Circuit board group and electronic equipment

Abstract

The utility model discloses a circuit board group and electronic equipment. The circuit board group comprises a circuit board, the circuit board is provided with a heat source area and a ground network area, the ground network area is located on the peripheral side of the heat source area, the heat source area is provided with a plurality of first bonding pads, the ground network area is provided with a first welding group, and the first welding group comprises a plurality of second bonding pads; the adhesive part covers the first welding group; the circuit board is provided with a glue isolating part which is located between the ground network area and the heat source area and used for preventing glue from overflowing to the heat source area from the glue adhering part.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, specifically relating to a circuit board assembly and an electronic device. Background Technology

[0002] Electronic devices include circuit boards, which have heat source areas, and corresponding electronic components such as central processing units or chips.

[0003] In related technologies, localized dispensing of adhesive onto circuit boards is used to enhance their resistance to mechanical stress. The adhesive used for dispensing is fluid, with an irregular flow pattern, and some adhesive may flow into heat source areas. Taking the central processing unit (CPU) as an example, as the performance of electronic devices continues to improve, the CPU's operating load is also increasing, with power consumption gradually rising to tens or even hundreds of watts. Uneven heating of the CPU leads to temperature differences. The inconsistent thermal expansion and contraction of the circuit board, adhesive, solder balls, and other materials in the heat source area, coupled with their mutual constraints, generates thermal stress. Repeated temperature fluctuations and resulting thermal fatigue can cause problems such as solder ball breakage in the CPU, leading to malfunctions in the electronic device. Utility Model Content

[0004] This application aims to provide a circuit board assembly and electronic device that solves one of the problems in the related art, where adhesive overflows onto the heat source area of ​​the circuit board, causing the solder balls of the electronic components in the heat source area to easily break as the electronic device is used for a longer period of time, resulting in malfunction of the electronic device.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, embodiments of this application propose a circuit board assembly, comprising: a circuit board having a heat source area and a ground network area, the ground network area being located around the heat source area, the heat source area having a plurality of first pads, the ground network area having a first solder group, the first solder group including a plurality of second pads; an adhesive portion covering the first solder group; and an adhesive separator portion being provided on the circuit board, the adhesive separator portion being located between the ground network area and the heat source area, the adhesive separator portion being used to prevent adhesive from overflowing from the adhesive portion into the heat source area.

[0007] In a second aspect, embodiments of this application provide an electronic device, including: the circuit board assembly described in the first aspect.

[0008] In embodiments of this application, the circuit board assembly includes a circuit board and an adhesive portion.

[0009] The circuit board has a heat source area and a ground network area. The heat source area corresponds to the electronic components of the electronic device (such as central processing unit, neural network processor, modem and image controller, etc.).

[0010] The heat source area has multiple first solder pads, and the ground network area has a first solder group, which includes multiple second solder pads. Adhesive covers the first solder group in the ground network area to enhance the circuit board assembly's resistance to mechanical stress and reduce the probability of circuit board assembly damage.

[0011] The circuit board features an adhesive separator located between the ground network area and the heat source area, effectively separating them. This separator prevents adhesive from overflowing from the ground network area into the heat source area, indirectly defining the shape of the adhesive portion. While meeting the application requirements for localized adhesive application on the circuit board, it ensures the regularity of the adhesive portion shape, balancing the circuit board's resistance to thermal and mechanical stresses. This reduces the risk of thermal creep in the solder balls of electronic components in the heat source area, lowers the probability of thermal fatigue caused by repeated temperature fluctuations, and ultimately ensures the lifespan of the circuit board, improving its effectiveness and reliability.

[0012] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0013] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0014] Figure 1 This is a schematic diagram of the circuit board structure according to the first embodiment of this application;

[0015] Figure 2 for Figure 1 A magnified view of part A on the circuit board shown;

[0016] Figure 3 for Figure 2 The diagram shows a partial structural schematic of the circuit board.

[0017] Figure 4 for Figure 1 A magnified view of part B on the circuit board shown.

[0018] Figure 5 for Figure 1 A magnified view of part C on the circuit board shown;

[0019] Figure 6 for Figure 1 A magnified view of part D on the circuit board shown;

[0020] Figure 7 for Figure 1 A magnified view of part E on the circuit board shown;

[0021] Figure 8 This is a schematic diagram of the circuit board assembly according to the first embodiment of this application;

[0022] Figure 9 This is a schematic diagram of the circuit board assembly according to the second embodiment of this application;

[0023] Figure 10 This is a schematic diagram of the circuit board assembly according to the third embodiment of this application;

[0024] Figure 11 This is a schematic diagram of the circuit board assembly according to the fourth embodiment of this application;

[0025] Figure 12 This is a schematic diagram of the circuit board assembly according to the fifth embodiment of this application;

[0026] Figure 13 This is a schematic diagram of the circuit board assembly according to the sixth embodiment of this application;

[0027] Figure 14 This is a schematic diagram of the circuit board assembly according to the seventh embodiment of this application;

[0028] Figure 15 This is a schematic diagram of the circuit board assembly according to the eighth embodiment of this application;

[0029] Figure 16 This is a schematic diagram of the circuit board assembly according to the ninth embodiment of this application;

[0030] Figure 17 This is a schematic diagram of the circuit board assembly according to the tenth embodiment of this application;

[0031] Figure 18 This is a schematic diagram of the circuit board assembly according to the eleventh embodiment of this application;

[0032] Figure 19 This is a schematic diagram of the circuit board assembly according to the twelfth embodiment of this application;

[0033] Figure 20 This is a schematic diagram of the circuit board assembly according to the thirteenth embodiment of this application.

[0034] Figure label:

[0035] Figures 1 to 20 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0036] 10 Circuit board group, 100 Circuit board, 110 Heat source area, 112 First pad, 120 Ground network area, 122 First solder group, 1222 Second pad, 130 Adhesive part, 132 Second solder group, 1322 Fourth pad, 134 Fifth pad, 136 First adhesive groove, 138 Second adhesive groove, 140 Third pad, 200 Adhesive part, 22 Central processing unit, 23 Neural network processor, 24 Modem, 25 Image controller. Detailed Implementation

[0037] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0038] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0039] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0040] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] The following is in conjunction with the appendix Figures 1 to 20 This application describes the circuit board assembly 10 and electronic device provided in embodiments of the present application.

[0042] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 As shown, a circuit board assembly 10 according to some embodiments of this application includes: a circuit board 100 having a heat source region 110 and a ground network region 120, the ground network region 120 being located around the heat source region 110, the heat source region 110 having a plurality of first pads 112, the ground network region 120 having a first solder group 122, the first solder group 122 including a plurality of second pads 1222; an adhesive portion 200 covering the first solder group 122; and an adhesive barrier portion 130 located between the ground network region 120 and the heat source region 110, the adhesive barrier portion 130 being used to prevent adhesive from overflowing from the adhesive portion 200 into the heat source region 110.

[0043] In embodiments of this application, the circuit board assembly 10 includes a circuit board 100 and an adhesive portion 200.

[0044] The circuit board 100 has a heat source area 110 and a ground network area 120. The heat source area 110 corresponds to the electronic components of the electronic device (such as a central processing unit 22, a neural network processor 23, a modem 24, and an image controller 25, etc.).

[0045] The heat source area 110 is provided with multiple first solder pads 112, and the ground network area 120 is provided with a first solder group 122, which includes multiple second solder pads 1222. The adhesive part 200 covers the first solder group 122 of the ground network area 120 to enhance the resistance of the circuit board assembly 10 to mechanical stress and reduce the probability of damage to the circuit board assembly 10.

[0046] The circuit board 100 is provided with an adhesive separator 130, which is located between the ground network area 120 and the heat source area 110. That is, the adhesive separator 130 serves to separate the ground network area 120 and the heat source area 110. The adhesive separator 130 prevents the adhesive portion 200 in the ground network area 120 from overflowing into the heat source area 110, and can indirectly limit the shape of the adhesive portion 200. While meeting the application requirements of localized adhesive application on the circuit board 100, it ensures the regularity of the shape of the adhesive portion 200, taking into account both the thermal stress resistance and mechanical stress resistance of the circuit board assembly 10. This reduces the risk of thermal creep of the solder balls of electronic components in the heat source area 110, lowers the probability of thermal fatigue caused by repeated temperature changes in the electronic components in the heat source area 110, and thus reduces the probability of electronic component failure. This ensures the service life of the circuit board assembly 10 and improves the effectiveness and reliability of its use.

[0047] Understandably, the multiple first pads 112 of the heat source area 110 are used to connect electronic components of the electronic device.

[0048] Understandably, the adhesive separator 130 serves to prevent adhesive from overflowing from the adhesive portion 200 of the ground network region 120 into the heat source region 110. When the adhesive portion 200 avoids the heat source region 110, the maximum value of thermal creep of the solder balls of the electronic components in the heat source region 110 will be reduced accordingly.

[0049] Optionally, there are multiple heat source areas 110, ground network areas 120, adhesive parts 200, and insulating parts 130, with each heat source area 110 cooperating with one ground network area 120, one adhesive part 200, and one insulating part 130. Each heat source area 110 corresponds to one electronic component.

[0050] In some embodiments, the separator portion 130 extends circumferentially along the ground network region 120.

[0051] In this embodiment, the mating structure of the separator 130 and the ground network area 120 is further defined.

[0052] The adhesive separator 130 extends circumferentially along the ground network area 120, thus defining the extension direction of the adhesive separator 130. The shape of the adhesive separator 130 is adapted to the shape of the ground network area 120. In this way, the path of adhesive overflow from the adhesive portion 200 of the ground network area 120 to the heat source area 110 can be blocked from multiple directions and angles, effectively preventing adhesive overflow from the adhesive portion 200 of the ground network area 120 to the heat source area 110.

[0053] Since the adhesive part 200 is located in the ground network area 120, by limiting the extension direction of the adhesive-isolating part 130, the extension direction of the adhesive-isolating part 130 can be adapted to the shape of the ground network area 120, thus fundamentally solving the problem of adhesive overflow from the adhesive part 200 to the heat source area 110.

[0054] In some embodiments, the insulating portion 130 is disposed around the heat source region 110 and is located between the heat source region 110 and the ground network region 120.

[0055] In this embodiment, the mating structure of the separator 130 and the ground network area 120 is further defined.

[0056] The insulating portion 130 surrounds the heat source region 110 and the ground network region 120. That is, the insulating portion 130 is disposed around the heat source region 110 and is located between the heat source region 110 and the ground network region 120. For example, the insulating portion 130 has a ring structure. The insulating portion 130 is disposed around the heat source region 110 and is adapted to the shape of the ground network region 120.

[0057] This arrangement allows the adhesive portion 130 to seal the adhesive portion 200 of the ground network area 120 from all directions and angles, preventing the adhesive portion 200 from overflowing into the heat source area 110.

[0058] In some embodiments, such as Figure 1 and Figure 11 As shown, there are multiple first welding groups 122 and adhesive parts 200, and each adhesive part 200 is paired with a first welding group 122; the ground network area 120 is also provided with multiple third pads 140, and at least one third pad 140 is provided between any two adjacent first welding groups 122.

[0059] In this embodiment, the structure of the circuit board 100 is further defined.

[0060] There are multiple first welding groups 122 and multiple adhesive parts 200. Each adhesive part 200 mates with one first welding group 122. That is, each adhesive part 200 covers one first welding group 122.

[0061] The ground network area 120 is also provided with a plurality of third pads 140, and at least one third pad 140 is provided between any two adjacent first solder groups 122. That is, two adjacent first solder groups 122 are separated by at least one third pad 140. The adhesive portion 200 is not covered at the third pad 140.

[0062] In other words, the adhesive can be applied in sections according to the specific actual needs of use. While ensuring the mechanical stress resistance of the circuit board assembly 10, the amount of adhesive applied to the adhesive section 200 can be reduced, which helps to reduce the production cost of the circuit board assembly 10.

[0063] In some embodiments, the first welding group 122 covers the ground network area 120.

[0064] In this embodiment, the structure of the circuit board 100 is further defined.

[0065] The first welding group 122 covers the ground network area 120. The adhesive part 200 covers the first welding group 122. That is, according to the specific actual use requirements, the ground network area 120 is fully coated with adhesive.

[0066] In some embodiments, there are multiple ground network areas 120, adhesive portions 200, and separator portions 130, with each ground network area 120 cooperating with an adhesive portion 200 and a separator portion 130.

[0067] In this embodiment, the structure of the circuit board assembly 10 is further defined.

[0068] There are multiple ground network areas 120, multiple adhesive parts 200, and multiple insulating parts 130. Each ground network area 120 is paired with one adhesive part 200 and one insulating part 130. For example, one heat source area 110 is paired with multiple ground network areas 120, and each ground network area 120 is paired with one adhesive part 200 and one insulating part 130. That is, it realizes segmented adhesive dispensing and can also effectively prevent adhesive from the adhesive part 200 of each ground network area 120 from overflowing into the heat source area 110.

[0069] In some embodiments, such as Figure 1 , Figure 2 and Figure 3 As shown, the separator 130 includes a plurality of spaced second welding groups 132, each second welding group 132 including a plurality of fourth welding pads 1322; in each second welding group 132, the plurality of fourth welding pads 1322 are welded together.

[0070] In this embodiment, the structure of the separator portion 130 is further defined.

[0071] The separator 130 includes a plurality of second welding groups 132, which are arranged at intervals. Each second welding group 132 includes a plurality of fourth solder pads 1322, and the plurality of fourth solder pads 1322 in each second welding group 132 are welded together.

[0072] For example, when the second welding group 132 includes two fourth pads 1322, the two fourth pads 1322 are welded together.

[0073] For example, when the second welding group 132 includes three fourth pads 1322, the three fourth pads 1322 are welded together.

[0074] For example, when the second welding group 132 includes four fourth welding pads 1322, the four fourth welding pads 1322 are connected by a welding machine.

[0075] When multiple fourth pads 1322 are soldered together, solder will fill between the multiple fourth pads 1322. The solder and the multiple fourth pads 1322 form a barrier to prevent the adhesive portion 200 of the ground network area 120 from overflowing into the heat source area 110.

[0076] In some embodiments, any two adjacent second welding groups 132 are welded together.

[0077] In this embodiment, the mating structure of a plurality of second welding groups 132 is further defined.

[0078] Any two adjacent second welding groups 132 are welded together. That is, multiple second welding groups 132 are connected as a whole by solder. In other words, the solder and multiple second welding groups 132 form a continuous barrier, which is located between the ground network area 120 and the heat source area 110, and can effectively prevent the adhesive portion 200 of the ground network area 120 from overflowing into the heat source area 110.

[0079] In some embodiments, such as Figure 1 and Figure 2 As shown, the separator 130 also includes a plurality of fifth solder pads 134, and at least one fifth solder pad 134 is provided between any two adjacent second solder groups 132.

[0080] In this embodiment, the structure of the separator portion 130 is further defined.

[0081] The adhesive separation section 130 includes multiple second solder groups 132 and multiple fifth solder pads 134. At least one fifth solder pad 134 is provided between any two adjacent second solder groups 132, and multiple fourth solder pads 1322 of each second solder group 132 are soldered together. Any two adjacent second solder groups 132 are disconnected through at least one fifth solder pad 134. This arrangement can both prevent adhesive from overflowing from the adhesive section 200 of the ground network area 120 to the heat source area 110, and reduce the difficulty of subsequent repair and maintenance of the circuit board assembly 10, thereby reducing the repair and maintenance costs of the circuit board assembly 10.

[0082] In some embodiments, such as Figure 1 , Figure 2 and Figure 3 As shown, the adhesive separation section 130 also includes a first adhesive separation groove 136, which is located between the plurality of second welding groups 132 and the heat source area 110.

[0083] In this embodiment, the structure of the separator portion 130 is further defined.

[0084] The adhesive separation section 130 also includes a first adhesive separation groove 136, which is located between the plurality of second welding groups 132 and the heat source area 110. That is, the first adhesive separation groove 136 is located between each second welding group 132 and the heat source area 110. The first adhesive separation groove 136 cooperates with the plurality of second welding groups 132 to achieve a double barrier function, which can improve the effect of preventing adhesive from overflowing from the adhesive section 200 of the ground network area 120 to the heat source area 110.

[0085] Optionally, a portion of the circuit board 100 is recessed to form a first adhesive sealant groove 136. Specifically, the first adhesive sealant groove 136 is formed by removing a portion of the substrate of the circuit board 100.

[0086] In some embodiments, such as Figure 9 As shown, the portion of the circuit board 100 located between the heat source region 110 and the ground network region 120 is the insulating portion 130; the width of the insulating portion 130 along the heat source region 110 to the ground network region 120 is denoted as d1, and the diameter of the second pad 1222 is denoted as d2, wherein d2≤d1≤2×d2.

[0087] In this embodiment, the structure of the separator portion 130 is further defined.

[0088] The portion of the circuit board 100 located between the heat source area 110 and the ground network area 120 is a separator 130. By defining the relationship between the width of the separator 130 and the diameter of the second pad 1222, the width d1 of the separator 130 and the diameter d2 of the second pad 1222 satisfy d2≤d1≤2×d2, that is, the width of the separator 130 is increased. The portion of the circuit board 100 located between the heat source area 110 and the ground network area 120 serves to prevent the adhesive portion 200 of the ground network area 120 from overflowing into the heat source area 110.

[0089] Alternatively, d1 = 1.2 × d2, d1 = 1.4 × d2, d1 = 1.5 × d2, and d1 = 1.8 × d2, etc., which will not be listed here.

[0090] In some embodiments, such as Figure 10 As shown, the adhesive separating part 130 is provided with a second adhesive separating groove 138.

[0091] In this embodiment, the structure of the separator portion 130 is further defined.

[0092] The adhesive separator 130 is provided with a second adhesive separator groove 138, which is located between the ground network area 120 and the heat source area 110. The width of the adhesive separator 130, combined with the second adhesive separator groove 138, serves as a double barrier, thereby improving the effect of preventing the adhesive portion 200 of the ground network area 120 from overflowing into the heat source area 110.

[0093] Optionally, a portion of the circuit board 100 is recessed to form a second adhesive sealant groove 138. Specifically, the second adhesive sealant groove 138 is formed by removing a portion of the substrate of the circuit board 100.

[0094] like Figure 11 As shown, in some other embodiments of this application, an electronic device is provided, including: a circuit board assembly 10 of any of the above embodiments.

[0095] In this application embodiment, the electronic device includes the circuit board group 10 of any of the above embodiments, and therefore has all the beneficial effects of the circuit board group 10, which will not be described one by one here.

[0096] Alternatively, the electronic device may be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop computer, a mobile computer, an augmented reality device (also known as an AR (Augmented Reality) device), a virtual reality device (also known as a VR (Virtual Reality) device), and a handheld game console, etc.

[0097] This application rationally designs the structure of the circuit board 100, ensuring the regularity of the dispensing shape while balancing the product's resistance to thermal and mechanical stresses, based on localized dispensing on the circuit board 100. This saves on the repeated dispensing adjustments on the production line, which helps extend the product's lifespan and improve its reliability.

[0098] Optionally, this application targets a full-sphere central processing unit 22. On the circuit board 100 (e.g., a printed circuit board 100), peanut-shaped pads are created using the pads adjacent to the heat source area 110 (i.e., a second solder group 132 is created using the pads adjacent to the heat source area 110), and combined with the first adhesive groove 136 as a barrier, the adhesive portion 200 is confined outside the heat source area 110. Here, the peanut-shaped pad refers to a fourth pad 1322 of multiple soldered connections.

[0099] Optionally, this application provides an isolation zone around the heat source area 110, which is the insulating part 130. The isolation zone is provided with a second insulating groove 138.

[0100] Optionally, the circuit board 100 has a heat source area 110 and a ground network area 120. The heat source area 110 is provided with a plurality of first solder pads 112, and the ground network area 120 is provided with a first solder group 122. An adhesive portion 200 covers the first solder group 122. The circuit board 100 also provides an adhesive separator 130, which is located between the ground network area 120 and the heat source area 110. The adhesive separator 130 includes second solder groups 132 arranged at intervals. The second solder groups 132 include a plurality of fourth solder pads 1322 that are soldered together. In this way, it does not affect the soldering and maintenance of the circuit board group 10, and can also act as a barrier. The adhesive separator 130 also includes a first adhesive separator groove 136, which is located between the plurality of second solder groups 132 and the heat source area 110.

[0101] This application can prevent adhesive from overflowing from the adhesive section 200 into the heat source area 110, thus reducing the risk of thermal creep of the solder balls of electronic components in the heat source area 110. When adhesive flows into the heat source area 110, it can significantly increase the thermal creep of the solder balls of electronic components.

[0102] like Figure 12 As shown in the first comparative example, when the adhesive portion 130 is located between the ground network area 120 and the heat source area 110, and the adhesive portion 200 completely covers the multiple second pads 1222 of the first solder group 122, the maximum thermal creep value of the first pad 112 of the heat source area 110 is 7.008E-04, and the thermal creep value of the first pad 112 closest to the adhesive portion 200 is 7.000E-12.

[0103] like Figure 13 As shown in the second comparative example, in the first solder group 122, the row of second pads 1222 closest to the heat source area 110 is designated as the first reference pad, and the remaining second pads 1222 are designated as the second reference pads. The adhesive portion 130 is located between the ground network area 120 and the heat source area 110, and the adhesive portion 200 completely covers the second reference pads, and also covers half of each first reference pad. The maximum thermal creep value of the first pad 112 in the heat source area 110 is 7.008E-04, and the thermal creep value of the first reference pad is 1.200E-11.

[0104] like Figure 14 As shown in the third comparative example, the multiple first pads 112 of the heat source region 110 are divided into multiple first reference pads and multiple second reference pads. A portion of the adhesive portion 200 overflows into the heat source region 110, completely covering the multiple first reference pads, but not covering the multiple second reference pads. The maximum thermal creep value of the first pads 112 in the heat source region 110 is 6.992E-04, and the thermal creep value of the first reference pads is 1.847E-04.

[0105] like Figure 15As shown in the fourth comparative example, the plurality of first pads 112 in the heat source region 110 are divided into a plurality of first reference pads and a plurality of second reference pads. A portion of the adhesive portion 200 overflows into the heat source region 110, and the adhesive portion 200 in the heat source region 110 covers half of each first reference pad, but does not cover the plurality of second reference pads. The maximum thermal creep value of the first pads 112 in the heat source region 110 is 7.009E-04, and the thermal creep value of the first reference pads is 4.702E-04.

[0106] As can be seen from the first, second, third, and fourth comparative examples, this application positions the insulating part 130 between the ground network area 120 and the heat source area 110, which can reduce the risk of thermal creep of the solder balls of the electronic components in the heat source area 110, reduce the probability of thermal fatigue caused by repeated temperature rises and falls of the electronic components in the heat source area 110, and thus ensure the service life of the circuit board assembly 10, and improve the effectiveness and reliability of the use of the circuit board assembly 10.

[0107] This application provides a reasonable structure for the circuit board assembly 10, which allows the adhesive portion 200 to avoid the heat source area 110. Depending on specific application requirements, adhesive can be applied to the ground network area 120 in sections or applied to the entire ground network area 120.

[0108] like Figure 16 As shown in the fifth comparative example, the circuit board assembly 10 is fully glued, the glued area of ​​the adhesive part 200 is 100%, the maximum drop stress of the solder balls of the circuit board assembly 10 is 179MPa, and the risk of mechanical stress cracking is low.

[0109] like Figure 17 As shown in the sixth comparative example, the adhesive is applied to part of the circuit board assembly 10. The adhesive part 200 covers two-thirds of the cross-sectional area of ​​the central processing unit 22 of the heat source area 110. The adhesive application area of ​​the adhesive part 200 is 45%. The maximum drop stress of the solder balls of the circuit board assembly 10 is 179 MPa, and the risk of mechanical stress cracking is low.

[0110] like Figure 18 As shown in the seventh comparative example, the adhesive is applied to part of the circuit board assembly 10. The adhesive part 200 covers half of the cross-sectional area of ​​the central processing unit 22 of the heat source area 110. The adhesive application area of ​​the adhesive part 200 is 25%. The maximum drop stress of the solder balls of the circuit board assembly 10 is 264 MPa, and the risk of mechanical stress cracking is medium to low.

[0111] like Figure 19As shown in the eighth comparative example, the circuit board assembly 10 is partially glued, the insulating part 130 is located between the ground network area 120 and the heat source area 110, the adhesive part 200 does not cover the central processing unit 22, the glued area of ​​the adhesive part 200 is 45%, the maximum drop stress of the solder balls of the circuit board assembly 10 is 180MPa, and the risk of mechanical stress cracking is low.

[0112] like Figure 20 As shown in the ninth comparative example, without adhesive, the maximum drop stress of the solder balls in circuit board group 10 is 429 MPa, indicating a high risk of mechanical stress cracking.

[0113] As can be seen from the fifth, sixth, seventh, eighth and ninth comparative examples, this application has reasonably designed the structure of the circuit board assembly 10, taking into account both the thermal stress resistance and mechanical stress resistance of the circuit board assembly 10.

[0114] An adhesive separator 130 surrounds the heat source area 110 and the ground network area 120. That is, an adhesive separator 130 is provided around the entire perimeter of the heat source area 110. The adhesive separator 130 has a second adhesive separator groove 138. The width of the adhesive separator 130 along the heat source area 110 to the ground network area 120 is denoted as d1, and the diameter of the second pad 1222 is denoted as d2, where d2≤d1≤2×d2. Specifically, the surface substrate of the circuit board 100 is cut away to form the second adhesive separator groove 138. This ensures that when adhesive is applied to the ground network area 120, the adhesive portion 200 will not overflow into the heat source area 110. Because the adhesive separator 130 surrounds the heat source area 110, even if a portion of the surface substrate of the circuit board 100 is removed, the impact on the mechanical stress of the circuit board assembly 10 is minimal.

[0115] An adhesive separator 130 surrounds the heat source area 110 and the ground network area 120. The adhesive separator 130 includes multiple spaced-apart second welding groups 132 and first adhesive grooves 136. Each second welding group 132 includes multiple fourth solder pads 1322 for welding connections. Adhesive can be applied to the entire ground network area 120 or only partially, depending on actual usage requirements. Full application means that the first welding groups 122 cover the entire ground network area 120, and the adhesive portion 200 covers the first welding groups 122. Partial application means that there are multiple first welding groups 122 and multiple adhesive portions 200, with each adhesive portion 200 cooperating with one first welding group 122. The ground network area 120 also has multiple third solder pads 140, with at least one third solder pad 140 positioned between any two adjacent first welding groups 122.

[0116] Optionally, such as Figure 12 , Figure 13 , Figure 14 , Figure 15 , Figure 19 and Figure 20In the circuit board assembly 10, the electronic components connected to the heat source area 110 include a central processing unit 22, a neural network processor 23, a modem 24, and an image controller 25.

[0117] Figures 12 to 15 In this context, MAX refers to the region with the highest temperature.

[0118] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0119] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that, include: A circuit board having a heat source area and a ground network area, the ground network area being located around the heat source area, the heat source area having a plurality of first pads, and the ground network area having a first solder group, the first solder group including a plurality of second pads; The adhesive portion covers the first welding assembly; The circuit board is provided with an adhesive separator, which is located between the ground network area and the heat source area. The adhesive separator is used to prevent the adhesive from overflowing into the heat source area.

2. The circuit board assembly according to claim 1, characterized in that, The insulating portion extends circumferentially along the ground network area.

3. The circuit board assembly according to claim 2, characterized in that, The insulating portion is disposed around the heat source area and is located between the heat source area and the ground network area.

4. The circuit board assembly according to claim 3, characterized in that, There are multiple first welding groups and multiple adhesive parts, each adhesive part cooperating with one first welding group. The ground network area is also provided with multiple third pads, and at least one third pad is provided between any two adjacent first welding groups; or The first welding group covers the ground network area.

5. The circuit board assembly according to claim 2, characterized in that, There are multiple ground network areas, adhesive portions, and separator portions, with each ground network area cooperating with one adhesive portion and one separator portion.

6. The circuit board assembly according to any one of claims 1 to 5, characterized in that, The insulating portion includes a plurality of spaced-apart second welding groups, each of which includes a plurality of fourth welding pads; In each of the second welding groups, multiple fourth pads are welded together.

7. The circuit board assembly according to claim 6, characterized in that, Any two adjacent second welding groups are welded together.

8. The circuit board assembly according to claim 6, characterized in that, The insulating part also includes a plurality of fifth solder pads, with at least one of the fifth solder pads disposed between any two adjacent second solder groups.

9. The circuit board assembly according to claim 6, characterized in that, The separator also includes: A first diaphragm groove is located between the plurality of second welding groups and the heat source area.

10. The circuit board assembly according to any one of claims 2 to 5, characterized in that, The portion of the circuit board located between the heat source area and the ground network area is the insulating part; Along the heat source area to the ground network area, the width of the insulating part is denoted as d1, and the diameter of the second pad is denoted as d2, where d2≤d1≤2×d2.

11. The circuit board assembly according to claim 10, characterized in that, The separator section is provided with a second separator groove.

12. An electronic device, characterized in that, include: The circuit board assembly as described in any one of claims 1 to 11.

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