Sandwich type multi-layer substrate with embedded micro-channels

Abstract

The utility model discloses a sandwich type multi-layer substrate with embedded micro-channels, which comprises a first electrical substrate provided with a liquid inlet channel and a liquid outlet channel penetrating through the upper surface and the lower surface; the second electrical substrate is provided with two liquid storage flow channels penetrating through the upper surface and the lower surface; and the upper surface of the liquid cooling substrate is provided with a cooling liquid flow channel. According to the utility model, the heat of the chip or the electronic component on the substrate is transferred to the liquid cooling substrate through the conductive and heat-conducting columns, and the liquid cooling substrate is cooled through the cooling liquid flowing in the cooling liquid flow channel, so that the heat of the chip or the electronic component is quickly dissipated, and a near-source heat dissipation technology based on substrate cooling is realized; the heat resistance of the thermal interface material is eliminated, and the device has the advantages of small thermal resistance, high controllability and wide application range, and is more suitable for being integrated on a three-dimensional stacked module chip for efficient heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, and in particular to a sandwich-type multilayer substrate with embedded microchannels. Background Technology

[0002] With the increasing integration density of integrated circuits, the number of transistors integrated per unit area is growing larger, leading to a rapid increase in power consumption. On the other hand, as transistor feature sizes continue to shrink, Moore's Law is approaching its limits, prompting consideration of three-dimensional stacking of planar integrated circuits to further improve integration density. Both the ever-increasing transistor integration density and the three-dimensional stacked structure place higher demands on chip heat dissipation.

[0003] For example, the patent with patent number CN102522380A includes at least two carrier boards that are stacked and packaged in sequence. The top surface of the carrier board is provided with a chip, and the bottom surface of the other carrier boards except the first carrier board is provided with a heat sink. The bottom surface of the first carrier board is provided with a pad for soldering to the system board. The chip on the other carrier boards except the top carrier board is attached to the heat sink adjacent to the chip.

[0004] Although the above-mentioned device can increase the heat dissipation area of ​​the chip, the heat sink has poor heat dissipation effect and cannot effectively cool the chip. Utility Model Content

[0005] To address the aforementioned shortcomings, the purpose of this invention is to propose a sandwich-type multilayer substrate with embedded microchannels to solve the problem of poor heat dissipation in existing three-dimensional stacked chips.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A sandwich-type multilayer substrate with embedded microchannels, comprising:

[0008] A first electrical substrate, wherein the first electrical substrate has an inlet channel and an outlet channel extending through the upper and lower surfaces;

[0009] At least one second electrical substrate, wherein the second electrical substrate has two liquid storage channels extending through the upper and lower surfaces;

[0010] A liquid-cooled substrate, wherein a cooling liquid flow channel is formed on the upper surface of the liquid-cooled substrate;

[0011] The first electrical substrate, the second electrical substrate, and the liquid cooling substrate are arranged sequentially from top to bottom and are tightly connected. The liquid inlet channel and the liquid outlet channel are respectively connected to the liquid inlet end and the liquid outlet end of the coolant channel through the corresponding liquid storage channel. The first electrical substrate, the second electrical substrate, and the liquid cooling substrate are all provided with a plurality of corresponding mounting through holes, and conductive and heat-conducting pillars are inserted into the plurality of corresponding mounting through holes.

[0012] Preferably, the areas of the liquid inlet channel and the liquid outlet channel of the first electrical substrate are both smaller than the area of ​​the liquid storage channel of the second electrical substrate.

[0013] Preferably, the height of the coolant channel is at most two-thirds of the thickness of the liquid-cooled substrate.

[0014] Preferably, the width of the coolant flow channel is 1-100 μm, and several mounting through holes on the liquid-cooled substrate are alternately arranged with the coolant flow channel.

[0015] Preferably, metal solder rings are mounted on the upper surfaces of the first electrical substrate, the second electrical substrate, and the liquid-cooled substrate. The metal solder rings are sleeved on the outside of the conductive and heat-conducting pillars and are in close contact with the conductive and heat-conducting pillars. Electrical interconnects are connected between each pair of metal solder rings on the first electrical substrate and the second electrical substrate.

[0016] Preferably, the total number of the first electrical substrate, the second electrical substrate, and the liquid-cooled substrate is at most seven.

[0017] Preferably, the conductive and heat-conducting pillar is made of at least one material selected from Cu, Sn, Pb, In, Au, Ag, and Sb.

[0018] Preferably, it further includes at least one third electrical substrate that is tightly bonded to the liquid-cooled substrate, the third electrical substrate being disposed on the side of the liquid-cooled substrate away from the second electrical substrate.

[0019] Preferably, the third electrical substrate also has mounting through holes for inserting conductive and heat-conducting pillars, and the third electrical substrate also has metal welding rings fitted on the outside of the conductive and heat-conducting pillars and tightly attached to the conductive and heat-conducting pillars, with electrical interconnects connecting the two metal welding rings.

[0020] Preferably, the total number of the first electrical substrate, the second electrical substrate, the liquid-cooled substrate, and the third electrical substrate is at most 7, and the difference between the number of the second electrical substrate and the third electrical substrate is at most 1.

[0021] The technical solution provided by this utility model can include the following beneficial effects:

[0022] The heat from the chip or electronic component on the substrate is transferred to the liquid-cooled substrate through conductive heat-conducting pillars. The liquid-cooled substrate is then cooled by the coolant flowing in the coolant channels, thereby rapidly dissipating heat from the chip or electronic component. This near-source heat dissipation technology based on substrate cooling eliminates the thermal resistance of the thermal interface material and has the advantages of low thermal resistance, strong controllability, and wide applicability. It is more suitable for integration into three-dimensional stacked module chips for efficient heat dissipation. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of this utility model;

[0024] Figure 2 This is an exploded view of the structure of Embodiment 1 of this utility model;

[0025] Figure 3 This is a schematic diagram of the overall structure of Embodiment 2 of this utility model;

[0026] Figure 4 This is an exploded view of the structure of Embodiment 2 of this utility model.

[0027] Wherein: 1. First electrical substrate; 2. Second electrical substrate; 3. Liquid-cooled substrate; 4. Third electrical substrate; 5. Liquid inlet channel; 6. Liquid outlet channel; 7. Mounting through hole; 71. Conductive and heat-conducting pillar; 72. Metal welding ring; 73. Electrical interconnect; 8. Liquid storage channel. Detailed Implementation

[0028] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0029] In the description of this utility model, it should be understood that the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this utility model. Furthermore, features defined with "first" and "second" may explicitly or implicitly include one or more of these features, used to distinguish and describe features, without any order or emphasis.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] The following is in conjunction with the accompanying drawings. Figures 1 to 4 The technical solution of this utility model will be further illustrated through specific implementation methods.

[0032] Example 1

[0033] like Figure 1-2 As shown, a sandwich-type multilayer substrate with embedded microchannels includes:

[0034] A first electrical substrate 1, wherein the first electrical substrate 1 has an inlet channel 5 and an outlet channel 6 extending through the upper and lower surfaces;

[0035] At least one second electrical substrate 2, the second electrical substrate 2 having two liquid storage channels 8 extending through the upper and lower surfaces;

[0036] A liquid-cooled substrate 3, wherein a cooling liquid flow channel 31 is formed on the upper surface of the liquid-cooled substrate 3;

[0037] The first electrical substrate 1, the second electrical substrate 2, and the liquid-cooled substrate 3 are arranged sequentially from top to bottom and are tightly connected. The liquid inlet channel 5 and the liquid outlet channel 6 are respectively connected to the liquid inlet end and liquid outlet end of the coolant channel 31 through the corresponding liquid storage channel 8. The first electrical substrate 1, the second electrical substrate 2, and the liquid-cooled substrate 3 are each provided with a plurality of corresponding mounting through holes 7, and each of the plurality of vertically corresponding mounting through holes 7 is fitted with a conductive and heat-conducting column 71.

[0038] The heat from the chip or electronic component on the substrate is transferred to the liquid-cooled substrate 3 through the conductive heat-conducting pillar 71, and the liquid-cooled substrate 3 is cooled down by the coolant flowing in the coolant channel 31, thereby quickly dissipating heat from the chip or electronic component. This realizes the near-source heat dissipation technology based on substrate cooling, eliminates the thermal resistance of the thermal interface material, and has the advantages of low thermal resistance, strong controllability, and wide applicability. It is more suitable for integration into three-dimensional stacked module chips for efficient heat dissipation.

[0039] like Figure 2 As shown, the areas of the liquid inlet channel 5 and the liquid outlet channel 6 of the first electrical substrate 1 are both smaller than the area of ​​the liquid storage channel 8 of the second electrical substrate 2.

[0040] Specifically, the area of ​​the liquid inlet channel 5 and the area of ​​the liquid outlet channel 6 of the first electrical substrate 1 are both set to be smaller than the area of ​​the liquid storage channel 8 of the second electrical substrate 2. Sufficient coolant can be stored in the liquid storage channel 8 of the second electrical substrate 2 and the sufficient coolant can circulate in the coolant channel 31 to absorb heat and cool down, thereby improving the cooling effect of the substrate.

[0041] Preferably, the liquid inlet channel 5 and liquid outlet channel 6 of the first electrical substrate 1 are circular or elliptical, and the liquid storage channel 8 of the second electrical substrate 2 is rectangular or elongated. This facilitates the connection and installation of the liquid inlet channel 5 and liquid outlet channel 6 of the first electrical substrate 1 with the liquid inlet pipe and liquid outlet pipe of the external circulating liquid supply device, and allows for the storage of a larger amount of coolant in the liquid storage channel 8 of the second electrical substrate 2.

[0042] like Figure 2 As shown, the maximum height of the coolant channel 31 is two-thirds of the thickness of the liquid-cooled substrate 3.

[0043] Specifically, the height of the coolant channel 31 is up to two-thirds of the thickness of the liquid-cooled substrate 3, which allows the coolant channel 31 to store sufficient coolant to cool the substrate and the conductive and heat-conducting pillars 71, and also allows the liquid-cooled substrate 3 to have good strength and not be easily damaged.

[0044] like Figure 2 As shown, the width of the coolant channel 31 is 1-100um, and several mounting through holes 7 on the liquid-cooled substrate 3 are alternately arranged with the coolant channel 31.

[0045] Specifically, the alternating arrangement of the through hole 7 and the coolant flow channel 31 can increase the contact area between the coolant in the coolant flow channel 31 and the heat source conducted by the conductive heat-conducting column 71, thereby quickly cooling down the conductive heat-conducting column 71. Furthermore, the coolant in the coolant flow channel 31 will not directly contact the conductive heat-conducting column 71, and will not affect the conductivity of the conductive heat-conducting column 71.

[0046] like Figure 1 As shown, metal solder rings 72 are mounted on the upper surfaces of the first electrical substrate 1, the second electrical substrate 2, and the liquid-cooled substrate 3. The metal solder rings 72 are sleeved on the outside of the conductive and heat-conducting pillars 71 and are tightly attached to the conductive and heat-conducting pillars 71. Electrical interconnect lines 73 are connected between each pair of metal solder rings 72 on the first electrical substrate 1 and the second electrical substrate 2.

[0047] Specifically, the conductive and heat-conducting pillars 71 are connected together by the metal solder rings 72 connected by the electrical interconnection line 73, so that the multilayer electrical substrate has a complete electrical interconnection system. Therefore, the circuit system and the heat dissipation system can be integrated in the circuit design by transmitting electrical signals.

[0048] like Figure 1 As shown, the total number of the first electrical substrate 1, the second electrical substrate 2, and the liquid-cooled substrate 3 is at most 7.

[0049] Specifically, the total number of the first electrical substrate 1, the second electrical substrate 2, and the liquid-cooled substrate 3 is at most 7, to avoid the substrate being too thick and affecting the chip packaging.

[0050] like Figure 1 As shown, the conductive and heat-conducting pillar 71 is made of at least one material selected from Cu, Sn, Pb, In, Au, Ag and Sb.

[0051] Specifically, the conductive and heat-conducting pillar 71 is made of at least one material selected from Cu, Sn, Pb, In, Au, Ag and Sb, which enables the conductive and heat-conducting pillar 71 to have good thermal conductivity and can quickly carry the heat generated by the heat source located on the substrate into the substrate.

[0052] Furthermore, the conductive and thermally conductive pillar 71 is installed in the mounting through hole 7 by one of the following methods: vapor deposition, electroplating, and adhesive bonding.

[0053] It is worth noting that the conductive and heat-conducting pillar 71 is installed in the mounting through hole 7 by vapor deposition or electroplating, which makes the installation more secure and the sealing better, preventing coolant from flowing out from the gap between the conductive and heat-conducting pillar 71 and the mounting through hole 7. The conductive and heat-conducting pillar 71 is installed in the mounting through hole 7 by adhesive, which can facilitate the installation of the conductive and heat-conducting pillar 71 and reduce the manufacturing difficulty. Preferably, the adhesive is a thermally conductive adhesive with a high thermal conductivity, which can quickly conduct heat.

[0054] Example 2

[0055] like Figure 3-4 As shown, compared with Embodiment 1, the difference is that it also includes at least one third electrical substrate 4 that is tightly attached to the liquid-cooled substrate 3, and the third electrical substrate 4 is disposed on the side of the liquid-cooled substrate 3 away from the second electrical substrate 2.

[0056] The third electrical substrate 4 is also provided with mounting through holes 7 for inserting conductive and heat-conducting pillars 71. The third electrical substrate 4 is also provided with metal welding rings 72 that are sleeved on the outside of the conductive and heat-conducting pillars 71 and tightly fitted to the conductive and heat-conducting pillars 71. Electrical interconnection lines 73 are connected between each pair of metal welding rings 72.

[0057] Specifically, since the liquid-cooled substrate 3 only has simple metal pads, if the entire multilayer substrate and the circuit board have more complex electrical interconnections, a third electrical substrate 4 needs to be added at the connection between the liquid-cooled substrate 3 and the circuit board, that is, under the liquid-cooled substrate 3.

[0058] The sum of the number of the first electrical substrate 1, the second electrical substrate 2, the liquid-cooled substrate 3, and the third electrical substrate 4 is at most 7, and the difference between the number of the second electrical substrate 2 and the third electrical substrate 4 is at most 1.

[0059] It is worth noting that while increasing the number of second electrical substrates 2 can increase the coolant storage capacity, it will also cause the distance between the inlet channel 5 and the outlet channel 6 and the liquid cooling substrate 3 to be too far. This will require the coolant to travel a longer path to complete the circulation, and the heat from the liquid cooling substrate 3 cannot be dissipated in time. Instead, it will heat the coolant, resulting in less heat being carried away by the coolant and affecting the heat dissipation performance. However, by adding a third electrical substrate 4, heat can be transferred to the liquid cooling substrate 3 slowly, preventing the liquid cooling substrate 3 from overheating and heating the coolant. Therefore, it is necessary to increase the number of second electrical substrates 2 and third electrical substrates 4 evenly.

[0060] Preferably, the first electrical substrate 1, the second electrical substrate 2, the liquid-cooled substrate 3, and the third electrical substrate 4 are made of silicon or glass.

[0061] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without any inventive effort, and these embodiments will all fall within the scope of protection of this utility model.

Claims

1. A sandwich-type multilayer substrate with embedded microchannels, characterized in that, include: A first electrical substrate (1) has an inlet channel (5) and an outlet channel (6) extending through the upper and lower surfaces. At least one second electrical substrate (2) is provided, the second electrical substrate (2) having two liquid storage channels (8) extending through the upper and lower surfaces; A liquid-cooled substrate (3) has a cooling liquid channel (31) on its upper surface. Among them, the first electrical substrate (1), the second electrical substrate (2) and the liquid cooling substrate (3) are arranged sequentially from top to bottom and are tightly connected. The liquid inlet channel (5) and the liquid outlet channel (6) are respectively connected to the liquid inlet end and liquid outlet end of the coolant channel (31) through the corresponding liquid storage channel (8). The first electrical substrate (1), the second electrical substrate (2) and the liquid cooling substrate (3) are each provided with a number of corresponding mounting through holes (7). Each of the several corresponding mounting through holes (7) is filled with a conductive heat-conducting column (71).

2. The sandwich-type multilayer substrate with embedded microchannels according to claim 1, characterized in that: The areas of the liquid inlet channel (5) and liquid outlet channel (6) of the first electrical substrate (1) are both smaller than the area of ​​the liquid storage channel (8) of the second electrical substrate (2).

3. The sandwich-type multilayer substrate with embedded microchannels according to claim 1, characterized in that: The maximum height of the coolant channel (31) is two-thirds of the thickness of the liquid-cooled substrate (3).

4. The sandwich-type multilayer substrate with embedded microchannels according to claim 1, characterized in that: The width of the coolant channel (31) is 1-100um, and several mounting through holes (7) on the liquid-cooled substrate (3) are alternately arranged with the coolant channel (31).

5. A sandwich-type multilayer substrate with embedded microchannels according to claim 1, characterized in that: Metal solder rings (72) are mounted on the upper surfaces of the first electrical substrate (1), the second electrical substrate (2) and the liquid-cooled substrate (3). The metal solder rings (72) are sleeved on the outside of the conductive and heat-conducting pillars (71) and are tightly attached to the conductive and heat-conducting pillars (71). Electrical interconnects (73) are connected between the two metal solder rings (72) on the first electrical substrate (1) and the second electrical substrate (2).

6. The sandwich-type multilayer substrate with embedded microchannels according to claim 1, characterized in that: The total number of the first electrical substrate (1), the second electrical substrate (2), and the liquid-cooled substrate (3) is at most 7.

7. A sandwich-type multilayer substrate with embedded microchannels according to claim 5, characterized in that: It also includes at least one third electrical substrate (4) that is tightly attached to the liquid-cooled substrate (3), the third electrical substrate (4) being disposed on the side of the liquid-cooled substrate (3) away from the second electrical substrate (2).

8. A sandwich-type multilayer substrate with embedded microchannels according to claim 7, characterized in that: The third electrical substrate (4) is also provided with mounting through holes (7) for inserting conductive and heat-conducting pillars (71). The third electrical substrate (4) is also provided with metal welding rings (72) that are sleeved on the outside of the conductive and heat-conducting pillars (71) and tightly fitted to the conductive and heat-conducting pillars (71). Electrical interconnection lines (73) are connected between each pair of metal welding rings (72).

9. A sandwich-type multilayer substrate with embedded microchannels according to claim 7, characterized in that: The sum of the number of the first electrical substrate (1), the second electrical substrate (2), the liquid-cooled substrate (3) and the third electrical substrate (4) is at most 7, and the difference between the number of the second electrical substrate (2) and the third electrical substrate (4) is at most 1.

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