Heating test device for chip particles

Abstract

The utility model discloses a heating testing device for chip particles, which relates to the technical field of chip testing and comprises a placing mechanism for placing the chip particles to be tested. The temperature control module is connected with the placing mechanism, the test circuit module is electrically connected with the chip particles to be tested, the data analysis module is electrically connected with the temperature control module and the test circuit module, the temperature control module is used for adjusting the temperature of the placing mechanism, and the test circuit module is used for testing the performance of the chip. And the data analysis module is used for analyzing and recording the test result. The chip particle heating test device provided by the utility model can test a single chip in different temperature environments, and can more accurately evaluate the performance and reliability of the chip, thereby being beneficial to improving the quality of a final product.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and specifically to a chip heating testing device. Background Technology

[0002] Integrated circuits, also known as microcircuits, microchips, or wafers / chips, are a way to miniaturize circuits (mainly including semiconductor devices, but also passive components) in electronics. They are often manufactured on the surface of semiconductor wafers. When a chip is powered on, it generates heat. If the heat is too high, the chip will burn out. Therefore, chips need to be tested after production.

[0003] Currently, chip testing is mainly conducted at room temperature, without considering the various temperature environments that chips may encounter in actual applications. Traditional testing methods often fail to accurately reflect the performance of chips under high or low temperature environments, which can affect the reliability and quality of the final product. Therefore, there is a need for a device that can test chip particles at different temperatures. This invention addresses this technical problem. Utility Model Content

[0004] The purpose of this application is to provide a heating test device for chip particles, which aims to solve the technical problems corresponding to the prior art.

[0005] To achieve the above objectives, this application proposes a heating test device for chip particles. The heating test device includes a placement mechanism for placing the chip particle under test, a temperature control module connected to the placement mechanism, a test circuit module electrically connected to the chip particle under test, and a data analysis module electrically connected to the temperature control module and the test circuit module. The temperature control module is used to adjust the temperature of the placement mechanism, the test circuit module is used to perform performance testing on the chip, and the data analysis module is used to analyze and record the test results.

[0006] Furthermore, the temperature control module includes a temperature-changing component and a temperature sensor connected to the placement mechanism, and a controller electrically connected to the temperature-changing component and the temperature sensor. The controller is electrically connected to the data analysis module.

[0007] Furthermore, the temperature-changing assembly includes a heater connected to the placement mechanism, and the heater is connected to the controller via a relay.

[0008] Furthermore, the test circuit module includes a signal generator electrically connected to the chip under test, a data acquisition card electrically connected to the chip under test, and a data comparison module connected to the data acquisition card. The data comparison module is electrically connected to the data analysis module.

[0009] Furthermore, the data analysis module includes a data processing unit for analyzing data and a storage device for storing data, wherein the storage device, the controller, and the data comparison module are electrically connected to the data processing unit.

[0010] Furthermore, the signal generator and the data acquisition card are electrically connected to the metal pin points, which are connected to the placement mechanism and in contact with the chip particles under test.

[0011] Furthermore, the placement mechanism includes a test socket for placing the chip under test and a top cover for pressing onto the chip under test.

[0012] Furthermore, the heater is connected to the upper cover.

[0013] Furthermore, the temperature sensor is connected to the top cover.

[0014] Furthermore, the metal needle point is connected to the test socket.

[0015] The technical effects of this utility model are as follows:

[0016] (1) This solution uses a temperature control module to control the temperature applied to the chip particles by the placement mechanism, and uses a test circuit module to perform performance tests on the chip particles. The collected data is uploaded to the data analysis module for analysis and recording to obtain the chip's performance at different temperatures. In this way, the chip's performance and reliability can be evaluated more accurately, which helps to improve the quality of the final product.

[0017] (2) This solution uses a heater to heat the top cover to increase the ambient temperature of the chip particles, thereby achieving temperature regulation. Moreover, both the heater and the temperature sensor are located on the top cover, which helps with temperature transmission and rapid response of the temperature sensor. It also improves the accuracy of the temperature collected by the temperature sensor, reduces temperature error, and thus improves the accuracy of the test.

[0018] (3) The test signal emitted by the signal generator will be transmitted to the metal pin point and then to the chip particle. The data acquisition card will read the data of the chip particle under test during the test through the metal pin point. The data comparison module will compare the acquired data with the standard data and transmit the data comparison result to the data processing unit, thereby realizing the test of the chip particle. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 This is a connection block diagram of the present invention.

[0021] Figure 2 This is a flowchart of the workflow of this utility model.

[0022] Figure 3 This is a flowchart of the preheating process in this utility model.

[0023] The attached diagram is labeled as follows: 1. Controller; 2. Temperature sensor; 3. Heater; 4. Top cover; 5. Test socket; 6. Signal generator; 7. Data acquisition card; 8. Chip under test; 9. Data processing unit; 10. Metal pin point; 11. Storage device; 12. Data comparison module.

[0024] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0027] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0028] See Figures 1-3 A heating test device for chip particles includes a placement mechanism for placing a chip particle 8 to be tested, a temperature control module connected to the placement mechanism, a test circuit module electrically connected to the chip particle 8 to be tested, and a data analysis module electrically connected to the temperature control module and the test circuit module. The temperature control module is used to adjust the temperature of the placement mechanism, the test circuit module is used to perform performance testing on the chip, and the data analysis module is used to analyze and record the test results. Figure 2 The heating test platform in this solution is the placement mechanism, because this solution uses the placement mechanism to place the chip particles, thereby realizing the heating test of the chip particles.

[0029] Furthermore, the temperature control module includes a temperature variable component and a temperature sensor 2 connected to the placement mechanism, and a controller 1 electrically connected to the temperature variable component and the temperature sensor 2. The controller 1 is electrically connected to the data analysis module.

[0030] See Figure 2 , Figure 3 Preferably, in this embodiment, the controller 1 may use only the PID feedback control algorithm or only the PWM technology to accurately control the temperature regulation of the variable temperature component.

[0031] PID control algorithm: The PID algorithm can effectively reduce temperature overshoot and response delay, and improve control accuracy. The PID algorithm module is one of the most commonly used feedback control strategies in automatic control systems. It adjusts the system output by combining the three elements of proportional (P), integral (I) and derivative (D) so that the actual output of the system tracks the desired set value.

[0032] PWM signal adjustment: By precisely controlling the duty cycle of the PWM signal, the heating power can be finely adjusted. System response speed: Selecting a suitable PWM frequency balances the system's response speed and efficiency, avoiding uneven heating or overheating caused by excessively low frequency. Preferably, controller 1 can be used to generate a PWM signal. Controller 1 adjusts the duty cycle of the PWM signal based on the difference between the preset temperature value (target temperature) and the current temperature (detected by temperature sensor 2). For example, if temperature sensor 2 detects that the current temperature is 19℃ and the target temperature is 20℃, controller 1 calculates the required increase in power based on the difference and the characteristics of the heating element, and then appropriately increases the duty cycle of the PWM signal, causing the heating element to output more heat, thereby raising the temperature. Temperature sensor 2 continuously monitors the temperature of the test environment and feeds the temperature data back to microcontroller 1. This feedback is key to achieving precise control. For example, if temperature sensor 2 detects that the temperature has reached 20℃, controller 1 will adjust the duty cycle of the PWM signal based on this information, such as by decreasing the duty cycle to maintain this temperature and prevent the temperature from rising further, thus achieving precise temperature control.

[0033] The above method allows the system to apply gradual temperature changes to the chip during the preheating phase, avoiding potential damage to the chip due to excessively rapid temperature changes.

[0034] Furthermore, the temperature-changing assembly includes a heater 3 connected to the placement mechanism, and the heater is connected to the controller 1 via a relay.

[0035] Furthermore, the test circuit module includes a signal generator 6 electrically connected to the chip under test 8, a data acquisition card 7 electrically connected to the chip under test 8, and a data comparison module 12 connected to the data acquisition card 7. The data comparison module 12 is electrically connected to the data analysis module.

[0036] Furthermore, the data analysis module includes a data processing unit 9 for analyzing data, a storage device 11 for storing data, and the storage device 11, controller 1, and data comparison module 12 are electrically connected to the data processing unit 9. In this embodiment, the data processing unit 9 can be a computer or other device capable of data processing.

[0037] Furthermore, the signal generator 6 and the data acquisition card 7 are electrically connected to the metal pin point 10, which is connected to the placement mechanism and in contact with the chip particle 8 under test.

[0038] Furthermore, the placement mechanism includes a test socket 5 for placing the chip under test 8 and an upper cover 4 for pressing onto the chip under test 8. The structures of the upper cover 4 and the test socket 5 are prior art known to those skilled in the art. Provided that the contents described in this solution can be achieved, the upper cover 4 and the test socket 5 can be of any shape, and will not be described in detail here.

[0039] Furthermore, heater 3 is connected to the upper cover 4.

[0040] Furthermore, temperature sensor 2 is connected to the upper cover 4.

[0041] Preferably, in this embodiment, both the heater 3 and the temperature sensor 2 are located inside the upper cover 4. With this arrangement, the heater 3 can transfer heat to the chip particle 8 under test more quickly. Furthermore, the temperature sensor 2 is very close to the heater 3 and the chip particle 8 under test. This arrangement can make the collected temperature more accurate, thereby improving the reliability of the data.

[0042] Furthermore, the metal needle point 10 is connected to the test socket 5.

[0043] The working principle of this utility model is as follows:

[0044] Before starting the test, the preset temperature range, the configuration of the test circuit module, and the parameter settings of the data analysis module need to be initialized. Then, the target temperature is set through the controller 1 to preheat the chip under test 8 so that its working environment reaches the target temperature so that the chip under test 8 can be tested at the target temperature. Only one of PID or PWM technology can be used for preheating, and the ambient temperature is gradually adjusted to the set target temperature. During the preheating process, the heater 3 will gradually increase the ambient temperature until the target temperature is reached. The temperature sensor 2 will monitor the temperature of the cover 4 in real time. The temperature is continuously monitored throughout the preheating process. As needed, it can be adjusted through the controller 1 to ensure that the ambient temperature is always kept within the target temperature range.

[0045] After reaching the target temperature, the chip is tested by the test circuit module. The test signal emitted by the signal generator 6 is transmitted to the metal pin point 10 and then to the chip under test 8. The data acquisition card 7 reads the data of the chip under test 8 during the test through the metal pin point 10. The data comparison module 12 compares the acquired data with the standard data to determine whether the data of the chip under test 8 during the test meets the standard, and transmits the data comparison result to the data processing unit 9.

[0046] After the performance test is completed at the initial target temperature, the heating power of the heater 3 can be gradually adjusted by the controller 1 to change the temperature of the test stand 5, and the performance test of the chip can be repeated to test the chip's operation under different temperature environments.

[0047] The temperature conditions and test data during the test are uploaded to the data processing unit 9 to achieve data integration. The data processing unit 9 analyzes and records the data and can display the performance of the chip particles as a function of temperature through graphs or other means. This is used to analyze and judge whether the chip particles meet the performance standards and generate a test report. The storage device 11 stores the data.

[0048] After the test is completed, the preset temperature range, the configuration of the test circuit module, and the parameter settings of the data analysis module are initialized to prepare for the test of the next chip.

[0049] As can be seen from the above embodiments, this application uses a temperature control module to control the temperature applied to the chip particle 8 by the placement mechanism, and uses a test circuit module to perform performance tests on the chip. The collected data is then uploaded to a data analysis module for analysis and recording to obtain the chip's performance at different temperatures. Compared with traditional testing methods, this solution overcomes the problem of difficulty in testing chips at different temperatures. Thus, the chip's performance and reliability can be evaluated more accurately through the above method, which helps to improve the quality of the final product.

[0050] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A heating test device for chip particles, characterized in that, The device includes a placement mechanism for placing the chip under test (8), a temperature control module connected to the placement mechanism, a test circuit module electrically connected to the chip under test (8), and a data analysis module electrically connected to the temperature control module and the test circuit module. The temperature control module is used to adjust the temperature of the placement mechanism, the test circuit module is used to perform performance testing on the chip, and the data analysis module is used to analyze and record the test results.

2. The heating test apparatus for chip particles according to claim 1, characterized in that, The temperature control module includes a temperature-changing component and a temperature sensor (2) connected to the placement mechanism, and a controller (1) electrically connected to the temperature-changing component and the temperature sensor (2). The controller (1) is electrically connected to the data analysis module.

3. The heating test apparatus for chip particles according to claim 2, characterized in that, The temperature-changing component includes a heater (3) connected to the placement mechanism, and the heater (3) is connected to the controller (1) via a relay.

4. The heating test apparatus for chip particles according to claim 3, characterized in that, The test circuit module includes a signal generator (6) electrically connected to the chip under test (8), a data acquisition card (7) electrically connected to the chip under test (8), and a data comparison module (12) connected to the data acquisition card (7). The data comparison module (12) is electrically connected to the data analysis module.

5. The heating test apparatus for chip particles according to claim 4, characterized in that, The data analysis module includes a data processing unit (9) for analyzing data and a storage device (11) for storing data. The storage device (11), the controller (1), and the data comparison module (12) are electrically connected to the data processing unit (9).

6. The heating test apparatus for chip particles according to claim 4, characterized in that, The signal generator (6) and the data acquisition card (7) are electrically connected to the metal pin point (10), and the metal pin point (10) is connected to the placement mechanism and in contact with the chip particle (8) under test.

7. The heating test apparatus for chip particles according to claim 6, characterized in that, The placement mechanism includes a test socket (5) for placing the chip particle (8) under test and a top cover (4) for pressing on the chip particle (8) under test.

8. The heating test apparatus for chip particles according to claim 7, characterized in that, The heater (3) is connected to the top cover (4).

9. The heating test apparatus for chip particles according to claim 7, characterized in that, The temperature sensor (2) is connected to the top cover (4).

10. The heating test apparatus for chip particles according to claim 7, characterized in that, The metal needle point (10) is connected to the test socket (5).

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