Heat dissipation system

Abstract

The utility model provides a heat dissipation system, and belongs to the technical field of device heat dissipation. The heat dissipation system comprises a heat source, a graphene gasket and a radiator which are sequentially distributed in a stacked mode in the overlapping direction, the graphene gasket comprises a gasket body and a wrapping piece which covers the circumferential edge of the gasket body and is bonded with the gasket body, and the circumferential edge of the gasket body protrudes out of the heat source and the radiator. According to the heat dissipation system, gaps are formed between the wrapping pieces and the heat source as well as between the wrapping pieces and the heat radiator, the wrapping pieces have lap joint areas at any corners of the gasket body in the circumferential direction of the gasket body, and the wrapping pieces located in the lap joint areas are bonded, so that the problem that the wrapping pieces are prone to falling off after being heated can be effectively solved; therefore, the problem of powder falling on the side surface of the graphene gasket can be better solved.

Description

Technical Field

[0001] This application relates to the field of device heat dissipation technology, and more specifically, to a heat dissipation system. Background Technology

[0002] In existing technologies, graphene, due to its excellent thermal conductivity, is one of the ideal materials for preparing thermal pads. Specifically, graphene thermal pads are typically installed between a heat source (such as electronic devices) and a heat sink to quickly transfer heat generated by the heat source to the heat sink, thereby achieving efficient heat dissipation and maintaining the normal operation of the heat source. However, the process of preparing thermal pads using graphene often employs a layering and slicing process, resulting in cut edges on the sides of the graphene pad. These cut edges are prone to powder shedding. Because the shedding powder has good conductivity, if it falls onto a circuit board, it can easily cause a short circuit, damaging electronic devices. Therefore, a wrapper is usually bonded to the circumferential edge of the thermal pad to solve the problem of short circuits caused by powder shedding. However, existing wrappers have suboptimal placement, leading to the problem of the wrapper easily detaching due to heat during heat transfer. Utility Model Content

[0003] The purpose of this application is to provide a heat dissipation system that can effectively solve the problem of packaging materials easily falling off after being heated, so as to better solve the problem of powder falling off the sides of graphene pads.

[0004] The embodiments of this application are implemented as follows:

[0005] This application provides a heat dissipation system, including a heat source, a graphene pad, and a heat sink stacked sequentially along the overlapping direction. The graphene pad includes a pad body and a wrapping element covering the circumferential edge of the pad body and bonded to the pad body. The circumferential edge of the pad body protrudes from the heat source and the heat sink. There are gaps between the wrapping element and the heat source and the heat sink. In the circumferential direction of the pad body, the wrapping element has an overlap area at any corner of the pad body, and the wrapping element located in the overlap area is bonded.

[0006] In existing technologies, packages are typically bonded directly to the gasket body using adhesives. However, under prolonged pressure and high temperatures, these adhesives are prone to aging and failure, leading to package detachment. In this application, researchers have optimized the structure of the package at the corners of the gasket body. Specifically, in the circumferential direction of the gasket body, the package has an overlapping area at any corner, and packages within this overlapping area are bonded together. This adds mutually bonded overlapping areas at the corners, allowing for two connection methods at the corners: one is bonding the package to the gasket body, and the other is bonding the packages to each other within the overlapping area. This specific arrangement can provide auxiliary connection and fixation when the connection between the package and the gasket body becomes loose. Furthermore, the bonding between packages offers a stronger bond, resulting in a more secure overall connection between the package and the gasket body, effectively solving the problem of packages easily detaching after heating.

[0007] In some alternative implementations, the area of ​​each overlap region is 0.25–1 mm. 2 .

[0008] In the above technical solution, the area of ​​each overlapping region is limited to a specific range, which can better balance the bonding stability and manufacturing cost.

[0009] In some alternative embodiments, the gasket body has a first surface that contacts the heat source and a second surface that contacts the radiator, and the package covers the circumferential side of the gasket body, the circumferential edge of the first surface of the gasket body and the circumferential edge of the second surface of the gasket body, and in the circumferential direction of the gasket body, the circumferential edges of the first surface and the circumferential edges of the second surface have overlapping areas at any corner of the gasket body.

[0010] In the above technical solution, the package simultaneously covers the circumferential side of the gasket body, the circumferential edge of the first surface of the gasket body, and the circumferential edge of the second surface of the gasket body, so as to achieve complete coverage of the circumferential edge of the gasket body, thereby more thoroughly solving the problem of powder falling off the side; in addition, the circumferential edges of the two surfaces are provided with overlapping areas at any corner of the gasket body, which can further improve the stability of the connection and fixation between the package and the gasket body, thereby better solving the problem that the package is easy to fall off after being heated.

[0011] In some alternative implementations, the overlapping area on the circumferential edge of the first surface is the first overlapping area, and the overlapping area on the circumferential edge of the second surface is the second overlapping area. In the overlapping direction, the orthographic projections of the first overlapping area and the corresponding second overlapping area coincide.

[0012] In the above technical solution, the first overlapping area and the corresponding second overlapping area are set to coincide in the orthographic projection in the overlapping direction, so that the reference for the setting position of the two corresponding overlapping areas is the same, which facilitates the setting of the wrapping component. At the same time, it also makes the structure of the entire graphene pad more regular.

[0013] In some alternative implementations, at each corner of the graphene pad, an overlap area is covered between the outer corner and the inner corner of the package.

[0014] In the above technical solution, an overlap area is provided between the outer corner and the inner corner of the package, so that the arrangement of the overlap area is more reasonable and thus facilitates the setting of the overlap area.

[0015] In some alternative implementations, the orthographic projection of the gasket body in the overlapping direction is rectangular, and at each corner of the graphene gasket, the overlapping area is symmetrical about the extension of the line connecting the corresponding outer and inner corners.

[0016] In the above technical solution, the shape of the orthographic projection of the gasket body is set to a rectangle, which has the advantage of a wide range of applications. In addition, based on the rectangular shape of the orthographic projection of the graphene gasket, the overlapping area at each corner is set to be symmetrical about the extension line of the line connecting the corresponding outer corner and the inner corner, which has the advantage of facilitating the setting of the overlapping area. At the same time, the relatively regular shape also facilitates the industrial manufacturing of the package.

[0017] In some alternative implementations, the width of the package covering the first surface and the width covering the second surface are both 0.5 to 1.5 mm.

[0018] In the above technical solution, the width of the package on both surfaces is limited to a specific range so that the package can wrap the circumferential edge of the gasket body relatively completely, while also effectively improving the mechanical strength of the gasket body.

[0019] In some alternative embodiments, the thickness of the package is 5 to 50 μm, and / or the thickness of the gasket body is 0.2 to 0.4 mm.

[0020] In the above technical solution, the thickness of the package is limited to a specific range so that the package and the gasket body have a high bonding force after bonding and are not easily peeled off under external force; in addition, the thickness of the gasket body is limited to a specific range so that the gasket body has the advantages of good heat conduction and high structural strength.

[0021] In some alternative implementations, the distance between the side of the package closest to the heat source and the edge of the heat source is 0.1 to 1 mm.

[0022] In the above technical solution, the gap size between the package and the heat source is limited to a specific range so that there is a suitable distance between the edge of the package and the edge of the heat source. On the one hand, limiting the lower limit of the gap size can effectively reduce the impact of the heat generated by the heat source during operation on the bonding joint between the package and the gasket body (i.e., reduce the heat transferred to the bonding joint), so as to solve the problem of the package easily falling off after being heated from another perspective. On the other hand, limiting the upper limit of the gap size can effectively solve the problem of the gasket body being unstable and easily broken due to the vibration of the heat source during operation.

[0023] In some alternative implementations, the package is made of any one of polyurethane, polysiloxane, styrene-butadiene latex, paraffin wax, polyethylene terephthalate, epoxy resin, polyethylene, acrylic resin, and polyimide.

[0024] In the above technical solutions, there are many types of materials that can be used for the package, which can provide a variety of feasible solutions, thereby facilitating the promotion and application of the technical solutions provided in the embodiments of this application. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a cross-sectional schematic diagram of a heat dissipation system provided in an embodiment of this application;

[0027] Figure 2 This is a schematic diagram of the structure of a graphene gasket provided in an embodiment of this application;

[0028] Figure 3 for Figure 2 A magnified view of a portion of point A in the middle.

[0029] Icons: 10-Heat dissipation system; 100-Heat source; 200-Graphene pad; 210-Pad body; 211-First surface; 212-Second surface; 213-Circumferential side; 220-Wrapper; 221-Outer corner; 222-Inner corner; 230-Overlapping area; 300-Heat sink. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0033] In the description of this application, it should be noted that the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0034] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] The following is a detailed description of a heat dissipation system according to this application.

[0036] See Figure 1 and Figure 2This application provides a heat dissipation system 10, including a heat source 100, a graphene pad 200, and a heat sink 300 stacked sequentially along the overlapping direction. The graphene pad 200 includes a pad body 210 and a wrapping member 220 covering the circumferential edge of the pad body 210 and bonded to the pad body 210. The circumferential edge of the pad body 210 protrudes from the heat source 100 and the heat sink 300. There are gaps between the wrapping member 220 and the heat source 100 and the heat sink 300. In the circumferential direction of the pad body 210, the wrapping member 220 has an overlap area 230 at any corner of the pad body 210, and the wrapping member 220 located in the overlap area 230 is bonded.

[0037] In this application, the package 220 is generally bonded directly to the gasket body 210 with an adhesive. Under long-term pressure and high temperature conditions, the adhesive is prone to aging and failure, resulting in the package 220 falling off. In this application, the researchers optimized the structure of the package 220 at the corner of the gasket body 210. Specifically, in the circumferential direction of the gasket body 210, the package 220 is provided with an overlap area 230 at any corner of the gasket body 210, and the package 220 within the overlap area 230 is bonded. That is, the package 220 adds an overlap area 230 for mutual bonding at the corner of the gasket body 210, so that the package 220 has two connection methods at the corner: one is the package 220 and the gasket. The main body 210 is bonded, and the second is that the package 220 in the overlapping area 230 is bonded to the package 220. This specific arrangement can play an auxiliary role in fixing the connection when the connection between the package 220 and the gasket main body 210 becomes loose. At the same time, the bonding between the package 220 and the package 220 has the advantage of being more firmly bonded, so that the connection between the package 220 and the gasket main body 210 is more secure, thereby effectively solving the problem that the package 220 is easy to fall off after being heated.

[0038] See Figure 1 As an example, heat source 100 is flush with the circumferential edge of radiator 300.

[0039] In this embodiment, the heat source 100 and the radiator 300 are set to be flush with each other, which can better transfer the heat of the heat source 100 to the radiator 300 through the graphene pad 200, thereby achieving a better heat dissipation effect. At the same time, it also makes the entire heat dissipation system 10 have the advantage of a more regular overall structure.

[0040] It is understandable that the bonding stability of the package 220 within the overlapping area 230 is directly related to the area of ​​the overlapping area 230. Based on this, considering the connection stability, the area of ​​the overlapping area 230 can be optimized.

[0041] As an example, the area of ​​each overlapping region 230 is 0.25–1 mm. 2 For example, but not limited to, an area of ​​0.25 mm 2 0.5mm 2 0.75mm 2 and 1mm 2 The value of any one of the points or the range between any two.

[0042] In this embodiment, limiting the area of ​​each overlapping region 230 to a specific range can better balance bonding stability and manufacturing cost.

[0043] It should be noted that the form in which the package 220 covers the circumferential edge of the gasket body 210 is not limited. For example, it can cover the circumferential side 213 of the gasket body 210 and one of the contact surfaces of the gasket body 210 (e.g., the surface in contact with the heat source 100), or it can cover the circumferential side 213 of the gasket body 210 and both contact surfaces of the gasket body 210. The specific form can be adjusted according to actual needs.

[0044] See Figure 1 As an example, the gasket body 210 has a first surface 211 that contacts the heat source 100 and a second surface 212 that contacts the heat sink 300. The wrapping member 220 covers the circumferential side 213 of the gasket body 210, the circumferential edge of the first surface 211 of the gasket body 210 and the circumferential edge of the second surface 212 of the gasket body 210. In the circumferential direction of the gasket body 210, the circumferential edges of the first surface 211 and the circumferential edges of the second surface 212 have an overlap area 230 at any corner of the gasket body 210.

[0045] In this embodiment, the package 220 simultaneously covers the circumferential side 213 of the gasket body 210, the circumferential edge of the first surface 211 of the gasket body 210, and the circumferential edge of the second surface 212 of the gasket body 210, so as to completely cover the circumferential edge of the gasket body 210, thereby more thoroughly solving the problem of powder falling off its side. In addition, the circumferential edges of the two surfaces are provided with overlapping areas 230 at any corner of the gasket body 210, which can further improve the stability of the connection and fixation between the package 220 and the gasket body 210, thereby better solving the problem that the package 220 is easy to fall off after being heated.

[0046] As an example, the overlapping area 230 on the circumferential edge of the first surface 211 is the first overlapping area, and the overlapping area 230 on the circumferential edge of the second surface 212 is the second overlapping area. In the overlapping direction, the orthographic projections of the first overlapping area and the corresponding second overlapping area coincide.

[0047] In this embodiment, the first overlapping area and the corresponding second overlapping area are set to coincide in the orthographic projection in the overlapping direction, so that the reference for the setting position of the two corresponding overlapping areas 230 is the same, which facilitates the setting of the wrapping 220. At the same time, it also makes the structure of the entire graphene pad 200 more regular.

[0048] In other possible implementations, the orthographic projections of the first overlapping region and the corresponding second overlapping region in the overlapping direction may also be non-overlapping.

[0049] It should be noted that the distribution of the overlapping area 230 at the corner is not limited and can be adjusted according to actual needs.

[0050] See Figure 2 and Figure 3 As an example, at each corner of the graphene pad 200, an overlap area 230 is covered between the outer corner 221 and the inner corner 222 of the package 220.

[0051] In this embodiment, an overlap area 230 is provided between the outer corner 221 and the inner corner 222 of the package 220, so that the arrangement of the overlap area 230 is more reasonable and thus facilitates the arrangement of the overlap area 230.

[0052] See Figure 3 As an example, in the overlapping direction, the orthographic projection of the gasket body 210 is rectangular, and at each corner of the graphene gasket 200, the overlapping area 230 is symmetrical about the extension of the line connecting the corresponding outer corner 221 and inner corner 222 (specifically, Figure 3 The dashed line L in the diagram is the extension of the connecting line.

[0053] In this embodiment, the shape of the orthographic projection of the gasket body 210 is set to a rectangle, which gives the graphene gasket 200 a wide range of applications. Furthermore, based on the rectangular shape of the orthographic projection of the graphene gasket 200, the overlapping area 230 at each corner is set to be symmetrical about the extension of the line connecting the corresponding outer corner 221 and inner corner 222. This has the advantage of facilitating the setting of the overlapping area 230. At the same time, the relatively regular shape also facilitates the industrial manufacturing of the package 220.

[0054] It should be noted that the configuration of the gasket body 210 is not limited to a rectangular shape in the orthographic projection in the overlapping direction. It can be adapted to actual needs, and can also be a square, a circle or an ellipse.

[0055] See Figure 3It should be noted that the shape of the package 220 within the overlapping area 230 is not limited and can be adapted to actual needs. For example, in the overlapping direction, the shape of the orthographic projection of the package 220 within the overlapping area 230 can be a regular shape such as a rectangle, elongated rectangle, ellipse or regular polygon, or it can be an irregular shape.

[0056] It should be noted that the coverage width of the package 220 on both surfaces is not limited and can be adjusted adaptively according to actual needs.

[0057] As an example, the width of the package 220 covering the first surface 211 and the width covering the second surface 212 are both 0.5 to 1.5 mm, for example, but not limited to any one of 0.5 mm, 0.8 mm, 1.0 mm, 1.2 mm and 1.5 mm or any range between the two.

[0058] In this embodiment, the width of the wrapping member 220 on both surfaces is limited to a specific range so that the wrapping member 220 can wrap the circumferential edge of the gasket body 210 relatively completely, while also effectively improving the mechanical strength of the gasket body 210.

[0059] It should be noted that the thickness of the package 220 and the gasket body 210 is not limited and can be adjusted according to actual needs.

[0060] As an example, the thickness of the package 220 is 5 to 50 μm, for example, but not limited to any one of the thicknesses of 5 μm, 10 μm, 20 μm, 30 μm, 40 μm and 50 μm or any range between two; and / or, the thickness of the gasket body 210 is 0.2 to 0.4 mm, for example, but not limited to any one of the thicknesses of 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm and 0.4 mm or any range between two.

[0061] In this embodiment, the thickness of the package 220 is limited to a specific range so that the package 220 and the gasket body 210 have a high bonding force after being bonded together and are not easily peeled off under external force. In addition, the thickness of the gasket body 210 is limited to a specific range so that the gasket body 210 has the advantages of good heat conduction and high structural strength.

[0062] It should be noted that the inventors have also discovered that in the prior art, although the gasket body 210 of the graphene gasket 200 is provided with a wrapping element 220, the distance between the edge of the wrapping element 220 and the edge of the heat source 100 is not specifically designed. If the distance between the edge of the wrapping element 220 and the edge of the heat source 100 is too large, that is, the gasket body 210 protrudes too much from the heat source 100 and the heat sink 300, coupled with the vibration that the heat source 100 usually experiences during normal operation, the gasket becomes unstable and prone to breakage. If the distance between the edge of the wrapping element 220 and the edge of the heat source 100 is too small, the wrapping element 220 is usually bonded to the gasket body 210. Furthermore, the continuous heat generation by the heat source 100 during normal operation causes the adhesive layer to age easily due to heat, leading to the wrapping element 220 easily detaching and failing. Based on this, the gap size between the wrapping element 220 and the heat source 100 can be optimized.

[0063] As an example, the distance between the side of the package 220 closest to the heat source 100 and the edge of the heat source 100 is 0.1 to 1 mm, for example, but not limited to any one of 0.1 mm, 0.2 mm, 0.4 mm, 0.6 mm, 0.8 mm and 1 mm or any range between two of them.

[0064] In this embodiment, the gap size between the package 220 and the heat source 100 is limited to a specific range so that there is a suitable distance between the edge of the package 220 and the edge of the heat source 100. On the one hand, limiting the lower limit of the gap size can effectively reduce the impact of the heat generated by the heat source 100 during operation on the bonding joint between the package 220 and the gasket body 210 (i.e., reduce the heat transferred to the bonding joint), so as to solve the problem that the package 220 is easy to fall off after being heated from another perspective. On the other hand, limiting the upper limit of the gap size can effectively solve the problem that the gasket body 210 is unstable and easy to break during the vibration of the heat source 100 during operation.

[0065] As an example, the distance between the side of the package 220 near the heat sink 300 and the edge of the heat sink 300 is 0.1 to 1 mm.

[0066] In this embodiment, the distance between the edge of the package 220 and the edge of the heat sink 300, and the distance between the edge of the package 220 and the edge of the heat source 100 are both limited to a specific range of 0.1 to 1 mm, so that the structure of the package 220 is more symmetrical, which facilitates the manufacturing process and also helps to improve the structural regularity of the entire heat dissipation system 10.

[0067] As an example, the material of package 220 is any one of polyurethane, polysiloxane, styrene-butadiene latex, paraffin wax, polyethylene terephthalate, epoxy resin, polyethylene, acrylic resin and polyimide.

[0068] In this embodiment, the materials of the package 220 can be of a wide variety, providing more feasible implementation schemes, thereby facilitating the promotion and application of the technical solutions provided in the embodiments of this application.

[0069] As an example, heat source 100 is an electronic device, such as, but not limited to, a CPU or GPU.

[0070] It should be noted that any structural or functional units in the heat dissipation system 10 that are not specifically described or limited can be configured in accordance with conventional choices in the art.

[0071] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heat dissipation system, characterized in that, The device includes a heat source, a graphene pad, and a heat sink, which are stacked sequentially along the overlapping direction. The graphene pad includes a pad body and a wrapping element that covers the circumferential edge of the pad body and is bonded to the pad body. The circumferential edge of the pad body protrudes from the heat source and the heat sink. There are gaps between the wrapping element and the heat source and the heat sink. In the circumferential direction of the pad body, the wrapping element has an overlap area at any corner of the pad body, and the wrapping element located in the overlap area is bonded.

2. The heat dissipation system according to claim 1, characterized in that, The area of ​​each overlapping region is 0.25–1 mm. 2 .

3. The heat dissipation system according to claim 1 or 2, characterized in that, The pad body has a first surface that contacts the heat source and a second surface that contacts the radiator. The package covers the circumferential side of the pad body, the circumferential edge of the first surface of the pad body and the circumferential edge of the second surface of the pad body. In the circumferential direction of the pad body, the circumferential edges of the first surface and the circumferential edges of the second surface have overlapping areas at any corner of the pad body.

4. The heat dissipation system according to claim 3, characterized in that, The overlapping area on the circumferential edge of the first surface is the first overlapping area, and the overlapping area on the circumferential edge of the second surface is the second overlapping area. In the overlapping direction, the orthographic projections of the first overlapping area and the corresponding second overlapping area coincide.

5. The heat dissipation system according to claim 4, characterized in that, At each corner of the graphene pad, the overlapping area is covered between the outer corner and the inner corner of the package.

6. The heat dissipation system according to claim 5, characterized in that, In the overlapping direction, the orthographic projection of the gasket body is rectangular, and at each corner of the graphene gasket, the overlapping area is symmetrical about the extension of the line connecting the corresponding outer corner and the inner corner.

7. The heat dissipation system according to claim 3, characterized in that, The width of the package covering the first surface and the width of the package covering the second surface are both 0.5 to 1.5 mm.

8. The heat dissipation system according to claim 3, characterized in that, The thickness of the package is 5 to 50 μm, and / or the thickness of the gasket body is 0.2 to 0.4 mm.

9. The heat dissipation system according to claim 1, characterized in that, The distance between the side of the package closest to the heat source and the edge of the heat source is 0.1 to 1 mm.

10. The heat dissipation system according to claim 1, characterized in that, The material of the package is any one of polyurethane, polysiloxane, styrene-butadiene latex, paraffin wax, polyethylene terephthalate, epoxy resin, polyethylene, acrylic resin and polyimide.

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