Grinding equipment

Abstract

The grinding equipment comprises a carrying table, a grinding module, a measuring module and a processor. The platform deck supports a workpiece. The grinding module grinds the workpiece. The distance between the measuring module and the carrying table is larger than the thickness of the workpiece. The measuring module comprises an outer shell, a measuring device, an inner shell and an air pressure device. The housing has a first opening and a through hole. The measuring device and the inner shell are located in the outer shell, the inner shell is provided with a second opening and located between the outer shell and the measuring device, a first gap communicated with the first opening and the second opening is defined between the inner shell and the measuring device, and a second gap communicated with the through hole is defined between the outer shell and the inner shell. The measuring device sends and receives signals through the first opening and the second opening and measures the distance between the relative workpieces. The air pressure device supplies air to the first and second gaps. And the processor calculates the thickness of the workpiece according to the measured distance. The grinding equipment prevents water vapor from entering the non-contact measuring module, reduces the chance that the measuring device is damaged by the water vapor, blows away water and impurities on the to-be-ground piece, and improves the measuring accuracy of the measuring device.

Description

Technical Field

[0001] This utility model relates to a grinding device, and more particularly to a grinding device for grinding semiconductor packaging strips. Background Technology

[0002] As people's living standards continue to improve, electronic products are becoming increasingly important in their lives. Faced with the huge market demand for electronic products, major manufacturers are also striving to improve their brand's market competitiveness.

[0003] In fact, in addition to strengthening the research and development of electronic products' functions and performance, how to effectively optimize the production process and quality of electronic products, while reducing their production costs, is undoubtedly a key issue that manufacturers attach great importance to. Utility Model Content

[0004] One of the objectives of this invention is to provide a grinding device that can prevent moisture from entering the non-contact measurement module, thereby reducing the chance of the measuring device being damaged by moisture, and can blow away moisture and impurities on the workpiece to be ground, thereby improving the accuracy of the measurement device.

[0005] According to one embodiment of the present invention, a grinding device includes a stage, a grinding module, a non-contact measurement module, and a processor. The stage is configured to support a workpiece to be ground. The grinding module is configured to grind the workpiece. The non-contact measurement module is separated from the stage by a first distance, the first distance being greater than a first thickness of the workpiece to be ground. The non-contact measurement module includes a housing, a measuring device, an inner housing, and a pneumatic device. The housing has a first opening and a plurality of first perforations distributed around the first opening. The measuring device is located inside the housing. The inner housing has a second opening and is located inside the housing, the second opening being at least partially aligned with the first opening. The inner housing is at least partially located between the housing and the measuring device, and at least partially defines a first gap between the inner housing and the measuring device, the first gap connecting the second opening and the first opening. At least partially defines a second gap between the housing and the inner housing, the second gap connecting the first perforations. The measuring device is configured to send and receive signals to and from the workpiece to be ground through the first and second openings to measure a second distance between the device and the workpiece. The pneumatic device connects the first gap and the second gap and is configured to supply air to the first gap and the second gap respectively. The processor is connected to the measuring device and configured to calculate the first thickness of the workpiece to be ground based on the measured second distance.

[0006] In one or more embodiments of this utility model, the outer shell further includes a main body and a connecting portion. The inner shell is located inside the main body, and the first through hole is located within the main body. The connecting portion is disposed on the inner side of the main body and abuts against the inner shell; the connecting portion and the main body together define a first opening, and the first through hole surrounds the connecting portion.

[0007] In one or more embodiments of this utility model, the above-mentioned non-contact measurement module and the stage are arranged at least partially along a first direction, and the stage is configured to move relative to the non-contact measurement module along a second direction, wherein the first direction and the second direction are perpendicular to each other.

[0008] In one or more embodiments of this utility model, the above-described grinding apparatus further includes a contact measurement module. The contact measurement module is configured to contact the workpiece to be ground and measure a first thickness of the workpiece.

[0009] In one or more embodiments of this utility model, the contact measurement module and the platform are arranged at least partially along a first direction, the platform is configured to move relative to the contact measurement module along a second direction, and the contact measurement module is configured to move relative to the platform along a third direction, wherein the first direction, the second direction and the third direction are perpendicular to each other.

[0010] In one or more embodiments of this utility model, the above-described grinding apparatus further includes a carrier plate measuring module. The carrier plate measuring module includes a base, a pressing mechanism, and a measuring probe. The base has a supporting surface and is configured to support the workpiece to be ground. The pressing mechanism is connected to the base and configured to press against the side of the carrier plate away from the supporting surface. The measuring probe is connected to the pressing mechanism and configured to abut against the side of the carrier plate away from the supporting surface, thereby measuring a second thickness of the carrier plate.

[0011] In one or more embodiments of this invention, the base further has multiple first flow channels, each connected to a supporting surface. The grinding equipment also includes a first vacuum device. The first vacuum device is connected to the first flow channels and configured to draw air from the first flow channels.

[0012] In one or more embodiments of this utility model, the aforementioned stage includes a panel, an outer peripheral plate, an inner peripheral plate, and a base plate. The panel has a support area, multiple second through holes, and multiple third through holes. The support area is configured to support the workpiece to be ground and is divided into a central area and a peripheral area. The peripheral area connects to and surrounds the central area. The second through holes are connected to and distributed in the central area, and the third through holes are connected to and distributed in the peripheral areas. The outer peripheral plate surrounds and connects to the side of the panel opposite to the support area. The inner peripheral plate connects to the side of the panel opposite to the support area and surrounds to form a first space. The first space corresponds to the central area and connects to the second through holes. A second space is formed between the outer peripheral plate and the inner peripheral plate, and the second space corresponds to the peripheral area and connects to the third through holes. The base plate connects the outer peripheral plate and the inner peripheral plate to the side away from the panel. The base plate has multiple second flow channels and multiple third flow channels. The second flow channels connect to the first space, and the third flow channels connect to the second space. The grinding equipment also includes a second vacuum device. The second vacuum device connects the second flow channels and the third flow channels and is configured to draw air from the second flow channels and the third flow channels.

[0013] In one or more embodiments of this utility model, the above-mentioned grinding equipment further includes a spin-drying module. The spin-drying module includes a rotating table and two stops. The rotating table is configured to support the finished grinding workpiece and rotate about a first axis. The stops are pivotally connected to opposite ends of the rotating table about a second axis, which is perpendicular to the first axis. Each stop includes a stop section and a counterweight section. The stop section is configured to abut against the edge of the finished grinding workpiece. The stop section and the counterweight section are located on opposite sides of the second axis; the counterweight section has a first weight, and the stop section has a second weight, the first weight being greater than the second weight.

[0014] In one or more embodiments of this utility model, the aforementioned stop portions are structurally symmetrical to each other and are equidistant from the first axis.

[0015] In one or more embodiments of this utility model, each of the aforementioned stop portions further includes a curved lever, which connects to the end of the stop section away from the counterweight section. The spin-drying module also includes two guiding devices, each of which includes a guide rail, a lifting body, an actuator, and a pulley. The guide rail is configured to guide the finished grinding workpiece to move relative to the rotary table. The lifting body is connected to the guide rail. The actuator is connected to the lifting body and configured to move the lifting body along a first direction parallel to a first axis. The pulley is connected to the lifting body and configured to press against a corresponding curved lever, so that the corresponding stop portion rotates relative to the rotary table about a corresponding stop portion along a second axis.

[0016] The above-described embodiments of this utility model have at least the following advantages:

[0017] (1) When the measuring probe measures the second thickness of the carrier plate, the pressing mechanism presses the carrier plate against the support surface of the base, which can effectively prevent the carrier plate from tilting up, thus improving the accuracy of measuring the second thickness of the carrier plate.

[0018] (2) Since the first vacuum device draws air from the first flow channel of the base, it can adsorb the carrier plate of the workpiece to be ground onto the support surface of the base, thereby further preventing the carrier plate from tilting. This can also effectively improve the measurement accuracy of the carrier plate measurement module.

[0019] (3) Since the air blown into the first gap of the non-contact measurement module will be blown out from the first opening and the second opening, it can prevent water vapor from entering the first gap through the first opening and the second opening, thereby reducing the chance of the measurement device being damaged by water vapor.

[0020] (4) Since the air blown into the second gap of the non-contact measurement module will be blown out from the first perforation, the moisture and impurities on the workpiece to be ground can be blown away, thereby improving the accuracy of the measuring device in measuring the second distance.

[0021] (5) When the second vacuum device draws air from the second and third channels of the stage, in addition to the carrier plate in the central area being adsorbed onto the panel because of the second perforation connecting the second channel, the carrier plate in the peripheral area is also adsorbed onto the panel because of the third perforation connecting the third channel. Therefore, the workpiece to be polished can be securely adsorbed and fixed onto the panel of the stage, and the chance of the edge of the workpiece to be polished being lifted is reduced.

[0022] (6) When the rotary table of the spin-drying module supports the finished grinding part and rotates around the first axis to spin-dry the finished grinding part, since the first weight of the counterweight section of the stop section is greater than the second weight of the stop section, the counterweight section will be farther away from the first axis than the stop section, so that the stop section will also rotate around the second axis, while the stop section will move towards the first axis and press against the edge of the finished grinding part, so that the finished grinding part can be securely fixed on the rotating rotary table. Attached Figure Description

[0023] Figure 1 This is a top view schematic diagram illustrating a grinding apparatus according to an embodiment of the present invention.

[0024] Figure 2 For illustration Figure 1 A partial cross-sectional view of the application of the carrier plate measurement module.

[0025] Figure 3 For illustration Figure 1 A partial cross-sectional view of the application of the non-contact measurement module.

[0026] Figure 4 For illustration Figure 1 A partial sectional view of the application diagram of the platform.

[0027] Figure 5 To illustrate along Figure 4 A cross-sectional view of line segment AA.

[0028] Figure 6 For illustration Figure 1 A partial cross-sectional view of the spin-drying module.

[0029] The reference numerals in the attached figures are explained as follows:

[0030] 100: Grinding equipment

[0031] 110: Platform

[0032] 111: Panel

[0033] 111Z: Supporting Area

[0034] 112: Outer panel

[0035] 113: Inner panel

[0036] 114: Base Plate

[0037] 120: Grinding Module

[0038] 125: Image capturing device

[0039] 130: Non-contact measurement module

[0040] 131: Outer shell

[0041] 1311: Main Body

[0042] 1312: Connecting part

[0043] 132: Measuring device

[0044] 133: Inner shell

[0045] 134: Pneumatic device

[0046] 138: Contact Measurement Module

[0047] 140: Processor

[0048] 150: Carrier plate measurement module

[0049] 151: Abutment

[0050] 151S: Supporting surface

[0051] 152: Tableting Mechanism

[0052] 153: Surveying probe

[0053] 160: First vacuum device

[0054] 170: Second vacuum device

[0055] 180: Spin-drying module

[0056] 181: Rotary Table

[0057] 182: Stop section

[0058] 1821: Stop section

[0059] 1822: Counterweight Section

[0060] 1823: Curved lever

[0061] 183: Guiding device

[0062] 1831: Guide rail

[0063] 1832: Elevator

[0064] 1833: Actuator

[0065] 1834: Pulley

[0066] 190: Conveying device

[0067] 191: First Conveyor Belt

[0068] 192: Conveying Gantry

[0069] 193: Second Conveyor Belt

[0070] 200: Part to be ground

[0071] 200Z: Finished grinding parts

[0072] 210: Carrier board

[0073] 300: Impurities

[0074] 400: Dragon Gate

[0075] AA: line segment

[0076] C1: First flow channel

[0077] C2: Second flow channel

[0078] C3: Third Flow Channel

[0079] DD1, DD2, DD3: Conveying direction

[0080] D1: First Direction

[0081] D2: Second Direction

[0082] D3: Third direction

[0083] GP1: First gap

[0084] GP2: Second gap

[0085] H1: First perforation

[0086] H2: Second perforation

[0087] H3: Third perforation

[0088] OP1: First opening

[0089] OP2: Second opening

[0090] SL: Signal

[0091] SP1: First Space

[0092] SP2: Second Space

[0093] TK1: First Thickness

[0094] TK2: Second Thickness

[0095] V1: First Distance

[0096] V2: Second Distance

[0097] X1: First axis line

[0098] X2: Second axis

[0099] ZC: Central District

[0100] ZP: Surrounding Area Detailed Implementation

[0101] The following describes several embodiments of the present invention with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is, in some embodiments of the present invention, these practical details are not essential. Furthermore, for the sake of simplicity, some conventional structures and elements will be shown in the drawings in a simple schematic manner, and in all drawings, the same reference numerals will be used to denote the same or similar elements. And, where feasible, features of different embodiments can be applied interchangeably.

[0102] Unless otherwise defined, all terms used herein (including technical and scientific terms) have their ordinary meanings, which are understandable to those skilled in the art. Furthermore, the definitions of the aforementioned terms in commonly used dictionaries should be interpreted in the context of this specification as meanings consistent with the relevant field of this invention. Unless specifically defined, these terms will not be construed as having idealized or overly formal meanings.

[0103] Please refer to Figure 1 . Figure 1 This is a top view schematic diagram illustrating a grinding apparatus 100 according to an embodiment of the present invention. In this embodiment, as... Figure 1 As shown, a grinding apparatus 100 includes a carrier plate measurement module 150, an image capturing device 125, a stage 110, a grinding module 120, a non-contact measurement module 130, a contact measurement module 138, a processor 140, a spin-drying module 180, and a conveying device 190. In fact, the conveying device 190 also includes a first conveyor belt 191, a conveying gantry 192, and a second conveyor belt 193, with the conveying gantry 192 connected between the first conveyor belt 191 and the second conveyor belt 193.

[0104] When the grinding equipment 100 is operating, the first conveyor belt 191 carries the workpiece 200 to be ground (see workpiece 200 for details). Figure 2The material is conveyed to the carrier plate measurement module 150. The workpiece to be polished 200 can be, for example, a semiconductor package strip, but this invention is not limited thereto. The carrier plate measurement module 150 is signal-connected to the processor 140 and configured to measure the second thickness TK2 of the carrier plate 210 of the workpiece to be polished 200 (see [link to relevant documentation] for the second thickness TK2). Figure 2 ).

[0105] After the carrier plate measurement module 150 measures the second thickness TK2 of the carrier plate 210, the first conveyor belt 191 further conveys the workpiece 200 to be ground 200 along the conveying direction DD1 to the position of the corresponding image capturing device 125, so that the image capturing device 125 can capture an image of the workpiece 200 to be ground. The image capturing device 125 is signal-connected to the processor 140, so that the processor 140 can identify the model of the workpiece 200 to be ground and determine its expected target thickness.

[0106] Then, the first conveyor belt 191 further conveys the workpiece 200 to be ground along the conveying direction DD1 to the conveying gantry 192. The conveying gantry 192 then moves the workpiece 200 to be ground along the conveying direction DD2. The platform 110 moves to the conveying gantry 192 to receive the workpiece 200. The platform 110 then moves the workpiece 200 to the position of the non-contact measurement module 130 and / or the contact measurement module 138, so that the non-contact measurement module 130 and / or the contact measurement module 138 can measure the actual total thickness of the workpiece 200, i.e., the first thickness TK1 mentioned below (see [link to first thickness TK1]). Figure 2 Subsequently, the stage 110 moves the workpiece 200 to be ground to the position of the grinding module 120, which is configured to grind the workpiece 200 until it reaches the target thickness.

[0107] During the grinding process of the grinding module 120 grinding the workpiece 200, the non-contact measurement module 130 continuously measures the workpiece 200 to obtain the first thickness TK1 of the workpiece 200 changing in real time during the grinding process, thereby improving the accuracy of the grinding process.

[0108] While the non-contact measurement module 130 continuously measures the workpiece 200 to be ground, once the workpiece 200 reaches the target thickness, grinding of the workpiece 200 can be stopped, and the non-contact measurement module 130 and / or the contact measurement module 138 can be used to further measure the workpiece 200 to ensure that the workpiece 200 has reached the target thickness and becomes the finished workpiece 200Z. In fact, the contact measurement module 138 is configured to contact the workpiece 200 to be ground and measure the first thickness TK1 of the workpiece 200 to be ground. The contact measurement module 138 and the stage 110 are arranged at least partially along the first direction D1, and the contact measurement module 138 is configured to move relative to the stage 110 along the third direction D3. The stage 110 is configured to move relative to the contact measurement module 138 along the second direction D2, wherein the first direction D1, the second direction D2 and the third direction D3 are perpendicular to each other.

[0109] After the workpiece 200 to be ground on the platform 110 reaches the target thickness and becomes the finished grinding part 200Z, the platform 110 moves to below the conveying gantry 192 (relative to the first direction D1), and the conveying gantry 192 takes away the finished grinding part 200Z. The conveying gantry 192 then delivers the finished grinding part 200Z to the second conveyor belt 193, which then conveys the finished grinding part 200Z to the corresponding spin-drying module 180 along the conveying direction DD3. The spin-drying module 180 spins the finished grinding part 200Z dry, thus achieving a dry-in, dry-out effect in the process of the grinding equipment 100 turning the workpiece 200 to be ground into the finished grinding part 200Z.

[0110] In practical applications, such as Figure 1 As shown, the grinding equipment 100 may also include two stages 110 (each connected to the second vacuum device 170 described below), two grinding modules 120, two non-contact measurement modules 130 (each connected to the pneumatic device 134 described below), and two contact measurement modules 138, so that the grinding equipment 100 can grind two workpieces 200 to be ground at the same time, thereby improving the operating efficiency of the grinding equipment 100; furthermore, the grinding modules 120, non-contact measurement modules 130 and contact measurement modules 138 are respectively disposed on the gantry 400.

[0111] Please refer to Figure 2 . Figure 2 For illustration Figure 1 A partial cross-sectional view of the carrier plate measurement module 150 is shown in this embodiment. Figure 2As shown, the carrier plate measurement module 150 includes a base 151, a pressing mechanism 152, and a measuring probe 153. The base 151 has a support surface 151S, configured to support the workpiece 200 to be ground. The pressing mechanism 152 is connected to the base 151 and configured to press against the side of the carrier plate 210 of the workpiece 200 away from the support surface 151S. Figure 2 As shown, the tablet pressing mechanism 152 moves from the position indicated by the dashed line toward the carrier plate 210 to press against the carrier plate 210 of the workpiece 200. A measuring probe 153 is connected to the tablet pressing mechanism 152 and configured to abut against the side of the carrier plate 210 away from the support surface 151S, thereby measuring the second thickness TK2 of the carrier plate 210, and the measuring probe 153 is signal-connected to the processor 140. Figure 2 As shown, the measuring probe 153 moves from the position indicated by the dashed line toward the carrier plate 210 to abut against the carrier plate 210. Since the pressing mechanism 152 presses the carrier plate 210 against the supporting surface 151S of the base 151 when the measuring probe 153 measures the second thickness TK2 of the carrier plate 210, it can effectively prevent the carrier plate 210 from tilting, which helps to improve the accuracy of measuring the second thickness TK2 of the carrier plate 210.

[0112] Furthermore, such as Figure 2 As shown, the base 151 of the carrier plate measurement module 150 further has a first flow channel C1, which connects to the support surface 151S. The grinding equipment 100 also includes a first vacuum device 160. The first vacuum device 160 connects to the first flow channel C1 of the base 151 and is configured to draw air from the first flow channel C1 to adsorb the carrier plate 210 of the workpiece 200 to be ground onto the support surface 151S of the base 151, thereby further preventing the carrier plate 210 from tilting, which can also effectively improve the measurement accuracy of the carrier plate measurement module 150. Furthermore, in the actual mechanism design of some embodiments, the number of first flow channels C1 is multiple.

[0113] Please refer to Figure 3 . Figure 3 For illustration Figure 1 A partial cross-sectional view of the non-contact measurement module 130 is shown in this embodiment. Figure 3As shown, the non-contact measurement module 130 and the stage 110 are separated by a first distance V1. In some embodiments, the first distance V1 is a set value, and the first distance V1 is greater than the first thickness TK1 of the workpiece 200 to be polished. That is, the non-contact measurement module 130 and the workpiece 200 to be polished do not contact each other. Specifically, the non-contact measurement module 130 includes a housing 131, a measuring device 132, an inner housing 133, and a pneumatic device 134. The measuring device 132 is signal-connected to the processor 140. The housing 131 has a first opening OP1 and a plurality of first through holes H1, which are distributed around the first opening OP1. The measuring device 132 is at least partially located inside the housing 131. The inner shell 133 has a second opening OP2 and is located within the outer shell 131. The second opening OP2 is at least partially aligned with the first opening OP1. The inner shell 133 is at least partially located between the outer shell 131 and the measuring device 132. A first gap GP1 is at least partially defined between the inner shell 133 and the measuring device 132. The first gap GP1 connects the second opening OP2 and the first opening OP1. A second gap GP2 is at least partially defined between the outer shell 131 and the inner shell 133. The second gap GP2 connects to the first through-hole H1. The measuring device 132 is configured to send and receive a signal SL to the workpiece 200 to be ground via the first opening OP1 and the second opening OP2, representing a second distance V2 between the measuring device 132 and the workpiece 200. Knowing in advance the distance between the measuring device 132 and the stage 110 and the target thickness of the workpiece 200 to be ground, the processor 140 can calculate the target value of the second distance V2. Then, the processor 140 controls the grinding module 120 to grind the workpiece 200 according to this target value; in other words, the grinding equipment 100 can calculate the amount of grinding required for the workpiece 200. The air pressure device 134 is connected to the first gap GP1 and the second gap GP2 respectively, and is configured to supply air to the first gap GP1 and the second gap GP2 respectively. Specifically, the air blown into the first gap GP1 will be blown out from the first opening OP1 and the second opening OP2 to prevent moisture from entering the first gap GP1 through the first opening OP1 and the second opening OP2, thereby reducing the chance of the measuring device 132 being damaged by moisture. In addition, the air blown into the second gap GP2 will be blown out from the first perforation H1 to blow away moisture and impurities 300 on the workpiece 200 to be ground, thereby improving the accuracy of the measuring device 132 in measuring the second distance V2.In addition, since the stage 110 can carry the workpiece 200 to be ground to move relative to the non-contact measurement module 130 in the second direction D2, the measuring device 132 can measure the second distance V2 of multiple surfaces of the workpiece 200 relative to the measuring device 132, thereby calculating the grinding amount of the workpiece 200; the processor 140 is configured to calculate the first thickness TK1 of the workpiece 200 to be ground based on the measured second distance V2, the second thickness TK2 and the first distance V1, and determine whether the first thickness TK1 of the workpiece 200 to be ground has reached the target thickness.

[0114] More specifically, such as Figure 3 As shown, the outer shell 131 also includes a main body 1311 and a connecting portion 1312. The inner shell 133 is located inside the main body 1311, and the first through hole H1 is located in the main body 1311. The connecting portion 1312 is disposed on the inner side of the main body 1311 and abuts against the inner shell 133. The connecting portion 1312 and the main body 1311 together define the first opening OP1, and the first through hole H1 surrounds the connecting portion 1312. In addition, it is worth noting that in some embodiments, the first through hole H1 is formed by directly drilling a hole in the main body 1311; in other embodiments, the first through hole H1 is a slit-shaped annular hole formed by the connecting portion 1312 and the main body 1311; and in other embodiments, the first through hole H1 is formed by the surface irregularities of the connecting portion 1312 and the main body 1311 on their abutting sides.

[0115] Furthermore, such as Figure 3 As shown, the non-contact measurement module 130 and the platform 110 are at least partially arranged along the first direction D1, and the platform 110 is configured to move relative to the non-contact measurement module 130 along the second direction D2 to move closer to or further away from the conveying gantry 192 (see [link to conveying gantry 192]). Figure 1 ).

[0116] Please refer to Figures 4-5 . Figure 4 For illustration Figure 1 A partial cross-sectional view of the platform 110. Figure 5 To illustrate along Figure 4 A cross-sectional view of line segment AA. In this embodiment, as... Figures 4-5As shown, the stage 110 includes a front panel 111, a peripheral plate 112, an inner plate 113, and a base plate 114. The front panel 111 has a support area 111Z, multiple second through holes H2, and multiple third through holes H3. The support area 111Z is configured to support the workpiece 200 to be ground. The support area 111Z is divided into a central area ZC and a peripheral area ZP. The peripheral area ZP connects to and surrounds the central area ZC. The second through holes H2 are connected to and distributed in the central area ZC, and the third through holes H3 are connected to and distributed in the peripheral area ZP. The peripheral plate 112 surrounds and connects to the side of the front panel 111 that faces away from the support area 111Z. The inner shroud 113 connects to the side of the panel 111 facing away from the support area 111Z. The inner shroud 113 surrounds the panel to form a first space SP1, which corresponds to the central area ZC and connects to the second perforation H2. A second space SP2 is formed between the outer shroud 112 and the inner shroud 113, which corresponds to the peripheral area ZP and connects to the third perforation H3. The bottom plate 114 connects the outer shroud 112 and the inner shroud 113 on the side away from the panel 111. The bottom plate 114 has multiple second flow channels C2 and multiple third flow channels C3. The second flow channels C2 connect to the first space SP1, and the third flow channels C3 connect to the second space SP2. The grinding equipment 100 also includes a second vacuum device 170. The second vacuum device 170 connects the second flow channels C2 and the third flow channels C3 and is configured to draw air from the second flow channels C2 and the third flow channels C3.

[0117] In this way, as Figure 4 As shown, when the second vacuum device 170 draws air from the second flow channel C2 and the third flow channel C3, in addition to the carrier plate 210 abutting the central area ZC being adsorbed onto the panel 111 because of the second perforation H2 connecting the second flow channel C2, the carrier plate 210 abutting the peripheral area ZP is also adsorbed onto the panel 111 because of the third perforation H3 connecting the third flow channel C3. Therefore, the workpiece 200 to be polished can be securely adsorbed and fixed onto the panel 111 of the stage 110, which also reduces the chance of the edge portion of the workpiece 200 to be polished lifting up.

[0118] Please refer to Figure 6 . Figure 6 For illustration Figure 1 A partial cross-sectional view of the spin-drying module 180 is shown in this embodiment. Figure 6As shown, the spin-drying module 180 includes a rotating platform 181 and two stops 182. The rotating platform 181 is configured to support the finished grinding part 200Z and rotate about a first axis X1, which is substantially parallel to a first direction D1. The stops 182 are pivotally connected to opposite ends of the rotating platform 181 about a second axis X2, which is perpendicular to the first axis X1. Each of the stops 182 includes a stop section 1821 and a counterweight section 1822. The stop section 1821 is configured to abut against the edge of the finished grinding part 200Z. The stop section 1821 and the counterweight section 1822 are located on opposite sides of the second axis X2. The counterweight section 1822 has a first weight, and the stop section 1821 has a second weight, wherein the first weight is greater than the second weight. In this way, when the rotary table 181 supports the finished grinding part 200Z and rotates around the first axis X1 to spin dry the finished grinding part 200Z, since the first weight of the counterweight section 1822 of the stop section 182 is greater than the second weight of the stop section 1821, the counterweight section 1822 will be farther away from the first axis X1 than the stop section 1821, so that the stop section 182 will also rotate around the second axis X2, while the stop section 1821 will move towards the first axis X1 and press against the edge of the finished grinding part 200Z, so that the finished grinding part 200Z can be securely fixed on the rotating rotary table 181.

[0119] Furthermore, in this embodiment, in order to enable the spin-drying module 180 to rotate stably around the first axis X1, the two stop portions 182 of the spin-drying module 180 are structurally symmetrical to each other and are equidistant from the first axis X1.

[0120] Furthermore, in this embodiment, such as Figure 6 As shown, each of the stop sections 182 further includes a curved lever 1823, which connects to the end of the stop section 1821 away from the counterweight section 1822. Furthermore, the spin-drying module 180 also includes two guide devices 183, each of which includes a guide rail 1831, a lifting body 1832, an actuator 1833, and a pulley 1834. The guide rail 1831 is configured to guide the finished grinding part 200Z to move relative to the rotary table 181. The lifting body 1832 is connected to the guide rail 1831. The actuator 1833 is connected to the lifting body 1832 and configured to move the lifting body 1832 along a first direction D1. The pulley 1834 is connected to the lifting body 1832, that is, the pulley 1834 is located between the guide rail 1831 and the actuator 1833. The pulley 1834 is configured to press against one of the corresponding curved levers 1823 so that the corresponding stop part 182 rotates relative to the turntable 181 about the corresponding one of the second axis X2.

[0121] Specifically, when the finished polished part 200Z needs to enter or exit the spin-drying module 180, the guide device 183, as follows: Figure 6As shown by the dotted line, the actuator 1833 drives the lifting body 1832 to descend along the first direction D1, and at the same time drives the pulley 1834 to descend along the first direction D1 to press against the curved lever 1823, so that the stop part 182 rotates around the second axis X2, so that the stop section 1821 will not interfere with the path of the polished part 200Z entering and exiting the spin-drying module 180. The guide rail 1831 is located on the path of the polished part 200Z entering and exiting the spin-drying module 180 as the lifting body 1832 descends, thus allowing the polished part 200Z to enter and exit the rotary table 181 through the guide rail 1831.

[0122] Furthermore, after the finished grinding part 200Z enters the rotary table 181, the guiding device 183, as follows: Figure 6 As shown by the solid line, the actuator 1833 drives the lifting body 1832 to rise along the first direction D1, causing the pulley 1834 to also rise and disengage from the curved lever 1823, meaning the curved lever 1823 is no longer subjected to the pressing action of the pulley 1834. At this time, the stop part 182 will be subjected to the gravity of the counterweight section 1822 and rotate around the second axis X2, causing the stop section 1821 to move closer to the rotary table 181 and interfere with the path of the polished part 200Z entering and exiting the spin-drying module 180, thus creating a stopping effect, that is, limiting the polished part 200Z to be on the rotary table 181. Subsequently, the rotary table 181 rotates, and the counterweight section 1822 is subjected to centrifugal force as described above during the rotation, so that the stop section 1821 located at the other end of the second axis X2 continues to maintain the stopping effect on the polished part 200Z, thereby preventing the polished part 200Z from being thrown off the rotary table 181.

[0123] In summary, the technical solution disclosed in the above embodiments of this utility model has at least the following advantages:

[0124] (1) When the measuring probe measures the second thickness of the carrier plate, the pressing mechanism presses the carrier plate against the support surface of the base, which can effectively prevent the carrier plate from tilting up, thus improving the accuracy of measuring the second thickness of the carrier plate.

[0125] (2) Since the first vacuum device draws air from the first flow channel of the base, it can adsorb the carrier plate of the workpiece to be ground onto the support surface of the base, thereby further preventing the carrier plate from tilting. This can also effectively improve the measurement accuracy of the carrier plate measurement module.

[0126] (3) Since the air blown into the first gap of the non-contact measurement module will be blown out from the first opening and the second opening, it can prevent water vapor from entering the first gap through the first opening and the second opening, thereby reducing the chance of the measurement device being damaged by water vapor.

[0127] (4) Since the air blown into the second gap of the non-contact measurement module will be blown out from the first perforation, the moisture and impurities on the workpiece to be ground can be blown away, thereby improving the accuracy of the measuring device in measuring the second distance.

[0128] (5) When the second vacuum device draws air from the second and third channels of the stage, in addition to the carrier plate in the central area being adsorbed onto the panel because of the second perforation connecting the second channel, the carrier plate in the peripheral area is also adsorbed onto the panel because of the third perforation connecting the third channel. Therefore, the workpiece to be polished can be securely adsorbed and fixed onto the panel of the stage, and the chance of the edge of the workpiece to be polished being lifted is reduced.

[0129] (6) When the rotary table of the spin-drying module supports the finished grinding part and rotates around the first axis to spin-dry the finished grinding part, since the first weight of the counterweight section of the stop section is greater than the second weight of the stop section, the counterweight section will be farther away from the first axis than the stop section, so that the stop section will also rotate around the second axis, while the stop section will move towards the first axis and press against the edge of the finished grinding part, so that the finished grinding part can be securely fixed on the rotating rotary table.

[0130] Although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications without departing from the concept and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. A grinding device, characterized in that, Include: A platform, configured to support a workpiece to be ground; A grinding module, configured to grind the workpiece to be ground; A non-contact measurement module is positioned at a first distance from the stage, the first distance being greater than a first thickness of the workpiece to be ground. The non-contact measurement module comprises: A housing having a first opening and a plurality of first perforations distributed around the first opening; A measuring device is located inside the housing; An inner shell has a second opening and is located within the outer shell, the second opening being at least partially aligned with the first opening, the inner shell being at least partially located between the outer shell and the measuring device, the inner shell and the measuring device defining at least a first gap communicating with the second opening and the first opening, the outer shell and the inner shell defining at least a second gap communicating with the plurality of first perforations, the measuring device being configured to send and receive a signal to the workpiece to be polished through the first opening and the second opening to measure a second distance between the measuring device and the workpiece to be polished; as well as A pneumatic device is connected to the first gap and the second gap, and is configured to supply air to the first gap and the second gap respectively; as well as A processor is signal-connected to the measuring device and configured to calculate the first thickness of the workpiece to be ground based on the measured second distance.

2. The grinding equipment as described in claim 1, characterized in that, The casing also includes: A main body, the inner shell located within the main body, and the plurality of first perforations located within the main body; and A connecting portion is disposed on the inner side of the main body and abuts against the inner shell. The connecting portion and the main body together define the first opening, and the plurality of first perforations surround the connecting portion.

3. The grinding equipment as described in claim 1, characterized in that, The non-contact measurement module and the stage are at least partially arranged along a first direction, and the stage is configured to move relative to the non-contact measurement module along a second direction, the first direction and the second direction being perpendicular to each other.

4. The grinding equipment as described in claim 1, characterized in that, Also includes: A contact measurement module is configured to abut against the workpiece to be polished and measure the first thickness of the workpiece.

5. The grinding equipment as described in claim 4, characterized in that, The contact measurement module and the stage are at least partially arranged along a first direction, the stage is configured to move relative to the contact measurement module along a second direction, and the contact measurement module is configured to move relative to the stage along a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other.

6. The grinding equipment as described in claim 1, characterized in that, Also includes: A carrier board measurement module, comprising: A base having a supporting surface, configured to support the workpiece to be ground; A pressing mechanism, connected to the base and configured to press against the side of a carrier plate away from the supporting surface of the workpiece to be ground; and A measuring probe is connected to the pressing mechanism and configured to abut against the side of the carrier plate away from the support surface, thereby measuring a second thickness of the carrier plate.

7. The grinding equipment as described in claim 6, characterized in that, The base has multiple first flow channels, each connected to the supporting surface, and the grinding equipment also includes: A first vacuum device is connected to the plurality of first channels and configured to draw air from the plurality of first channels.

8. The grinding equipment as described in claim 1, characterized in that, The platform includes: A panel has a support area, a plurality of second through holes and a plurality of third through holes. The support area is configured to support the workpiece to be ground. The support area is divided into a central area and a peripheral area. The peripheral area is connected to and surrounds the central area. The plurality of second through holes are connected and distributed in the central area. The plurality of third through holes are connected and distributed in the peripheral area. An outer panel surrounds and connects to the side of the panel opposite to the support area; An inner panel is connected to the side of the panel facing away from the support area. The inner panel surrounds the panel to form a first space, which corresponds to the central area and connects to the plurality of second perforations. A second space is formed between the outer panel and the inner panel, which corresponds to the peripheral area and connects to the plurality of third perforations. A base plate connects the outer perimeter plate and the inner perimeter plate on the side away from the front panel. The base plate has multiple second flow channels and multiple third flow channels. The multiple second flow channels communicate with the first space, and the multiple third flow channels communicate with the second space. The grinding equipment also includes: A second vacuum device is connected to the plurality of second channels and the plurality of third channels, and is configured to draw air from the plurality of second channels and the plurality of third channels.

9. The grinding equipment as described in claim 1, characterized in that, Also includes: A spin-drying module includes: A rotary table configured to support a finished grinding workpiece and rotate about a first axis; and Two stops are pivotally connected to opposite ends of the rotary table about a second axis perpendicular to the first axis. Each of the two stops includes: A stop section, configured to abut an edge of the finished polished part; and A counterweight section, the stop section and the counterweight section are located on opposite sides of the second axis. The counterweight section has a first weight, and the stop section has a second weight, the first weight being greater than the second weight.

10. The grinding equipment as described in claim 9, characterized in that, The two stop portions are structurally symmetrical to each other and are equidistant from the first axis.

11. The grinding apparatus as described in claim 9, characterized in that, Each of the two stop sections further includes a curved lever connected to the end of the stop section away from the counterweight section. The spin-drying module also includes: Two guiding devices, each of the two guiding devices comprising: A guide rail is configured to guide the finished grinding part to move relative to the rotary table; A lifting body is connected to the guide rail; An actuator is connected to the lifting body and configured to move the lifting body along a first direction, the first direction being parallel to the first axis. as well as A pulley is connected to the lifting body and configured to press against one of the plurality of curved levers, so that one of the two stops rotates relative to the rotary table about one of the plurality of second axes.

Images