Positioning device and machining equipment

Abstract

The utility model provides a positioning device and machining equipment, and relates to the technical field of liquid crystal display screens. The positioning substrate is provided with a positioning surface, the positioning surface of the positioning substrate is provided with a positioning groove and at least one edge groove formed in the peripheral side of the positioning groove, the edge groove is communicated with the positioning groove, and the edge groove extends along the edge of the positioning groove; the buffer pad is arranged in the positioning groove, the upper surface of the buffer pad is higher than or flush with the groove bottom face of the edge groove, and a positioning structure used for positioning the liquid crystal panel is arranged on the buffer pad. According to the technical scheme, the edge grooves can form hollow areas on the peripheral sides of the buffer pads, and when the liquid crystal panel is placed, the liquid crystal panel is not prone to being in lap joint with the positioning base plate due to small-distance dislocation or displacement, so that the problems of breaking or cracking and the like caused by lap joint in the vacuum attaching process are solved, and the production quality of the liquid crystal module in the vacuum attaching process is improved.

Description

Technical Field

[0001] This application belongs to the field of liquid crystal display processing technology, and more specifically, relates to a positioning device and processing equipment. Background Technology

[0002] The vacuum bonding process for LCD modules utilizes vacuum adsorption to tightly bond the LCD panel to the backlight module, ensuring uniformity and brightness consistency of the display. In this process, a positioning device for the LCD panel is used to position the panel during vacuum bonding, ensuring the stability and repeatability of the bonding process, effectively reducing defect rates and improving production efficiency.

[0003] Currently, the positioning devices used for vacuum bonding of LCD panels mainly involve creating grooves on the surface of the substrate. The shape of the grooves matches the outline of the LCD panel, and the LCD panel is positioned by placing it within the groove. However, due to the small thickness of the LCD panel, it is easy for the edges of the panel to become suspended in the air at the opening of the groove during placement, leading to problems such as breakage and cracking during vacuum bonding. Utility Model Content

[0004] The purpose of this application is to provide a positioning device and processing equipment to solve the problem in the prior art where the liquid crystal panel is easily overlapped at the edge of the groove, causing breakage or cracking.

[0005] To achieve the above objectives, in a first aspect, this application provides a positioning device, including a positioning substrate and a buffer pad; the positioning substrate has a positioning surface, a positioning groove and at least one side groove disposed around the positioning groove are formed on the positioning surface of the positioning substrate, the side groove communicates with the positioning groove and extends along the edge of the positioning groove; the buffer pad is disposed in the positioning groove, the upper surface of the buffer pad is higher than or flush with the bottom surface of the side groove, and the buffer pad is provided with a positioning structure for positioning a liquid crystal panel.

[0006] In some embodiments of the first aspect, the positioning structure includes at least one positioning hole disposed on the buffer pad.

[0007] In some embodiments of the first aspect, the positioning substrate has a clearance groove on the positioning surface, the clearance groove is connected to the positioning groove, and the depth of the clearance groove is greater than the depth of the positioning groove.

[0008] In some embodiments of the first aspect, the clearance groove and the plurality of side grooves are together arranged around the periphery of the positioning groove.

[0009] In some embodiments of the first aspect, the positioning substrate has a pick-and-place slot on the positioning surface, the pick-and-place slot is located on the side of one of the side slots facing away from the buffer pad, and the pick-and-place slot is connected to the corresponding side slot.

[0010] In some embodiments of the first aspect, the pick-and-place slot is disposed close to the relief slot and located on one side of the extension direction of the relief slot.

[0011] In some embodiments of the first aspect, the depth of the pick-and-place slot is greater than the depth of the side slot.

[0012] In some embodiments of the first aspect, the positioning substrate has a positioning protrusion on the positioning surface, the positioning protrusion being used to position an external assembly tool.

[0013] In some embodiments of the first aspect, the positioning substrate has a plurality of connection holes on the positioning surface, and the plurality of connection holes surround the periphery of the positioning groove.

[0014] Secondly, this application provides a processing device, including a worktable, a pressing component, and a positioning device as described in the first aspect and any embodiment thereof. The positioning base plate is mounted on the worktable, and the pressing component is movably disposed above the positioning base plate, capable of moving toward the positioning base plate and pressing against the positioning surface of the positioning base plate.

[0015] The advantages of the positioning device and processing equipment provided in this application are as follows: By setting one or more side grooves around the positioning groove, a hollow area can be formed on one or more sides of the buffer pad. When placing the LCD panel, the positioning structure is used to position the LCD panel and determine its placement position on the buffer pad. If there is a small misalignment or displacement of the LCD panel during placement, the edge of the LCD panel will be in the hollow area and will not directly overlap with the positioning substrate, thereby avoiding problems such as breakage or cracking caused by overlap during vacuum bonding. In addition, the buffer pad can also buffer the LCD panel during vacuum bonding, improve the production quality of the LCD module in the vacuum bonding process, and increase production efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the positioning device in the embodiments of this application;

[0018] Figure 2 for Figure 1 A partial sectional view along the AA direction;

[0019] Figure 3 This is an exploded view of the positioning device in the embodiments of this application;

[0020] Figure 4 for Figure 3 Enlarged view of section B.

[0021] The following are the labeling elements in the figure:

[0022] 100 - Positioning substrate; 101 - Positioning groove; 102 - Side groove; 103 - Clearance groove; 104 - Pick-up and drop groove; 105 - Connection hole; 110 - Positioning protrusion; 200 - Buffer pad; 201 - Positioning hole. Detailed Implementation

[0023] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0024] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0025] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0027] In a first aspect, embodiments of this application provide a positioning device, referring to... Figures 1-4The positioning device includes a positioning substrate 100 and a buffer pad 200. The positioning substrate 100 has a positioning surface. A positioning groove 101 and at least one side groove 102 disposed on the periphery of the positioning groove 101 are provided on the positioning surface of the positioning substrate 100. The side groove 102 communicates with the positioning groove 101 and is disposed along the extension direction of the corresponding side of the positioning groove 101. The buffer pad 200 is disposed in the positioning groove 101. The upper surface of the buffer pad 200 is higher than or flush with the bottom surface of the side groove 102, and the buffer pad 200 is provided with a positioning structure for positioning the liquid crystal panel.

[0028] Specifically, the positioning substrate 100 is a flat plate structure with a certain area. The positioning surface is the upper surface of the positioning substrate 100, which can be made of metal or non-metal materials. The shape of the positioning substrate 100 can be arbitrary, for example, the shape of the positioning substrate 100 is rectangular.

[0029] The buffer pad 200 is a flat plate structure with a certain area. The buffer pad 200 can be made of materials with a high coefficient of friction and moderate hardness, such as polyurethane. The shape of the buffer pad 200 can be arbitrary, and the size of the buffer pad 200 should not be smaller than the size of the LCD panel so that the LCD panel can be completely placed on the buffer pad 200.

[0030] For example, the buffer pad 200 is a rectangle with the same shape and size as the LCD panel. In use, the LCD panel is placed on the buffer pad 200. The friction between the buffer pad 200 and the LCD panel is relatively large, which improves the stability of the LCD panel during vacuum bonding. When the LCD panel is subjected to pressure, the buffer pad 200 can also cushion the LCD panel and prevent it from being damaged by excessive pressure.

[0031] The positioning groove 101 is a cavity structure with a certain area, used to accommodate the buffer pad 200 and fix its position on the positioning substrate 100. The shape and size of the positioning groove 101 can be the same as the shape of the buffer pad 200; for example, the positioning groove 101 can be a rectangle with the same shape as the buffer pad 200, to accurately embed the buffer pad 200 within the positioning groove 101 and ensure that the buffer pad 200 does not shift during vacuum bonding. The depth of the positioning groove 101 should be greater than the thickness of the buffer pad 200, so that after the LCD panel is placed on the buffer pad 200, the upper surface of the LCD panel will not be higher than the upper surface of the positioning substrate 100, thus meeting the process requirements of the LCD panel during vacuum adsorption.

[0032] The positioning structure is used to position the LCD panel on the buffer pad 200 to ensure the accurate position of the LCD panel during vacuum bonding. The positioning structure can be a groove structure provided on the buffer pad 200 or a protrusion structure protruding from the buffer pad 200, and can be adapted to the back side structure of the LCD panel.

[0033] In some embodiments, the positioning structure includes at least one positioning hole 201 disposed on the buffer pad 200. The positioning hole 201 is used to insert a screw protruding from the back side of the liquid crystal panel, so as to determine the position of the liquid crystal panel on the buffer pad 200 by the position of the positioning screw.

[0034] The positioning hole 201 can be round or square, and its size can be slightly larger than that of the screw to allow the screw to be inserted more smoothly. The number and position of the positioning holes 201 can be adapted to the number and position of the screws on the back of the LCD panel, so that after the LCD panel is placed on the buffer pad 200, the screws on the back are inserted into the corresponding positioning holes 201, thereby positioning the LCD panel on the buffer pad 200.

[0035] The side groove 102 is a receiving structure with a certain area. The side groove 102 is elongated and extends in the same direction as the edge corresponding to the positioning groove 101. The length of the side groove 102 can be equal to the length of the edge corresponding to the buffer pad 200. The width of the side groove 102 can be adapted to the area of ​​the positioning groove 101. For example, when the positioning groove 101 is rectangular and the wide side is 300mm~400mm and the long side is 500~600mm, the width of the side groove 102 can be 4-6mm.

[0036] The number of side grooves 102 may be the same as or different from the number of peripheral edges of the positioning groove 101. For example, when the positioning groove 101 is rectangular, there may be multiple side grooves 102, each located at a different edge of the positioning groove 101. Furthermore, when the positioning groove 101 is circular, the shape of the side grooves 102 may be arc-shaped or annular.

[0037] like Figure 2 As shown, the bottom surface of the side groove 102 is a plane. The end of the bottom surface of the side groove 102 facing the positioning groove 101 shares an edge with the vertical sidewall corresponding to the positioning groove 101, so that the side groove 102 and the positioning groove 101 are interconnected. The depth of the side groove 102 should be less than the depth of the positioning groove 101, and is set according to the height of the upper surface of the buffer pad 200 after it is placed in the positioning groove 101, so that the bottom surface of the side groove 102 is lower than the upper surface of the buffer pad 200 or flush with the upper surface of the buffer pad 200.

[0038] By setting one or more side grooves 102 around the buffer pad 200, a hollow area is formed on one or more sides of the buffer pad 200. If the LCD panel is misaligned or moves when placed on the buffer pad 200, the edge of the LCD panel will move to the hollow area and will not directly overlap with the upper surface of the positioning substrate 100. This avoids problems such as vacuum bonding failure or LCD panel breakage and cracking caused by overlap, thus improving the production quality of the LCD module. In addition, the positioning structure on the buffer pad 200 reduces the difficulty of placing the LCD panel.

[0039] like Figure 1 and Figure 3 As shown, in some embodiments, the positioning substrate 100 is provided with a relief groove 103 on the positioning surface. The relief groove 103 is connected to the positioning groove 101, and the depth of the relief groove 103 is greater than the depth of the positioning groove 101.

[0040] Specifically, one end of the LCD panel typically has an electronic module for controlling, driving, or connecting to other components. The thickness of the electronic module is greater than the thickness of the LCD panel. The clearance groove 103 is a cavity structure with a certain area. After the LCD panel is placed on the buffer pad 200, the electronic module can be embedded in the clearance groove 103 to ensure the flatness of the LCD panel on the buffer pad 200. The cooperation between the electronic module and the clearance groove 103 also allows for the positioning of the LCD panel on the buffer pad 200.

[0041] The shape of the clearance groove 103 can be the same as the outer contour of the electronic module, and the size of the clearance groove 103 can be slightly larger than the size of the electronic module, so that the electronic module can be accurately placed into the clearance groove 103 and avoid hard contact between the electronic module and the clearance groove 103 during the handling process. The position of the clearance groove 103 can be set according to the position of the electronic module on the LCD panel. For example, when the electronic module is placed on one side of the LCD panel, the clearance groove 103 can be located on the corresponding side of the positioning groove 101. The edge of the bottom surface of the positioning groove 101 shares the same edge as the corresponding vertical sidewall of the clearance groove 103, so that the positioning groove 101 and the clearance groove 103 are connected.

[0042] In some embodiments, the clearance groove 103 and a plurality of side grooves 102 are together arranged around the periphery of the positioning groove 101. That is, when the clearance groove 103 is provided on one side of the positioning groove 101, the plurality of side grooves 102 are respectively provided on the other sides of the positioning groove 101. For example, when the positioning groove 101 is rectangular, the clearance groove 103 may be located on one of the long sides of the positioning groove 101, and the number of side grooves 102 may be three, respectively provided on the other three sides of the positioning groove 101. Since the end of the liquid crystal panel with the electronic module is positioned in the clearance groove 103, there is no risk of overlapping with the outside of the positioning substrate 100 during the vacuum bonding process. The side grooves 102 are provided on the side of the positioning groove 101 where the clearance groove 103 is not provided, so as to provide protective measures for the liquid crystal panel in various directions where overlapping risks may occur, and further reduce the problem of overlapping of the liquid crystal panel.

[0043] In addition, when the positioning groove 101 is not provided with a clearance groove 103, the number of side grooves 102 can be the same as the number of sides of the buffer pad 200. For example, four side grooves 102 are provided and arranged in a U-shape around the buffer pad 200.

[0044] like Figure 3 and Figure 4 As shown, in some embodiments, the positioning substrate 100 is provided with a pick-and-place groove 104 on the positioning surface. The pick-and-place groove 104 is located on the side of one of the side grooves 102 facing away from the positioning groove 101 and is connected to the corresponding side groove 102.

[0045] Specifically, the pick-and-place slot 104 is a receiving structure with a certain volume. The pick-and-place slot 104 is used to allow the operator's fingers to insert into it so that they can contact the edge of the LCD panel on the buffer pad 200 facing the pick-and-place slot 104, thereby improving the convenience of picking up and placing the LCD panel.

[0046] The shape of the pick-and-place slot 104 can be arbitrary; for example, it can be rectangular. The side slot 102 has a corresponding cutout on its side wall to connect the pick-and-place slot 104 to the side slot 102. The pick-and-place slot 104 can be positioned on either side of the buffer pad 200, depending on where it is easier for the operator to apply force when picking up or placing the LCD panel. For example, when the electronic module of the LCD panel is located on the side of the LCD panel, the overall center of gravity of the LCD panel is closer to the electronic module due to its greater weight. In this case, the pick-and-place slot 104 can be positioned close to the clearance slot 103 and on one side of the extension direction of the clearance slot 103, allowing the user to apply force to the part of the LCD panel near its electronic module, making the point of force application closer to the center of gravity of the LCD panel.

[0047] In addition, the number of pick-up and place slots 104 can be arbitrary. For example, there can be two pick-up and place slots 104 located on both sides of the extension direction of the positioning slot 101, which further improves the convenience for staff when picking up and placing LCD panels.

[0048] In some embodiments, the depth of the pick-and-place slot 104 is greater than the depth of the side slot 102. The deeper pick-and-place slot 104 allows the operator to insert more of their fingers, so that the edge of the LCD panel corresponds to the middle part of the operator's finger joints, which allows for more comfortable application of force to the LCD panel and also ensures the stability of the force applied to the LCD panel, further improving the convenience of picking up and placing the LCD panel.

[0049] In some embodiments, the positioning substrate 100 has a positioning protrusion 110 on its positioning surface, which is used to position the pressing component of the processing equipment. The positioning protrusion 110 is matched with the pressing component in the liquid crystal module processing equipment. The pressing component has a groove structure adapted to the structure of the positioning protrusion 110. During operation, the pressing component moves towards the positioning substrate 100, causing the positioning protrusion 110 to embed into the groove structure, thereby achieving positioning and engagement between the positioning substrate 100 and the pressing component.

[0050] In some embodiments, the positioning substrate 100 is provided with a plurality of connection holes 105, which surround the periphery of the positioning groove 101. Specifically, the connection holes 105 are used to fix the positioning substrate 100 to the worktable in the liquid crystal module processing equipment using fasteners such as screws, so that the positioning substrate 100 maintains a stable position during vacuum bonding. The shape of the connection holes 105 can be adapted to the type of fastener; for example, the connection holes 105 can be through holes or countersunk holes. The number and arrangement of the connection holes 105 can also be arbitrary; for example, a plurality of connection holes 105 can be evenly arranged around the periphery of the positioning substrate 100, so that the plurality of connection holes 105 surround the periphery of the positioning groove 101, which provides a better fixing effect for the positioning substrate 100.

[0051] On the other hand, this application also provides a processing device, which can be a liquid crystal module vacuum bonding device, including a worktable, a pressing component and the positioning device provided in the first aspect embodiment above. The positioning substrate 100 in the positioning device can be fixed on the worktable by fasteners, so that the positioning substrate 100 is located on the lower side of the pressing component, and the vacuum bonding work is realized by the up and down movement of the pressing component.

[0052] During vacuum bonding, the LCD panel is positioned using multiple positioning holes 201 on the buffer pad 200, and multiple edge grooves 102 ensure that the LCD panel does not easily overlap with the positioning substrate 100 during placement. This avoids the problem of the LCD panel cracking or breaking during the downward pressing of the pressing components, reduces the difficulty of placing and removing the LCD panel, and improves vacuum bonding efficiency. In addition, the buffer pad 200 also cushions the pressure on the LCD panel, making it less likely to break during bonding and improving the production quality of the LCD module.

[0053] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A positioning device, characterized in that, The device includes a positioning substrate and a buffer pad. The positioning substrate has a positioning surface, and a positioning groove and at least one side groove disposed around the positioning groove are formed on the positioning surface of the positioning substrate. The side groove communicates with the positioning groove and extends along the edge of the positioning groove. The buffer pad is disposed in the positioning groove, and the upper surface of the buffer pad is higher than or flush with the bottom surface of the side groove. The buffer pad is provided with a positioning structure for positioning the liquid crystal panel.

2. The positioning device according to claim 1, characterized in that, The positioning structure includes at least one positioning hole disposed on the buffer pad.

3. The positioning device according to claim 1, characterized in that, The positioning substrate has a clearance groove on the positioning surface, the clearance groove is connected to the positioning groove, and the depth of the clearance groove is greater than the depth of the positioning groove.

4. The positioning device according to claim 3, characterized in that, The clearance groove and the plurality of side grooves are together arranged around the periphery of the positioning groove.

5. The positioning device according to claim 3, characterized in that, The positioning base plate has a pick-and-place slot on the positioning surface. The pick-and-place slot is located on the side of one of the side slots facing away from the buffer pad, and the pick-and-place slot is connected to the corresponding side slot.

6. The positioning device according to claim 5, characterized in that, The pick-and-place slot is located close to the relief slot and on one side of the extension direction of the relief slot.

7. The positioning device according to claim 5, characterized in that, The depth of the pick-and-place slot is greater than the depth of the side slot.

8. The positioning device according to claim 4, characterized in that, The positioning base plate has a positioning protrusion on the positioning surface, and the positioning protrusion is used to position the pressing component of the processing equipment.

9. The positioning device according to any one of claims 1-8, characterized in that, The positioning base plate has multiple connection holes on the positioning surface, and the multiple connection holes surround the periphery of the positioning groove.

10. A processing device, characterized in that, The device includes a worktable, a pressing component, and a positioning device as described in any one of claims 1-9; the positioning base plate is mounted on the worktable, and the pressing component is movably disposed above the positioning base plate, capable of moving toward the positioning base plate and pressing against the positioning surface of the positioning base plate.

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