Negative pressure suction device for heterojunction ultrathin silicon wafer
By designing a negative pressure suction device with a fixed shell and a sliding shell, combined with a flexible buffer layer and a pressure relief structure, the problem of ultrathin silicon wafers breaking during negative pressure transportation was solved, and safe silicon wafer transfer was achieved.
Patent Information
- Application Number
- CN202422778465.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-14
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-11-14
AI Technical Summary
Existing negative pressure suction devices are prone to causing silicon wafers to break during transport, especially when the negative pressure is too high or the adsorption is uneven. Furthermore, existing devices are prone to causing the silicon wafer to collide with the adsorption surface during startup, increasing the risk of breakage.
A negative pressure suction device for heterojunction ultrathin silicon wafers was designed, including a fixed shell and a sliding shell. A flexible buffer layer is set on the bottom surface of the sliding shell, and a negative pressure cavity is formed with the fixed shell through a sliding connection. After the negative pressure source is activated, the sliding shell adsorbs the silicon wafer, avoiding direct negative pressure acting on the silicon wafer. Combined with the pressure discharge structure, the negative pressure is adjusted to ensure the safe transfer of the silicon wafer.
This effectively prevents the ultra-thin silicon wafers from breaking during transportation, enabling safe wafer transfer, reducing the risk of fragmentation, and ensuring the safety of the transportation process.
Smart Images
Figure CN223501847U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of ultrathin silicon wafer processing technology, and in particular to a negative pressure suction device for heterojunction ultrathin silicon wafers. Background Technology
[0002] HJT cells are currently one of the mainstream cells in the industry, but their production costs still need to be reduced further. Therefore, the application of ultra-thin silicon wafers in the field of heterojunction cells is an important direction for the development of photovoltaic technology. By reducing the thickness of silicon wafers, material costs can be significantly reduced, and even the photoelectric conversion efficiency of cells can be improved.
[0003] Current ultrathin silicon wafers have reached a thickness of approximately 90µm. Based on existing applications in heterojunction solar cells, ultrathin silicon wafers can help reduce costs and improve efficiency and reliability. However, as the thickness of the silicon wafer decreases, its structural strength also decreases, leading to increased brittleness. When subjected to external forces, the silicon wafer is prone to breakage or fragmentation. This is especially true during the processing of ultrathin silicon wafers. When using a negative pressure suction device to pick up and transport the ultrathin silicon wafer, if the negative pressure is too high or the suction surface is uneven, the silicon wafer will be subjected to uneven or extremely high negative pressure attraction forces, thus increasing the risk of fragmentation. In addition, with existing negative pressure devices, after the lifting device is used to approach the silicon wafer, the silicon wafer moves upward as the negative pressure device is activated, causing it to come into contact with and collide with the suction surface of the suction device, which can easily lead to fragmentation. If the suction surface is pressed against the top surface of the silicon wafer by the lifting device before suction, the silicon wafer is easily subjected to impact and compression, which can also easily lead to fragmentation.
[0004] Therefore, it is necessary to improve the existing negative pressure suction device for handling ultrathin silicon wafers. Utility Model Content
[0005] The purpose of this invention is to overcome the defects in the existing technology and provide a negative pressure suction device for heterojunction ultrathin silicon wafers to reduce fragmentation and achieve safe transportation.
[0006] To achieve the above-mentioned technical effects, the technical solution of this utility model is: a negative pressure suction device for heterojunction ultrathin silicon wafers, comprising:
[0007] A fixed shell is used to connect to the output end of the lifting device. The fixed shell has a hollow structure and is provided with an air extraction port and an air intake port. The air intake port is located on the bottom surface of the fixed shell, and the air extraction port is used to connect to a negative pressure source.
[0008] A sliding shell has an open top and an adsorption through hole at the bottom. The bottom surface of the sliding shell is horizontally positioned. The sliding shell slides vertically on the fixed shell, and the adsorption through hole is located below the fixed shell. The sliding shell and the fixed shell are sealed together to form a negative pressure cavity. The adsorption through hole, the negative pressure cavity, the air intake, the inner cavity of the fixed shell, and the air extraction port are sequentially connected.
[0009] Preferably, in order to further ensure the safe adsorption of the ultrathin silicon wafer, the bottom surface of the sliding shell is provided with a flexible buffer layer, and the buffer layer is provided with a buffer through hole that communicates with the adsorption through hole.
[0010] Preferably, in order to ensure the flexibility of the buffer layer and reduce its impact on the ultrathin silicon wafer, the buffer layer is a sponge layer.
[0011] Preferably, in order to ensure a uniform distribution of adsorption force, the buffer through holes are densely distributed on the buffer layer, the adsorption through holes are densely distributed on the bottom of the sliding shell, and the buffer through holes and the adsorption through holes communicate to form a negative pressure channel that communicates with the negative pressure cavity.
[0012] Preferably, in order to ensure a sealed connection and sliding fit between the sliding shell and the fixed shell, the circumferential inner wall of the sliding shell is sealed and fitted with the circumferential outer edge of the fixed shell.
[0013] Preferably, in order to achieve a limiting sliding connection between the sliding shell and the fixed shell, a sliding rod is slidably passed through the bottom wall of the fixed shell in the vertical direction, the sliding rod is fixedly connected to the inner wall of the sliding shell, and a limiting protrusion is provided at the top of the sliding rod.
[0014] Preferably, to prevent excessive negative pressure in the fixing shell and negative pressure chamber from causing the ultrathin silicon wafer to break, the top of the fixing shell is provided with a pressure discharge port located directly above the limiting protrusion. The top of the limiting protrusion is provided with a pressure discharge component that moves vertically between the sealing position and the pressure discharge position. In the sealing position, the circumferential outer edge of the pressure discharge component is sealed and fitted with the circumferential inner wall of the pressure discharge port. In the pressure discharge position, the pressure discharge component is located above the pressure discharge port.
[0015] Preferably, in order to ensure a firm connection between the pressure relief component and the limiting protrusion, the pressure relief component is connected to the limiting protrusion.
[0016] Preferably, in order to achieve automatic adjustment of the internal pressure of the fixed shell cavity and the negative pressure cavity, an elastic element is provided between the pressure discharge component and the fixed shell. After the negative pressure source is activated, the elastic element applies a force to the pressure discharge component towards the negative pressure cavity, and the magnitude of the force is positively correlated with the height of the pressure discharge component.
[0017] Preferably, in order to ensure the sealing between the pressure relief component and the pressure relief port in the sealed position, the pressure relief component includes a pressure relief sleeve that is closed at the bottom and open at the top. The top of the pressure relief sleeve is provided with an outward flange. The elastic element includes a spring and a bracket fixed to the top of the fixed shell. The top end of the spring is connected to the bracket, and the bottom end is disposed inside the pressure relief sleeve.
[0018] In summary, compared with the prior art, the negative pressure suction device for heterojunction ultrathin silicon wafers of this invention uses a sliding shell with its bottom surface in contact with the silicon wafer. The sliding shell can move relative to the fixed shell in the vertical direction, reducing the pressure on the silicon wafer and preventing breakage. Then, the negative pressure source is activated, creating negative pressure in the negative pressure chamber and the fixed shell, which adsorbs the silicon wafer. This avoids the risk of silicon wafer fragmentation during adsorption and facilitates the safe transfer and transportation of silicon wafers. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the structure of the first embodiment;
[0020] Figure 2 yes Figure 1 An explosion diagram;
[0021] Figure 3 yes Figure 1 A schematic diagram of the cross-sectional structure;
[0022] Figure 4 yes Figure 3 The front view;
[0023] Figure 5 This is a schematic diagram of the structure of the second embodiment;
[0024] Figure 6 yes Figure 5 An explosion diagram;
[0025] Figure 7 yes Figure 5 A schematic diagram of the cross-sectional structure;
[0026] Figure 8 yes Figure 7 The front view;
[0027] In the diagram: 1. Fixed shell; 11. Fixed barrel; 111. Inlet; 12. Shell cover; 121. Outlet; 122. Pressure outlet; 123. Outlet pipe; 124. Pressure outlet pipe; 13. Bolt; 14. Nut; 15. Positioning frame; 2. Sliding shell; 21. Sliding frame; 22. Base plate; 221. Adsorption through hole; 23. Buffer layer; 231. Buffer through hole; 3. Negative pressure channel; 4. Sliding rod; 41. Limiting protrusion; 5. Pressure outlet component; 51. Pressure outlet sleeve; 52. Outer flange; 53. Connecting rod; 6. Elastic component; 61. Spring; 62. Bracket. Detailed Implementation
[0028] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings and examples. The following examples are only used to more clearly illustrate the technical solution of this utility model and should not be construed as limiting the scope of protection of this utility model.
[0029] First Embodiment
[0030] like Figures 1-4 As shown, a negative pressure suction device for a heterojunction ultrathin silicon wafer according to the first embodiment of this utility model includes:
[0031] Fixed shell 1 is used to connect to the output end of the lifting device. Fixed shell 1 has a hollow structure. Fixed shell 1 is provided with an air extraction port 121 and an air intake port 111. The air intake port 111 is located on the bottom surface of fixed shell 1. The air extraction port 121 is used to connect to a negative pressure source.
[0032] The sliding shell 2 has an open top and an adsorption through hole 221 at the bottom. The bottom surface of the sliding shell 2 is horizontally positioned. The sliding shell 2 slides vertically on the fixed shell 1, and the adsorption through hole 221 is located below the fixed shell 1. The sliding shell 2 and the fixed shell 1 are sealed together to form a negative pressure cavity. The adsorption through hole 221, the negative pressure cavity, the air intake 111, the inner cavity of the fixed shell 1, and the air extraction port 121 are connected in sequence.
[0033] When using this device to pick up silicon wafers, connect the air extraction port 121 on the fixed shell 1 to the negative pressure source. Adjust the positions of the fixed shell 1 and the sliding shell 2 so that they are directly above the silicon wafer. Then, adjust the positions of the fixed shell 1 and the sliding shell 2 through the lifting device so that after they are lowered, the bottom surface of the sliding shell 2 contacts the top surface of the silicon wafer. Since the sliding shell 2 and the fixed shell 1 are relatively slidably connected, the silicon wafer only needs to bear the gravity pressure of the sliding shell 2, avoiding the silicon wafer from being crushed due to excessive pressure.
[0034] After the bottom surface of the sliding shell 2 contacts the top surface of the silicon wafer, the negative pressure source is activated, drawing air out of the fixed shell 1 and the sliding shell 2. This reduces the pressure inside the cavity of the fixed shell 1 and the negative pressure cavity, generating negative pressure. While adsorbing the silicon wafer below, both the sliding shell 2 and the silicon wafer slide upwards in the vertical direction, maintaining the negative pressure inside the negative pressure cavity. This allows the ultra-thin silicon wafer to adhere to the bottom surface of the sliding shell 2. At this point, the position of the silicon wafer can be moved by moving the fixed shell 1.
[0035] After the silicon wafer and the fixed housing 1 are transferred to the destination, the lifting device drives the fixed housing 1 to move downward, reducing the distance between the silicon wafer and the lower bearing surface. After the two are brought close together, the negative pressure source is controlled to gradually increase the air pressure in the negative pressure chamber. This gradually reduces the adsorption force generated on the sliding housing 2 and the adsorption force generated on the silicon wafer by the air pressure in the negative pressure chamber through the adsorption through hole 221. The sliding housing 2 and the silicon wafer descend until the silicon wafer contacts the lower bearing surface. When the negative pressure source stops, there is a certain distance between the bottom surface of the fixed housing 1 and the lower bearing surface, and the silicon wafer only bears the gravity pressure of the sliding housing 2.
[0036] Therefore, when using the device of this embodiment to pick up and release silicon wafers, the silicon wafers only bear the pressure of the sliding shell 2, while the sliding shell 2 and the fixed shell 1 are relatively slidably connected. This avoids the downward driving force of the lifting device after the fixed shell 1 is driven down by the lifting device acting on the silicon wafer through the fixed shell 1, which would cause the silicon wafer to break and be damaged. In other words, the device can achieve safe transfer and transportation of ultra-thin silicon wafers and avoid breakage.
[0037] In this embodiment, the fixed shell 1 includes a fixed barrel 11 with an open top. The top of the fixed barrel 11 is covered with a shell cover 12. The fixed barrel 11 and the shell cover 12 are fixedly connected by bolts 13 and nuts 14 with threaded connections. The air intake 111 is opened and sealed at the bottom of the fixed barrel 11. The air extraction port 121 is set at the top of the shell cover 12 and an air extraction pipe 123 extends upward to facilitate the connection of a negative pressure source. The bottom surface of the shell cover 12 is provided with a positioning frame 15. The outer circumferential edge of the positioning frame 15 is sealed to the inner circumferential wall of the fixed barrel 11. The outer side of the bottom surface of the positioning frame 15 is chamfered to facilitate the precise placement of the shell cover 12 on the fixed barrel 11.
[0038] In order to achieve a relative sliding connection between the fixed shell 1 and the sliding shell 2, the inner circumferential wall of the sliding shell 2 is sealed and fitted with the outer circumferential edge of the fixed shell 1. Specifically, the sliding shell 2 includes a sliding frame 21 and a horizontal base plate 22 fixed to the bottom of the sliding frame 21. Adsorption through holes 221 are densely distributed on the base plate 22. The inner circumferential wall of the sliding frame 21 is sealed and fitted with the outer circumferential edge of the fixed barrel 11. In this way, the fixed shell 1 and the sliding shell 2 can be relatively slidably connected.
[0039] A further improvement is that a sliding rod 4 slides vertically through the bottom wall of the fixed shell 1, and the sliding rod 4 is fixedly connected to the inner wall of the sliding shell 2. A limiting protrusion 41 is provided at the top of the sliding rod 4. Specifically, the sliding rod 4 is sealed and inserted into the top of the fixed barrel 11, and its bottom surface is fixedly connected to the bottom plate 22. With the above structure, the fixed shell 1 and the sliding shell 2 are slidably connected, and a limiting connection between them is also achieved, restricting the relative sliding range of the sliding shell 2 and the fixed shell 1 and preventing the sliding shell 2 from detaching from the fixed shell 1.
[0040] A further improvement is that a flexible buffer layer 23 is provided on the bottom surface of the sliding shell 2, and a buffer through hole 231 communicating with the adsorption through hole 221 is provided on the buffer layer 23.
[0041] Specifically, the buffer layer 23 is a horizontal sponge layer fixed below the base plate 22, the buffer through holes 231 are densely distributed on the buffer layer 23, the adsorption through holes 221 are densely distributed on the bottom of the sliding shell 2, and the buffer through holes 231 and the adsorption through holes 221 are connected to form a negative pressure channel 3 that is connected to the negative pressure chamber.
[0042] Since the buffer layer 23 is made of sponge and has sufficient flexibility, it contacts the silicon wafer when picking it up, thus avoiding rigid contact between the silicon wafer and the base plate 22. The buffer through holes 231 densely distributed on the buffer layer 23 and the adsorption through holes 221 densely distributed on the base plate 22 combine to form a negative pressure channel 3. This allows the adsorption force acting on the ultra-thin silicon wafer through the negative pressure channel 3 after negative pressure is generated in the negative pressure chamber, thus picking up the silicon wafer while preventing it from breaking or being damaged.
[0043] Second Embodiment
[0044] like Figures 5-8 As shown, the negative pressure suction device for a heterojunction ultrathin silicon wafer according to the second embodiment of the present invention is based on the first embodiment. The difference is that the top of the fixed shell 1 is provided with a pressure discharge port 122 located directly above the limiting protrusion 41. The top of the limiting protrusion 41 is provided with a pressure discharge member 5 that moves vertically between the sealing position and the pressure discharge position. In the sealing position, the outer circumferential edge of the pressure discharge member 5 is sealed and fitted with the inner circumferential wall of the pressure discharge port 122. In the pressure discharge position, the pressure discharge member 5 is located above the pressure discharge port 122.
[0045] Specifically, four pressure relief ports 122 are arranged in a circular array around the centerline of the suction pipe 123, located at the top of the cover 12. A pressure relief pipe 124 extends downward from the pressure relief port 122. An elastic element 6 is provided between the pressure relief component 5 and the fixed housing 1. After the negative pressure source is activated, the elastic element 6 applies a force to the pressure relief component 5, which moves towards the negative pressure chamber. The magnitude of this force is positively correlated with the height of the pressure relief component 5. The pressure relief component 5 includes a pressure relief sleeve that is closed at the bottom and open at the top. 51. The top of the pressure relief sleeve 51 is provided with an outward flange 52, and the bottom is fixedly connected to the limiting protrusion 41 through the connecting rod 53. The connecting rod 53 and the limiting protrusion 41 are both coaxial with the pressure relief sleeve 51 and their outer diameters are both smaller than the outer diameter of the pressure relief sleeve 51. The elastic element 6 includes a spring 61 and a bracket 62 fixed to the top of the fixed shell 1. The bracket 62 is fixedly set above the shell cover 12. The top end of the spring 61 is connected to the bracket 62, and the bottom end is set inside the pressure relief sleeve 51.
[0046] With the above structure, during silicon wafer adsorption, as the power of the negative pressure source increases, the silicon wafer adsorbed by the sliding shell 2 moves upward, thereby driving the sliding rod 4 and the limiting protrusion 41 to move upward. Above the limiting protrusion 41, the pressure discharge sleeve 51 rises, still in the sealed position. The greater the power of the negative pressure source, the higher the height of the pressure discharge sleeve 51, compressing the spring 61 and generating downward pressure on the pressure discharge sleeve 51. When the power of the negative pressure source is too high, the bottom of the pressure discharge sleeve 51 moves above the pressure discharge port 122 via the connecting rod 53, and the pressure discharge component 5 is in the pressure discharge position. At this time, the pressure discharge port 122 opens. After the inner cavity of the fixed shell 1 is connected to the outside through the pressure relief port 122, it can prevent the negative pressure in the fixed shell 1 and the negative pressure chamber from being too large, which would cause the silicon wafer to break due to excessive adsorption force, and further ensure the safe transport of the silicon wafer. After the negative pressure decreases, the spring 61 acts on the pressure relief sleeve edge 51 through its own elastic force, so that after the pressure relief sleeve 51 descends, its outer circumferential edge is sealed to the pressure relief port 122 and the inner circumferential wall of the pressure relief pipe 124. The outer flange 52 can prevent the top of the pressure relief sleeve 51 from passing through the pressure relief port 122, thus limiting the range of motion of the pressure relief sleeve 51.
[0047] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.
Claims
1. A negative pressure suction device for heterojunction ultrathin silicon wafers, characterized in that, include: Fixed shell (1), the fixed shell (1) is used to connect to the output end of the lifting device. The fixed shell (1) is a hollow structure. The fixed shell (1) is provided with an air extraction port (121) and an air intake port (111). The air intake port (111) is located on the bottom surface of the fixed shell (1). The air extraction port (121) is used to connect to a negative pressure source. The sliding shell (2) has an open top and an adsorption through hole (221) at the bottom. The bottom surface of the sliding shell (2) is horizontally arranged. The sliding shell (2) slides vertically on the fixed shell (1) and the adsorption through hole (221) is located below the fixed shell (1). The sliding shell (2) and the fixed shell (1) are sealed together to form a negative pressure cavity. The adsorption through hole (221), the negative pressure cavity, the air inlet (111), the inner cavity of the fixed shell (1) and the air extraction port (121) are connected in sequence.
2. The negative pressure suction device for heterojunction ultrathin silicon wafers according to claim 1, characterized in that: The bottom surface of the sliding shell (2) is provided with a flexible buffer layer (23), and the buffer layer (23) is provided with a buffer through hole (231) that communicates with the adsorption through hole (221).
3. The negative pressure suction device for heterojunction ultrathin silicon wafers according to claim 2, characterized in that: The buffer layer (23) is a sponge layer.
4. The negative pressure suction device for heterojunction ultrathin silicon wafers according to claim 2, characterized in that: The buffer through holes (231) are densely distributed on the buffer layer (23), and the adsorption through holes (221) are densely distributed on the bottom of the sliding shell (2). The buffer through holes (231) and the adsorption through holes (221) are connected to form a negative pressure channel (3) that is connected to the negative pressure chamber.
5. The negative pressure suction device for heterojunction ultrathin silicon wafers according to claim 1, characterized in that: The inner circumferential wall of the sliding shell (2) is sealed and fitted with the outer circumferential edge of the fixed shell (1).
6. The negative pressure suction device for heterojunction ultrathin silicon wafers according to claim 5, characterized in that: The bottom wall of the fixed shell (1) is slidably penetrated by a slide rod (4) in the vertical direction. The slide rod (4) is fixedly connected to the inner wall of the sliding shell (2). A limiting protrusion (41) is provided on the top of the slide rod (4).
7. The negative pressure suction device for heterojunction ultrathin silicon wafers according to claim 6, characterized in that: The top of the fixed shell (1) is provided with a pressure discharge port (122) located directly above the limiting protrusion (41). The top of the limiting protrusion (41) is provided with a pressure discharge component (5) that moves vertically between the sealing position and the pressure discharge position. In the sealing position, the outer edge of the pressure discharge component (5) is sealed and fitted with the inner wall of the pressure discharge port (122). In the pressure discharge position, the pressure discharge component (5) is located above the pressure discharge port (122).
8. The negative pressure suction device for heterojunction ultrathin silicon wafers according to claim 7, characterized in that: The pressure relief component (5) is connected to the limiting protrusion (41).
9. The negative pressure suction device for heterojunction ultrathin silicon wafers according to claim 7, characterized in that: An elastic element (6) is provided between the pressure relief component (5) and the fixed shell (1). After the negative pressure source is started, the elastic element (6) applies a force to the pressure relief component (5) towards the negative pressure cavity, and the magnitude of the force is positively correlated with the height of the pressure relief component (5).
10. The negative pressure suction device for heterojunction ultrathin silicon wafers according to claim 9, characterized in that: The pressure relief component (5) includes a pressure relief sleeve (51) that is closed at the bottom and open at the top. The top of the pressure relief sleeve (51) is provided with an outward flange (52). The elastic component (6) includes a spring (61) and a bracket (62) fixed to the top of the fixed shell (1). The top end of the spring (61) is connected to the bracket (62), and the bottom end is located inside the pressure relief sleeve (51).