Bowl-shaped grinding wheel

Abstract

The utility model belongs to the field of grinding wheels, and particularly relates to a bowl-shaped grinding wheel which comprises a bowl-shaped base body and an annular working layer. The outer end face of the opening end of the bowl-shaped base body is provided with a sinking step, the inner wall and the inner end wall of the annular working layer are matched with the sinking step, the outer wall of the annular working layer protrudes out of the outer side of the opening end of the bowl-shaped base body, and the outer end wall of the annular working layer protrudes out of the outer end face of the opening end of the bowl-shaped base body. A chip removal and heat dissipation cavity I communicated with the outer end face of the bowl-shaped base body is formed in the waist portion of the bowl-shaped base body, a through hole communicated to the outer end of the waist portion of the bowl-shaped base body is formed in the inner side wall of the chip removal and heat dissipation cavity I, and the through hole is used for conducting chip removal and air circulation on the chip removal and heat dissipation cavity I. The heat dissipation effect of the bowl-shaped grinding wheel is comprehensively improved from multiple aspects, the grinding temperature is reduced, additional drive and energy are not needed for cooling, air cooling heat dissipation is carried out through rotation of the bowl-shaped grinding wheel, and energy consumption cannot be additionally increased.

Description

Technical Field

[0001] This utility model belongs to the field of grinding wheels, specifically relating to a cup-shaped grinding wheel. Background Technology

[0002] Grinding wheels are mechanical devices used to process the surface of products, ensuring that the final product meets the relevant technical requirements. A grinding wheel is a machine tool that, through grinding between the grinding wheel and the workpiece, can produce products of various shapes that meet technical requirements.

[0003] Traditional single-layer electroplated diamond grinding wheels are circular, centrally-holed molds made from diamond abrasives, metal powder, resin powder, and electroplating metal binders. They consist of three parts: a working layer, a substrate, and a transition layer. The working layer, also known as the diamond layer, comprises abrasives, binders, and fillers, and is the working part of the grinding wheel. The transition layer, also known as the non-diamond layer, consists of binders, metal powder, and fillers, and is the part that firmly connects the diamond layer to the substrate. The substrate serves to support the abrasive layer and securely clamps the flange to the machine tool spindle during use. Because the plating metal of traditional electroplated diamond grinding wheels does not have a strong chemical-metallurgical bond with the substrate and abrasive surfaces, the abrasive is only mechanically encapsulated and embedded. This results in weak holding force, a heavy load on the diamond grit, and easy detachment during high-efficiency grinding (the plating peels off in sheets), leading to overall failure. Increasing the holding force requires increasing the coating thickness, which reduces the height of the exposed abrasive grains and the chip space, making the grinding wheel prone to clogging and significantly impacting heat dissipation. This also increases the risk of workpiece overheating and even burning. Furthermore, the unique nature of current manufacturing processes means that workpieces cannot be cooled by air, water, or oil, resulting in significant limitations in efficiency and quality when processing hard silica, modified silicon, and quartz materials. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a bowl-shaped grinding wheel with a large holding force and good heat dissipation effect in the annular working layer.

[0005] This utility model provides a bowl-shaped grinding wheel, including a bowl-shaped base and an annular working layer;

[0006] The outer end face of the opening end of the bowl-shaped substrate is provided with a recessed step. The inner wall and inner end wall of the annular working layer cooperate with the recessed step. The outer wall of the annular working layer protrudes outside the opening end of the bowl-shaped substrate, and the outer end wall protrudes outside the opening end face of the bowl-shaped substrate.

[0007] The waist of the bowl-shaped base is provided with a chip removal and heat dissipation cavity I that connects to the outer end face of the bowl-shaped base. The inner side wall of the chip removal and heat dissipation cavity I is provided with a through hole that connects to the outer end of the waist of the bowl-shaped base. The through hole is used to remove chips and allow air to circulate in the chip removal and heat dissipation cavity I.

[0008] Furthermore, the inner wall of the annular working layer protrudes from the position of the sunken step and surrounds the outer end face of the opening end of the bowl-shaped substrate to form a chip removal and heat dissipation cavity II;

[0009] The chip removal and heat dissipation cavity II is connected to the chip removal and heat dissipation cavity I.

[0010] Furthermore, the bowl-shaped substrate and the annular working layer are thermally connected.

[0011] Furthermore, the bowl-shaped substrate is made of aluminum alloy, and the annular working layer is made of ceramic diamond.

[0012] Furthermore, the top of the bowl-shaped base is provided with a mounting hole that extends through to the chip removal and heat dissipation cavity I.

[0013] Furthermore, the through holes are arranged in a ring array of multiple holes.

[0014] Furthermore, an air guide shroud is provided at the outer end of the waist of the bowl-shaped substrate on at least one of the through holes.

[0015] Furthermore, at least one of the through holes is tangential to the chip removal and heat dissipation cavity I, and the tangential direction is downstream of the rotation direction of the cup-shaped grinding wheel.

[0016] Furthermore, a chip guide plate is provided at the outer end of the waist of the bowl-shaped substrate, which is tangent to the outer end of the through hole of the chip removal and heat dissipation cavity I;

[0017] The distance from the chip guide plate to the axis of the bowl-shaped base is greater than the distance from the air guide shroud to the axis of the bowl-shaped base.

[0018] Furthermore, the through holes with air guide covers and the through holes tangent to the chip removal and heat dissipation cavity I are arranged alternately.

[0019] The beneficial effects of this utility model are that the bowl-shaped grinding wheel provided by this utility model can improve the holding force of the annular working layer by setting a recessed step on the bowl-shaped base to fix the annular working layer, and can also improve its heat conduction effect to the bowl-shaped base. The through holes set on the bowl-shaped base can dissipate heat from the bowl-shaped base and the annular working layer, and further reduce the working temperature of the annular working layer by combining the heat conduction of the bowl-shaped base. Moreover, the through holes can also remove the chips and dust trapped in the chip removal and heat dissipation cavity I, and prevent the chips from re-entering the grinding surface between the annular working layer and the workpiece to be ground, thus affecting the grinding quality.

[0020] This invention comprehensively improves the heat dissipation effect of the cup-shaped grinding wheel from multiple aspects, reduces the grinding temperature, and the cooling does not require additional drive or energy. It achieves air cooling through the rotation of the cup-shaped grinding wheel, without increasing energy consumption. Attached Figure Description

[0021] Appendix Figure 1 This is a schematic diagram of the structure of the present invention from a first angle;

[0022] Appendix Figure 2 This is a schematic diagram of the second angle structure of this utility model;

[0023] Appendix Figure 3 This is a front sectional view of the present invention;

[0024] Appendix Figure 4 This is a schematic diagram of the structure of an embodiment of the present invention that includes an air guide shroud and a chip guide plate;

[0025] Appendix Figure 5 This is a bottom view of an embodiment of the present invention that includes an air guide shroud and a chip guide plate.

[0026] In the figure, 1-bowl-shaped base; 11-open end; 111-sunken step; 112-outer side; 113-outer end face; 12-waist; 121-chip removal and heat dissipation cavity I; 122-through hole; 13-top; 131-mounting hole; 2-annular working layer; 21-inner wall; 22-inner end wall; 23-outer wall; 24-outer end wall; 25-chip removal and heat dissipation cavity II; 3-air guide shroud; 4-chip guide plate. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0029] Furthermore, in this utility model, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0030] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection, an electrical connection, a physical connection, or a wireless communication connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal connection of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] Furthermore, the technical solutions of the various embodiments of this utility model can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0032] As attached Figure 1 -Appendix Figure 5 As shown, this utility model provides a bowl-shaped grinding wheel, including a bowl-shaped base 1 and an annular working layer 2. The bowl-shaped base 1 includes an open end 11, a waist 12 and a top end 13 arranged in a bowl-shaped structure. The annular working layer 2 has an annular structure and a rectangular cross-section, including an inner wall 21, an inner end wall 22, an outer wall 23 and an outer end wall 24.

[0033] The outer end face 113 of the open end 11 of the bowl-shaped substrate 1 is provided with a recessed step 111. The inner wall 21 and inner end wall 22 of the annular working layer 2 cooperate with the recessed step 111, that is, the annular working layer 2 is fixed on the recessed step 111 by the inner wall 21 and inner end wall 22. This arrangement can, on the one hand, increase the connection contact area between the annular working layer 2 and the bowl-shaped substrate 1, improve the fixing strength of the two, and thus improve the holding force of the annular working layer 2. On the other hand, the increased connection contact area between the annular working layer 2 and the bowl-shaped substrate 1 can improve the conductivity between the annular working layer 2 and the bowl-shaped substrate 1. The outer wall 23 of the annular working layer 2 protrudes from the outer side 112 of the opening end 11 of the bowl-shaped base 1, thereby making the outer diameter of the annular working layer 2 larger than the overall outer diameter of the bowl-shaped base 1, which facilitates the grinding of the outer wall 23 of the annular working layer 2 and is more convenient when processing products with irregular internal shapes. The outer end wall 24 protrudes from the outer end face 113 of the opening end 11 of the bowl-shaped base 1, so that when the outer end wall 24 of the annular working layer 2 is being ground, the outer end face 113 of the opening end 11 of the bowl-shaped base 1 will not interfere with the workpiece being ground.

[0034] A chip removal and heat dissipation cavity I 121 is provided on the waist 12 of the bowl-shaped base 1, which is connected to the outer end face 113 of the bowl-shaped base 1. The chip removal and heat dissipation cavity I 121 will retain the chips and dust after grinding the workpiece. A through hole 122 is provided on the inner side wall of the chip removal and heat dissipation cavity I 121, which is connected to the outer end of the waist 12 of the bowl-shaped base 1. The through hole 122 is located on the waist 12 of the bowl-shaped base 1, which can ensure the structural strength of the open end 11 of the bowl-shaped base 1, thereby improving the fixation stability of the annular working layer 2. The through hole 122 is used for chip removal and air circulation in the chip removal and heat dissipation cavity I 121. That is, the chips and dust after grinding the workpiece retained in the chip removal and heat dissipation cavity I 121 can flow out through the through hole 122. When the bowl-shaped grinding wheel rotates, the chips in the chip removal and heat dissipation cavity I 121 are discharged. The dust particles are affected by centrifugal force and adhere to the inner wall of the chip removal and heat dissipation cavity I121. During movement, they are thrown out of the cup-shaped grinding wheel through the through hole 122, reducing the impact of chips on the cup-shaped grinding wheel and the workpiece to be ground. At the same time, the through hole 122 can also allow air to circulate in the chip removal and heat dissipation cavity I121. When the cup-shaped grinding wheel rotates, the air circulation speed increases. On the one hand, it can dissipate heat from the cup-shaped base 1, the annular working layer 2, and the workpiece to be ground within the range of the chip removal and heat dissipation cavity I121, thereby reducing the temperature of the cup-shaped base 1 and the workpiece to be ground and reducing the possibility of thermal deformation. On the other hand, the flowing air can also improve the chip removal efficiency in the chip removal and heat dissipation cavity I121. Furthermore, the through hole 122 can reduce the weight of the cup-shaped base 1, thereby reducing the weight of the cup-shaped grinding wheel.

[0035] The bowl-shaped grinding wheel provided by this utility model can improve the holding force of the annular working layer 2 by setting a recessed step 111 on the bowl-shaped base 1 to fix the annular working layer 2. It can also improve the heat conduction effect of the annular working layer 2 to the bowl-shaped base 1. The through hole 122 set on the bowl-shaped base 1 can dissipate heat from the bowl-shaped base 1 and the annular working layer 2. In addition, the heat conduction of the bowl-shaped base 1 can further reduce the working temperature of the annular working layer 2. Moreover, the through hole 122 can also remove the chips and dust trapped in the chip removal and heat dissipation cavity I121, and prevent the chips from re-entering the grinding surface between the annular working layer 2 and the workpiece to be ground, thus affecting the grinding quality.

[0036] This invention comprehensively improves the heat dissipation effect of the cup-shaped grinding wheel from multiple aspects, reduces the grinding temperature, and the cooling does not require additional drive or energy. It achieves air cooling through the rotation of the cup-shaped grinding wheel, without increasing energy consumption.

[0037] In one embodiment, the inner wall 21 of the annular working layer 2 protrudes from the position of the sunken step 111 and surrounds the outer end face 113 of the opening end 11 of the bowl-shaped base 1 to form a chip removal and heat dissipation cavity II 25.

[0038] The chip removal and heat dissipation cavity II 25 is connected to the chip removal and heat dissipation cavity I 121, thereby ensuring that chips and dust can enter the chip removal and heat dissipation cavity I 121. At this time, the air flowing in the chip removal and heat dissipation cavity I 121 can also directly act on the inner wall 21 of the annular working layer 2, directly cooling the annular working layer 2. At this time, the through hole 122 simultaneously cools the chip removal and heat dissipation cavity I 121, the chip removal and heat dissipation cavity II 25, and the inner wall 21 of the annular working layer 2. In addition, in this embodiment, the inner wall 21 of the annular working layer 2 protruding from the sinking step 111 can also serve as the grinding surface of the outer surface.

[0039] In one embodiment, the bowl-shaped substrate 1 and the annular working layer 2 are thermally connected. The bowl-shaped substrate 1 and the annular working layer 2 can be fixed by a transition layer composed of a binder, metal powder and filler. Through thermal connection, the thermal conductivity of the bowl-shaped substrate 1 and the annular working layer 2 can be guaranteed, thereby realizing the thermal conduction and cooling of the annular working layer 2 by the bowl-shaped substrate 1, and improving the cooling effect of air cooling on the annular working layer 2.

[0040] In one embodiment, the bowl-shaped substrate 1 is made of aluminum alloy. Aluminum alloy has good thermal conductivity and heat dissipation, which can quickly transfer and dissipate the heat of the annular working layer 2. The annular working layer 2 is made of ceramic diamond. Compared with ordinary electroplated diamond grinding wheels, ceramic diamond has strong grinding force and low temperature during grinding, which makes it easy to control the temperature and avoids burning the workpiece to be ground.

[0041] In one embodiment, the top end 13 of the bowl-shaped base 1 is provided with a mounting hole 131 that extends through the chip removal and heat dissipation cavity I 121. The mounting hole 131 is used for fixing the bowl-shaped grinding wheel to the grinding machine.

[0042] In one embodiment, multiple through holes 122 are arranged in a ring array, which can further improve heat dissipation, chip removal, and weight reduction. The ring array arrangement of multiple through holes 122 ensures the structural strength of the bowl-shaped substrate 1.

[0043] Reference Appendix Figure 4 and attached Figure 5 In one embodiment, the outer end of the waist 12 of the bowl-shaped base 1 is provided with an air guide shroud 3 on at least one of the through holes 122, and the opening of the air guide shroud 3 faces upstream of the rotation direction of the bowl-shaped grinding wheel, thereby guiding the air into the through hole 122 and improving the air intake effect of the through hole 122. In this embodiment, the through hole 122 with the air guide shroud 3 is mainly used for air circulation, and the removal of debris and dust in the chip removal and heat dissipation cavity I 121 is mainly carried out through other through holes 122.

[0044] Reference Appendix Figure 4 and attached Figure 5 In one embodiment, at least one of the through holes 122 is tangentially disposed to the chip removal and heat dissipation cavity I 121, and the tangential direction is downstream of the rotation direction of the cup-shaped grinding wheel. In this embodiment, the through hole 122 is mainly used to remove debris and dust from the chip removal and heat dissipation cavity I 121. The through hole 122 is tangentially disposed to the chip removal and heat dissipation cavity I 121, so that the opening size of the through hole 122 on the inner side wall of the chip removal and heat dissipation cavity I 121 is larger, which facilitates the entry of debris and dust into the through hole 122. On the other hand, it facilitates the exit of debris and dust from the through hole 122 in the forward direction under the action of centrifugal force.

[0045] In one embodiment, a chip guide plate 4 is provided at the outer end of the waist 12 of the bowl-shaped base 1, which is located at the outer end of the through hole 122 that is tangent to the chip removal and heat dissipation cavity I 121;

[0046] The distance from the chip guide plate 4 to the axis of the bowl-shaped base 1 is greater than the distance from the air guide shroud 3 to the axis of the bowl-shaped base 1. In this embodiment, the chip guide plate 4 can extend the distance between the chip and dust exit position and the axis of the bowl-shaped base 1, thereby preventing the chip from entering the downstream through hole 122 and re-entering the chip discharge heat dissipation cavity I121.

[0047] In one embodiment, the through holes 122 with the air guide shroud 3 and the through holes 122 tangent to the chip removal and heat dissipation cavity I 121 are arranged alternately to ensure uniform air intake and chip removal, thereby improving heat dissipation and chip removal efficiency. Furthermore, the air guide shroud 3 and the chip guide plate 4 can be integrally formed with the bowl-shaped base 1, or they can be welded to the bowl-shaped base 1, or they can be detachably fixed to the bowl-shaped base 1 using a fastening structure, depending on the actual needs.

[0048] The above description is merely an embodiment and does not constitute any limitation on this utility model. Any person skilled in the art can make many possible variations, modifications, or alterations to the technical solution of this utility model without departing from its scope. Therefore, any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this utility model, without departing from its scope, should fall within the protection scope of this utility model.

Claims

1. A bowl-shaped grinding wheel, characterized in that, It includes a bowl-shaped substrate (1) and an annular working layer (2); The outer end face (113) of the open end (11) of the bowl-shaped substrate (1) is provided with a sunken step (111). The inner wall (21) and inner end wall (22) of the annular working layer (2) cooperate with the sunken step (111). The outer wall (23) of the annular working layer (2) protrudes out of the outer side (112) of the open end (11) of the bowl-shaped substrate (1), and the outer end wall (24) protrudes out of the outer end face (113) of the open end (11) of the bowl-shaped substrate (1). The bowl-shaped base (1) has a chip removal and heat dissipation cavity I (121) on its waist (12) that connects to the outer end face (113) of the bowl-shaped base (1). The inner wall of the chip removal and heat dissipation cavity I (121) has a through hole (122) that connects to the outer end of the waist (12) of the bowl-shaped base (1). The through hole (122) is used to remove chips and allow air to circulate in the chip removal and heat dissipation cavity I (121).

2. The cup-shaped grinding wheel as described in claim 1, characterized in that, The inner wall (21) of the annular working layer (2) protrudes from the position of the sunken step (111) and surrounds the outer end face (113) of the opening end (11) of the bowl-shaped base (1) to form a chip removal and heat dissipation cavity II (25). The chip removal heat dissipation cavity II (25) is connected to the chip removal heat dissipation cavity I (121).

3. The cup-shaped grinding wheel as described in claim 1, characterized in that, The bowl-shaped substrate (1) and the annular working layer (2) are thermally connected.

4. The cup-shaped grinding wheel as described in claim 1, characterized in that, The bowl-shaped substrate (1) is made of aluminum alloy, and the annular working layer (2) is made of ceramic diamond.

5. The cup-shaped grinding wheel as described in claim 1, characterized in that, The top end (13) of the bowl-shaped base (1) is provided with a mounting hole (131) that extends through the chip removal and heat dissipation cavity I (121).

6. The cup-shaped grinding wheel as described in any one of claims 1-5, characterized in that, The through holes (122) are arranged in a ring array.

7. The cup-shaped grinding wheel as described in claim 6, characterized in that, The outer end of the waist (12) of the bowl-shaped base (1) is provided with a wind guide hood (3) on the side of at least one of the through holes (122).

8. The cup-shaped grinding wheel as described in claim 7, characterized in that, At least one of the through holes (122) is disposed tangentially to the chip removal and heat dissipation cavity I (121), and the tangential direction is downstream of the rotation direction of the cup-shaped grinding wheel.

9. The cup-shaped grinding wheel as described in claim 8, characterized in that, A chip guide plate (4) is provided at the outer end of the waist (12) of the bowl-shaped base (1), which is tangent to the chip removal heat dissipation cavity I (121). The distance from the chip guide plate (4) to the axis of the bowl-shaped base (1) is greater than the distance from the air guide shroud (3) to the axis of the bowl-shaped base (1).

10. The cup-shaped grinding wheel as described in claim 7, characterized in that, The through holes (122) with air guide shroud (3) and the through holes (122) tangent to the chip removal heat dissipation cavity I (121) are arranged alternately.

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