Servo driver

Abstract

The servo driver comprises a circuit board, a heat dissipation plate and a connecting piece, the circuit board is provided with a first connecting hole, and two surfaces of the circuit board are respectively provided with an interface device and a power device; the heat dissipation plate is provided with a protruding structure and a second connecting hole corresponding to the first connecting hole, the protruding structure abuts against the face provided with the power device so that a first gap can be formed between the heat dissipation plate and the power device, and an insulating heat conduction piece is installed in the first gap. The connecting pieces penetrate through the corresponding first connecting holes and second connecting holes so that the circuit board and the heat dissipation plate can be relatively fixed, heat generated by the power device is transmitted to the heat dissipation plate along the insulating heat conduction pieces, meanwhile, the circuit board is provided with the first connecting holes, and the heat dissipation plate is provided with second connecting holes corresponding to the first connecting holes. The connecting piece is used for connecting the circuit board and the heat dissipation plate, and the arrangement mode of the single circuit board is adopted, so that the complexity and the production cost of the assembly process of the driver can be reduced.

Description

Technical Field

[0001] This utility model relates to the field of servo driver technology, and in particular to a servo driver. Background Technology

[0002] Servo drives are widely used in industrial control, automation, and other fields. Their main function is to precisely control the rotation of motors to achieve various mechanical movements and positioning tasks. However, most servo drives on the market today are large in size and heavy in weight, making installation difficult and unable to meet the needs of space-constrained equipment.

[0003] In the prior art, the size of the driver can be reduced to a certain extent by using a stacked structure, but the stacked structure usually still contains three circuit boards, which increases the complexity of the assembly process and the cost of production.

[0004] Therefore, how to reduce the complexity of the driver assembly process and production costs is a technical problem that needs to be solved by those skilled in the art. Utility Model Content

[0005] The purpose of this invention is to provide a servo driver that can reduce the complexity of the driver assembly process and production costs.

[0006] To achieve the above objectives, this utility model provides a servo driver, comprising:

[0007] The circuit board has a first connection hole, and interface devices and power devices are respectively provided on both sides of the circuit board;

[0008] The heat sink has a raised structure and a second connecting hole corresponding to the first connecting hole. The raised structure abuts against the side where the power device is located, so that a first gap is formed between the heat sink and the power device. An insulating heat-conducting component is installed in the first gap.

[0009] The connector passes through the corresponding first and second connecting holes to fix the circuit board and the heat sink relatively.

[0010] Preferably, the raised structures are installed at the four corners of the heat sink using a press-riveting process.

[0011] Preferably, the interface device is located at the edge of the circuit board.

[0012] Preferably, the two sides of the insulating thermally conductive component are respectively attached to the power device and the heat sink, and the insulating thermally conductive component is specifically a thermally conductive silicone sheet.

[0013] Preferably, it also includes a positioning element;

[0014] The circuit board has a first positioning hole, and the heat sink has a second positioning hole. The positioning element passes through the first positioning hole and the second positioning hole to limit the relative rotation of the circuit board and the heat sink.

[0015] Preferably, the second connecting hole and the protrusion structure correspond one-to-one, and the second connecting hole penetrates through the heat sink and the corresponding protrusion structure.

[0016] Preferably, it further includes a heat dissipation element, a top cover, and a housing, with the top cover and housing together forming a first receiving cavity. The heat dissipation element is located in the first receiving cavity and is detachably connected to the bottom of the housing. The heat dissipation element is provided with a third connecting hole. The connector passes through the first connecting hole and the second connecting hole and is fixed to the third connecting hole to fix the circuit board and the heat sink in the first receiving cavity.

[0017] Preferably, the interface device specifically includes a first control interface, a first power line interface, a first power supply interface, a first communication interface, and an RS232 communication interface;

[0018] The first control interface specifically includes a first encoder interface and an I / O control interface;

[0019] The first communication interface specifically includes an RS485 communication interface and a first CAN communication interface.

[0020] Preferably, a second power line interface, a second encoder interface, a second power interface, and a second CAN communication interface are sequentially provided on one side of the housing.

[0021] The second power line interface is connected to the first power line interface via an adapter cable;

[0022] The second encoder interface is connected to the first encoder interface via an adapter cable;

[0023] The second power interface is connected to the first power interface via an adapter cable;

[0024] The second CAN communication interface is connected to the first CAN communication interface via an adapter cable.

[0025] Preferably, the second power line interface, the second encoder interface, the second power interface, and the second CAN communication interface are all provided with rubber pads that can abut against the housing.

[0026] Compared with the above-mentioned background technology, the servo driver provided by this utility model includes a circuit board, a heat sink, and a connector. The circuit board has a first connection hole, and interface devices and power devices are respectively provided on both sides of the circuit board. The heat sink has a raised structure and a second connection hole corresponding to the first connection hole. The raised structure abuts against the side where the power device is located, so that a first gap is formed between the heat sink and the power device. An insulating heat-conducting component is installed in the first gap. The connector passes through the corresponding first connection hole and second connection hole to fix the circuit board and the heat sink relatively.

[0027] Specifically, the interface device and the power device are respectively placed on two sides of the circuit board. The heat sink has a raised structure and abuts against the side of the circuit board where the power device is located. This allows a first gap to be formed between the heat sink and the power device, so that the heat generated by the power device, which is prone to heat generation, can be transferred to the heat sink along the insulating heat conductor. At the same time, the circuit board has a first connection hole and the heat sink has a second connection hole corresponding to the first connection hole, so as to connect the circuit board and the heat sink with a connector. The use of a single circuit board can reduce the complexity of the driver assembly process and the production cost. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the assembled circuit board and heat sink provided in an embodiment of the present utility model.

[0030] Figure 2 This is a schematic diagram of the circuit board structure provided in an embodiment of the present utility model;

[0031] Figure 3 This is a schematic diagram of the structure of the heat sink provided in an embodiment of the present utility model;

[0032] Figure 4 This is a schematic diagram of the structure of the heat dissipation element provided in an embodiment of the present utility model;

[0033] Figure 5 This is a schematic diagram of the top cover and shell provided in an embodiment of the present utility model;

[0034] Figure 6 This is an exploded view of the top cover and shell provided in an embodiment of the present utility model.

[0035] in:

[0036] 100 - Circuit board, 110 - First connection hole, 141 - First control interface, 142 - First power line interface, 143 - First power interface, 144 - First communication interface, 145 - RS232 communication interface, 150 - Power device;

[0037] 200 - Heat sink, 210 - Raised structure, 220 - Second connection hole, 240 - Insulating heat-conducting component;

[0038] 300-Connector;

[0039] 400 - Top Cover;

[0040] 500 - Housing, 510 - First receiving cavity, 520 - Second power line interface, 530 - Second encoder interface, 540 - Second power interface, 550 - Second CAN communication interface;

[0041] 600 - Fastener;

[0042] 700 - Heat dissipation element. Detailed Implementation

[0043] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0044] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0045] In the description of this utility model, it should be understood that the terms "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the position or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations of this utility model.

[0046] The purpose of this invention is to provide a servo driver that can reduce the complexity of the driver assembly process and production costs.

[0047] Please see Figures 1 to 3 To achieve the above objectives, this utility model provides a servo driver, including a circuit board 100, a heat sink 200, and a connector 300.

[0048] The circuit board 100 is provided with a first connection hole 110, and interface devices and power devices 150 are respectively provided on both sides of the circuit board 100.

[0049] The circuit board 100 has a square board structure, and its overall dimensions are approximately 80mm × 55mm × 1.6mm (length × width × thickness). The first connecting holes 110 are located at the four corners of the circuit board 100. The first connecting holes 110 can be M3 threaded holes. The surface of the circuit board 100 is coated with conformal adhesive for waterproofing, moisture protection and short circuit prevention.

[0050] The heat sink 200 is provided with a protruding structure 210 and a second connecting hole 220 corresponding to the first connecting hole 110. The protruding structure 210 abuts against the side where the power device 150 is located, so that a first gap is formed between the heat sink 200 and the power device 150. An insulating heat-conducting component 240 is installed in the first gap.

[0051] The heat sink 200 is manufactured using sheet metal processing and is made of aluminum profile, possessing certain structural rigidity and thermal conductivity. The heat sink 200 measures 80mm × 55mm × 1mm (length × width × thickness). The raised structures 210 are installed at the four corners of the heat sink 200 using a press-fit process. The second connecting holes 220 correspond one-to-one with the raised structures 210, penetrating both the heat sink 200 and the corresponding raised structure 210. The second connecting holes 220 can be M3 threaded holes. Specifically, the raised structures 210 with the second connecting holes 220 are press-fitted to the four corners of the heat sink 200, resulting in a columnar structure with internal M3 threaded holes after pressing.

[0052] It should be noted that the height of the protruding structure 210 after pressing on its own axis is 2 to 4 times the thickness of the heat sink 200 on the same axis, preferably 3 mm.

[0053] The connector 300 passes through the corresponding first connection hole 110 and second connection hole 220 to fix the circuit board 100 and the heat sink 200 relative to each other.

[0054] The interface device and the power device 150 are respectively disposed on two sides of the circuit board 100. The heat sink 200 has a raised structure 210 that abuts against the side of the circuit board 100 where the power device 150 is disposed. This allows a first gap to be formed between the heat sink 200 and the power device 150 for mounting the insulating heat-conducting component 240. This allows the heat generated by the power device 150, which is prone to overheating, to be transferred to the heat sink 200 along the insulating heat-conducting component 240. At the same time, the circuit board 100 has a first connection hole 110 and the heat sink 200 has a second connection hole 220 corresponding to the first connection hole 110, for the connector 300 to connect the circuit board 100 and the heat sink 200. By using a single circuit board 100, the complexity of the driver assembly process and the production cost can be reduced.

[0055] The insulating thermally conductive component 240 is attached to the power device 150 and the heat sink 200 on both sides, respectively. The insulating thermally conductive component 240 is specifically a thermally conductive silicone sheet.

[0056] The thermally conductive silicone pad measures 52mm × 26mm × 3mm (length × width × thickness). By ensuring that the thickness of the thermally conductive silicone pad is greater than the distance between the power device 150 and the heat sink 200, the thermally conductive silicone pad can be completely and tightly attached to the surfaces of the power device 150 and the heat sink 200. The thermally conductive silicone pad has a high thermal conductivity, low hardness, and good adhesion, which can quickly conduct the heat generated by the power device 150 to the heat sink 200, preventing the power device 150 from overheating.

[0057] Please see Figure 4 The connector 300 can be a screw adapted to the first connecting hole 110 and the second connecting hole 220. The circuit board 100 and the heat sink 200 can be detachably connected by the screw. A long screw can be used as needed. After the long screw passes through the circuit board 100 and the heat sink 200, it still has an extra threaded section, which can fix the circuit board 100 and the heat sink 200 on the heat dissipation element 700 with the third connecting hole, so that the heat on the heat sink 200 can be dissipated in time and the heat dissipation effect of the heat sink 200 can be increased.

[0058] Considering the alignment process of the circuit board 100 and the heat sink 200, the servo driver preferably also includes a positioning element. A first positioning hole is added to the circuit board 100, and a second positioning hole is added to the heat sink 200. The first and second positioning holes can be round or square, and their central axes are collinear. The positioning element passes through the first and second positioning holes to restrict the relative rotation of the circuit board 100 and the heat sink 200. The placement of the positioning element ensures the alignment of the circuit board 100 and the heat sink 200, facilitating the subsequent connection process of the connector 300 to the circuit board 100 and the heat sink 200. After the circuit board 100 and the heat sink 200 are connected, the positioning element can be removed. The second positioning hole increases airflow on the heat sink 200, improving its heat dissipation effect.

[0059] In this embodiment, the interface devices are arranged at the edge of the circuit board 100 to facilitate the connection of subsequent adapter cables. There are five interface devices, specifically the first control interface 141, the first power line interface 142, the first power interface 143, the first communication interface 144, and the RS232 communication interface 145.

[0060] Specifically, the first control interface 141 is a first encoder interface and an I / O control interface, and the first communication interface 144 is an RS485 communication interface and a first CAN communication interface.

[0061] Please see Figure 5 and Figure 6 In another embodiment, the servo driver further includes the aforementioned heat dissipation element 700, top cover 400, and housing 500. The top cover 400 has M4 threaded holes at its four corners, and the housing 500 also has M4 threaded holes at its top four corners. A fastener 600 (screw) passes through the corresponding M4 threaded holes to achieve a detachable connection between the top cover 400 and the housing 500. The top cover 400 and the housing 500 together form a first receiving cavity 510. The heat dissipation element 700 is located in the first receiving cavity 510 and is detachably connected to the bottom of the housing 500. The heat dissipation element 700 has a third connecting hole. The connector 300 passes through the first connecting hole 110 and the second connecting hole 220 and is fixed to the third connecting hole to fix the circuit board 100 and the heat sink 200 to the first receiving cavity 510.

[0062] It should be noted that the heat dissipation element 700 has M3 threaded holes at its four corners, and the bottom of the housing 500 also has M3 threaded holes, so that the heat dissipation element 700 and the housing 500 can be detachably connected after the screw is inserted.

[0063] The shell 500 has a reinforcing rib adjacent to the M4 threaded hole inside. The reinforcing rib extends vertically and forms a receiving space with the inner wall of the shell 500. The reinforcing rib can strengthen the structure of the shell 500, and the top of the reinforcing rib can support the top cover 400 to increase the contact area between the top cover 400 and the shell 500 and improve the stability of the connection between the top cover 400 and the shell 500.

[0064] It should be noted that a second power line interface 520, a second encoder interface 530, a second power interface 540, and a second CAN communication interface 550 are sequentially provided on one side of the housing 500; the second power line interface 520 is connected to the first power line interface 142 via an adapter cable; the second encoder interface 530 is connected to the first encoder interface via an adapter cable; the second power interface 540 is connected to the first power interface 143 via an adapter cable; and the second CAN communication interface 550 is connected to the first CAN communication interface via an adapter cable.

[0065] The housing 500 has four adjacent through holes for the second power line interface 520, the second encoder interface 530, the second power interface 540, and the second CAN communication interface 550 to pass through. At the same time, the second power line interface 520, the second encoder interface 530, the second power interface 540, and the second CAN communication interface 550 are all provided with rubber gaskets that can abut against the inner wall of the housing 500 to achieve sealing and waterproofing.

[0066] In summary, this application provides a servo driver with only one circuit board 100, which is approximately 80mm × 55mm × 1.6mm in size, about the size of a business card. It has five interface devices located near the edge of the circuit board 100 for easy wiring. Four M3 screw holes are located at the four corners of the circuit board 100. Power devices 150, which are prone to heat generation, are located at the bottom of the circuit board 100 for easy heat dissipation. The heat sink 200 is made of aluminum profile, possessing a certain degree of hardness and good thermal conductivity. Threaded columnar structures are pressed into the four corners. After the connector 300 locks the circuit board 100 and the heat sink 200 together, the thermally conductive silicone pads are completely in close contact with the surfaces of the power devices 150 and the heat sink 200, increasing heat dissipation. The heat dissipation element 700, top cover 400, and housing 500 can be flexibly designed according to customer requirements.

[0067] It should be noted that in this specification, relational terms such as first and second are used only to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.

[0068] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0069] This article uses specific examples to illustrate the principles and implementation methods of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made to this utility model without departing from the principles of this utility model, and these improvements and modifications also fall within the protection scope of this utility model.

Claims

1. A servo driver, characterized in that, include: The circuit board (100) is provided with a first connection hole (110), and the two sides of the circuit board (100) are respectively provided with interface devices and power devices (150). The heat sink (200) has a raised structure (210) and a second connecting hole (220) corresponding to the first connecting hole (110). The raised structure (210) abuts against the side where the power device (150) is located, so that a first gap is formed between the heat sink (200) and the power device (150). An insulating heat-conducting component (240) is installed in the first gap. A connector (300) is inserted through the corresponding first connection hole (110) and second connection hole (220) to fix the circuit board (100) and the heat sink (200) relative to each other.

2. The servo driver according to claim 1, characterized in that, The protruding structures (210) are arranged at the four corners of the heat sink (200) using a riveting process.

3. The servo driver according to claim 1, characterized in that, The interface device is located at the edge of the circuit board (100).

4. The servo driver according to claim 1, characterized in that, The insulating thermal conductive element (240) is attached to the power device (150) and the heat sink (200) on both sides respectively. The insulating thermal conductive element (240) is specifically a thermally conductive silicone sheet.

5. The servo driver according to claim 1, characterized in that, It also includes positioning components; The circuit board (100) is provided with a first positioning hole, and the heat sink (200) is provided with a second positioning hole. The positioning member passes through the first positioning hole and the second positioning hole to restrict the relative rotation of the circuit board (100) and the heat sink (200).

6. The servo driver according to claim 2, characterized in that, The second connecting hole (220) and the protruding structure (210) correspond one-to-one, and the second connecting hole (220) passes through the heat sink (200) and the corresponding protruding structure (210).

7. The servo driver according to claim 2, characterized in that, It also includes a heat dissipation element (700), a top cover (400), and a housing (500). The top cover (400) and the housing (500) together form a first receiving cavity (510). The heat dissipation element (700) is located in the first receiving cavity (510) and is detachably connected to the bottom of the housing (500). The heat dissipation element (700) is provided with a third connecting hole. The connector (300) passes through the first connecting hole (110) and the second connecting hole (220) and is fixed to the third connecting hole to fix the circuit board (100) and the heat sink (200) in the first receiving cavity (510).

8. The servo driver according to claim 7, characterized in that, The interface devices are specifically a first control interface (141), a first power line interface (142), a first power interface (143), a first communication interface (144), and an RS232 communication interface (145). The first control interface (141) is specifically a first encoder interface and an I / O control interface; The first communication interface (144) is specifically an RS485 communication interface and a first CAN communication interface.

9. The servo driver according to claim 8, characterized in that, The housing (500) is provided with a second power line interface (520), a second encoder interface (530), a second power interface (540), and a second CAN communication interface (550) in sequence on one side. The second power line interface (520) is connected to the first power line interface (142) via an adapter cable. The second encoder interface (530) is connected to the first encoder interface via an adapter cable; The second power interface (540) is connected to the first power interface (143) via an adapter cable. The second CAN communication interface (550) is connected to the first CAN communication interface via an adapter cable.

10. The servo driver according to claim 9, characterized in that, The second power line interface (520), the second encoder interface (530), the second power interface (540), and the second CAN communication interface (550) are all provided with rubber pads that can abut against the housing (500).

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