Impact-resistant circuit board

Abstract

The utility model provides an anti-impact circuit board, which comprises a substrate, a plurality of electronic elements and a flexible protective layer, and is characterized in that the plurality of electronic elements are arranged on the substrate at intervals; the flexible protection layer covers the electronic components, and the flexible protection layer passes through a gap between two adjacent electronic components and is fixedly connected with the substrate. Through the arrangement of the flexible protection layer, on one hand, the electronic component is covered by the flexible protection layer, the flexible protection layer is fixedly connected to the substrate, and a force facing the substrate is provided for the electronic component through the flexible protection layer, so that the resultant force of the electronic component along with the substrate in the acceleration process is increased; therefore, the electronic component can do accelerated motion along with the substrate, the speed difference between the substrate and the electronic component is prevented, and the purpose of preventing the electronic component from falling off is achieved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to an impact-resistant circuit board. Background Technology

[0002] In artillery shell weapon systems, the control circuit board is a key component for realizing core functions such as precise guidance and detonation control of the shell. Its operational stability directly determines the combat effectiveness and operational safety of the shell. With the continuous development of shell launching technology, higher requirements are placed on the control circuit board's ability to withstand harsh environments, especially its shock resistance.

[0003] In existing technologies, conventional artillery shell control circuit boards mostly employ traditional electronic component soldering assembly methods, where electronic components such as resistors, capacitors, and chips are fixed to the surface of the circuit board substrate using processes such as soldering. However, during the firing of an artillery shell, the combustion of propellant inside the barrel generates instantaneous high-intensity impact loads, which are transmitted to the circuit board and its surface electronic components in the form of vibrations. Because conventional circuit boards do not employ targeted impact-resistant protection measures, the solder joints between electronic components and the circuit board substrate are prone to fatigue damage or even direct breakage under impact vibrations, causing electronic components to fall off the circuit board surface.

[0004] The malfunction of electronic components due to vibration can cause control circuit boards to fail. This can range from minor issues like projectiles deviating from their intended trajectory or detonation timing being off-target, to more serious problems like misfires or accidental detonations. These issues not only severely impact the completion of combat missions but also pose safety hazards to operators and the surrounding environment. Although the industry has attempted to improve this issue by optimizing welding processes and using high-strength welding materials, the extreme impact loads of projectile launch mean that existing solutions cannot effectively prevent the risk of electronic components falling during launch, and thus fail to meet the reliability requirements of projectile control circuit boards.

[0005] In conclusion, there is an urgent need for an impact-resistant circuit board to solve, or at least partially solve, the problems existing in the prior art. Utility Model Content

[0006] The purpose of this utility model is to provide an impact-resistant circuit board, which aims to solve the problem that electronic components on existing circuit boards detach due to severe impacts during use. The specific technical solution is as follows:

[0007] An impact-resistant circuit board includes a substrate, electronic components, and a flexible protective layer. Multiple electronic components are arranged on the substrate at intervals. The flexible protective layer covers the arrangement of electronic components and passes through the gap between two adjacent electronic components and is fixedly connected to the substrate.

[0008] It also includes a first protective layer and a second protective layer. The first protective layer covers both the substrate and the electronic components. The first protective layer is located between the substrate and the flexible protective layer. The flexible protective layer is fixedly connected to the substrate through the first protective layer.

[0009] The second protective layer covers the flexible protective layer and completely covers the arrangement of electronic components;

[0010] The second protective layer is a foamed polyurethane layer.

[0011] Furthermore, the flexible protective layer covers the electronic components from the direction of the electronic components toward the substrate, and the flexible protective layer is fixedly connected to the substrate at the edge of the electronic components.

[0012] Specifically, the flexible protective layer is made of silicone rubber or fluororubber; the thickness of the flexible protective layer is between 0.3 mm and 0.5 mm.

[0013] Furthermore, the first protective layer is a conformal coating.

[0014] Specifically, the thickness of the first protective layer is between 25 micrometers and 40 micrometers.

[0015] Furthermore, the top surface of the second protective layer away from the substrate is arranged in a planar shape, and the side of the second protective layer close to the substrate is provided with a receiving groove corresponding to the electronic component. The electronic component and the flexible protective layer corresponding to the electronic component are both embedded in the receiving groove.

[0016] Specifically, the thickness of the second protective layer is between 4 mm and 8 mm.

[0017] Furthermore, mounting holes are provided on the substrate, and the mounting holes are arranged through the substrate along the thickness direction of the substrate, while the second protective layer is arranged to avoid the mounting holes.

[0018] The application of the technical solution of this utility model has the following beneficial effects:

[0019] By setting a flexible protective layer, the electronic components are covered and fixedly connected to the substrate. The flexible protective layer provides a force to the electronic components toward the substrate, which increases the resultant force of the electronic components and the substrate during the acceleration process. This allows the electronic components to accelerate together with the substrate, preventing a speed difference between the substrate and the electronic components, thereby preventing the electronic components from falling off.

[0020] In addition to the objectives, features, and advantages described above, this utility model has other objectives, features, and advantages. These will be described below with reference to... Figures 1-4 The present invention will be described in further detail below. Attached Figure Description

[0021] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0022] Figure 1 This is a schematic diagram of the overall structure of an impact-resistant circuit board according to this utility model;

[0023] Figure 2 This is one of the internal structural diagrams of an impact-resistant circuit board according to this utility model;

[0024] Figure 3 This is the second schematic diagram of the internal structure of an impact-resistant circuit board according to this utility model;

[0025] Figure 4 yes Figure 3 A magnified view of point A in the middle.

[0026] Among them, 1. substrate; 11. mounting hole; 12. receiving groove; 2. electronic component; 3. flexible protective layer; 4. first protective layer; 5. second protective layer; 51. top surface. Detailed Implementation

[0027] To facilitate understanding of this invention, a more comprehensive description is provided below, along with preferred embodiments. However, this invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this invention.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0029] Example:

[0030] See also Figures 1-4This embodiment provides an impact-resistant circuit board, including a substrate 1, electronic components 2, and a flexible protective layer 3. Multiple electronic components 2 are arranged on the substrate 1 at intervals. The flexible protective layer 3 covers the arrangement of the electronic components 2 and passes through the gap between two adjacent electronic components 2, and is fixedly connected to the substrate 1. It also includes a first protective layer 4 and a second protective layer 5. The first protective layer 4 covers both the substrate 1 and the electronic components 2, and is located between the substrate 1 and the flexible protective layer 3. The flexible protective layer 3 is fixedly connected to the substrate 1 through the first protective layer 4. The second protective layer 5 covers the flexible protective layer 3 and completely covers the arrangement of the electronic components 2.

[0031] It should be noted that through continuous testing, it was found that when the circuit board is subjected to impact, the surface-mount electronic component 2 is also affected by the impact. The connection between the surface-mount electronic component 2 and the substrate 1 is prone to cracking due to impact, leading to the problem of electronic component 2 falling off. Through analysis, the specific reason for its falling off is that when the projectile is launched, it will generate a large acceleration. This acceleration first acts on the substrate 1. During the acceleration process, the substrate 1 drives the electronic component 2, which is fixedly connected to the substrate 1, to accelerate. At this time, the force for the electronic component 2 to accelerate is determined by the connection structure between the electronic component 2 and the substrate 1. It can be seen from the existing problems that the existing connection structure is insufficient to provide the force for the electronic component 2 to accelerate with the substrate 1, resulting in a speed difference between the electronic component 2 and the substrate 1, which in turn leads to the electronic component 2 falling off.

[0032] The second protective layer 5 protects the electronic component 2, completely covering and enveloping it. Specifically, the second protective layer 5 is a foamed polyurethane layer. Foamed polyurethane is lightweight and has low inertia. Furthermore, the foamed polyurethane provides good support and protection. Therefore, the use of foamed polyurethane effectively protects the electronic component 2, preventing damage. Its lightweight nature and low inertia during launch also prevent it from detaching during launch. The second protective layer 5 envelops the electronic component 2, making the connection between the substrate 1, electronic component 2, flexible protective layer 3, and second protective layer 5 tighter, increasing the stability of the connection.

[0033] It is understood that by setting the flexible protective layer 3, the flexible protective layer 3 covers the electronic component 2 and is fixedly connected to the substrate 1. The flexible protective layer 3 provides a force to the electronic component 2 toward the substrate 1, so that the resultant force of the electronic component 2 and the substrate 1 increases during the acceleration process, thereby enabling the electronic component 2 to accelerate together with the substrate 1, preventing the generation of a speed difference between the substrate 1 and the electronic component 2, thereby achieving the purpose of preventing the electronic component 2 from falling off.

[0034] Specifically, the flexible protective layer 3 is arranged to cover the electronic component 2 from the direction of the electronic component 2 toward the substrate 1, and the flexible protective layer 3 is fixedly connected to the substrate 1 at the edge of the electronic component 2.

[0035] It should be noted that the flexible protective layer 3 is formed by curing the flowing liquid. The cured flexible layer will generate shrinkage internal stress, thereby providing a tensile force close to the substrate 1 around the electronic component 2, thereby improving the resultant force of the electronic component 2 during the acceleration process.

[0036] Furthermore, in this embodiment, the flexible protective layer 3 is made of silicone rubber. Silicone rubber has high-temperature resistance (it does not melt or burn at 250 degrees Celsius and maintains good stability), and it also has good elasticity at low temperatures (it can still maintain good elasticity at -40 degrees Celsius), exhibiting good performance between -40 degrees Celsius and 250 degrees Celsius. The thickness of the flexible protective layer 3 is between 0.3 mm and 0.5 mm. Experiments have shown that if the flexible protective layer 3 is too thin, the protective effect will be poor and it will be difficult to construct; if the flexible protective layer 3 is too thick, on the one hand, it will be difficult to construct, and on the other hand, it will easily lead to material waste and increase costs.

[0037] In some other embodiments of this application, the flexible protective layer 3 may also be made of a material such as fluororubber that can maintain good elasticity between -40 degrees Celsius and 250 degrees Celsius.

[0038] Specifically, the first protective layer 4 is a conformal coating layer. After the electronic component 2 is soldered onto the substrate 1, the entire substrate 1 and the electronic component 2 are immersed in the conformal coating, so that the conformal coating completely covers the electronic component 2 and the substrate 1. After the conformal coating is completely cured, the flexible protective layer 3 is applied. It is known that the conformal coating has good waterproof and insulating properties. In addition, by wetting the gap between the electronic component 2 and the substrate 1, the connection between the electronic component 2 and the substrate 1 is further improved, further preventing the electronic component 2 from falling off during launch.

[0039] Specifically, the thickness of the first protective layer 4 is between 25 micrometers and 40 micrometers.

[0040] Furthermore, the top surface 51 of the second protective layer 5 away from the substrate 1 is arranged in a plane, and the side of the second protective layer 5 close to the substrate 1 is provided with a receiving groove corresponding to the electronic component 2. The electronic component 2 and the flexible protective layer 3 corresponding to the electronic component 2 are both embedded in the receiving groove.

[0041] It is known that after electronic components 2 are mounted on the substrate 1, due to the inconsistent sizes of each electronic component 2, they protrude from the substrate 1 and are of varying heights. By providing a second protective layer 5, and by arranging the second protective layer 5 as a plane away from the top surface 51 of the substrate, the planar arrangement facilitates the contact between the plane and the mounting plane of the projectile when the circuit board is installed in the projectile. The mounting plane of the projectile provides stable support for the second protective layer 5 and the substrate 1, while also preventing the mounting plane of the projectile from directly contacting the electronic component 2 and causing damage. The second protective layer 5 is produced by casting using a mold. After casting, a receiving groove for accommodating the electronic component 2 is naturally formed on the side closest to it, and it is tightly connected to the flexible protective layer 3 outside the electronic component 2, improving connection stability and protective effect.

[0042] Specifically, the thickness of the second protective layer 5 is between 4 mm and 8 mm. This allows the second protective layer 5 to completely cover the arrangement of electronic components 2, and also allows the second protective layer 5 to be arranged in a planar manner away from the basic top surface 51.

[0043] Furthermore, mounting holes 11 are provided on the substrate 1, and the mounting holes 11 are arranged through the substrate 1 along the thickness direction of the substrate 1. The second protective layer 5 is arranged to avoid the mounting holes 11. Four mounting holes 11 are arranged at the four corners of the substrate 1.

[0044] It is understood that the mounting holes 11 facilitate the installation of the substrate 1 to the desired location. Furthermore, the second protective layer 5, positioned to avoid the mounting holes 11, allows the connecting components to be directly and stably connected to the substrate 1 during installation, improving connection reliability. Because the second protective layer 5 is made of foamed polyurethane, which has a certain degree of compressibility, direct connection to the foamed polyurethane layer could easily lead to loosening, resulting in reduced connection stability.

[0045] It should also be noted that the flexible protective layer 3 and the first protective layer 4 cover the mounting holes 11. When the substrate 1 is installed through the mounting holes 11, the fasteners used for installation come into contact with the flexible protective layer 3. After the fasteners press the substrate 1, the flexible protective layer 3 undergoes elastic deformation and is partially compressed. The elastic force of the compressed flexible layer acts on the fasteners, which prevents the fasteners from loosening. In addition, the fasteners are in direct contact with the flexible protective layer 3. When the projectile is fired, the force is transmitted to the flexible protective layer 3 through the fasteners and then to the substrate 1. The flexible protective layer 3 acts as a buffer. Through the deformation of the flexible layer, the time of impact on the substrate 1 is extended, the impact on the substrate 1 is reduced, and the electronic components 2 are further prevented from falling off.

[0046] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. An impact-resistant circuit board, characterized in that: It includes a substrate (1), electronic components (2) and a flexible protective layer (3), wherein multiple electronic components (2) are arranged on the substrate (1) at intervals between each other; The flexible protective layer (3) covers the electronic components (2) and passes through the gap between two adjacent electronic components (2) and is fixedly connected to the substrate (1); It also includes a first protective layer (4) and a second protective layer (5). The first protective layer (4) covers both the substrate (1) and the electronic component (2), and the first protective layer (4) is located between the substrate (1) and the flexible protective layer (3). The flexible protective layer (3) is fixedly connected to the substrate (1) through the first protective layer (4). The second protective layer (5) covers the flexible protective layer (3) and completely covers the arrangement of the electronic components (2); The second protective layer (5) is a foamed polyurethane layer.

2. The impact-resistant circuit board according to claim 1, characterized in that: The flexible protective layer (3) is arranged to cover the electronic component (2) from the direction of the electronic component (2) toward the substrate (1), and the flexible protective layer (3) is fixedly connected to the substrate (1) at the edge of the electronic component (2).

3. The impact-resistant circuit board according to claim 1, characterized in that: The flexible protective layer (3) is made of silicone rubber or fluororubber; The thickness of the flexible protective layer (3) is between 0.3 mm and 0.5 mm.

4. The impact-resistant circuit board according to claim 1, characterized in that: The first protective layer (4) is a conformal coating.

5. The impact-resistant circuit board according to claim 4, characterized in that: The thickness of the first protective layer (4) is between 25 micrometers and 40 micrometers.

6. The impact-resistant circuit board according to claim 1, characterized in that: The second protective layer (5) is arranged in a planar shape on the top surface (51) away from the substrate (1). The second protective layer (5) is provided with a receiving groove (12) corresponding to the electronic component (2) on the side close to the substrate (1). The electronic component (2) and the flexible protective layer (3) corresponding to the electronic component (2) are both embedded in the receiving groove (12).

7. The impact-resistant circuit board according to claim 1, characterized in that: The thickness of the second protective layer (5) is between 4 mm and 8 mm.

8. The impact-resistant circuit board according to claim 6, characterized in that: The substrate (1) is provided with mounting holes (11), which are arranged through the substrate (1) along the thickness direction of the substrate (1), and the second protective layer (5) is arranged to avoid the mounting holes (11).

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