Wafer material box uncovering mechanism

Abstract

The utility model discloses a wafer material box uncovering mechanism which comprises a wafer material box, an integral rack is arranged on the outer side of the wafer material box, a wafer material box platform is fixedly connected to one side of the integral rack, a wafer material box positioning pin is fixedly connected to the interior of the wafer material box platform, and the wafer material box positioning pin is fixedly connected to the wafer material box platform. A wafer material box existence sensor is further fixedly installed in the wafer material box platform, a platform moving air cylinder is fixedly installed at the bottom of the wafer material box platform, and a wafer material box fixing air cylinder is further fixedly installed at the bottom of the wafer material box platform. According to the wafer material box uncovering mechanism, the uncovering assembly and the box cover moving assembly are matched for uncovering, the uncovering assembly is driven by the box cover moving assembly to move relative to the material box, the uncovering assembly can make contact with the material cover and take down the material cover, uncovering of the material box is completed, the automation degree is high, and the uncovering efficiency of the material box can be improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer cassette opening technology, specifically a wafer cassette opening mechanism. Background Technology

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits, and it is generally in the shape of a circular plate. To improve wafer loading efficiency and avoid environmental contamination during the wafer loading process, wafers are usually placed in a cassette. Batch loading of wafers is achieved by transferring the cassette. During the transfer process, the cassette cover remains locked. When loading wafers, the cover needs to be opened. The transfer platform of the cassette has limited space, and manual operation is restricted. The efficiency of manually opening the cover is low, which affects the wafer loading and inspection efficiency.

[0003] To address this problem, the present invention provides a wafer cassette opening mechanism. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a wafer cassette opening mechanism, which solves the aforementioned problems.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a wafer cassette opening mechanism, comprising a wafer cassette, an integral frame disposed on the outer side of the wafer cassette, a wafer cassette platform assembly disposed on one side of the integral frame, an opening assembly disposed inside the integral frame, and a cassette cover moving assembly disposed at the bottom of the wafer cassette platform assembly; the wafer cassette platform assembly comprises a wafer cassette platform, the wafer cassette platform being fixedly connected to one side of the integral frame, a wafer cassette positioning pin being fixedly connected inside the wafer cassette platform, a wafer cassette presence / absence sensor being fixedly installed inside the wafer cassette platform, a platform moving cylinder being fixedly installed at the bottom of the wafer cassette platform, a wafer cassette fixing cylinder being fixedly installed at the bottom of the wafer cassette platform, a wafer cassette fixing block being fixedly connected to the movable end of the wafer cassette fixing cylinder, and the wafer cassette fixing block being fixedly connected to the bottom of the wafer cassette platform.

[0006] Furthermore, a platform positioning sensor is fixedly installed at the bottom of the wafer cassette platform.

[0007] The above technical solution is used to detect whether the wafer cassette is installed and fixed in place.

[0008] Furthermore, the lid opening assembly includes a lid unlocking cylinder, which is fixedly installed on one side of the overall frame. An unlocking head is also fixedly installed on one side of the overall frame, and the movable end of the lid unlocking cylinder is fixedly connected to the interface of the unlocking head.

[0009] By adopting the above technical solution, the cover unlocking cylinder is activated, which drives the unlocking head to rotate and unlock the wafer cassette.

[0010] Furthermore, a lid suction cup is fixedly installed on one side of the overall frame.

[0011] By adopting the above technical solution, the lid suction cup is used to hold the lid of the wafer cassette.

[0012] Furthermore, the lid moving assembly includes a lid removal cylinder, which is fixedly installed on one side of the housing of the overall frame.

[0013] By adopting the above technical solution, the lid removal cylinder moves forward to remove the lid.

[0014] Furthermore, a cover-moving cylinder is fixedly installed on one side of the overall frame housing.

[0015] By adopting the above technical solution, after the lid is removed, the lid-moving cylinder moves downward to reset it.

[0016] Beneficial effects

[0017] This invention provides a wafer cassette opening mechanism. Compared with the prior art, it has the following advantages:

[0018] 1. The wafer cassette opening mechanism opens the cassette by cooperating with the cassette cover moving component. The opening component moves relative to the cassette under the drive of the cassette cover moving component, so that the opening component can contact the cover and remove the cover, thus completing the cassette opening. It has a high degree of automation and is conducive to improving the opening efficiency of the cassette.

[0019] 2. The wafer cassette opening mechanism uses an overall frame to install and connect various components. The wafer cassette platform component provides a relatively flat placement platform for the wafer cassette, which is used to place and fix the wafer cassette to prevent it from shaking or shifting during the opening process, thus affecting the opening accuracy. The opening component is located on one side of the wafer cassette cover, and the cover removal component can unlock and adsorb the wafer cassette cover, removing the cover from the wafer cassette to achieve the opening effect. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is a perspective view of the external structure of this utility model;

[0022] Figure 2 This is a three-dimensional view of the structure of this utility model after removing the wafer cassette;

[0023] Figure 3 This is a top view of the structure of this utility model;

[0024] Figure 4 This is a bottom view of the internal structure of this utility model;

[0025] Figure 5 This is a detailed structural diagram of one side of the overall frame of this utility model;

[0026] Figure 6 This is a detailed structural diagram of the other side of the overall frame of this utility model;

[0027] Figure 7 This is a partial structural front view of this utility model;

[0028] Figure 8 This is a left-side view of the present invention.

[0029] In the diagram: 1. Wafer bin; 100. Overall frame; 200. Wafer bin platform assembly; 201. Wafer bin platform; 202. Wafer bin positioning pin; 203. Wafer bin presence / absence sensor; 204. Platform moving cylinder; 205. Wafer bin fixing cylinder; 206. Wafer bin fixing block; 207. Platform positioning sensor; 300. Cover opening assembly; 301. Cover unlocking cylinder; 302. Unlocking head; 303. Cover suction cup; 400. Cover moving assembly; 401. Cover removal cylinder; 402. Cover moving cylinder. Detailed Implementation

[0030] It should be noted that in the description of the embodiments of this application, the terms "front," "rear," "left," "right," "up," "down," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0031] The present application will be further described in detail below with reference to the accompanying drawings and embodiments.

[0032] Reference Figures 1 to 8This application provides a wafer cassette opening mechanism, including a wafer cassette 1, an integral frame 100 disposed on the outer side of the wafer cassette 1, a wafer cassette platform assembly 200 disposed on one side of the integral frame 100, an opening assembly 300 disposed inside the integral frame 100, and a cassette cover moving assembly 400 disposed at the bottom of the wafer cassette platform assembly 200; the wafer cassette platform assembly 200 includes a wafer cassette platform 201, which is fixedly connected to one side of the integral frame 100, and the wafer cassette... A wafer cassette positioning pin 202 is fixedly connected inside the wafer cassette platform 201. A wafer cassette presence / absence sensor 203 is also fixedly installed inside the wafer cassette platform 201. A platform moving cylinder 204 and a wafer cassette fixing cylinder 205 are also fixedly installed at the bottom of the wafer cassette platform 201. A wafer cassette fixing block 206 is fixedly connected to the movable end of the wafer cassette fixing cylinder 205, and the wafer cassette fixing block 206 is fixedly connected to the bottom of the wafer cassette platform 201. A platform positioning sensor 207 is fixedly installed at the bottom of the wafer cassette platform 201.

[0033] In practical implementation: The overall frame 100 is used to install and connect various components. The wafer cassette platform assembly 200 provides a relatively flat placement platform for the wafer cassettes, used to place and fix the wafer cassettes, preventing them from shaking or shifting during the opening process, which would affect the opening accuracy. The opening assembly 300 is located on one side of the wafer cassette cover. The cover removal assembly can unlock and magnetically attach the wafer cassette cover, removing it from the wafer cassette to achieve the opening effect. The cover moving assembly 400 is connected to the overall frame 100 and the opening assembly 300. The cover moving assembly 400 drives the cover opening assembly 300 to move downwards or upwards, completing the opening or resetting of the wafer cassette. Before manual placement of the wafer cassette, the platform moving cylinder 204 resets, and the wafer cassette platform 201 moves to its original position. The operator places the wafer cassette according to the wafer cassette positioning pin 202. After placement, the wafer cassette presence sensor 203 ON, the wafer cassette fixing cylinder 205 moves forward, and the wafer cassette fixing block 206 locks the wafer cassette, completing the wafer cassette fixing. The platform moving cylinder 204 moves forward, and the platform positioning sensor 207 detects and determines that the wafer cassette is in contact with the cover opening assembly 300.

[0034] Reference Figures 1 to 8 In one aspect of this embodiment, a platform positioning sensor 207 is fixedly installed at the bottom of the wafer cassette platform 201. The cover opening assembly 300 includes a cover unlocking cylinder 301, which is fixedly installed on one side of the overall frame 100. An unlocking head 302 is also fixedly installed on one side of the overall frame 100, and the movable end of the cover unlocking cylinder 301 is fixedly connected to the interface of the unlocking head 302.

[0035] In practice: the cover unlocking cylinder 301 actuates, causing the unlocking head 302 to rotate and unlock the wafer cassette. The cover adsorption Air system is activated, and the cover suction cup 303 adsorbs the wafer cassette cover.

[0036] Reference Figures 1 to 8 In one aspect of this embodiment, the lid moving assembly 400 includes a lid removal cylinder 401, which is fixedly mounted on one side of the housing of the overall frame 100. A lid moving cylinder 402 is fixedly mounted on one side of the housing of the overall frame 100.

[0037] In practice: the cover removal cylinder 401 moves forward to remove the cover, the cover moving cylinder 402 moves downward, and the cover opening component 300 adsorbs the wafer cassette cover and lowers it, thus completing the wafer cassette opening.

[0038] All electrical devices in this plan are powered by an external power source.

[0039] Working Principle: The overall frame 100 is used to install and connect various components. The wafer cassette platform assembly 200 provides a relatively flat placement platform for the wafer cassette, used to place and fix the wafer cassette, preventing it from shaking or shifting during the opening process, which would affect the opening accuracy. The lid opening assembly 300 is located on one side of the wafer cassette lid. The lid removal assembly can unlock and magnetically attach the wafer cassette lid, removing it from the wafer cassette to achieve the opening effect. The lid moving assembly 400 is connected to the overall frame 100 and the lid opening assembly 300. The cover moving assembly 400 drives the cover opening assembly 300 to move downwards or upwards, completing the opening or resetting of the wafer cassette. Before manual placement of the wafer cassette, the platform moving cylinder 204 resets, and the wafer cassette platform 201 moves to its original position. The operator places the wafer cassette according to the wafer cassette positioning pin 202. After placement, the wafer cassette presence sensor 203 ON, the wafer cassette fixing cylinder 205 moves forward, and the wafer cassette fixing block 206 locks the wafer cassette, completing the wafer cassette fixing. The platform moving cylinder 204 moves forward, and the platform positioning sensor 207 detects and judges that the wafer cassette is in contact with the cover opening assembly 300. The cover unlocking cylinder 301 actuates, driving the unlocking head 302 to rotate and unlock the wafer cassette. The lid adsorption Air system is activated, the lid suction cup 303 adsorbs the wafer cassette lid, the lid removal cylinder 401 moves forward to remove the lid, the lid moving cylinder 402 moves downward, the lid opening component 300 adsorbs the wafer cassette lid and lowers it, completing the wafer cassette opening.

[0040] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0041] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer cassette opening mechanism, comprising a wafer cassette (1), characterized in that: An integrated rack (100) is provided on the outside of the wafer cassette (1). A wafer cassette platform assembly (200) is provided on one side of the integrated rack (100). A cover opening assembly (300) is provided inside the integrated rack (100). A cover moving assembly (400) is provided at the bottom of the wafer cassette platform assembly (200). The wafer cassette platform assembly (200) includes a wafer cassette platform (201). The wafer cassette platform (201) is fixedly connected to one side of the integrated rack (100). The wafer cassette platform (201) has a fixed internal structure. A wafer cassette positioning pin (202) is fixedly connected to the wafer cassette platform (201). A wafer cassette presence / absence sensor (203) is also fixedly installed inside the wafer cassette platform (201). A platform moving cylinder (204) is fixedly installed at the bottom of the wafer cassette platform (201). A wafer cassette fixing cylinder (205) is also fixedly installed at the bottom of the wafer cassette platform (201). A wafer cassette fixing block (206) is fixedly connected to the movable end of the wafer cassette fixing cylinder (205). The wafer cassette fixing block (206) is fixedly connected to the bottom of the wafer cassette platform (201).

2. The wafer cassette opening mechanism according to claim 1, characterized in that: A platform positioning sensor (207) is fixedly installed at the bottom of the wafer cassette platform (201).

3. The wafer cassette opening mechanism according to claim 1, characterized in that: The lid opening assembly (300) includes a lid unlocking cylinder (301), which is fixedly installed on one side of the overall frame (100). An unlocking head (302) is also fixedly installed on one side of the overall frame (100). The movable end of the lid unlocking cylinder (301) is fixedly connected to the interface of the unlocking head (302).

4. The wafer cassette opening mechanism according to claim 1, characterized in that: A lid suction cup (303) is fixedly installed on one side of the overall frame (100).

5. The wafer cassette opening mechanism according to claim 1, characterized in that: The lid moving assembly (400) includes a lid removal cylinder (401), which is fixedly installed on one side of the housing of the overall frame (100).

6. The wafer cassette opening mechanism according to claim 1, characterized in that: A cover-moving cylinder (402) is fixedly installed on one side of the housing of the overall frame (100).

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