Multi-channel cascade power supply module aging tool

Abstract

The utility model relates to the technical field of multi-channel cascade power supplies, in particular to a multi-channel cascade power supply module aging tool, which comprises an aging tool bottom plate, an MCU (Microprogrammed Control Unit) module, a dial switch, a power supply management module, an RS485 module, a liquid crystal display module, a communication isolation module, a power supply module, a voltage and current measuring circuit and a 220V AC (Alternating Current) input module, a dial switch, a power supply management module, an RS485 module, a liquid crystal display module, a communication isolation module, a power supply module and a voltage and current measuring circuit are arranged on the aging tool bottom plate, and the liquid crystal display module is electrically connected with the power supply management module. According to the utility model, manual one-by-one measurement is not needed, parameters are synchronously sent to an upper computer for display through the RS485, the load size is not needed to be changed by manually replacing a load resistor, the NTC temperature measurement function is provided, devices with high heat productivity, such as a transformer, an MOS tube and the like, on the module can be monitored in real time, and the reliability is high. Abnormal temperature can be displayed on a liquid crystal and an upper computer in time for production troubleshooting.

Description

Technical Field

[0001] This utility model relates to the field of multi-channel cascaded power supply technology, specifically a multi-channel cascaded power supply module for old chemical equipment. Background Technology

[0002] Traditional power module aging procedures use a load resistor connected to the output voltage for aging, but this method cannot measure the power module's input power, power factor, output voltage, or output ripple. Manually changing the load resistor alters the output power, but bus configuration methods cannot be used to change it. Output voltage and current are measured manually using a multimeter, and output ripple is measured using an oscilloscope.

[0003] Traditional methods of aging power modules using electronic loads can only measure the output voltage, current, and power, but cannot measure the input power and efficiency. An external AC power measuring instrument is required to measure input power and efficiency. Using hundreds or thousands of electronic loads to age power modules simultaneously is inconvenient for reading data and extremely costly, making it unsuitable for factory aging of power modules. Utility Model Content

[0004] The purpose of this invention is to provide a multi-channel cascaded power module for old-fashioned equipment, which eliminates the need for manual measurement of each component. Parameters are also synchronously transmitted to a host computer via RS485 for display. It eliminates the need for manual replacement of load resistors to adjust load values ​​and includes an NTC temperature measurement function. This allows for real-time monitoring of high-heat-generating components such as transformers and MOSFETs on the module, and abnormal temperatures can be promptly displayed on the LCD and host computer for production troubleshooting, thus solving the problems mentioned in the background section.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A multi-channel cascaded power supply module for aging equipment includes an aging equipment base plate, an MCU module, a DIP switch, a power management module, an RS485 module, an LCD display module, a communication isolation module, a power module, a voltage and current measurement circuit, and a 220VAC input module. The DIP switch, power management module, RS485 module, LCD display module, communication isolation module, power module, and voltage and current measurement circuit are mounted on the aging equipment base plate. The LCD display module is electrically connected to the power management module, and the 220VAC input module is connected to the communication isolation module through an AC metering circuit.

[0007] Furthermore, a load resistor is provided on the voltage and current measurement circuit.

[0008] Furthermore, a ripple temperature measurement circuit is provided between the power module and the voltage and current measurement circuit.

[0009] Furthermore, the RS485 module is equipped with a cascading interface, which is electrically connected to the power management system.

[0010] Furthermore, the power module is equipped with an NTC temperature measurement module and a module plug-in interface.

[0011] Furthermore, a cooling fan is installed on the power management module.

[0012] Furthermore, the cooling fan is equipped with heat sinks.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This multi-channel cascaded power supply module, used in older engineering equipment, displays the input and output voltage, current, power, efficiency, and ripple of each channel intuitively on an LCD screen, eliminating the need for manual measurement. Parameters are also synchronously transmitted to a host computer via RS485, eliminating the need for manual load resistor replacement. It also features NTC temperature measurement, allowing real-time monitoring of high-heat-generating components such as transformers and MOSFETs. Abnormal temperatures are promptly displayed on the LCD and host computer for troubleshooting in production. Attached Figure Description

[0015] Figure 1 This is a system block diagram of an old chemical plant using a multi-channel cascaded power module.

[0016] Figure 2 This is a schematic diagram of the structure of the 220VAC input module, AC metering circuit, NTC temperature measurement module, and ripple temperature measurement circuit.

[0017] Figure 3 This is a schematic diagram of an isolated communication circuit.

[0018] Figure 4 This is a schematic diagram of the voltage and current measurement circuit, load resistor, and cooling fan.

[0019] Figure 5 This is a schematic diagram of the liquid crystal display module.

[0020] Figure 6 This is a schematic diagram of the power management module.

[0021] Figure 7 This is a schematic diagram of the RS485 module and cascade interface.

[0022] Figure 8 This is a schematic diagram of a DIP switch. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figures 1 to 8 This utility model provides a technical solution:

[0025] A multi-channel cascaded power supply module for aging equipment includes an aging equipment base plate, an MCU module, a DIP switch, a power management module, an RS485 module, an LCD display module, a communication isolation module, a power module, a voltage and current measurement circuit, and a 220VAC input module. The DIP switch, power management module, RS485 module, LCD display module, communication isolation module, power module, and voltage and current measurement circuit are mounted on the aging equipment base plate. The LCD display module is electrically connected to the power management module, and the 220VAC input module is connected to the communication isolation module through an AC metering circuit.

[0026] Reference Figure 5 The liquid crystal display circuit consists of a liquid crystal module LCD1, a filter capacitor C113, a backlight switch Q2, and current-limiting resistors R20, R21, R22, and R23.

[0027] Reference Figure 2 This invention uses a 220VAC input voltage via J1 to power the modules M1, M2, etc., to be aged. A fuse FUSE1 connected in series after J1 provides short-circuit and overload protection. The metering chip U8 measures the input power and power factor of module M1. A voltage divider resistor composed of R44, R50, R64, R43, R45, R56, and R49 divides the 220VAC voltage to obtain a small signal, which is then fed into U8 for measurement. This signal is input to U8's V3P, V3N voltage differential ADC channel through an RC anti-aliasing filter circuit composed of R56, C27, R57, and C28. A low-resistance alloy resistor R76 connected in series to pin 3 of module M1 collects the current signal of module M1. This signal is then input to U8's V1P, V1N current differential ADC channel through an anti-aliasing filter circuit composed of R84, C50, R85, and C51. U8 calculates the input power and power factor of the power supply module by collecting the voltage and current signals.

[0028] R154, D39, R155, U22, and J16 form a pulse output circuit. The measurement accuracy of U8 is calibrated using a standard calibration stand, ensuring that the input power and power factor errors are less than 0.5%.

[0029] R158, R159, C122, and NTC1 form the NTC temperature measurement circuit of power module M1. VINA is the reference voltage value of the ADC, and NTC_ADC1 is the analog voltage signal of the NTC. The analog voltage decreases as the temperature increases. The MCU obtains the temperature value of the power module by looking up a table.

[0030] C24, R48, R53, and R54 form the ripple measurement circuit. The output voltage of the power supply module is blocked by DC and passed through C24 to obtain the AC ripple component. R53 and R54 divide the reference voltage ADC_REF to obtain the center value of the reference voltage. The AC ripple component is then superimposed onto the center value of the reference voltage through R48. In this way, the ADC input signal RIPPLE_1 is converted from an AC signal to a DC signal, which meets the MCU's ADC input voltage range requirements. The MCU can recover the AC ripple component value by removing the center value component from the acquired RIPPLE_1 signal.

[0031] Reference Figure 3 A serial optocoupler communication isolation circuit composed of R46, U11, R70 and R55, U12, R73 is used to connect the MCU to U8 to obtain the input power and power factor parameters of the power module. A complementary PWM signal with dead time is output from U5 to drive PMOS transistor Q12 and NMOS transistor Q11. R1 provides an initial NMOS pull-down resistor for Q11. The half-bridge driver circuit composed of Q11 and Q12 outputs a T_PWM signal to drive the isolation transformer T1. C111 is used as a resonant capacitor. The signals T_CHA1 and T_CHB1 output from the secondary winding of the transformer are rectified by four Schottky diodes D1, D2, D3, and D4, filtered by C109, regulated by U21, and filtered by C112 to output a 3.3V_L voltage for use by U8. Isolation of the chip's power supply voltage and communication ensures the safety of the measurement.

[0032] The voltage and current measurement circuit is equipped with a load resistor, and a ripple temperature measurement circuit is provided between the power supply module and the voltage and current measurement circuit.

[0033] Reference Figure 4 A voltage divider resistor network consisting of R40, R41, R42, and C26 measures the voltage across the load resistor. R58, R59, R60, and C29 measure the output voltage of the power module. A current sampling resistor and anti-aliasing network consisting of R90, R80, R81, C33, and C34 measures the output current of the power module.

[0034] The output voltage multiplied by the output current is the module's output power, and the module's output power divided by the input power gives the module's operating efficiency.

[0035] A PWM drive circuit, consisting of driver chip U7, filter capacitor C115, bootstrap diode D18, and bootstrap capacitor C54, drives a half-bridge drive topology composed of D21, R68, Q5 and D22, R69, Q6 to buck and step down the module's output voltage. The square wave is filtered by an LC filter circuit composed of L6 and C56, C58, C62 and then applied to the high-power load resistor R160. R160 is fixed to the heatsink of SR1 with screws and thermal grease, and the heatsink is cooled by fan FAN2. A fan speed control circuit composed of J11, D37, Q1, and R12 further cools the heatsink. The fan speed is directly proportional to the total heat generated by the module; the higher the total heat generated, the higher the fan speed.

[0036] The RS485 module is equipped with a cascading interface, which is electrically connected to the power management interface.

[0037] Reference Figure 7 The interface consists of J2 and J12, forming a cascaded interface. Some older chemical assembly boards are connected to form an aging array via the cascaded interface. Each older chemical assembly board obtains the required 12V power supply from the cascaded interface and communicates via RS485.

[0038] The RS485 circuit composed of R3, R9, R10, R7, R11, R15, R16, R17, and R18 is responsible for converting the MCU's TTL level to RS485 level. Using RS485 connection ensures good anti-interference capability and compatibility of the cascaded bus, and it can be easily connected to a host computer via a USB-to-RS485 adapter cable.

[0039] The power module is equipped with an NTC temperature measurement module and a module plug-in interface.

[0040] Reference Figure 7 A 12V voltage is obtained from the cascade interface and reverse connection protection is provided through D6. C3 is a filter capacitor. The BUCK circuit, composed of U1, R13, C5, R6, R8, C4, R14, D7, L2, C7, C120, and C9, provides 5V to the system. A 3.3V voltage and a voltage LED indicator are provided by U4, C8, R19, and D8; this part constitutes the system's power management.

[0041] Reference Figure 8The power management module is equipped with a cooling fan, and the cooling fan has a heatsink. R24, R25, R26, R32, R33, R34, R35, R3 and D9, D10, D11, D12, D13, D14, D15, D16 and DIP1 form an 8-bit address DIP switch, providing a total of 256 addresses. Address 00 is the host address, and the other addresses are for the aging assembly. Each aging assembly can age 4 power modules, allowing for the aging and testing of up to 1020 power modules, including their operating parameters and status.

[0042] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-channel cascaded power supply module for aging equipment, comprising an aging equipment baseboard, an MCU module, a DIP switch, a power management module, an RS485 module, an LCD display module, a communication isolation module, a power module, a voltage and current measurement circuit, and a 220VAC input module, characterized in that: The old chemical equipment base plate is equipped with a DIP switch, a power management module, an RS485 module, an LCD display module, a communication isolation module, a power module, and a voltage and current measurement circuit. The LCD display module is electrically connected to the power management module, and the 220VAC input module is connected to the communication isolation module through an AC metering circuit.

2. The aging equipment for a multi-channel cascaded power module according to claim 1, characterized in that: The voltage and current measurement circuit is equipped with a load resistor.

3. The aging equipment for a multi-channel cascaded power module according to claim 1, characterized in that: A ripple temperature measurement circuit is provided between the power module and the voltage and current measurement circuit.

4. The aging equipment for a multi-channel cascaded power module according to claim 1, characterized in that: The RS485 module is equipped with a cascading interface, which is electrically connected to the power management system.

5. The aging equipment for a multi-channel cascaded power module according to claim 1, characterized in that: The power module is equipped with an NTC temperature measurement module and a module plug-in interface.

6. The aging equipment for a multi-channel cascaded power module according to claim 1, characterized in that: The power management module is equipped with a cooling fan.

7. The aging equipment for a multi-channel cascaded power module according to claim 6, characterized in that: The cooling fan is equipped with heat sinks.

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