Wafer suction cup cleaning equipment

Abstract

The utility model relates to the field of semiconductor manufacturing, in particular to wafer suction cup cleaning equipment. Comprising a bottom plate, a cleaning tank, a supporting rod, a connecting frame, a fixing assembly, an adjusting assembly, a mounting assembly, a conveying assembly and a cleaning assembly. A cleaning tank is arranged above the bottom plate, supporting rods are arranged on the outer side of the bottom plate, four sets of supporting rods are arranged, connecting frames are arranged on one sides of the supporting rods, four sets of connecting frames are arranged, a fixing assembly is arranged above the cleaning tank, an adjusting assembly is arranged on one side of the fixing assembly, and a mounting assembly is arranged below the adjusting assembly. A conveying assembly is arranged above the bottom plate, and a cleaning assembly is arranged on the inner side of the cleaning tank; the wafer suction cup cleaning device can solve the problems that when wafer suction cup cleaning equipment works, a plurality of suction cups cannot be cleaned at the same time, the cleaning process needs to be carried out in batches, the time of the whole production process is greatly prolonged, the working efficiency is reduced, and the consistency of the cleaning quality is affected.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to wafer chuck cleaning equipment. Background Technology

[0002] Wafer chuck cleaning equipment is a specialized device used to clean wafer chucks used in semiconductor manufacturing. Wafer chucks play a crucial role in semiconductor wafer processing, firmly adhering to the wafer for various processing operations such as etching, deposition, and photolithography. However, over long-term use, various contaminants gradually accumulate on the surface of the wafer chucks. If these contaminants are not removed promptly, they can severely impact the quality of wafer processing. Wafer chuck cleaning equipment typically employs a combination of cleaning technologies to ensure effective cleaning.

[0003] Existing wafer chuck cleaning equipment cannot clean multiple chucks simultaneously during operation. The cleaning process needs to be carried out in batches, which greatly prolongs the entire production process and reduces work efficiency. Cleaning wafer chucks one by one may result in differences in the cleaning conditions for each wafer chuck, thereby affecting the consistency of cleaning quality. This makes it difficult to maintain a high level of cleaning effect for the wafer chucks and increases the uncertainty of product quality.

[0004] Therefore, wafer chuck cleaning equipment cannot clean multiple chucks simultaneously during operation, requiring batch cleaning, which significantly prolongs the entire production process and reduces work efficiency. Cleaning wafer chucks one by one may result in differences in cleaning conditions for each chuck, affecting the consistency of cleaning quality and making it difficult to maintain a high level of cleaning effect, thus increasing product quality uncertainty. By setting up an installation structure, more wafer chucks can be cleaned at the same time, greatly reducing the overall cleaning time, reducing equipment downtime, improving equipment utilization efficiency, and increasing the cleaning capacity to better meet production needs, ensuring the continuity of the wafer processing process, and ensuring that more chucks are cleaned under the same conditions, thereby improving the consistency of cleaning quality. Utility Model Content

[0005] To overcome the problem that wafer chuck cleaning equipment cannot clean multiple chucks simultaneously during operation, the cleaning process needs to be carried out in batches, which greatly prolongs the entire production process and reduces work efficiency. Cleaning wafer chucks one by one may result in differences in the cleaning conditions for each wafer chuck, thus affecting the consistency of cleaning quality. This makes it difficult to maintain a high level of cleaning effect for the wafer chucks and increases the uncertainty of product quality.

[0006] The technical solution of this utility model is as follows: a wafer suction cup cleaning device, including a base plate and a cleaning tank; characterized in that: it further includes support rods, connecting frames, fixing components, adjusting components, mounting components, conveying components, and cleaning components; a cleaning tank is provided above the base plate, support rods are provided on the outer side of the base plate, four sets of support rods are provided, a connecting frame is provided on one side of the support rods, four sets of connecting frames are provided, a fixing component is provided above the cleaning tank, an adjusting component is provided on one side of the fixing component, a mounting component is provided below the adjusting component, a conveying component is provided above the base plate, and a cleaning component is provided on the inner side of the cleaning tank; the mounting component includes a fixing block, a fixing plate, a connecting rod, a fixing frame, and a chassis, a fixing block is provided below the fixing component, a fixing plate is provided below the fixing block, a connecting rod is provided below the fixing plate, a fixing frame is provided on one side of the connecting rod, multiple sets of fixing frames are provided, and a chassis is provided on the inner side of the fixing frame, multiple sets of chassis are provided.

[0007] Preferably, the equipment is secured using support rods and connecting frames, ensuring a firm grip and preventing shaking during cleaning. Adjustment components and mounting plates are fixed with fixing blocks, the mounting plates and frames are connected by fixing rods, and the chassis and frame are connected. This allows for the simultaneous cleaning of more wafer chucks during operation, significantly reducing overall cleaning time, minimizing equipment downtime, improving efficiency, and increasing cleaning capacity to better meet production demands. It also ensures the continuity of the wafer processing process, guaranteeing that more chucks are cleaned under identical conditions, thus improving the consistency of cleaning quality.

[0008] Preferably, the fixing component includes a support plate and a connecting plate, with the support plate positioned above the cleaning tank and the connecting plate positioned inside the support plate.

[0009] Preferably, the adjustment component includes a groove and a fixing rod. The inner side of the support plate has a groove, and there are two sets of grooves. The fixing rod is provided on the inner side of the groove.

[0010] Preferably, the adjustment assembly also includes a connecting block, a threaded rod, and a motor. The connecting block is provided on the outside of the fixed rod, the motor is provided on the top of the support plate, and the threaded rod is provided at the output end of the motor.

[0011] Preferably, the conveying assembly includes a cleaning fluid tank and a first connecting pipe, with the cleaning fluid tank located on the outside of the support rod and the first connecting pipe located above the cleaning fluid tank.

[0012] Preferably, the delivery assembly also includes a water pump and a second connecting pipe, with the water pump located above the cleaning fluid tank and the second connecting pipe located on one side of the water pump.

[0013] Preferably, the cleaning assembly includes nozzles and annular pipes, with the annular pipes provided inside the cleaning tank and the nozzles provided inside the annular pipes, and multiple sets of nozzles are provided.

[0014] The beneficial effects of this utility model are:

[0015] 1. Compared to traditional wafer chuck cleaning equipment, which cannot clean multiple chucks simultaneously and requires batch cleaning, significantly extending the overall production process and reducing efficiency, this system allows for the cleaning of more wafer chucks at the same time. Cleaning each chuck individually may result in inconsistent cleaning conditions, affecting the consistency of cleaning quality and making it difficult to maintain a high level of cleaning effectiveness, thus increasing product quality uncertainty. This system, with its customized installation structure, enables the cleaning of more wafer chucks simultaneously, greatly reducing overall cleaning time, minimizing equipment downtime, improving equipment utilization, and increasing the cleaning capacity to better meet production needs. It ensures the continuity of the wafer processing process, guaranteeing that more chucks are cleaned under the same conditions, thereby improving the consistency of cleaning quality. Attached Figure Description

[0016] Figure 1 The diagram shown is a first three-dimensional structural schematic of the wafer chuck cleaning device of this utility model;

[0017] Figure 2 The diagram shown is a second three-dimensional structural schematic of the wafer chuck cleaning device of this utility model;

[0018] Figure 3 The diagram shown is a first cross-sectional perspective view of the wafer chuck cleaning device of this utility model.

[0019] Figure 4 The diagram shown is a two-dimensional cross-sectional view of the wafer chuck cleaning device of this utility model.

[0020] Explanation of reference numerals in the attached drawings: 1. Base plate; 2. Cleaning tank; 3. Support rod; 4. Connecting frame; 5. Support plate; 6. Connecting plate; 101. Groove; 102. Fixing rod; 103. Connecting block; 104. Threaded rod; 105. Motor; 201. Cleaning fluid tank; 202. First connecting pipe; 203. Water pump; 204. Second connecting pipe; 301. Nozzle; 302. Circular pipe; 401. Fixing block; 402. Fixing plate; 403. Connecting rod; 404. Fixing frame; 405. Chassis. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] Please see Figures 1-4This utility model provides an embodiment of a wafer chuck cleaning device, including a base plate 1, a cleaning tank 2, support rods 3, a connecting frame 4, a fixing component, an adjusting component, an installation component, a conveying component, and a cleaning component. The cleaning tank 2 is positioned above the base plate 1, and four sets of support rods 3 are positioned on the outer side of the base plate 1. Four sets of connecting frames 4 are positioned on one side of each support rod 3. A fixing component is positioned above the cleaning tank 2, and an adjusting component is positioned on one side of the fixing component. An installation component is positioned below the adjusting component. A conveying component is positioned above the base plate 1, and a cleaning component is positioned inside the cleaning tank 2. The installation component includes a fixing block 401, a fixing plate 402, a connecting rod 403, a fixing frame 404, and a base 405. A fixing block 401 is positioned below the fixing component, a fixing plate 402 is positioned below the fixing block 401, and a connecting rod 403 is positioned below the fixing plate 402. A fixing frame 404 is provided on one side of the connecting rod 403. Multiple sets of fixing frames 404 are provided. A base 405 is provided on the inner side of the fixing frame 404. Multiple sets of base 405 are provided. In use, the equipment is fixed by the support rod 3 and the connecting frame 4, which can firmly fix the equipment and prevent the equipment from shaking during the cleaning process. The adjusting component and the fixing plate 402 are fixed by the fixing block 401. The fixing plate 402 and the fixing frame 404 are connected by the connecting rod 403. The base 405 is connected to the fixing frame 404. Thus, more wafer chucks can be cleaned at the same time when the equipment is working, which greatly reduces the overall cleaning time, reduces the idle time of the equipment, improves the utilization efficiency of the equipment, increases the cleaning capacity, better adapts to production needs, ensures the continuity of the wafer processing process, and ensures that more chucks are cleaned under the same conditions, thereby improving the consistency of cleaning quality.

[0023] Please see Figures 1-4In this embodiment, the fixing component includes a support plate 5 and a connecting plate 6. The support plate 5 is disposed above the cleaning tank 2, and the connecting plate 6 is disposed on the inner side of the support plate 5. During use, the connecting plate 6 is fixedly supported by the support plate 5, thereby making the adjusting component work more stably and avoiding shaking when the equipment is working. The adjusting component includes a groove 101 and a fixing rod 102. The inner side of the support plate 5 has a groove 101, and two sets of grooves 101 are formed. The fixing rod 102 is disposed on the inner side of the groove 101. The adjusting component also includes a connecting block 103, a threaded rod 104, and a motor. 105. A connecting block 103 is provided on the outer side of the fixing rod 102. A motor 105 is provided above the support plate 5. A threaded rod 104 is provided at the output end of the motor 105. In use, the motor 105 is started to drive the threaded rod 104 to rotate. The rotation of the threaded rod 104 drives the connecting block 103 to move up and down. The up and down movement of the connecting block 103 drives the up and down movement of the mounting assembly. This allows the fixing frame 404 to adjust its height according to the actual situation, ensuring that the suction cup is in the optimal cleaning position and that the cleaning fluid is more evenly distributed on the surface of the suction cup, thereby obtaining a better cleaning effect.

[0024] Please see Figures 1-4 In this embodiment, the conveying assembly includes a cleaning fluid tank 201 and a first connecting pipe 202. The cleaning fluid tank 201 is located on the outer side of the support rod 3, and the first connecting pipe 202 is located above the cleaning fluid tank 201. The conveying assembly also includes a water pump 203 and a second connecting pipe 204. The water pump 203 is located above the cleaning fluid tank 201, and the second connecting pipe 204 is located on one side of the water pump 203. In use, by starting the water pump 203, the cleaning fluid in the cleaning fluid tank 201 is transported from the first connecting pipe 202 to the second connecting pipe 204, and then transported to the cleaning assembly through the second connecting pipe 204, thereby ensuring... Sufficient cleaning fluid supply during the cleaning process avoids production interruptions due to insufficient cleaning fluid, shortens cleaning time, and improves cleaning efficiency. The cleaning components include nozzles 301 and annular pipes 302. Annular pipes 302 are installed inside the cleaning tank 2, and nozzles 301 are installed inside the annular pipes 302. Multiple sets of nozzles 301 are provided. During use, the cleaning fluid is transported to the nozzles 301 through the annular pipes 302 and sprayed out through the nozzles 301. This ensures that all parts of the wafer chuck are fully contacted by the cleaning fluid, avoiding cleaning dead corners and greatly accelerating the cleaning speed. In the same amount of time, the production efficiency of the equipment is improved.

[0025] During operation, the equipment is secured by support rod 3 and connecting frame 4, which firmly fixes the equipment and prevents it from shaking during the cleaning process. The adjusting component and fixing plate 402 are fixed by fixing block 401, the fixing plate 402 and fixing frame 404 are connected by connecting rod 403, and the chassis 405 is connected to the fixing frame 404. This allows more wafer chucks to be cleaned at the same time during operation, greatly reducing the overall cleaning time, reducing equipment downtime, improving equipment utilization efficiency, increasing the number of cleaning cycles to better meet production needs, ensuring the continuity of the wafer processing process, and ensuring that more chucks are cleaned under the same conditions, thereby improving the consistency of cleaning quality.

[0026] Meanwhile, the support plate 5 provides fixed support for the connecting plate 6, which ensures that the adjustment components work more stably during equipment operation and prevents shaking. The starting motor 105 drives the threaded rod 104 to rotate, which in turn drives the connecting block 103 to move up and down. This movement of the connecting block 103 in turn drives the mounting components to move up and down, allowing the fixing frame 404 to adjust its height according to the actual situation. This ensures that the suction cup is in the optimal cleaning position, allowing the cleaning fluid to be distributed more evenly on the surface of the suction cup, thereby achieving a better cleaning effect.

[0027] Meanwhile, by starting the water pump 203, the cleaning fluid in the cleaning fluid tank 201 is transported from the first connecting pipe 202 to the second connecting pipe 204, and then transported to the cleaning assembly through the second connecting pipe 204. This ensures that there is a sufficient supply of cleaning fluid during the cleaning process, avoids production interruption due to insufficient cleaning fluid, shortens the cleaning time, and improves cleaning efficiency.

[0028] Meanwhile, the cleaning fluid is transported to the nozzle 301 through the annular pipe 302 and sprayed out through the nozzle 301, which ensures that all parts of the wafer chuck can be fully contacted by the cleaning fluid, avoiding cleaning dead corners and greatly speeding up the cleaning process. In the same amount of time, the production efficiency of the equipment is improved.

[0029] Through the above steps, the equipment is fixed using support rod 3 and connecting frame 4, thus firmly securing the equipment and preventing it from shaking during the cleaning process. Fixing block 401 is used to fix the adjustment component and fixing plate 402, connecting rod 403 connects fixing plate 402 and fixing frame 404, and chassis 405 connects to fixing frame 404. This allows for the cleaning of more wafer chucks simultaneously during operation, significantly reducing overall cleaning time, minimizing equipment downtime, improving equipment efficiency, and increasing the cleaning capacity to better meet production needs. It also ensures the continuity of the wafer processing process, ensuring more chucks are cleaned under the same conditions, thereby improving the consistency of cleaning quality.

[0030] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A wafer chuck cleaning device, comprising a base plate (1) and a cleaning tank (2); characterized in that: It also includes support rods (3), connecting frames (4), fixing components, adjusting components, installation components, conveying components, and cleaning components; a cleaning tank (2) is provided above the base plate (1), support rods (3) are provided on the outside of the base plate (1), four sets of support rods (3) are provided, a connecting frame (4) is provided on one side of the support rods (3), four sets of connecting frames (4) are provided, a fixing component is provided above the cleaning tank (2), an adjusting component is provided on one side of the fixing component, an installation component is provided below the adjusting component, a conveying component is provided above the base plate (1), and a cleaning tank (2) is provided on the inside. A cleaning assembly is provided; the installation assembly includes a fixing block (401), a fixing plate (402), a connecting rod (403), a fixing frame (404), and a chassis (405). The fixing block (401) is provided below the fixing assembly, the fixing plate (402) is provided below the fixing block (401), the connecting rod (403) is provided below the fixing plate (402), the fixing frame (404) is provided on one side of the connecting rod (403), and multiple sets of fixing frames (404) are provided. The chassis (405) is provided on the inner side of the fixing frame (404), and multiple sets of chassis (405) are provided.

2. The wafer chuck cleaning equipment according to claim 1, characterized in that: The fixing assembly includes a support plate (5) and a connecting plate (6). The support plate (5) is provided above the cleaning tank (2), and the connecting plate (6) is provided on the inner side of the support plate (5).

3. The wafer chuck cleaning equipment according to claim 2, characterized in that: The adjustment assembly includes a groove (101) and a fixing rod (102). The inner side of the support plate (5) is provided with a groove (101), and two sets of grooves (101) are provided. The inner side of the groove (101) is provided with a fixing rod (102).

4. The wafer chuck cleaning equipment according to claim 3, characterized in that: The adjustment assembly also includes a connecting block (103), a threaded rod (104) and a motor (105). The connecting block (103) is provided on the outside of the fixing rod (102), and the motor (105) is provided on the top of the support plate (5). The output end of the motor (105) is provided with a threaded rod (104).

5. The wafer chuck cleaning equipment according to claim 4, characterized in that: The delivery assembly includes a cleaning fluid tank (201) and a first connecting pipe (202). The cleaning fluid tank (201) is located on the outside of the support rod (3), and the first connecting pipe (202) is located above the cleaning fluid tank (201).

6. The wafer chuck cleaning equipment according to claim 5, characterized in that: The delivery assembly also includes a water pump (203) and a second connecting pipe (204). The water pump (203) is located above the cleaning fluid tank (201), and the second connecting pipe (204) is located on one side of the water pump (203).

7. The wafer chuck cleaning equipment according to claim 6, characterized in that: The cleaning assembly includes a nozzle (301) and an annular pipe (302). The annular pipe (302) is provided on the inner side of the cleaning tank (2), and the nozzle (301) is provided on the inner side of the annular pipe (302). There are multiple sets of nozzles (301).

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