Solder paste printing device of special-shaped printed circuit board

Abstract

The utility model relates to a solder paste printing device of a special-shaped printed circuit board, which comprises a base and an upper cover which can be opened or closed relatively, a positioning seat is fixedly arranged on the base and used for arranging a circuit substrate to be processed, and the upper cover is provided with an inner frame plate, an outer frame plate and a printing template clamped and fixed between the inner frame plate and the outer frame plate. The upper cover is provided with a printing template, circuit holes are formed in the printing template, and the circuit holes respectively correspond to element pins on a circuit board, so that when the upper cover covers the base, a worker can print solder paste on the element pins on the circuit board through the circuit holes of the printing template so as to facilitate reflow soldering operation of a subsequent surface mounting process.

Description

Technical Field

[0001] This utility model relates to a solder paste printing device for printed circuit boards, and more particularly to a manual solder paste printing device for use in surface mount technology (SMT) processes and applicable to irregularly shaped printed circuit boards. Background Art

[0002] Surface Mount Technology (SMT) involves first printing solder paste onto the component leads of a printed circuit board (PCB), then mounting components onto these solder-painted leads. The PCB is then sent to a reflow oven for reflow soldering. During reflow, the solder paste on the component leads melts at high temperatures, creating electrical connections between the components and the leads and traces on the PCB. This SMT process is primarily designed for automated operation of PCBs of fixed sizes. However, it cannot be used to process irregularly shaped or small quantities of PCBs. Therefore, a feasible technical solution is needed to meet the solder paste printing requirements of irregularly shaped PCBs. Utility Model Content

[0003] In view of the problems existing in the prior art, the purpose of this utility model is to provide a solder paste printing device for irregularly shaped printed circuit boards, which allows workers to manually print solder paste on circuit boards of different sizes.

[0004] To achieve the aforementioned objectives of this utility model, the technical means employed in this utility model is to include a solder paste printing device for an irregularly shaped printed circuit board, comprising:

[0005] A base;

[0006] A positioning seat, fixed to the upper surface of the base, the positioning seat having a positioning groove recessed into the top surface of the positioning seat; and

[0007] A top cover is flared or closed relative to the base. The top cover has an inner frame plate, an outer frame plate, and a printing template. An inner through hole is formed through the inner frame plate, and an outer through hole is formed through the outer frame plate. The inner frame plate and the outer frame plate are stacked and fixed to each other. The inner through hole of the inner frame plate and the outer through hole of the outer frame plate are correspondingly connected. The printing template is clamped between the inner frame plate and the outer frame plate. A circuit hole is formed on the printing template. The position of the circuit hole corresponds to the inner through hole of the inner frame plate and the outer through hole of the outer frame plate.

[0008] In the solder paste printing apparatus for the irregularly shaped printed circuit board: the cross-sectional area of ​​the inner through hole of the inner frame plate in the direction perpendicular to the through hole can be greater than the cross-sectional area of ​​the positioning seat in the direction perpendicular to the top surface of the positioning seat.

[0009] In the solder paste printing device for the irregular printed circuit board: at least one positioning hole can be formed through the inner frame plate, and at least one positioning hole can be formed through the outer frame plate. The at least one positioning hole of the inner frame plate and the at least one positioning hole of the outer frame plate are correspondingly connected.

[0010] When the top cover is closed on the base, the at least one positioning post of the base is correspondingly inserted into the at least one positioning hole of the inner frame plate and the at least one positioning hole of the outer frame plate.

[0011] In the solder paste printing apparatus for the irregularly shaped printed circuit board: the top surface of the positioning seat can be recessed to form at least one side groove, and the at least one side groove is connected to the positioning groove.

[0012] In the solder paste printing apparatus for the irregularly shaped printed circuit board, the inner frame plate and the outer frame plate can be detachably fixed to each other via multiple fasteners.

[0013] In the solder paste printing device for the irregularly shaped printed circuit board: each of the plurality of fixing members can be a screw, and each of the plurality of fixing members passes through one of the inner frame plate and the outer frame plate, and is then threadedly locked to the other of the inner frame plate and the outer frame plate.

[0014] In the solder paste printing apparatus for the irregularly shaped printed circuit board: the top cover can be pivotally connected to the rear side of the base so that the top cover can be opened or closed relative to the base.

[0015] When the top cover is closed on the base, the printing template is placed on the circuit board to be processed within the positioning groove of the positioning seat. Then, the operator can print solder paste onto the various component pins of the circuit board through the wiring holes of the printing template. With this design, this invention can process circuit boards of different shapes simply by changing the positioning seat with a different shaped positioning groove and using the corresponding printing template. It is particularly suitable for printing solder paste on circuit boards with special shapes and sizes or in small quantities. Attached Figure Description

[0016] Figure 1 This is an exploded perspective view of the present invention.

[0017] Figure 2 This is an exploded perspective view of the top cover of this utility model.

[0018] Figure 3 This is a front sectional view of the present invention.

[0019] Figure 4 This utility model is based on Figure 3 The side view section of section line 4-4.

[0020] Figure 5 This utility model is based on Figure 3 The side view section of section line 5-5.

[0021] Brief explanation of the icon numbers

[0022] 10: Base; 101: Top surface; 11: Positioning post;

[0023] 20: Positioning seat; 21: Positioning groove; 22: Side groove;

[0024] 30: Top cover; 31: Inner frame plate; 311: Inner perforation; 312: Positioning hole; 32: Outer frame plate; 321: Outer perforation; 322: Positioning hole; 33: Printing template; 331: Circuit hole; 34: Fastener; 35: Pivot connector;

[0025] 40: Circuit board DETAILED DESCRIPTION

[0026] The following, in conjunction with the accompanying drawings and preferred embodiments of the present invention, further illustrates the technical means adopted by the present invention to achieve its intended purpose.

[0027] See Figure 1 , Figure 3 and Figure 4 As shown, the solder paste printing device for irregularly shaped printed circuit boards of this utility model includes a base 10, a positioning seat 20 and a top cover 30.

[0028] The base 10 has an upper surface 101 and a front side and a rear side located on opposite sides. At least one positioning post 11 is provided on the upper surface 101 of the base 10. The at least one positioning post 11 is located near the front side of the base 10 and protrudes upward from the upper surface 101.

[0029] The positioning seat 20 is fixedly disposed on the upper surface 101 of the base 10. The positioning seat 20 has a top surface, a positioning groove 21, and at least one side groove 22. The positioning groove 21 is recessed in the top surface of the positioning seat 20. The shape of the positioning groove 21 matches the circuit board 40 to be processed, and it can be used to set the circuit board 40 to be processed to fix its position. The at least one side groove 22 is recessed in the top surface of the positioning seat 20. The at least one side groove 22 is located beside the positioning groove 21 and communicates with the positioning groove 21.

[0030] When the circuit board 40 is placed in the positioning groove 21, the side of the circuit board 40 will be exposed at at least one side groove 22. In this way, the operator can insert his / her finger into the at least one side groove 22 to apply force from the side of the circuit board 40 and move the circuit board 40 out of the positioning groove 21.

[0031] See further Figure 2 and Figure 5 As shown, the upper cover 30 is pivotally connected to the rear side of the base 10 and can be opened or closed relative to the base 10. The upper cover 30 has an inner frame plate 31, an outer frame plate 32 and a printing template 33.

[0032] The inner frame plate 31 has an internal through hole 311 and at least one positioning hole 312, and the outer frame plate 32 has an external through hole 321 and at least one positioning hole 322. The inner frame plate 31 and the outer frame plate 32 are stacked on top of each other and detachably fixed to each other by a plurality of fasteners 34. The internal through hole 311 of the inner frame plate 31 and the external through hole 321 of the outer frame plate 32 are correspondingly connected, thereby forming a hollow part on the top cover 30. The cross-sectional area of ​​the internal through hole 311 of the inner frame plate 31 in the direction perpendicular to the through hole 311 is larger than the cross-sectional area of ​​the positioning seat 20 in the direction perpendicular to the top surface of the positioning seat 20. The at least one positioning hole 312 of the inner frame plate 31 and the at least one positioning hole 322 of the outer frame plate 32 are also correspondingly connected.

[0033] In a specific embodiment of this utility model, the upper cover 30 is connected to the base 10 via the outer frame plate 32 through at least one pivot member 35, so that the upper cover 30 can be opened or closed relative to the base 10. However, this is not a limitation, the inner frame plate 31 can also be connected to the base 10 via a pivot member.

[0034] See also Figure 5 As shown, in a specific embodiment of this utility model, each of the plurality of fasteners 34 is a screw. Each of the plurality of fasteners 34 in the form of a screw passes through one of the inner frame plate 31 and the outer frame plate 32, and is then threadedly fastened to the other of the inner frame plate 31 and the outer frame plate 32, thereby achieving the purpose of detachably fastening the inner frame plate 31 and the outer frame plate 32 to each other.

[0035] The printing template 33 is clamped between the inner frame plate 31 and the outer frame plate 32. The printing template 33 has circuit holes 331 formed on it. The circuit holes 331 correspond to the pins of each component on the circuit board 40. The circuit holes 331 are located in the hollowed-out area formed by the inner through hole 311 of the inner frame plate 31 and the outer through hole 321 of the outer frame plate 32. Since the inner frame plate 31 and the outer frame plate 32 can be disassembled, the operator can replace the printing template 33 with the printing template 33 having the circuit holes 331 corresponding to the pins of different components on different circuit boards 40 as needed.

[0036] When the top cover 30 is closed on the base 10, at least one positioning post 11 of the base 10 is correspondingly inserted into at least one positioning hole 312 of the inner frame plate 31 and at least one positioning hole 322 of the outer frame plate 32, so as to prevent the positions of the base 10 and the top cover 30 from being misaligned. At the same time, since the inner through hole 311 of the inner frame plate 31 is larger than the positioning seat 20, the positioning seat 20 will protrude into the inner through hole 311, so that the printing template 33 is stacked on the circuit board 40 to be processed in the positioning groove 21 of the positioning seat 20. Then, the operator can print solder paste on each component pin of the circuit board 40 to be processed through the line hole 331 of the printing template 33.

[0037] The advantage of this invention is that it allows workers to manually print solder paste on the component pins of the circuit board 40. By simply replacing the positioning seat 20 with a different shape of positioning groove 21 and matching it with the corresponding printing template 33, it can be used to process circuit boards 40 of different shapes. It is particularly suitable for processing circuit boards 40 with special shapes or in small quantities.

[0038] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model's technical solution. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the content of the present utility model's technical solution shall still fall within the scope of the present utility model's technical solution.

Claims

1. A solder paste printing apparatus for irregularly shaped printed circuit boards, characterized in that, include: A base; A positioning seat is fixed on the upper surface of the base, and the positioning seat has a positioning groove that is recessed into the top surface of the positioning seat. as well as A top cover that can be opened or closed relative to the base, the top cover having an inner frame plate, an outer frame plate and a printing template; An inner through hole is formed through the inner frame plate, and an outer through hole is formed through the outer frame plate. The inner frame plate and the outer frame plate are stacked and fixed to each other. The inner through hole of the inner frame plate and the outer through hole of the outer frame plate are correspondingly connected. The printing template is clamped between the inner frame plate and the outer frame plate. The printing template has circuit holes, and the positions of the circuit holes correspond to the inner through hole of the inner frame plate and the outer through hole of the outer frame plate.

2. The solder paste printing apparatus for irregularly shaped printed circuit boards according to claim 1, characterized in that: The cross-sectional area of ​​the inner perforation of the inner frame plate in the direction perpendicular to the through-hole is greater than the cross-sectional area of ​​the positioning seat in the direction perpendicular to the top surface of the positioning seat.

3. The solder paste printing apparatus for irregularly shaped printed circuit boards according to claim 1, characterized in that: At least one positioning hole is formed through the inner frame plate, and at least one positioning hole is formed through the outer frame plate. The at least one positioning hole in the inner frame plate and the at least one positioning hole in the outer frame plate are positioned correspondingly and connected. When the top cover is closed on the base, at least one positioning post of the base is correspondingly inserted into at least one positioning hole in the inner frame plate and at least one positioning hole in the outer frame plate.

4. The solder paste printing apparatus for irregularly shaped printed circuit boards according to claim 2, characterized in that: At least one positioning hole is formed through the inner frame plate, and at least one positioning hole is formed through the outer frame plate. The at least one positioning hole in the inner frame plate and the at least one positioning hole in the outer frame plate are positioned correspondingly and connected. When the top cover is closed on the base, at least one positioning post of the base is correspondingly inserted into at least one positioning hole in the inner frame plate and at least one positioning hole in the outer frame plate.

5. The solder paste printing apparatus for irregularly shaped printed circuit boards according to any one of claims 1 to 4, characterized in that: The top surface of the positioning seat is further recessed to form at least one side groove, which is connected to the positioning groove.

6. The solder paste printing apparatus for irregularly shaped printed circuit boards according to any one of claims 1 to 4, characterized in that: The inner frame panel and the outer frame panel are detachably fixed to each other by a number of fasteners.

7. The solder paste printing apparatus for irregularly shaped printed circuit boards according to claim 6, characterized in that: Each of the plurality of fasteners is a screw, and each fastener passes through one of the inner frame plate and the outer frame plate and is then threadedly fastened to the other of the inner frame plate and the outer frame plate.

8. The solder paste printing apparatus for irregularly shaped printed circuit boards according to any one of claims 1 to 4, characterized in that: The top cover is pivotally connected to the rear side of the base so that the top cover can be opened or closed relative to the base.

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