BMS mainboard cooling device and battery

Abstract

The utility model relates to a BMS mainboard cooling device and a battery, the BMS mainboard cooling device comprises a BMS cooling chamber fixedly arranged below a BMS mainboard, the top heat exchange surface of the BMS cooling chamber clings to the bottom heat dissipation surface of the BMS mainboard, the BMS cooling chamber is provided with a cooling liquid inlet and a cooling liquid outlet, and the cooling liquid outlet is communicated with the bottom liquid cooling plate water inlet. By utilizing the convenience of the battery pack liquid cooling loop, the BMS cooling chamber is additionally arranged at the bottom of the BMS mainboard, and the BMS mainboard is cooled through the cooling liquid flowing through the BMS cooling chamber, so that the working environment temperature of the BMS mainboard is improved on the premise of not increasing extra power consumption, and the influence of high temperature on the functions and the service life of electronic components in the BMS is reduced to a certain extent.

Description

Technical Field

[0001] This utility model relates to a battery management system, specifically to a BMS motherboard cooling device and a battery. Background Technology

[0002] As a core component of the battery system, the battery management system (BMS) plays an indispensable role in the stable operation, performance optimization, life extension and safety of the battery system. Therefore, the operational stability of the BMS itself deserves special attention.

[0003] BMS typically operates within a temperature range of -40°C to 85°C, but its optimal operating range is generally below 35°C. High temperatures can cause changes in the parameters of internal electronic components such as resistors and capacitors. For example, this can lead to changes in resistance and capacitance, as well as a decrease in chip processing speed and accuracy. Furthermore, prolonged exposure to high temperatures accelerates the aging of electronic components, significantly shortening their lifespan and increasing the risk of malfunctions and failures. Since BMS generates a significant amount of heat during operation, adequate heat dissipation and high-temperature protection measures must be fully considered in its design and application.

[0004] Currently, BMS motherboard cooling methods mainly include natural cooling, air cooling, and liquid cooling. Natural cooling has low heat dissipation efficiency; in high-temperature environments or under high motherboard load, poor heat dissipation can lead to motherboard overheating, affecting BMS performance and stability. Air cooling offers some improvement over natural cooling and can meet the heat dissipation requirements of the BMS motherboard, but it requires additional power, reducing system energy efficiency and generating significant noise. Liquid cooling utilizes coolant circulating in pipes within the BMS motherboard to remove heat. This method offers good cooling performance, but its complex structure poses a risk of coolant leakage onto the motherboard, potentially causing short circuits or damage. Utility Model Content

[0005] To address the above issues, this invention provides a BMS motherboard cooling device and battery, which improves the operating temperature of the BMS without increasing additional power consumption.

[0006] The technical solution adopted in this utility model is: a BMS motherboard cooling device, characterized in that: it includes a BMS cooling chamber fixedly installed below the BMS motherboard, the top heat exchange surface of the BMS cooling chamber is in close contact with the bottom heat dissipation surface of the BMS motherboard, and the BMS cooling chamber is provided with a coolant inlet and a coolant outlet, the coolant outlet being connected to the inlet of the bottom liquid cooling plate. Taking advantage of the convenience of the battery pack liquid cooling circuit, a BMS cooling chamber is added to the bottom of the BMS motherboard. The coolant flowing through the BMS cooling chamber dissipates heat from the BMS motherboard, improving the operating temperature of the BMS motherboard without increasing additional power consumption, and to a certain extent reducing the impact of high temperatures on the function and lifespan of the electronic components inside the BMS.

[0007] Preferably, the BMS cooling chamber is located between the BMS motherboard and the bottom liquid cooling plate. The coolant flowing through the BMS cooling chamber quickly removes heat from the BMS motherboard, improving the operating temperature of the BMS motherboard.

[0008] Preferably, the BMS cooling chamber includes a cooling chamber body, which is thicker at both ends and thinner in the middle, with a hollow interior forming a coolant storage chamber. The BMS cooling chamber has a simple structure and is easy to manufacture; the thicker ends and thinner middle of the cooling chamber body ensure sufficient installation space for the connectors at both ends, and also provide ample contact area between the bottom of the BMS motherboard and the top cover of the cooling chamber. Furthermore, the coolant flow rate in the thinner middle section is relatively faster than in the thicker ends, further improving the cooling effect.

[0009] Preferably, the BMS cooling chamber includes a first coolant storage chamber, a second coolant storage chamber, and a third coolant storage chamber. The first and third coolant storage chambers are of the same size and are symmetrically arranged at both ends of the second coolant storage chamber. The depth of the second coolant storage chamber is less than that of the first and third coolant storage chambers. Dividing the BMS cooling chamber into three coolant storage areas not only allows for the holding of sufficient coolant but also enables zoned cooling of the BMS motherboard's heat dissipation characteristics, ensuring efficient heat dissipation.

[0010] Preferably, the coolant inlet is located on the side of the first coolant storage chamber, and the coolant outlet is located at the bottom of the third coolant storage chamber. This ensures both smooth coolant flow within the BMS cooling chamber and sufficient heat exchange between the coolant and the BMS mainboard.

[0011] Preferably, the BMS cooling chamber is provided with a first fixing connection hole for fixed connection with the BMS motherboard. This ensures structural stability and a reliable connection.

[0012] Preferably, the BMS cooling chamber has outwardly extending and downwardly bent connecting lugs at both ends, and the connecting lugs have second fixing connection holes. This ensures that the BMS cooling chamber has sufficient installation space for other components.

[0013] Preferably, the BMS cooling chamber is fixedly mounted on the upper end of the connecting bracket via a second fixing connection hole on the connecting ear plate, and the lower end of the connecting bracket is fixedly mounted on the bottom liquid cooling plate. This ensures the stability of the overall structure.

[0014] A battery characterized in that it has the above-mentioned BMS motherboard cooling device.

[0015] The beneficial effects of this invention are as follows: By setting a BMS cooling chamber at the bottom of the BMS motherboard, the coolant in the battery pack cooling circuit is introduced into the BMS cooling chamber. The coolant flowing through the BMS cooling chamber dissipates heat from the BMS motherboard, improving the operating temperature of the BMS motherboard without increasing power consumption. This reduces the impact of high temperatures on the function and lifespan of the internal electronic components of the BMS to a certain extent. Simultaneously, the BMS cooling chamber features a hollow design with a structure that is thicker at both ends and thinner in the middle. This ensures sufficient installation space for the connectors at both ends and provides ample contact area between the bottom of the BMS motherboard and the top cover of the cooling chamber. Furthermore, the coolant flow rate in the thinner middle section is faster than in the thicker ends, further enhancing the cooling effect. Attached Figure Description

[0016] Figure 1 It is a structural diagram of the utility model;

[0017] Figure 2 This is a schematic diagram of the connection structure between the BMS motherboard and the BMS cooling chamber;

[0018] Figure 3 This is a schematic diagram of the structure of the upper part of the BMS cooling chamber cover;

[0019] Figure 4 A schematic diagram of the BMS cooling chamber without its top cover;

[0020] The components include: 1. BMS mainboard; 2. BMS cooling chamber; 20. Coolant storage chamber; 201. First coolant storage chamber; 202. Second coolant storage chamber; 203. Third coolant storage chamber; 21. Coolant inlet; 22. Coolant outlet; 23. Connecting lug; 24. First fixing connection hole; 25. Second fixing connection hole; 26. Top cover; 3. Bottom liquid cooling plate; 4. Connecting bracket. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0022] like Figure 1-2 As shown, a BMS motherboard cooling device of this utility model includes a BMS cooling chamber 2 fixedly installed below the BMS motherboard 1. The heat exchange surface (i.e., the upper cover 26) at the top of the BMS cooling chamber 2 is in close contact with the heat dissipation surface at the bottom of the BMS motherboard 1. The BMS cooling chamber 2 is provided with a coolant inlet 21 and a coolant outlet 22. The coolant outlet 22 is connected to the inlet of the bottom liquid cooling plate.

[0023] The coolant in the battery pack liquid cooling circuit enters the BMS cooling chamber 2 through the coolant inlet 21. Inside the BMS cooling chamber 2, the coolant exchanges heat with the BMS mainboard 1, dissipating heat and ensuring the BMS mainboard operates at a suitable ambient temperature. After heat exchange, the coolant flows out of the BMS cooling chamber 2 through the coolant outlet 22 and then flows into the bottom liquid cooling plate through the bottom liquid cooling plate inlet. This invention utilizes the convenience of the battery pack liquid cooling circuit by adding a BMS cooling chamber 2 at the bottom of the BMS mainboard 1. The coolant flowing through the BMS cooling chamber 2 dissipates heat from the BMS mainboard 1, improving the operating ambient temperature of the BMS mainboard 1 without increasing power consumption, and to some extent reducing the impact of high temperatures on the function and lifespan of the internal electronic components of the BMS.

[0024] In this embodiment, the BMS cooling chamber 2 is disposed between the BMS mainboard 1 and the bottom liquid cooling plate 3. The coolant flowing through the BMS cooling chamber 2 quickly removes heat from the BMS mainboard 1, improving the operating temperature of the BMS mainboard 1.

[0025] Combination Figure 3 As shown, in this embodiment, the BMS cooling chamber 2 includes a cooling chamber body, which is thicker at both ends and thinner in the middle, with a hollow interior forming a coolant storage chamber 20. The BMS cooling chamber 2 has a simple structure and is easy to manufacture; the thicker ends and thinner middle of the cooling chamber body ensure that the connectors at both ends have sufficient installation space, and also provide sufficient contact area between the bottom of the BMS motherboard 1 and the top cover 26 of the BMS cooling chamber 2. At the same time, the coolant flow rate in the thinner middle part is relatively faster than that in the thicker ends, further improving the cooling effect.

[0026] Combination Figure 3As shown, in this embodiment, the BMS cooling chamber 2 is a hollow rectangle (or other shapes); the lower end is closed, and the middle part is recessed inward to form a thinned structure; the upper end is flush and has a cover 26 to form a closed structure. The BMS cooling chamber 2 includes a first coolant storage chamber 201, a second coolant storage chamber 202, and a third coolant storage chamber 203. The first coolant storage chamber 201, the second coolant storage chamber 202, and the third coolant storage chamber 203 together constitute the coolant storage chamber 20. The second coolant storage chamber 202 is located at the recessed thinned structure in the middle. The first coolant storage chamber 201 and the third coolant storage chamber 203 are the same size and are symmetrically arranged at both ends of the second coolant storage chamber 202. The depth of the second coolant storage chamber 202 is less than that of the first coolant storage chamber 201 and the third coolant storage chamber 203. The BMS cooling chamber 2 is divided into three coolant storage areas, which can not only hold enough coolant, but also cool the BMS motherboard 1 in different areas to ensure heat dissipation efficiency.

[0027] In this embodiment, the coolant inlet 21 is located on the side of the first coolant storage chamber 201, and the coolant outlet 22 is located at the bottom of the third coolant storage chamber 203. This ensures both smooth flow of coolant within the BMS cooling chamber 2 and sufficient heat exchange between the coolant in the BMS cooling chamber 2 and the BMS mainboard 1.

[0028] In this embodiment, the BMS cooling chamber 2 is provided with a first fixing connection hole 24 for fixed connection with the BMS mainboard 1. The structure is stable and the connection is reliable.

[0029] In this embodiment, the BMS cooling chamber 2 has connecting lugs 23 extending outward and bending downward at both ends, and the connecting lugs 23 have second fixing connection holes 25. This ensures that the BMS cooling chamber 2 has sufficient installation space for other components.

[0030] In this embodiment, the BMS cooling chamber 2 is fixedly mounted on the upper end of the connecting bracket 4 via the second fixed connection hole 25 on the connecting ear plate 23, and the lower end of the connecting bracket 4 is fixedly mounted on the bottom liquid cooling plate 3. This ensures the stability of the overall structure.

[0031] The present invention provides a battery having the aforementioned BMS motherboard cooling device.

[0032] The foregoing has shown and described the basic principles and main structural features of this utility model. This utility model is not limited to the above examples; various changes and modifications can be made without departing from the spirit and scope of this utility model, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A BMS motherboard cooling device, characterized in that: It includes a BMS cooling chamber (2) fixedly installed below the BMS motherboard (1). The top heat exchange surface of the BMS cooling chamber (2) is in close contact with the bottom heat dissipation surface of the BMS motherboard (1). The BMS cooling chamber (2) is provided with a coolant inlet (21) and a coolant outlet (22). The coolant outlet (22) is connected to the bottom liquid cooling plate inlet.

2. The BMS motherboard cooling device according to claim 1, characterized in that: The BMS cooling chamber (2) is located between the BMS main board (1) and the bottom liquid cooling plate (3).

3. The BMS motherboard cooling device according to claim 1, characterized in that: The BMS cooling chamber (2) includes a cooling chamber body, which is thick at both ends and thin in the middle, and has a hollow interior to form a coolant storage chamber (20).

4. The BMS motherboard cooling device according to claim 1, characterized in that: The BMS cooling chamber (2) includes a first coolant storage chamber (201), a second coolant storage chamber (202), and a third coolant storage chamber (203). The first coolant storage chamber (201) and the third coolant storage chamber (203) are the same size and are symmetrically arranged at both ends of the second coolant storage chamber (202). The depth of the second coolant storage chamber (202) is less than that of the first coolant storage chamber (201) and the third coolant storage chamber (203).

5. The BMS motherboard cooling device according to claim 4, characterized in that: The coolant inlet (21) is located on the side of the first coolant storage chamber (201), and the coolant outlet (22) is located at the bottom of the third coolant storage chamber (203).

6. The BMS motherboard cooling device according to claim 1, characterized in that: The BMS cooling chamber (2) is provided with a first fixed connection hole (24) for fixed connection with the BMS motherboard (1).

7. The BMS motherboard cooling device according to claim 1, characterized in that: The BMS cooling chamber (2) has connecting ear plates (23) that extend outward and bend downward at both ends, and the connecting ear plates (23) have second fixed connection holes (25).

8. The BMS motherboard cooling device according to claim 7, characterized in that: The BMS cooling chamber (2) is fixedly mounted on the upper end of the connecting bracket (4) through the second fixed connection hole (25) on the connecting ear plate (23), and the lower end of the connecting bracket (4) is fixedly mounted on the bottom liquid cooling plate (3).

9. A battery, characterized in that: It has a BMS motherboard cooling device as described in any one of claims 1 to 8.

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