Chip module preparation device

Abstract

The utility model belongs to the technical field of chip module manufacturing, and relates to a chip module manufacturing device. According to the utility model, the consistent horizontal relationship between the chip and the substrate is constant through the chip positioning part and the horizontal base, the control and unification of the thickness of the chip module are realized through the distance control between the chip positioning part and the horizontal base, and the problem of non-unification of the thickness of the chip module in the prior art is solved. Besides, the chip and the substrate are limited through the limiting groove, the matching precision of the chip and the substrate is improved, glue between the chip and the substrate is prevented from overflowing or spreading, the chip module is more regular, meanwhile, sufficient glue injection under the chip is ensured through the arrangement of the pressure sensing part, the thickness of the chip module is controllable, and the production efficiency is improved. Therefore, the uniformity and consistency of the thickness of the chip module are improved from multiple aspects.

Description

Technical Field

[0001] This utility model relates to the field of chip module manufacturing technology, and in particular to a chip module preparation device. Background Technology

[0002] Generally, there are two types of CMOS image sensor chip (chip) splicing processes. One is to directly splice the chips onto a large substrate. This process has extremely high yield requirements; if a single chip has a quality or manufacturing problem, the entire module is scrapped, resulting in a huge waste of resources. The other process is to first attach individual chips to a single substrate to form a single module, and then splice multiple single modules onto a single substrate. The advantage of this process is that single modules can be tested and screened, and only the good ones are spliced ​​together, ensuring that all the spliced ​​products are of good quality. However, in this process, because each single module is manufactured separately, each chip, each substrate, and each manufacturing process will have different degrees of component or process differences. It is difficult to ensure that all the manufactured modules have a uniform thickness, resulting in various defects such as some modules being thicker than others, and some modules being thicker on one side than the other. The impact of thickness differences between individual modules will be amplified in the next step. When all modules are spliced ​​on the main substrate, it will not only affect the coupling process difficulty and coupling effect of the scintillator, but also ultimately affect the imaging quality of the entire detector. Utility Model Content

[0003] The purpose of this invention is to provide a chip module manufacturing device to address the problem of inconsistent and uneven chip module thickness in the prior art.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows.

[0005] A chip module fabrication apparatus includes a chip positioning part and a horizontal base; the chip positioning part is parallel to the horizontal base, or the chip positioning part can control the chip to be parallel to the horizontal base; the distance between the chip positioning part and the horizontal base is controllable.

[0006] Furthermore, the above-mentioned device also includes a drive unit for controlling the distance between the chip positioning unit and the horizontal base.

[0007] Furthermore, the above-mentioned device also includes a limiting groove disposed on the horizontal base. The limiting groove has a first space that matches the shape of the chip and / or substrate, so that the chip and / or substrate can be placed flat in the first space. The opening of the limiting groove faces upward, and the outer contour of the chip positioning part is larger than the opening, so that the chip positioning part cannot enter the first space through the opening.

[0008] Furthermore, a pressure sensing unit is provided in the area where the chip positioning part contacts the chip, for measuring the pressure between the chip positioning part and the chip when the chip positioning part and the chip are pressed against each other.

[0009] Furthermore, the chip positioning part can fix the chip and keep the chip parallel to the horizontal base, and the fixing method is at least one of clamping, adsorption, bonding and snapping.

[0010] Furthermore, the sidewall of the limiting groove has a through hole.

[0011] Furthermore, the chip and the substrate are rectangular, and the limiting groove includes a second limiting plate and a third limiting plate arranged opposite to and parallel to each other, and a first limiting plate connecting the second limiting plate and the third limiting plate to form the first space. The second limiting plate and the third limiting plate are used to limit the chip and / or the substrate in a first direction, and the first limiting plate is used to limit the chip and / or the substrate on one side in a second direction.

[0012] Furthermore, the limiting groove also includes a fourth limiting plate disposed opposite to the first limiting plate. The first limiting plate, the second limiting plate, the third limiting plate and the fourth limiting plate form a second space. The first limiting plate and the fourth limiting plate together perform bidirectional limiting of the chip in the second direction.

[0013] Furthermore, the distance between the end face of the fourth limiting plate away from the chip positioning part and the bottom surface of the limiting groove is not less than the thickness of the substrate.

[0014] Furthermore, the first limiting plate, the second limiting plate, the third limiting plate, and the fourth limiting plate are respectively perpendicular to the horizontal base.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] This invention achieves a constant horizontal relationship between the chip and the substrate through a chip positioning part and a horizontal base, and controls and unifies the chip module thickness by controlling the distance between the chip positioning part and the horizontal base. Furthermore, this invention uses a limiting groove to limit the chip and substrate, improving the fitting accuracy between the chip and the substrate and preventing glue overflow or spread between the chip and the substrate, resulting in a more regular chip module. Simultaneously, the inclusion of a pressure sensor ensures sufficient glue is applied to the chip, thereby making the chip module thickness controllable. This comprehensively improves the uniformity and consistency of the chip module thickness. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0018] Figure 1 This is a schematic diagram of the chip module fabrication device according to Embodiment 1 of this utility model;

[0019] Figure 2 This is a cross-sectional view of the chip module fabrication apparatus of Embodiment 1 of this utility model from side AA;

[0020] Figure 3 This is a cross-sectional view of the chip module fabrication apparatus of Embodiment 1 of this utility model from the BB side.

[0021] Reference numerals in the attached diagram: 1-Chip positioning part, 2-Horizontal base, 3-Drive part, 4-Limiting groove, 401-First limiting plate, 402-Second limiting plate, 403-Third limiting plate, 404-Fourth limiting plate, 405-Fifth limiting plate, 5-Chip, 6-Substrate, 7-Through hole, 8-PCB board, 9-Glue. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with the embodiments and accompanying drawings. The illustrative embodiments and descriptions of this utility model are for explanation only and are not intended to limit the scope of this utility model. The various technical features of this utility model can be combined to form different solutions, and all such combinations fall within the protection scope of this utility model.

[0023] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it can be directly on the other component or may have an intervening component present. When a component is referred to as "connected to" another component, it can be directly connected to the other component or may have an intervening component present. When a component is referred to as "provided with" another component, it can be located on the surface or inside the component.

[0024] In the CMOS image sensor chip (hereinafter referred to as chip) splicing process, in order to reduce the waste of materials, processes and time caused by the scrapping of all modules on the entire substrate due to the quality of the individual chip or poor bonding process, some manufacturers or researchers first glue the individual chip onto a single substrate, and at the same time attach a circuit board (such as a PCB board) electrically connected to the chip to the other end of the single substrate to form a single module. Then, multiple single modules are spliced ​​onto a total substrate, and the PCB boards on all the single modules are electrically connected to form a complete circuit board. This single module can be tested and screened, and the selected good products are then spliced ​​to ensure that the spliced ​​products are all qualified products. However, since each single module is made separately, each chip, each substrate, and each manufacturing process will have different degrees of part or process differences. It is difficult to ensure that the thickness of all the modules is uniform. Therefore, there are various defects such as some modules being thick, some modules being thin, and some modules being thicker on one side and thinner on the other, which affect the effect of the next process and thus affect the final performance of the product. This invention addresses the problem of inconsistent and uneven thickness of chip modules in the prior art by providing a chip module fabrication device that can improve the consistency and uniformity of single module thickness. The following is a detailed description of this invention through specific embodiments.

[0025] Example 1

[0026] This embodiment provides a chip module fabrication apparatus, such as... Figure 1 As shown, Figure 2 and Figure 3 These are cross-sectional views of the device from different angles. Figure 2 This is a cross-sectional view of the chip module fabrication apparatus in this embodiment from plane AA. Figure 3This is a cross-sectional view of the chip module fabrication apparatus of this embodiment from side BB. The chip module fabrication apparatus of this embodiment includes a chip positioning part 1 and a horizontal base 2. The chip positioning part 1 is parallel to the horizontal base 2, or the chip positioning part 1 can control the chip 5 to be parallel to the horizontal base 2. The distance between the chip positioning part 1 and the horizontal base 2 is controllable. That is, the distance between the two can be adjusted by fixing the horizontal base 2 and adjusting the position of the chip positioning part 1 to move closer to or away from the horizontal base 2. Alternatively, the distance between the two can be adjusted by fixing the chip positioning part 1 and adjusting the position of the horizontal base 2 to move closer to or away from the chip positioning part 1. Of course, the positions of the chip positioning part 1 and the horizontal base 2 can be adjusted simultaneously to adjust the distance between them. The chip positioning part 1 being parallel to the horizontal base 2, or the chip positioning part 1 being able to control the chip 5 to be parallel to the horizontal base 2, means that: the horizontal base 2 is located in the horizontal direction and has a horizontal plane; the chip positioning part 1 being parallel to the horizontal base 2, that is, the chip positioning part 1 also has a plane that is horizontally parallel to the horizontal base 2; or, the chip positioning part 1 being able to control the chip 5 to be parallel to the horizontal base 2, that is, the chip positioning part 1 does not necessarily have a plane that is horizontally parallel to the horizontal base 2, but it can control the chip 5 to be parallel to the horizontal base 2. Specifically, the above two methods will be explained through Embodiments 2 and 3.

[0027] Example 2

[0028] In Example 2, the chip module fabrication apparatus includes a chip positioning part 1 and a horizontal base 2. The chip positioning part 1 is parallel to the horizontal base 2, and the distance between the chip positioning part 1 and the horizontal base 2 is controllable. The chip positioning part 1 is parallel to the horizontal base 2, meaning it also has a pressing surface that is horizontally parallel to the horizontal base 2. This pressing surface can be any shape, such as square, triangular, or circular. When fabricating a single module, a flattening method can be used to create a single module with uniform thickness. In use, either the chip positioning part 1 or the horizontal base 2 can be fixed. For example, the horizontal base 2 can be fixed; it can be a flat, smooth, and horizontal plate placed on a horizontal platform, or it can be the horizontal platform itself. The chip positioning part 1 is located directly above the horizontal base 2, or it can be moved directly above the horizontal base 2 and can move downwards towards the horizontal base 2. Place the substrate 6 flat on the horizontal base 2, and then apply an appropriate amount of glue 9 to the substrate 6. Here, "appropriate amount of glue 9" means that the sum of the thicknesses of the substrate 6, glue 9, and chip should be greater than the thickness of the chip molded product. Place the chip flat on the glue 9, and adjust the position of the substrate 6 or chip positioning part 1 so that the substrate 6 and chip positioning part 1 are vertically aligned. Control the chip positioning part 1 to move downwards until a suitable distance is reached between the chip positioning part 1 and the horizontal base 2. This suitable distance is the thickness of the chip molded product. During the downward movement of the chip positioning part 1 until the suitable distance is reached, the pressing surface of the chip positioning part 1 exerts downward pressure on the chip, making the adhesion between the chip and the substrate 6 tighter and stronger. Furthermore, the glue 9 is squeezed out during the process, eliminating air bubbles generated during glue application. Similarly, if the chip positioning part 1 is fixed, the horizontal base 2 can be controlled to move upwards, or the chip positioning part 1 and the horizontal base 2 can move simultaneously, achieving the same purpose and effect.

[0029] Furthermore, to improve control precision and stability, the above-mentioned device also includes a drive unit 3 for controlling the distance between the chip positioning part 1 and the horizontal base. In application, the drive unit 3 can be connected to the chip positioning part 1 and / or the horizontal base 2 to control the chip positioning part 1 and / or the horizontal base 2 to move downward and / or upward, adjusting the distance between them, thereby controlling the uniformity of the chip module thickness.

[0030] In actual operation, the vertical alignment accuracy between the substrate 6, the chip, and the chip positioning part 1 affects the regularity of the chip module. Therefore, this embodiment further improves the device. The device in this embodiment also includes a limiting groove 4, which has a first space matching the shape of the chip and / or the substrate 6, allowing the chip and / or the substrate 6 to be placed flat in the first space, and the two to be parallel. This first space constrains the relative vertical position of the substrate 6 and the chip, making the chip module product more regular. The first space can be spherical, square, trapezoidal, etc., and can be designed according to the shape requirements of the chip, substrate 6, and chip module product. In this embodiment, the first space is preferably square to match the square substrate 6 and the square chip. It can also be rectangular, square, parallelogram, etc. Currently, most chip modules are rectangular; this embodiment uses a rectangular shape as an example. It should be noted that the first space in this embodiment is not necessarily a closed space. On one hand, the sidewalls of the first space are not necessarily closed. Taking a rectangular space as an example, the chip and the substrate 6 are rectangular. The limiting groove 4 includes a second limiting plate 402 and a third limiting plate 403 arranged opposite to and parallel to each other, and a first limiting plate 401 connecting the second limiting plate 402 and the third limiting plate 403 to form the first space. The second limiting plate 402 and the third limiting plate 403 are used to limit the chip and / or substrate 6 in a first direction, such as the width direction of the substrate 6. The first limiting plate 401 is used to limit the chip and / or substrate 6 in a second direction, namely, the length of the substrate 6 on one side. One end of the substrate 6 is close to the first limiting plate 401, achieving unilateral limitation in the length direction, while the other end of the substrate 6 is free. In other words, the sidewalls of the rectangular first space do not necessarily completely cover the perimeter of the substrate 6 and / or the chip. The limiting plates can also be spaced apart, as long as they can achieve the aforementioned limitation of the substrate 6. Optionally, the device in this embodiment may also provide a fifth limiting plate 405 at the free end of the substrate 6, which together with the first limiting plate 401 performs bilateral limiting of the substrate 6 in the length direction, further improving the precise limiting of the substrate 6.

[0031] Since the chip is smaller than the substrate 6, it is typically bonded to one end of the substrate 6, while the other end is used to bond the PCB board 8. Therefore, to further limit the chip's position and control its relative positional accuracy to the substrate 6, in some embodiments, the limiting groove 4 further includes a fourth limiting plate 404 disposed opposite to the first limiting plate 401. The first limiting plate 401, the second limiting plate 402, the third limiting plate 403, and the fourth limiting plate 404 form a second space. The first limiting plate 401 and the fourth limiting plate 404 jointly limit the chip bidirectionally in a second direction. Thus, the second limiting plate 402 and the third limiting plate 403 limit the chip in the width direction, while the first limiting plate 401 and the fourth limiting plate 404 limit the chip in the length direction, thereby limiting the chip as a whole. Since the chip is bonded to the substrate 6 and the chip size is smaller than the substrate 6, optionally, the distance between the end face of the fourth limiting plate 404 away from the chip positioning part 1 and the bottom surface of the limiting groove 4 is not less than the thickness of the substrate 6. In other words, a space matching the thickness of the substrate 6 is reserved below the fourth limiting plate 404.

[0032] Since the first space is a rectangular space, the first limiting plate 401, the second limiting plate 402, the third limiting plate 403, and the fourth limiting plate 404 are respectively perpendicular to the horizontal base 2. In this embodiment, the limiting groove 4 may or may not have a bottom surface, and the limiting plates may be placed directly on the horizontal base 2.

[0033] In this embodiment, the opening of the limiting groove 4 faces upward, and the outer contour of the chip positioning part 1 is larger than the opening, preventing the chip positioning part 1 from entering the first space through the opening. Specifically, during use, the substrate 6 is inserted into the first space through the notch facing the first limiting plate 401 and placed flat, so that the plane of the substrate 6 is close to or parallel to the horizontal base 2. After the substrate 6 is fixed, glue is applied to the substrate 6 so that the height of the chip 5 exceeds the upper edge of the side wall of the limiting groove 4. The position of the substrate 6 or the chip positioning part 1 is adjusted so that the substrate 6 and the chip positioning part 1 are vertically aligned. The chip positioning part 1 is controlled to move downward until it contacts the upper edge of the side wall of the limiting groove 4, and the pressing surface of the chip positioning part 1... The outline is larger than the opening outline of the limiting groove 4. When the chip positioning part 1 is directly opposite the chip 5 and is pressed down vertically in this direction, it cannot enter the first space through the opening. This is to ensure that when the chip positioning part 1 is pressed down, it is blocked when it contacts the upper edge of the side wall of the limiting groove 4, preventing the chip positioning part 1 from pressing down further. Thus, the thickness of the chip 5 is further controlled by the limiting effect of the upper edge of the side wall of the limiting groove 4. The chip module thickness is more accurately controlled by the mutual verification of the electronic control of the driving part 3 and the mechanical limiting of the upper edge of the side wall of the limiting groove 4. Here, the thickness of the chip module can also be directly controlled by the mechanical limiting of the upper edge of the side wall of the limiting groove 4, and the role of the driving part 3 is only to drive the chip positioning part 1 to press down the chip 5 and stop driving when the chip positioning part 1 reaches the upper edge of the side wall of the limiting groove 4.

[0034] To prevent variations in chip module thickness caused by inconsistent glue application and uneven bonding of the module adhesive layer due to insufficient air removal from the glue 9, resulting in insufficient bonding between the chip 5 and the substrate 6, for example, if the glue application is too small, the chip 5 will not be subjected to sufficient pressure when the chip positioning part 1 is pressed down, and the pressing surface of the chip 5 and the chip positioning part 1 may not even make contact. The upper edge of the side wall of the limiting groove 4 will prevent the chip positioning part 1 from pressing down further, thus causing the thickness of the prepared chip module to fail to meet the standard. Alternatively, if the glue application is uneven, with some areas being too high and others lacking glue, when the chip positioning part 1 presses down on the chip 5, the glue 9 may still not cover the entire chip 5 or substrate 6 when the chip positioning part 1 reaches the upper edge of the side wall of the limiting groove 4, resulting in insufficient bonding between the chip 5 and the substrate 6, in some embodiments, a pressure sensing part is provided in the area where the chip positioning part 1 contacts the chip 5 to measure the pressure between the chip positioning part 1 and the chip 5 when the chip positioning part 1 and the chip 5 are pressed against each other. Only when the pressure between the chip positioning part 1 and the chip 5 reaches the preset pressure value does it indicate that the chip 5 has fully compressed the adhesive 9, the air has been fully expelled, and the chip 5 and the substrate 6 are fully bonded. To prevent excess adhesive 9 from spreading during the compression process, in some embodiments, the sidewall of the limiting groove 4 has a through hole 7 to allow excess adhesive 9 to overflow. At the same time, the bonding condition between the chip 5 and the substrate 6 can be indirectly judged by observing the overflow of adhesive 9. When the pressure between the chip positioning part 1 and the chip 5 reaches the preset pressure value, the through hole 7 is blocked, and the chip module is completed after the adhesive 9 has cured.

[0035] Example 3

[0036] In this embodiment, the chip module fabrication apparatus includes a chip positioning part 1 and a horizontal base 2. The chip positioning part 1 can control the chip 5 to be parallel to the horizontal base 2, and the distance between the chip positioning part 1 and the horizontal base 2 is controllable. Compared with Embodiment 2, the difference in this embodiment is that the chip positioning part 1 can fix the chip 5 and keep the chip 5 parallel to the horizontal base 2. The fixing method is at least one of clamping, adsorption, bonding, and snap-fit. That is, the chip 5 is fixed on the chip positioning part 1. The chip positioning part 1 may be provided with claws to clamp the chip 5, or the chip positioning part 1 may be provided with an adhesive surface, magnetic surface, or vacuum adsorption hole, etc., and the chip 5 is fixed on the chip positioning part 1 by bonding, magnetic attraction, or vacuum adsorption. The driving device controls the chip 5 to be parallel to the horizontal base 2 and maintain a fixed angle, and the driving device adjusts the position of the chip 5 so that the distance between it and the horizontal base 2 plus the thickness of the chip 5 equals the thickness of the chip module. After the distance between chip 5 and horizontal base 2 is fixed, substrate 6 is placed flat on horizontal base 2 and directly opposite chip 5. Glue 9 is injected between substrate 6 and chip 5 to fill the space between chip 5 and substrate 6, thus removing the fixing effect of chip positioning part 1 on chip 5. After glue 9 cures, the chip module is completed.

[0037] This embodiment can also use the limiting groove 4 in embodiment 2. First, the substrate 6 is placed flat in the limiting groove 4 and closely attached to the horizontal base 2. The chip 5 is fixed to the chip positioning part 1, and the chip positioning part 1 is placed on the upper edge of the side wall of the limiting groove 4. The chip 5 is located in the first space, and one side is fixed to the chip positioning part 1. Adhesive 9 is injected into the space between the substrate 6 and the chip 5 through the through hole 7 on the side wall of the limiting groove 4 until the pressure data sensed by the pressure sensor of the chip positioning part 1 reaches the preset value. Then, the injection of adhesive is stopped and the through hole 7 is blocked. After the adhesive 9 cures, the chip module is completed.

[0038] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions, or different combinations of the features, do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A chip module fabrication apparatus, characterized in that, Includes a chip positioning section and a horizontal base; The chip positioning part is parallel to the horizontal base, or The chip positioning part can control the chip to be parallel to the horizontal base; The distance between the chip positioning part and the horizontal base is controllable.

2. The chip module fabrication apparatus according to claim 1, characterized in that, It also includes a drive unit for controlling the distance between the chip positioning unit and the horizontal base.

3. The chip module fabrication apparatus according to claim 2, characterized in that, It also includes a limiting groove disposed on the horizontal base, the limiting groove having a first space that matches the shape of the chip and / or substrate, so that the chip and / or substrate can be placed flat in the first space. The opening of the limiting groove faces upward, and the outer contour of the chip positioning part is larger than the opening, so that the chip positioning part cannot enter the first space through the opening.

4. The chip module fabrication apparatus according to claim 3, characterized in that, The area where the chip positioning part contacts the chip is provided with a pressure sensing part, which is used to measure the pressure between the chip positioning part and the chip when the chip positioning part and the chip are pressed against each other.

5. The chip module fabrication apparatus according to claim 4, characterized in that, The chip positioning part can fix the chip and keep the chip parallel to the horizontal base. The fixing method is at least one of clamping, adsorption, bonding and snapping.

6. The chip module fabrication apparatus according to claim 4, characterized in that, The sidewall of the limiting groove has a through hole.

7. A chip module fabrication apparatus according to claim 4 or 6, characterized in that, The chip and the substrate are rectangular. The limiting groove includes a second limiting plate and a third limiting plate arranged opposite to and parallel to each other, and a first limiting plate connecting the second limiting plate and the third limiting plate to form the first space. The second limiting plate and the third limiting plate are used to limit the chip and / or the substrate in a first direction, and the first limiting plate is used to limit the chip and / or the substrate on one side in a second direction.

8. The chip module fabrication apparatus according to claim 7, characterized in that, The limiting groove also includes a fourth limiting plate disposed opposite to the first limiting plate. The first limiting plate, the second limiting plate, the third limiting plate and the fourth limiting plate form a second space. The first limiting plate and the fourth limiting plate together perform bidirectional limiting of the chip in the second direction.

9. The chip module fabrication apparatus according to claim 8, characterized in that, The distance between the end face of the fourth limiting plate away from the chip positioning part and the bottom surface of the limiting groove is not less than the thickness of the substrate.

10. The chip module fabrication apparatus according to claim 9, characterized in that, The first limiting plate, the second limiting plate, the third limiting plate and the fourth limiting plate are respectively perpendicular to the horizontal base.

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