Printing steel mesh capable of reducing deformation of circuit board

Abstract

The printing steel mesh capable of reducing the deformation of the circuit board comprises a frame body, a reinforcing frame and a steel mesh, a printing hole is formed in the center of the top of the steel mesh, reinforcing frame through grooves are formed in the top and the bottom of the reinforcing frame, clamping grooves are formed in the centers of the surfaces of the reinforcing frame through grooves, and the steel mesh is arranged in the reinforcing frame through grooves. The outer surfaces of the top and the bottom of the steel mesh are connected to the reinforcing frame through grooves in a clamped mode. Frame body through grooves are formed in the positions, located on the four edges of the through groove, of the top of the frame body, a plurality of telescopic rods are arranged at the bottoms of the frame body through grooves, the tops of the telescopic rods are connected with the bottom of a fixing plate, the inner side face of the fixing plate is connected with the outer surface of the reinforcing frame, and the fixing plate is connected to the reinforcing frame through grooves in a clamped mode; the reinforcing frame is made of hard alloy, has extremely high strength, can protect the steel mesh from deforming under the action of pressure and further causing deformation of the PCB, relieves insufficient welding and missing welding of the PCB in the using process, and improves the percent of pass of machined finished products.

Description

Technical Field

[0001] This utility model relates to the field of printed stencil technology, specifically a printed stencil that can reduce the deformation of circuit boards. Background Technology

[0002] In the manufacturing process of electronic products, surface mount technology is used to solder various components onto printed circuit boards. The surface mount process generally includes: applying solder paste to the side of the PCB to be soldered, then mounting the components to be soldered onto the corresponding positions on the PCB, performing reflow soldering after component mounting is completed, thus completing the component mounting on one side of the PCB, and completing the surface mount process after inspection and approval.

[0003] In the process of applying solder paste to a PCB substrate, the amount of solder applied is a key factor affecting soldering quality. The amount of solder is determined by the shape and size of the stencil openings. A well-designed stencil opening ensures good solder paste removal, prevents short circuits, open circuits, or solder balls, and guarantees good hardware connections and soldering reliability.

[0004] A stencil, also known as an SMT template, is a special mold used in SMT. Its main function is to help deposit solder paste, with the aim of transferring the exact amount of solder paste to the exact location on the blank PCB.

[0005] However, in the use of existing printed stencils, due to the insufficient elasticity of the stencil, the stencil may deform under pressure, leading to deformation of the PCB board. This can cause poor soldering or missing solder joints on the PCB board, reducing the pass rate of the finished product. Utility Model Content

[0006] The purpose of this invention is to provide a printed stencil that can reduce the deformation of circuit boards, thereby solving the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solutions:

[0008] A printed stencil that can reduce the deformation of a circuit board includes a frame, a reinforcing frame, and a stencil. The stencil has a printing hole at the top center. The reinforcing frame has reinforcing frame through slots at the top and bottom. The reinforcing frame through slots have a slot at the center of the surface of the through slots. The stencil is placed inside the through slots. The top and bottom outer surfaces of the stencil are snap-fitted to the through slots.

[0009] The top and bottom of the frame are provided with through grooves, and a combination of a reinforcing frame and a steel mesh is provided inside the through grooves;

[0010] The frame body has a frame through groove at the top and at the four sides of the through groove. Several telescopic rods are provided at the bottom of the frame through groove. The top of the telescopic rods is connected to the bottom of the fixing plate. The inner side of the fixing plate is connected to the outer surface of the reinforcing frame.

[0011] Preferably, a spring is sleeved on the surface of the telescopic rod, with the top end of the spring connected to the bottom of the fixing plate and the bottom end of the spring connected to the bottom of the through groove of the frame.

[0012] Preferably, the reinforcing frame is made of cemented carbide.

[0013] Preferably, the fixing plate is slidably fitted into the through groove of the frame.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] This utility model discloses a printed stencil that can reduce the deformation of circuit boards. A reinforcing frame is snap-fitted onto the outer surface of the stencil. The reinforcing frame is made of hard alloy, which has extremely high strength. It can protect the stencil from deformation under pressure, thereby preventing deformation of the PCB board. This alleviates the problem of poor soldering and missing solder joints on the PCB board during use and improves the pass rate of the finished product.

[0016] This utility model discloses a printed stencil that can reduce the deformation of a circuit board. Fixed plates are provided on the front, back, and two sides of the reinforcing frame. The fixed plates are slidably connected to the through groove of the frame. In addition, several telescopic rods are provided at the bottom of the through groove of the frame. Springs are sleeved on the surface of the telescopic rods. The springs buffer the pressure acting on the stencil to a certain extent, preventing excessive pressure from deforming the stencil. Attached Figure Description

[0017] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 This is an exploded view of the overall structure of this utility model;

[0019] Figure 3 for Figure 2 Enlarged view of point A in the middle.

[0020] In the diagram: 1. Frame; 101. Through groove; 102. Frame through groove; 2. Reinforcing frame; 201. Reinforcing frame through groove; 202. Card slot; 3. Fixing plate; 4. Steel mesh; 5. Printed hole; 6. Telescopic rod; 7. Spring. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] In the description of this utility model, it should be noted that the terms "vertical", "up", "down", "horizontal", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0023] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0024] Please see Figure 1-3 This utility model provides a technical solution:

[0025] A printed stencil that can reduce the deformation of a circuit board includes a frame 1, a reinforcing frame 2, and a stencil 4. A printing hole 5 is provided at the top center of the stencil 4. A reinforcing frame through groove 201 is provided at the top and bottom of the reinforcing frame 2. A slot 202 is provided at the center of the surface of the reinforcing frame through groove 201. The stencil 4 is disposed in the reinforcing frame through groove 201. The top and bottom outer surfaces of the stencil 4 are snapped together with the reinforcing frame through groove 201.

[0026] The top and bottom of the frame 1 are provided with through grooves 101, and the inside of the through grooves 101 is provided with a combination of reinforcing frame 2 and steel mesh 4;

[0027] A frame through groove 102 is provided at the top of the frame 1 and at the four sides of the through groove 101. Several telescopic rods 6 are provided at the bottom of the frame through groove 102. The top of the telescopic rods 6 is connected to the bottom of the fixing plate 3. The inner side of the fixing plate 3 is connected to the outer surface of the reinforcing frame 2.

[0028] Furthermore, a spring 7 is sleeved on the surface of the telescopic rod 6. The top end of the spring 7 is connected to the bottom of the fixing plate 3, and the bottom end of the spring 7 is connected to the bottom of the frame through groove 102.

[0029] Furthermore, the reinforcing frame 2 is made of hard alloy, which has extremely high strength and can protect the steel mesh 4 from deformation under pressure, thereby preventing deformation of the PCB board. This utility model reduces the deformation of the circuit board by alleviating the deformation of the steel mesh 4, thus reducing the risk of poor soldering and missing solder joints on the PCB board during use and improving the pass rate of the finished product.

[0030] Furthermore, the fixing plate 3 is fitted and slidably connected to the through groove 102 of the frame. Under the pressure of the steel mesh 4, the steel mesh 4 and the reinforcing frame 2 assembly will move downward together, thereby moving the telescopic rod 6 and the spring 7 downward. This utility model uses the buffering property of the spring 7 to buffer the pressure acting on the steel mesh 4 to a certain extent, preventing excessive pressure from deforming the steel mesh 4, thereby reducing the deformation of the circuit board.

[0031] Working principle: The printed stencil of this utility model can reduce the deformation of the circuit board. When in use, the circuit board is placed inside the frame 1, and the bottom of the stencil 4 is positioned above the circuit board. Then, the circuit board is printed in the same way as in the prior art. This is a mature existing technology, and its specific working principle will not be described in detail here.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A printed stencil that can reduce the deformation of a circuit board, comprising a frame (1), a reinforcing frame (2), and a stencil (4), characterized in that: The steel mesh (4) has a printing hole (5) at the top center. The reinforcing frame (2) has a reinforcing frame through groove (201) at the top and bottom. The reinforcing frame through groove (201) has a slot (202) at the center of its surface. The steel mesh (4) is installed inside the reinforcing frame through groove (201). The top and bottom outer surfaces of the steel mesh (4) are snap-fitted to the reinforcing frame through groove (201). The top and bottom of the frame (1) are provided with through grooves (101), and the inside of the through grooves (101) is provided with a combination of a reinforcing frame (2) and a steel mesh (4); The frame (1) has a frame through groove (102) at the top and at the four sides of the through groove (101). The bottom of the frame through groove (102) is provided with several telescopic rods (6). The top of the telescopic rods (6) is connected to the bottom of the fixing plate (3). The inner side of the fixing plate (3) is connected to the outer surface of the reinforcing frame (2).

2. The printed stencil for reducing circuit board deformation according to claim 1, characterized in that: A spring (7) is sleeved on the surface of the telescopic rod (6). The top end of the spring (7) is connected to the bottom of the fixing plate (3), and the bottom end of the spring (7) is connected to the bottom of the frame through groove (102).

3. The printed stencil for reducing circuit board deformation according to claim 1, characterized in that: The reinforcing frame (2) is made of hard alloy.

4. The printed stencil for reducing circuit board deformation according to claim 1, characterized in that: The fixing plate (3) is fitted and slidably connected to the through groove (102) of the frame.

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