized in that, The circuit board module (200) further includes a heat source (33), the heat source (33) including at least one electronic component (330), wherein: The heat source (33) is installed in the cavity structure (40), and the heat source (33) is entirely wrapped in the thermally conductive material (402) or thermally coupled to the thermally conductive material (402) through the wall of the cavity structure (40). Alternatively, a part of the heat source (33) is wrapped in the thermally conductive material (402), and another part is thermally coupled to the thermally conductive material (402) through the wall of the cavity structure (40).

18. The circuit board module (200) as described in claim 17, characterized in that, The at least one electronic component (330) of the heat source (33) includes a chip, which includes any one or more of a central processing unit, an image processor, a charging chip, a system-on-a-chip, and a general-purpose flash memory chip.

19. The circuit board module (200) as described in any one of claims 1-18, characterized in that, The circuit board module (200) further includes a first sub-circuit board (31), a frame plate (4), and a second sub-circuit board (32) stacked sequentially along the thickness direction Z1 of the circuit board module. The frame plate (4) is configured as a hollow frame structure, such that the first sub-circuit board (31), the second sub-circuit board (32), and the frame plate (4) surround to form the cavity structure (40). The filling hole (323) is disposed on the second sub-circuit board (32) or the frame plate (4). The second sub-circuit board (32) or the frame plate (4) is provided with: a vent hole (324) spaced apart from the filling hole (323). When the circuit board module (200) further includes a heat source (33), the heat source (33) is entirely mounted on the side surface of the first sub-circuit board (31) facing or away from the second sub-circuit board (32), or a part of the heat source (33) is mounted on the side surface of the first sub-circuit board (31) facing the second sub-circuit board (32), and another part is mounted on the side surface of the first sub-circuit board (31) away from the second sub-circuit board (32); When the circuit board module (200) further includes a first shield (52), the first shield (52) is integrally mounted on the side surface of the second sub-circuit board (32) facing away from the first sub-circuit board (31).

20. A terminal device (100), characterized in that, Includes the circuit board module (200) according to any one of claims 1-19.

21. The terminal device (100) as described in claim 20, characterized in that, The terminal device (100) also includes a housing (2), and the circuit board module (200) is fixedly connected to the housing (2); When the circuit board module (200) includes a first sub-circuit board (31), a second sub-circuit board (32), and a frame board (4), the circuit board module (200) is installed in the housing (2) through the first sub-circuit board (31). The first sub-circuit board (31) and the second sub-circuit board (32) are both PCB boards. The first sub-circuit board (31) is an application processor board, and the second sub-circuit board (32) is an radio frequency board.

Images