Temperature control system for calibrating optical fiber length measuring equipment

Abstract

The utility model provides a temperature control system for optical fiber length measuring equipment calibration, which comprises a heating device and a control device, the heating device comprises a heating part and a heat transfer part, and the heating part is suitable for laying and heating an optical fiber with a standard length. The heat transfer part and the heating part are encircled to form a heat transfer chamber filled with a heat transfer medium, the standard-length optical fiber is located in the heat transfer chamber, is transmitted out through the heat transfer part and then is connected with equipment to be calibrated so as to measure the real-time length of the standard-length optical fiber, and at least one part of heat of the heating part is transmitted to the standard-length optical fiber through the heat transfer part and the heat transfer medium. The control device is suitable for adjusting the heating temperature of the heating part to obtain the corresponding relation between different heating temperatures and the real-time length so as to calibrate the equipment to be calibrated.

Description

Technical Field

[0001] This utility model relates to the field of optical frequency domain reflectometer calibration technology, and in particular to a temperature control system for calibrating optical fiber length measuring equipment. Background Technology

[0002] Optical fiber is a medium that allows light waves to propagate within the fiber. Its basic principle is total internal reflection, meaning that when the angle of incidence is greater than the critical angle, the light wave undergoes total internal reflection at the core-cladding interface, thus enabling long-distance transmission. Optical fiber offers advantages such as high transmission rate, long transmission distance, strong anti-interference capability, small size, and light weight.

[0003] As a high-performance transmission medium, the performance of optical fiber directly affects the stability and reliability of the entire communication system. Therefore, accurate testing and measurement of optical fibers are of great significance. Optical fiber testing and measurement technologies include: optical surface spectrometry (OSA) technology, used to measure parameters such as wavelength, bandwidth, and dispersion to evaluate the transmission performance of the fiber; optical power meter technology, used to measure the input and output optical power of the fiber, calculate the insertion loss and connection loss, and evaluate the transmission efficiency; fiber optic interferometer technology, which uses the interference principle to detect minute deformations and stresses in the fiber to evaluate its mechanical properties; and optical time domain reflectance (OTDR) technology, which injects pulsed light into the fiber and detects the reflected and backscattered light to obtain information such as the fiber's length, loss, and the status of connectors and splices. Currently, OTDR technology is the primary means of optical fiber fault location and length measurement.

[0004] The principle of fiber optic length calibration is to use a standard fiber or grating of known length as a reference, connect an OTDR or optical frequency domain reflectometer (OFDR) to the standard fiber, and perform zero-point calibration or linear calibration. In related technologies, a 2x2 fiber coupler is typically used to form a fiber loop, and a temperature sensor is used to monitor the temperature of the two fiber segments in real time. The fiber length is then corrected using the correction relationship between fiber length and temperature. However, this method can only meet the low-precision calibration requirements of OTDRs and can only display the current temperature; it cannot effectively adjust and maintain the fiber temperature, making it unsuitable for OFDR calibration. Therefore, how to achieve high-precision calibration of OFDR length parameters has become a pressing technical problem to be solved. Utility Model Content

[0005] In view of this, the present invention provides a temperature control system for calibrating fiber optic length measuring equipment, which can improve temperature control accuracy and achieve high-precision calibration.

[0006] To achieve the above objectives, this utility model provides a temperature control system for calibrating an optical fiber length measurement device, comprising: a heating device, including: a heating section, suitable for laying out and heating a standard length optical fiber; a heat transfer section, which together with the heating section forms a heat transfer chamber filled with a heat transfer medium, wherein the standard length optical fiber is located in the heat transfer chamber and passes through the heat transfer section and is connected to the device to be calibrated to measure the real-time length of the standard length optical fiber, wherein at least a portion of the heat from the heating section is transferred to the standard length optical fiber through the heat transfer section and the heat transfer medium; and a control device, suitable for adjusting the heating temperature of the heating section to obtain the correspondence between different heating temperatures and real-time lengths, thereby calibrating the device to be calibrated.

[0007] In one exemplary embodiment, the heating element includes: a semiconductor cooler configured to generate heat using the thermoelectric effect of a semiconductor when energized; and a heat-conducting stage disposed above the semiconductor cooler, wherein the standard-length optical fiber is wound on the heat-conducting stage to absorb heat from the semiconductor cooler through the heat-conducting stage.

[0008] In one exemplary embodiment, the heat conduction stage includes: a substrate attached to the upper surface of the semiconductor cooler; and a pillar formed in the middle of the substrate, wherein a spiral channel extending in the axial direction is formed on the side wall of the pillar, suitable for winding the standard length optical fiber.

[0009] In one exemplary embodiment, the heating element further includes a heat sink, which is attached to the surface of the thermoelectric cooler and is adapted to dissipate heat from the thermoelectric cooler.

[0010] In one exemplary embodiment, the heat sink includes a plurality of parallel and spaced-apart heat sink fins.

[0011] In one exemplary embodiment, the heating device further includes a heat insulation section, which is disposed outside the heat transfer section to reduce heat exchange between the heat transfer section and the external environment.

[0012] In one exemplary embodiment, both the heat transfer portion and the heat insulation portion are provided with through holes for the standard length optical fiber to pass through.

[0013] In one exemplary embodiment, the heating device further includes a temperature measuring unit adapted to measure the temperature of the semiconductor cooler.

[0014] In one exemplary embodiment, the control device includes: a temperature control unit adapted to acquire and adjust the heating temperature of the heating element; and a host computer configured to exchange data with the temperature control unit and provide a user interface.

[0015] In one exemplary embodiment, the temperature control unit is configured to collect temperature information from the temperature measuring unit, perform calculations, and then output a voltage signal to the semiconductor cooler.

[0016] The temperature control system for calibrating fiber optic length measurement equipment provided by this invention heats a standard-length fiber optic cable using a heating element and regulates the heating temperature using a control device, thereby adjusting and maintaining the temperature of the standard-length fiber optic cable. Simultaneously, the standard-length fiber optic cable is enclosed within a heat transfer chamber by the heat transfer element and the heating element, allowing the fiber optic cable to receive heat from both the heating element and the heat transfer medium. This results in more uniform heating, rapid temperature response, and faster attainment of a stable state, further improving the accuracy of temperature control and thus effectively enhancing calibration precision. Attached Figure Description

[0017] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the present invention with reference to the accompanying drawings, in which:

[0018] Figure 1 This is a schematic diagram of the temperature control system for calibrating an optical fiber length measuring device provided by this utility model;

[0019] Figure 2 yes Figure 1 A three-dimensional structural view of the heating section and the heat transfer section in the exemplary embodiment shown;

[0020] Figure 3 This is a schematic diagram of the control device in the temperature control system for calibrating fiber optic length measuring equipment provided by this utility model.

[0021] The meanings of the reference numerals in the above figures are as follows:

[0022] 1. Heating device;

[0023] 11. Heating section;

[0024] 111. Semiconductor refrigerator;

[0025] 112. Heat conduction stage;

[0026] 1121. Substrate;

[0027] 1122. Column;

[0028] 113. Radiator;

[0029] 12. Heat transfer section;

[0030] 13. Temperature measurement unit;

[0031] 14. Heat insulation section;

[0032] 2. Control device;

[0033] 21. Temperature control unit;

[0034] 22. Host computer;

[0035] 23. Microcontroller;

[0036] 24. Touch screen. Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0038] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0039] All terms used herein, including technical and scientific terms, have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0040] When using expressions such as "at least one of A, B, and C," the meaning should generally be interpreted according to the understanding of someone skilled in the art. For example, "a system having at least one of A, B, and C" should include, but is not limited to, systems having A alone, having B alone, having C alone, having A and B, having A and C, having B and C, and / or having A, B, and C. Similarly, when using expressions such as "at least one of A, B, or C," the meaning should generally be interpreted according to the understanding of someone skilled in the art. For example, "a system having at least one of A, B, or C" should include, but is not limited to, systems having A alone, having B alone, having C alone, having A and B, having A and C, having B and C, and / or having A, B, and C.

[0041] It should also be noted that the directional terms mentioned in the embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference in the accompanying drawings and are not intended to limit the scope of protection of this utility model. Throughout the drawings, the same elements are represented by the same or similar reference numerals. Conventional structures or constructions will be omitted where they may cause confusion in understanding this utility model.

[0042] Figure 1This is a schematic diagram of the temperature control system for calibrating fiber optic length measuring equipment provided by this utility model. Figure 2 yes Figure 1 The exemplary embodiment shown is a three-dimensional structural diagram of the heating part and the heat transfer part.

[0043] An exemplary embodiment of this utility model provides a temperature control system for calibrating an optical fiber length measuring device, such as... Figure 1 and Figure 2 As shown, the device includes a heating device 1 and a control device 2. The heating device 1 includes a heating section 11 and a heat transfer section 12. The heating section 11 is used to lay out and heat the standard length optical fiber. The heat transfer section 12 and the heating section together form a heat transfer chamber filled with a heat transfer medium. The standard length optical fiber is located in the heat transfer chamber and is connected to the device to be calibrated after being transmitted through the heat transfer section 12 to measure the real-time length of the standard length optical fiber. At least a portion of the heat from the heating section 11 is transferred to the standard length optical fiber through the heat transfer section 12 and the heat transfer medium. The control device 2 is used to adjust the heating temperature of the heating section 11 to obtain the correspondence between different heating temperatures and real-time lengths, thereby calibrating the device to be calibrated.

[0044] In this implementation, the standard-length optical fiber is heated by the heating unit 11, and the heating temperature is regulated by the control device 2. Simultaneously, the standard-length optical fiber is enclosed within the heat transfer chamber by the heat transfer unit 12 and the heating unit 11, allowing the standard-length optical fiber to receive heat from both the heating unit 11 and the heat transfer medium. This results in more uniform heating, faster temperature rise, and more stable temperature after heat absorption, further improving the accuracy of temperature control and effectively enhancing calibration precision to meet the calibration requirements of OFDR.

[0045] For example, air is preferred as the heat transfer medium because it has both good heat transfer performance and low cost, but helium, which has even better heat transfer performance, can also be used.

[0046] According to an embodiment of this disclosure, the heating unit 11 includes a semiconductor cooler 111 and a heat conduction stage 112. The semiconductor cooler 111 is configured to generate heat using the thermoelectric effect of a semiconductor when energized. The heat conduction stage 112 is disposed above the semiconductor cooler 111, and a standard-length optical fiber is wound on the heat conduction stage 112 to absorb the heat from the semiconductor cooler 111.

[0047] In this implementation, the semiconductor cooler consists of N-type and P-type semiconductors arranged alternately by wires to form multiple thermocouple pairs. These thermocouple pairs are soldered onto a ceramic substrate. When the power is turned on, heat is transferred from the ceramic substrate to the hot end and ultimately to a standard-length optical fiber. The standard-length optical fiber is arranged in a wound manner, which improves heat transfer efficiency.

[0048] More detailed, such as Figure 2 As shown, the heat conduction stage 112 includes a substrate 1121 and a column 1122. The substrate 1121 is attached to the upper surface of the semiconductor cooler 111. The column 1122 is formed in the middle of the substrate 1121. A spiral channel extending in the axial direction is formed on the side wall of the column 1122, which is suitable for winding standard length optical fibers.

[0049] In this embodiment, the materials of the substrate 1121 and the pillar 1122 include, but are not limited to, aluminum alloy. The substrate 1121 and the pillar 1122 can be connected by welding or manufactured using a one-piece molding technique. The heat transfer from the semiconductor cooler 111 to the pillar 1122 is effectively increased through the substrate 1121. Furthermore, the standard-length optical fiber wound within a helical channel further facilitates heat transfer between the standard-length optical fiber and the pillar 1122.

[0050] In some other exemplary embodiments, after the standard length of optical fiber is wound, thermally conductive adhesive is injected into the spiral channel for fixation and to further improve heat exchange efficiency.

[0051] Furthermore, silver paste is filled between the substrate 1121 and the semiconductor cooler 111 to reduce the contact thermal resistance between the contact surfaces.

[0052] In one exemplary embodiment, the heating part 11 further includes a heat sink 113, which is attached to the surface of the thermoelectric cooler 111 and is adapted to dissipate heat from the thermoelectric cooler 111.

[0053] In this implementation, since the semiconductor cooler 111 generates heat based on the thermoelectric effect of semiconductors, the heating temperature is controllable but the control precision is not ideal. Especially when it is necessary to maintain a constant temperature or reduce the heating temperature, although the heating power can be adjusted in time, the generated heat will continue to accumulate, making it difficult to achieve a constant temperature condition, or the generated heat is difficult to dissipate, making it impossible to achieve rapid and effective cooling. Therefore, by setting a heat sink 113 to dissipate heat from the semiconductor cooler 111, the heating temperature control precision is higher, the control response speed is faster, and it is beneficial to maintain a constant temperature condition.

[0054] For example, such as Figure 1 As shown, both the thermoelectric cooler 111 and the substrate 1121 are constructed as prism-shaped plates, preferably quadrangular prisms, with the same rectangular base size, so that the substrate 1121 and the upper surface of the thermoelectric cooler 111 are completely attached to obtain a better heat conduction effect. The heat sink 113 is also constructed as a roughly quadrangular prism and is attached to the lower surface of the thermoelectric cooler 111.

[0055] Correspondingly, the heat transfer part 12 is also made of aluminum alloy and forms a cube with the substrate 1121, which is shaped like a quadrangular prism.

[0056] According to embodiments of the present disclosure, the heat sink 113 includes a plurality of parallel and spaced-apart heat sinks.

[0057] In this embodiment, the heat sink 113 includes a quadrangular prism-shaped base attached to the lower surface of the semiconductor cooler 111, and a plurality of parallel spaced heat sinks extend from the lower surface of the base to increase the heat exchange surface area.

[0058] In one exemplary embodiment, the heating device 1 further includes a heat insulation portion 14, which covers the outside of the heat transfer portion 12 and is suitable for reducing heat exchange between the heat transfer portion 12 and the external environment.

[0059] In this implementation, since the heat transfer part 12 has high heat transfer performance, a heat insulation part 14 is provided on the outside to minimize the heat exchange between the heat transfer part 12 and the external environment (e.g., air), reduce heat dissipation, and prevent the standard length optical fiber from being affected by the ambient temperature.

[0060] Furthermore, both the heat transfer section 12 and the heating section 11 are enclosed by the heat insulation section 14 to reduce the impact of the environment around the heat sink 113 on the semiconductor cooler 111.

[0061] According to embodiments of this disclosure, such as Figure 2 As shown, both the heat transfer section 12 and the heat insulation section 14 have through holes for standard length optical fibers to pass through.

[0062] In this embodiment, the diameter of the through-hole on the heat transfer part 12 can be slightly larger to facilitate the routing of a standard-length optical fiber from the heating part 11. The diameter of the through-hole on the heat insulation part 14 can be slightly smaller to minimize heat loss through the through-hole.

[0063] In one exemplary embodiment, the heating device 1 further includes a temperature measuring unit 13, which is adapted to measure the temperature of the semiconductor cooler 111.

[0064] In such an implementation, the temperature measuring unit 13 can be a temperature sensor, including a thermistor, with a temperature accuracy of 0.01°C.

[0065] Figure 3 This is a schematic diagram of the control device 2 in another embodiment provided by this utility model.

[0066] In one exemplary embodiment, such as Figure 3 As shown, the control device 2 includes a temperature control unit 21 and a host computer 22. The temperature control unit 21 is used to acquire and adjust the heating temperature of the heating unit 11, and the host computer 22 is configured to exchange data with the temperature control unit 21 and provide a user interface.

[0067] In this implementation, the temperature control unit 21 can collect and process the heating temperature of the heating unit 11, and then send a signal to adjust the heating temperature. Users can interact with the host computer to retrieve, view, process, or export information.

[0068] According to an embodiment of this disclosure, the temperature control unit 21 is configured to collect temperature information from the temperature measuring unit 13, perform calculations, and then output a voltage signal to the semiconductor cooler 111.

[0069] Specifically, the temperature measuring unit 13 includes, but is not limited to, a temperature sensor, and the temperature control unit 21 includes a temperature control chip. The temperature control chip collects the temperature information from the temperature sensor, converts the temperature information into an electrical signal through A / D conversion, performs PID calculation based on the temperature difference, and converts the result into the required voltage output to the semiconductor cooler 111 until the temperature of the semiconductor cooler 111 reaches the set temperature.

[0070] In some other embodiments, to further improve temperature control accuracy, a temperature measuring unit 13 is also provided at the standard length optical fiber to directly monitor and provide feedback on the temperature of the standard length optical fiber.

[0071] In some other embodiments, the control device 2 may also include a microcontroller 23 and a touch screen 24 to collect data from the temperature measuring unit 13 and output voltage to the semiconductor cooler 111, thereby simplifying the layout and reducing costs.

[0072] The embodiments of the present invention have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of the present invention. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. The scope of the present invention is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of the present invention, and all such substitutions and modifications should fall within the scope of the present invention.

Claims

1. A temperature control system for calibrating an optical fiber length measuring device, characterized in that, include: Heating device (1), comprising: Heating unit (11) is suitable for laying standard length optical fibers and heating the standard length optical fibers; The heat transfer part (12) and the heating part (11) together form a heat transfer chamber filled with a heat transfer medium. The standard length optical fiber is located in the heat transfer chamber and passes through the heat transfer part (12) and is connected to the device to be calibrated to measure the real-time length of the standard length optical fiber. At least a portion of the heat from the heating part (11) is transferred to the standard length optical fiber through the heat transfer part (12) and the heat transfer medium. The control device (2) is adapted to adjust the heating temperature of the heating part (11) to obtain the correspondence between different heating temperatures and real-time lengths, thereby calibrating the device to be calibrated.

2. The temperature control system according to claim 1, characterized in that, The heating element (11) includes: The semiconductor cooler (111) is configured to generate heat by utilizing the thermoelectric effect of the semiconductor when energized; A heat-conducting stage (112) is disposed above the semiconductor cooler (111), and a standard-length optical fiber is wound on the heat-conducting stage (112) to absorb the heat of the semiconductor cooler (111) through the heat-conducting stage (112).

3. The temperature control system according to claim 2, characterized in that, The heat-conducting stage (112) includes: A substrate (1121) is attached to the upper surface of the semiconductor cooler (111); A column (1122) is formed in the middle of the substrate (1121), and a spiral channel extending in the axial direction is formed on the side wall of the column (1122) for winding the standard length optical fiber.

4. The temperature control system according to claim 2, characterized in that, The heating part (11) also includes a heat sink (113), which is attached to the surface of the semiconductor cooler (111) and is suitable for dissipating heat from the semiconductor cooler (111).

5. The temperature control system according to claim 4, characterized in that, The radiator (113) includes a plurality of parallel and spaced heat sinks.

6. The temperature control system according to claim 4, characterized in that, The heating device (1) further includes a heat insulation part (14), which is covered on the outside of the heat transfer part (12) and is suitable for reducing the heat exchange between the heat transfer part (12) and the external environment.

7. The temperature control system according to claim 6, characterized in that, Both the heat transfer part (12) and the heat insulation part (14) have through holes for the standard length optical fiber to pass through.

8. The temperature control system according to any one of claims 2-7, characterized in that, The heating device (1) also includes a temperature measuring unit (13) suitable for measuring the temperature of the semiconductor cooler (111).

9. The temperature control system according to claim 8, characterized in that, The control device (2) includes: Temperature control unit (21) is adapted to acquire and adjust the heating temperature of the heating part (11); The host computer (22) is configured to exchange data with the temperature control unit (21) and provide a user interface.

10. The temperature control system according to claim 9, characterized in that, The temperature control unit (21) is configured to collect the temperature information of the temperature measuring unit (13), perform calculation processing, and output a voltage signal to the semiconductor cooler (111).

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