Inverter, motor controller and vehicle
Through integrated liquid-cooled heat dissipation capacitors and laser welding technology, the heat dissipation problem of motor controllers in new energy vehicles is solved, the miniaturization and low-cost platform design of the inverter are realized, and the adaptability and reliability of the motor controller are improved.
Patent Information
- Application Number
- CN202422988191.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-12-04
AI Technical Summary
In new energy vehicles, the high-voltage film capacitors and power semiconductor devices of the motor controller have poor heat dissipation effects, resulting in large size and high cost. In addition, the traditional inverter structure does not have the platform advantage, which increases the development difficulty and cost.
It uses integrated liquid-cooled heat dissipation capacitors to dissipate heat for high-voltage film capacitors and power semiconductor devices simultaneously through liquid-cooled radiators. Liquid-cooled radiators are used to achieve indirect heat dissipation of high-voltage film capacitors, and laser welding is used to reduce contact resistance. The drive and control parts are integrated on the same circuit board.
It achieves efficient heat dissipation, reduces the size and weight of the inverter, improves reliability, reduces production costs, and realizes platform design of the inverter, reducing the R&D time and cost of the motor controller.
Smart Images
Figure CN223488640U_ABST
Abstract
Description
Technical Field
[0001] This specification relates to the field of vehicle technology, specifically to an inverter, a motor controller, and a vehicle. Background Technology
[0002] Motor controllers, as core components of new energy vehicles, face challenges such as large size, difficult manufacturing, and high cost. New energy vehicles need to convert the direct current from the battery into three-phase alternating current to drive the motor. To ensure voltage stability during the conversion process, high-voltage film capacitors are required to filter and absorb voltage spikes and high pulse currents while reducing inductance. Currently, many capacitors on the market use direct or indirect heat dissipation methods, which have relatively poor heat dissipation effects. Summary of the Invention
[0003] In view of this, embodiments of this specification provide an inverter, a motor controller, and a vehicle. By incorporating an integrated liquid-cooled heat dissipation capacitor, the liquid cooler directly dissipates heat from the power semiconductor devices and indirectly dissipates heat from the high-voltage film capacitor. This allows for simultaneous heat dissipation of both the high-voltage film capacitor and the power semiconductor devices through a single liquid cooler, resulting in excellent heat dissipation performance.
[0004] This specification provides the following technical solution through its embodiments: an inverter, comprising:
[0005] An integrated drive control board, comprising a drive unit and a control unit mounted on the same circuit board;
[0006] Onboard current sensor is used to detect the conversion of DC power to three-phase AC power;
[0007] An integrated liquid-cooled heat dissipation capacitor includes a high-voltage film capacitor and a liquid-cooled heat sink, wherein the high-voltage film capacitor is at least partially in contact with the liquid-cooled heat sink, and the liquid-cooled heat sink is provided with a liquid inlet and a liquid outlet.
[0008] A power semiconductor device, wherein at least part of the power semiconductor device is in contact with the liquid-cooled heat sink, and the high-voltage thin-film capacitor is connected to the positive and negative terminals of the upper side of the power semiconductor device through a positive terminal transfer copper busbar and a negative terminal transfer copper busbar, respectively, and the lower side of the power semiconductor device is connected to a three-phase copper busbar.
[0009] Preferably, the liquid-cooled radiator includes a housing, a water-cooling plate, and a sealing ring. The high-voltage film capacitor is at least partially inserted into the housing. The water-cooling plate has multiple protruding copper pins positioned in the water channels of the housing and sealed by the sealing ring.
[0010] Preferably, the liquid-cooled heat sink further includes an insulating cover, which is disposed between the heat dissipation water-cooling plate and the power semiconductor device.
[0011] Preferably, the liquid-cooled radiator further includes a water temperature sensor, which measures the liquid temperature at the inlet and outlet.
[0012] Preferably, the onboard current sensor is integrated on the support base of the three-phase copper busbar, and the AC copper busbars of the three-phase copper busbar pass through the magnet of the onboard current sensor to complete the current signal acquisition and feed the current signal back to the integrated drive control board.
[0013] Preferably, the integrated drive control board has a through slot for the onboard current sensor to pass through.
[0014] Preferably, the high-voltage film capacitor is formed by welding one or more capacitor cores to a laminated busbar.
[0015] Preferably, the lower portion of the power semiconductor device is connected to the three-phase copper busbar via laser welding.
[0016] A motor controller includes a filter, a three-phase terminal block, and an inverter as described in any of the preceding claims, wherein the filter is connected to the high-voltage thin-film capacitor, and the three-phase terminal block is connected to the three-phase copper busbar.
[0017] A vehicle includes a motor controller as described above.
[0018] Compared with the prior art, the beneficial effects that at least one technical solution adopted in the embodiments of this specification can achieve include at least:
[0019] By incorporating integrated liquid-cooled heat dissipation capacitors, the liquid cooler directly dissipates heat from power semiconductor devices and indirectly dissipates heat from high-voltage film capacitors. A single liquid cooler can simultaneously dissipate heat from both high-voltage film capacitors and power semiconductor devices, resulting in excellent heat dissipation. Furthermore, the drive and control units are integrated onto the same circuit board, eliminating the need for traditional cable connections. Attached Figure Description
[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is an exploded structural diagram of the inverter provided in this application;
[0022] Figure 2 This is a schematic diagram of the connection structure of the power semiconductor devices in the inverter provided in this application;
[0023] Figure 3 This is a schematic diagram of the three-phase copper busbar integrated current sensor of the inverter provided in this application;
[0024] Figure 4 This is a schematic diagram of the inverter provided in this application.
[0025] In the diagram, 010 is the housing; 020 is the positive electrode adapter copper busbar; 030 is the high-voltage film capacitor; 040 is the negative electrode adapter copper busbar; 050 is the integrated drive control board; 060 is the sealing ring; 070 is the heat dissipation water cooling plate; 080 is the insulating cover; 090 is the power semiconductor device; 100 is the three-phase copper busbar; 110 is the onboard current sensor; 101 is the magnetic core; and 102 is the chip. Detailed Implementation
[0026] The embodiments of this application will now be described in detail with reference to the accompanying drawings.
[0027] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0028] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.
[0029] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.
[0030] Additionally, in the following description, specific details are provided to provide a thorough understanding of the examples. However, one skilled in the art will appreciate that the aspects described may be practiced without these specific details.
[0031] New energy vehicles need to convert the direct current from the battery into three-phase alternating current to drive the motor. To ensure voltage stability during the conversion process, high-voltage film capacitors are required to filter and absorb voltage spikes and high pulse currents while reducing inductance. Currently, many capacitors on the market use direct or indirect heat dissipation methods, which are generally not very effective. Furthermore, these capacitors are typically large and lack platform-based advantages. To meet the needs of different customers, a completely new inverter structure is usually required, significantly increasing labor and manufacturing costs.
[0032] The technical solutions provided by the various embodiments of this application are described below with reference to the accompanying drawings.
[0033] like Figure 1-Figure 4 As shown, an inverter includes:
[0034] The integrated drive control board 050 includes a drive unit and a control unit mounted on the same circuit board, eliminating the need for traditional wiring connections.
[0035] The onboard current sensor 110 is used to detect the conversion of DC power to three-phase AC power. The onboard current sensor 110 is a device for detecting the conversion of DC power to three-phase AC power. It is integrated on the drive control board, which brings lower cost, smaller space and higher reliability.
[0036] An integrated liquid-cooled heat dissipation capacitor includes a high-voltage film capacitor 030 and a liquid-cooled heat sink, wherein the high-voltage film capacitor 030 is at least partially in contact with the liquid-cooled heat sink, and the liquid-cooled heat sink is provided with a liquid inlet and a liquid outlet.
[0037] A power semiconductor device 090 is at least partially in contact with the liquid-cooled heat sink. A high-voltage thin-film capacitor 030 is connected to the positive and negative terminals of the upper side of the power semiconductor device 090 through a positive terminal transfer copper busbar 020 and a negative terminal transfer copper busbar 040, respectively. The lower side of the power semiconductor device 090 is connected to a three-phase copper busbar 100.
[0038] By setting an integrated liquid-cooled heat dissipation capacitor, the liquid-cooled heat sink directly dissipates heat from the power semiconductor device 090 and indirectly dissipates heat from the high-voltage film capacitor 030. A single liquid-cooled heat sink can simultaneously dissipate heat from both the high-voltage film capacitor 030 and the power semiconductor device 090.
[0039] It should be noted that one end of the positive electrode adapter copper busbar 020 and the negative electrode adapter copper busbar 040 are respectively connected to the positive and negative terminals of the high-voltage film capacitor 030 by laser welding, and the other end is connected to the positive and negative terminals of one or more power semiconductor devices 090 by laser welding in the same way. Laser welding connection can minimize the heat generated by contact resistance and increase reliability.
[0040] It should also be noted that the high-voltage film capacitor 030 can be placed above or below the power semiconductor device 090, or placed side by side, etc. The power semiconductor device 090 can be a three-phase module with direct liquid cooling, a half-bridge module with direct liquid cooling, or one or more half-bridge modules with indirect heat dissipation through a water-cooled plate.
[0041] like Figure 1 As shown, in some embodiments, the liquid-cooled radiator includes a housing 010, a water-cooling plate 070, and a sealing ring 060. The high-voltage film capacitor 030 is at least partially inserted into the housing 010 and encapsulated with epoxy resin. The power semiconductor device 090 is placed above the water-cooling plate. The water-cooling plate 070 has multiple protruding copper pins placed in the water channels of the housing 010 and sealed by the sealing ring 060.
[0042] It should be noted that both the housing 010 and the heat dissipation water cooling plate 070 are made of aluminum alloy. The excellent thermal conductivity of aluminum alloy can simultaneously dissipate heat for the high-voltage film capacitor 030 and the power semiconductor device 090.
[0043] like Figure 1 As shown, in some embodiments, the liquid-cooled heat sink further includes an insulating cover 080, which is disposed between the heat dissipation water-cooling plate 070 and the power semiconductor device 090. By providing the insulating cover 080, the heat dissipation water-cooling plate 070 and the power semiconductor device 090 are kept insulated from each other, thus avoiding circuit failure.
[0044] like Figure 1As shown, in some embodiments, the liquid-cooled radiator further includes a water temperature sensor, which measures the liquid temperature at the inlet and outlet. The water temperature sensor can be directly integrated onto the water-cooling plate 070 or the insulating cover 080. The water temperature sensor can be integrated at one end onto the water-cooling plate 070 and at the other end onto the insulating cover 080, or both onto the water-cooling plate and the insulating cover 080.
[0045] like Figure 1-Figure 4 As shown, in some embodiments, the onboard current sensor 110 is integrated on the support base of the three-phase copper busbar 100, and the AC copper busbars of the three-phase copper busbar 100 pass through the magnets of the onboard current sensor 110 respectively to complete the current signal acquisition and feed the current signal back to the integrated drive control board 050 through a set of connectors. Specifically, the onboard current sensor 110 is integrated on the support base of the three-phase copper busbar 100 by injection molding the magnetic core 101 and the chip 102 into the three-phase copper busbar 100 and fixing them by soldering. The three-phase copper busbar 100 passes through the current sampling device and the magnetic ring. The current sampling device monitors the current value flowing through the three-phase copper busbar 100, and the magnetic ring filters the three-phase copper busbar 100 and suppresses noise.
[0046] like Figure 1 and Figure 4 As shown, in some embodiments, the integrated drive control board 050 has a through slot for the onboard current sensor 110 to pass through. By opening a through slot corresponding to the onboard current sensor 110 on the integrated drive control board 050, it is ensured that the onboard current sensor 110 can pass through the through slot and extend above the integrated drive control board 050.
[0047] like Figure 1-Figure 2 As shown, in some embodiments, the high-voltage film capacitor 030 is formed by welding one or more capacitor cores to a laminated busbar. The high-voltage film capacitor 030 is not limited to one chamber, but can be one or more capacitor chambers, which can achieve better heat dissipation.
[0048] like Figure 1-Figure 3 As shown, in some embodiments, the lower part of the power semiconductor device 090 is connected to the three-phase copper busbar 100 by laser welding. Laser welding technology is used at the connection and transition points of the three-phase copper busbar 100, which can greatly reduce the contact resistance at the connection point and reduce heat dissipation. Compared with the traditional bolt fastening method, it largely solves the problem of bolt loosening and falling off that may occur during long-term operation.
[0049] Based on the same technical concept, this specification provides a motor controller, including a filter, a three-phase terminal block, and an inverter as described in any of the above claims. The filter is connected to the high-voltage thin-film capacitor 030, and the three-phase terminal block is connected to the three-phase copper busbar 100.
[0050] In practice, by adopting the aforementioned inverter, the volume is reduced by about 30% and the weight by about 25% compared to traditional inverters. It also boasts higher reliability, higher power density, and lower production costs, essentially achieving a platform-based design. During the development of the motor controller, there is no need to develop the core inverter separately. The development of the electric control system can be completed simply by adding a filter before the film capacitor and a three-phase terminal block after the three-phase copper busbar. Adaptive DC input filters and three-phase terminal blocks for connecting the motor are developed for different interfaces of the motor controller, greatly reducing the development time and cost of the motor controller. The high-voltage film capacitor and inverter structure are integrated into one unit using laser welding technology, which effectively solves the problems of large size, cumbersome development process, and poor adaptability of the electric control system currently on the market.
[0051] Based on the same technical concept, this specification provides a vehicle including the motor controller as described above. By using the motor controller, the space occupied by the motor controller is greatly reduced, and it is easy to adapt to different vehicles.
[0052] The same or similar parts between the various embodiments in this specification can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the method embodiments described later are relatively simple in description since they correspond to the system, and relevant parts can be referred to the descriptions in the system embodiments.
[0053] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. An inverter, characterized in that, include: An integrated drive control board, comprising a drive unit and a control unit mounted on the same circuit board; Onboard current sensor is used to detect the conversion of DC power to three-phase AC power; An integrated liquid-cooled heat dissipation capacitor includes a high-voltage film capacitor and a liquid-cooled heat sink, wherein the high-voltage film capacitor is at least partially in contact with the liquid-cooled heat sink, and the liquid-cooled heat sink is provided with a liquid inlet and a liquid outlet. A power semiconductor device, wherein at least part of the power semiconductor device is in contact with the liquid-cooled heat sink, and the high-voltage thin-film capacitor is connected to the positive and negative terminals of the upper side of the power semiconductor device through a positive terminal transfer copper busbar and a negative terminal transfer copper busbar, respectively, and the lower side of the power semiconductor device is connected to a three-phase copper busbar.
2. The inverter according to claim 1, characterized in that, The liquid-cooled radiator includes a housing, a water-cooling plate, and a sealing ring. The high-voltage film capacitor is at least partially inserted into the housing. The water-cooling plate has multiple protruding copper pins positioned in the water channels of the housing and sealed by the sealing ring.
3. The inverter according to claim 2, characterized in that, The liquid-cooled heat sink also includes an insulating cover, which is disposed between the heat dissipation water-cooling plate and the power semiconductor device.
4. The inverter according to claim 3, characterized in that, The liquid-cooled radiator also includes a water temperature sensor, which measures the liquid temperature at the inlet and outlet.
5. The inverter according to claim 1, characterized in that, The onboard current sensor is integrated on the support base of the three-phase copper busbar, and the AC copper busbars of the three-phase copper busbar pass through the magnet of the onboard current sensor to complete the current signal acquisition and feed the current signal back to the integrated drive control board.
6. The inverter according to claim 5, characterized in that, The integrated drive control board has a through slot for the onboard current sensor to pass through.
7. The inverter according to claim 1, characterized in that, The high-voltage film capacitor is made by welding one or more capacitor cores to a stacked busbar.
8. The inverter according to claim 1, characterized in that, The lower portion of the power semiconductor device is connected to the three-phase copper busbar via laser welding.
9. A motor controller, characterized in that, The device includes a filter, a three-phase terminal block, and an inverter as described in any one of claims 1-8, wherein the filter is connected to the high-voltage thin-film capacitor, and the three-phase terminal block is connected to the three-phase copper busbar.
10. A vehicle, characterized in that, Includes the motor controller as described in claim 9.