Base structure of low-pressure injection molding brake lamp assembly

Abstract

The utility model discloses a base structure of a low-pressure injection molding brake lamp assembly, which comprises a bottom shell and a circuit board pressed in the bottom shell, a mounting cavity is arranged in the bottom shell, a pin component and a magnet are respectively arranged at two ends of the lower surface of the circuit board, a support structure is arranged in the mounting cavity, and the pin component is arranged in the support structure. The circuit board can be suspended in the bottom shell based on the supporting structure, the bottom shell is provided with glue sealing areas located on the upper side and the lower side of the circuit board, a glue injection channel used for conducting the upper glue sealing area and the lower glue sealing area is formed between the peripheral wall of the circuit board and the inner wall of the bottom shell, glue sealing on the upper side and the lower side of the PCBA is even, and the glue sealing effect is improved.

Description

Technical Field

[0001] This utility model relates to the field of automotive parts technology, and in particular to a base structure for a low-pressure injection molded brake light assembly. Background Technology

[0002] The existing brake light assembly base structure consists of three main parts: PCBA, magnet, and base shell. During the production process, the magnet and PCBA are pressed into the base shell and placed in a special low-pressure injection mold. After the hot melt adhesive is melted by the low-pressure injection molding machine, the low-pressure injection molding machine is started to close the mold and inject the hot melt adhesive. The base shell combines with the molten hot melt adhesive to complete the sealing of the PCBA. After the low-pressure injection molding machine opens the mold, the sealed base assembly is obtained.

[0003] From the injection molding process of the base assembly, the hot melt adhesive needs to maintain a certain flat surface during the injection molding process. That is, the PCBA needs to be placed flat in the bottom shell to ensure effective sealing of the PCBA. However, the upper surface of the PCBA is integrated with electronic components, and the thickness of the melt on the upper and lower parts of the PCBA is inconsistent, resulting in uneven cooling rate. This leads to uneven thickness of the sealant on the upper and lower parts of the PCBA and poor sealing effect. Based on this problem, the internal structure of the bottom shell is optimized. Utility Model Content

[0004] The purpose of this utility model is to overcome the shortcomings and deficiencies of the existing technology and to provide a base structure for a low-pressure injection molded brake light assembly.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a base structure for a low-pressure injection molded brake lamp assembly, comprising a bottom shell and a circuit board press-fitted into the bottom shell, a mounting cavity provided inside the bottom shell, pin assemblies and magnets respectively provided at both ends of the lower surface of the circuit board, a support structure provided inside the mounting cavity, the circuit board being suspended inside the bottom shell based on the support structure, the bottom shell having sealing areas located on the upper and lower sides of the circuit board, and an injection channel for connecting the upper and lower sealing areas being formed between the outer peripheral wall of the circuit board and the inner wall of the bottom shell.

[0006] As a preferred embodiment of this utility model, the glue injection channel is adapted to the shape of the outer peripheral wall of the circuit board, and the glue injection channel is provided in a ring.

[0007] As a preferred technical solution of this utility model, the bottom wall of the mounting cavity is provided with a plurality of grooves arranged along the length direction between the pin assembly and the magnet.

[0008] As a preferred embodiment of this utility model, there are two grooves arranged at intervals, and each groove has an exhaust hole on its side.

[0009] As a preferred embodiment of the present invention, the support structure includes multiple support portions distributed on the inner sidewall of the mounting cavity, the multiple support portions having the same height, and the lower surface of the circuit board being placed flat on the upper end of the multiple support portions.

[0010] As a preferred embodiment of this utility model, at least two support portions are provided and located on both sides of the lower surface of the circuit board.

[0011] As a preferred embodiment of this utility model, a slot is provided on the bottom wall of the mounting cavity on the side corresponding to the pin assembly.

[0012] As a preferred embodiment of this utility model, the part of the bottom wall of the mounting cavity corresponding to the support structure and the upper surface of the slot are provided with a chamfered surface.

[0013] As a preferred embodiment of this utility model, the side wall of the slot relative to the support structure and the side wall of the mounting cavity are a common surface, and two guide plates are spaced apart on the common surface, with a guide groove formed between the two guide plates.

[0014] As a preferred technical solution of this utility model, the circuit board is provided with a notch at one end corresponding to the guide plate. The two side walls of the notch abut against the opposite side of the two guide plates. One end of the guide plate relative to the common surface extends to the inner side wall of the notch, and a distance is left between the end of the other guide plate relative to the common surface and the inner side wall of the notch.

[0015] In summary, the beneficial effects of this utility model are as follows: the circuit board can be suspended in the bottom shell through the support structure, the injected hot melt adhesive can flow quickly into the sealing area below the circuit board through the adhesive injection channel, and the groove added to the bottom wall of the mounting cavity makes the sealing of the upper and lower sides of the PCBA uniform, avoiding problems such as uneven cooling and abnormal quality. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 This is an exploded view of this utility model;

[0018] Figure 3 This is a cross-sectional view of the present invention;

[0019] Figure 4 This is a schematic diagram of the internal structure of the bottom shell in this utility model;

[0020] Figure 5 yes Figure 4 A magnified view of part A;

[0021] Figure 6 This is a schematic diagram of the internal structure of the bottom shell in this utility model.

[0022] Reference numerals: 1. Bottom shell; 2. Circuit board; 3. Mounting cavity; 4. Pin assembly; 5. Magnet; 6. Sealing area; 7. Injection channel; 8. Groove; 9. Vent hole; 10. Support; 11. Slot; 12. Chamfered surface; 13. Common surface; 14. Guide plate; 15. Guide groove; 16. Notch; 17. Hot melt adhesive. Detailed Implementation

[0023] To make the technical means, creative features, and achieved objectives and effects of this utility model easier to understand, the present utility model is further described below with reference to specific embodiments and accompanying drawings. However, the following embodiments are merely preferred embodiments of this utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described in the implementation plan without creative effort are all within the protection scope of this utility model.

[0024] The specific embodiments of this utility model are described below with reference to the accompanying drawings.

[0025] like Figure 1-6 The diagram shows a base structure for a low-pressure injection molded brake lamp assembly, including a base shell 1 and a circuit board 2 press-fitted into the base shell 1. A mounting cavity 3 is provided within the base shell 1. Pin assemblies 4 and magnets 5 are respectively provided at both ends of the lower surface of the circuit board 2. A support structure is provided within the mounting cavity 3. The circuit board 2 can be suspended within the base shell 1 based on the support structure. The base shell 1 has sealing areas 6 located on the upper and lower sides of the circuit board 2. An injection channel 7 for connecting the upper and lower sealing areas 6 is formed between the outer peripheral wall of the circuit board 2 and the inner wall of the base shell 1. In this embodiment, the thickness of the upper and lower sealing areas 6 can be set to be the same, or there may be some error.

[0026] The circuit board 2 can be suspended in the bottom shell 1 by the support structure. The injected hot melt adhesive 17 can flow into the sealing area 6 below the circuit board 2 through the adhesive injection channel 7. In addition, a groove 8 is added to the bottom wall of the mounting cavity 3 to make the sealing of the upper and lower sides of the PCBA uniform, so as to avoid uneven cooling and abnormal quality problems.

[0027] The injection channel 7 is adapted to the shape of the outer peripheral wall of the circuit board 2. The injection channel 7 is provided with a ring to improve the melt flow rate, so that it can quickly fill the sealing area 6 below the circuit board 2.

[0028] The bottom wall of the mounting cavity 3 has multiple grooves 8 arranged along the length direction between the pin assembly 4 and the magnet 5. There are two grooves 8, and the two grooves 8 are spaced apart. Each groove 8 has a vent hole 9 on its side. In this embodiment, the bottom wall of the mounting cavity 3 also has a vent hole 9 at the end corresponding to the magnet 5, so that the gas in the cavity can be effectively discharged, and the gas cannot be discharged, which will cause the surface of the part to bulge.

[0029] The support structure includes multiple support parts 10 distributed on the inner sidewall of the mounting cavity 3. The multiple support parts 10 have the same height. The lower surface of the circuit board 2 is placed flat on the upper end of the multiple support parts 10. At least two support parts 10 are provided and located on both sides of the lower surface of the circuit board 2. In this embodiment, the support parts 10 are block-shaped.

[0030] A slot 11 is provided on the bottom wall of the mounting cavity 3 corresponding to the side of the pin assembly 4. A chamfered surface 12 is provided at the junction of the bottom wall of the mounting cavity 3 and the upper surface of the slot 11. The chamfered surface 12 can improve the orientation of melt molecules and the flow rate.

[0031] The side wall of the slot 11 relative to the support structure and the side wall of the mounting cavity 3 are a common surface 13. Two guide plates 14 are spaced apart on the common surface 13, and a guide groove 15 is formed between the two guide plates 14. The circuit board 2 is provided with a notch 16 at one end of the guide plate 14. The two side walls of the notch 16 abut against the opposite side of the two guide plates 14. One end of the guide plate 14 relative to the common surface 13 extends to the inner side wall of the notch 16, and a distance is left between the end of the other guide plate 14 relative to the common surface 13 and the inner side wall of the notch 16. This can improve the melt flow rate and allow the hot melt adhesive 17 to enter the slot 11 quickly.

[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the utility model as defined by the appended claims and their equivalents.

Claims

1. A base structure for a low-pressure injection-molded brake lamp assembly, comprising a base shell (1) and a circuit board (2) press-fitted into the base shell (1), characterized in that: The bottom shell (1) is provided with an installation cavity (3). The lower surface of the circuit board (2) is provided with a pin assembly (4) and a magnet (5) at both ends. The installation cavity (3) is provided with a support structure. The circuit board (2) can be suspended in the bottom shell (1) based on the support structure. The bottom shell (1) has a sealing area (6) located on the upper and lower sides of the circuit board (2). An injection channel (7) for connecting the upper and lower sealing areas (6) is formed between the outer peripheral wall of the circuit board (2) and the inner wall of the bottom shell (1).

2. The base structure of the low-pressure injection molded brake lamp assembly according to claim 1, characterized in that: The glue injection channel (7) is adapted to the shape of the outer peripheral wall of the circuit board (2), and the glue injection channel (7) is provided with a ring.

3. The base structure of the low-pressure injection molded brake lamp assembly according to claim 1, characterized in that: The bottom wall of the mounting cavity (3) has multiple grooves (8) arranged along the length direction between the pin assembly (4) and the magnet (5).

4. The base structure of the low-pressure injection molded brake lamp assembly according to claim 3, characterized in that: The groove (8) is provided in two places and the two grooves (8) are spaced apart. Each groove (8) has an exhaust hole (9) on its side.

5. The base structure of the low-pressure injection molded brake lamp assembly according to claim 1, characterized in that: The support structure includes multiple support parts (10) distributed on the inner sidewall of the mounting cavity (3). The multiple support parts (10) have the same height, and the lower surface of the circuit board (2) is placed flat on the upper end of the multiple support parts (10).

6. The base structure of the low-pressure injection molded brake lamp assembly according to claim 5, characterized in that: The support portion (10) is provided in at least two parts and is located on both sides of the lower surface of the circuit board (2).

7. The base structure of the low-pressure injection-molded brake lamp assembly according to any one of claims 1 to 6, characterized in that: The mounting cavity (3) has a slot (11) on the bottom wall corresponding to the side of the pin assembly (4).

8. The base structure of the low-pressure injection molded brake lamp assembly according to claim 7, characterized in that: The bottom wall of the mounting cavity (3) corresponding to the support structure is provided with a chamfered surface (12) at the connection between the part of the support structure and the upper surface of the slot (11).

9. The base structure of the low-pressure injection molded brake lamp assembly according to claim 7, characterized in that: The side wall of the slot (11) relative to the support structure and the side wall of the mounting cavity (3) are a common surface (13). Two guide plates (14) are spaced apart on the common surface (13) and a guide groove (15) is formed between the two guide plates (14).

10. The base structure of the low-pressure injection molded brake lamp assembly according to claim 9, characterized in that: The circuit board (2) has a notch (16) at one end corresponding to the guide plate (14). The two side walls of the notch (16) abut against the opposite side of the two guide plates (14). One end of one guide plate (14) extends to the inner side wall of the notch (16) relative to the common surface (13), and there is a distance between the end of the other guide plate (14) relative to the common surface (13) and the inner side wall of the notch (16).

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