Electric connector

Abstract

The utility model relates to the field of electronic devices, in particular to an electric connector, which comprises a shielding shell, an insertion port, an insulating colloid group and a transmission conductor group, the transmission conductor group comprises a first transmission conductor group welding part, two first high-frequency differential transmission conductor pair welding parts, at least one first grounding transmission conductor welding part, a second transmission conductor group welding part and two second high-frequency differential transmission conductor pair welding parts; when a counter electric connector is placed into the shielding shell from the insertion opening and is conducted with the transmission conductor group on the insulating colloid group, the welding part of the first grounding transmission conductor can isolate noise generated by the first high-frequency differential transmission conductor to the welding part, and the advantages of solving the problem of high-frequency crosstalk interference and stabilizing the high-frequency transmission speed are achieved.

Description

Technical Field

[0001] This utility model relates to the field of electronic devices, and in particular to an electrical connector that can effectively solve the problem of high-frequency crosstalk interference, so as to stabilize high-frequency transmission speed. Background Technology

[0002] With the development of the electronics industry, various types of electronic devices are present in the daily lives of the general public. In order to input control commands to operate electronic devices or to transfer data between multiple electronic devices, most electronic devices are equipped with multiple connectors on the motherboard.

[0003] Generally speaking, the periphery of the motherboard of an electronic device can be used to set up connectors. However, the side-mounted electrical connectors currently available on the market, especially TYPE-C electrical connectors, often suffer from unstable characteristics and severe interference in high-frequency transmission, thus affecting the user experience.

[0004] Therefore, how to solve the above-mentioned common problems and shortcomings is the direction that the applicant of this utility model and related manufacturers in this industry want to research and improve. Utility Model Content

[0005] The main objective of this invention is to provide a method that uses a first grounding transmission conductor welded between two first high-frequency differential transmission conductor welded portions and a second grounding transmission conductor welded between two second high-frequency differential transmission conductor welded portions to effectively isolate crosstalk interference generated by the first high-frequency differential transmission conductor welded portions and the second high-frequency differential transmission conductor welded portions, thereby stabilizing or improving the high-frequency characteristics of the transmission conductor group.

[0006] The structure of this utility model that achieves the above-mentioned main objectives includes a shielding shell with an insertion port extending in the X-axis direction, and the shielding shell contains an insulating colloid assembly. The insulating colloid assembly is provided with a transmission conductor assembly conforming to the USB-C transmission protocol. The transmission conductor assembly includes a first transmission conductor group welding portion arranged in the Z-axis direction and a second transmission conductor group welding portion disposed on one side of the first transmission conductor group welding portion and located in the Y-axis direction. The first transmission conductor group welding portion includes two first high-frequency differential transmission conductor welding portions and at least one first grounding transmission conductor welding portion disposed between each of the first high-frequency differential transmission conductor welding portions. The second transmission conductor group welding portion includes two second high-frequency differential transmission conductor welding portions, and the second transmission conductor group welding portions are arranged in the Z-axis direction.

[0007] Therefore, when the socket of the shielded housing is inserted by the power connector, the transmission conductor group on the insulating colloid is electrically connected to the power connector. In other words, the first high-frequency differential transmission conductor of the first transmission conductor group solder joint begins to transmit high-frequency signals to the solder joint. However, during operation, each of the first high-frequency differential transmission conductors will generate crosstalk interference to the solder joint, making the characteristics of the high-frequency signal transmission unstable. For example, it may be misidentified as other signals, the signal may be abnormal (error code), the packet may be lost, the network speed may be reduced, the sequence may be disordered, or the sequence may be retransmitted. Therefore, when crosstalk interference occurs between each of the first high-frequency differential transmission conductors and the solder joint, the first grounding transmission conductor solder joint is used to isolate the interference noise, so that the first high-frequency differential transmission conductors and the solder joint can operate normally without being affected by each other's interference.

[0008] By employing the above-mentioned technology, the problems of unstable transmission characteristics and severe interference that often exist in commonly used side-mounted TYPE-C electrical connectors can be overcome, thus affecting the user experience and achieving the advantages of this utility model. Attached Figure Description

[0009] Figure 1 A perspective view of the first preferred embodiment of this utility model.

[0010] Figure 2 This is an exploded perspective view of the first preferred embodiment of the present invention.

[0011] Figure 3 This is a perspective view of the second preferred embodiment of the present invention.

[0012] Figure 4 This is an exploded perspective view of the third preferred embodiment of the present invention.

[0013] Figure 5 This is a circuit board diagram of the fourth preferred embodiment of the present invention.

[0014] Figure 6 This is a circuit board diagram of the fifth preferred embodiment of the present invention.

[0015] Figure 7 This is a circuit board diagram of the sixth preferred embodiment of the present invention.

[0016] Figure 8 This is a circuit board diagram of the seventh preferred embodiment of the present invention.

[0017] Figure 9 This is a circuit board diagram of the eighth preferred embodiment of the present invention.

[0018] Figure 10 This is an exploded perspective view of the ninth preferred embodiment of the present invention.

[0019] Figure label:

[0020] Shielding housing…………1

[0021] Insertion port…………11

[0022] Insulating colloid group…………2

[0023] Transmission conductor group…………3

[0024] First transmission conductor group welding section...31

[0025] First high-frequency differential transmission conductor butt welding part ··311

[0026] First grounding transmission conductor welding section... 312

[0027] First outer grounding transmission conductor welded section…313

[0028] First inner power transmission conductor welding section…314

[0029] First low-frequency transmission conductor to welding part... 315

[0030] Second transmission conductor group welding section...32

[0031] The second high-frequency differential transmission conductor is welded to the joint ··321

[0032] Second grounding transmission conductor welding section... 322

[0033] Second outer grounding transmission conductor welded section…323

[0034] Second inner power transmission conductor welding section…324

[0035] The second low-frequency transmission conductor is welded to the joint... 325

[0036] Circuit board…………4

[0037] First side circuit conductor group·······41

[0038] First side high-frequency differential conductor section...411

[0039] First side grounding conductor section·······412

[0040] First outer grounding conductor section·······413

[0041] First inner power conductor section...414

[0042] First side low-frequency conductor section········415

[0043] Second side circuit conductor group·······42

[0044] Second side high-frequency differential conductor section...421

[0045] Second side grounding conductor section·······422

[0046] Second outer grounding conductor section...423

[0047] Second inner power conductor section………………424

[0048] Second side low-frequency conductor section...425

[0049] Intermediate side grounding conductor section…43

[0050] Conductor region…………44 Detailed Implementation

[0051] Please refer to Figure 1 and Figure 2 The figures shown are perspective views and exploded perspective views of the first preferred embodiment of the present invention. It can be clearly seen from the figures that the present invention includes:

[0052] The shielding housing 1 has an insertion port 11 extending in the X-axis direction;

[0053] An insulating colloid assembly 2 is housed within the shielding housing 1;

[0054] The transmission conductor group 3, which is disposed on the insulating colloid group 2 and conforms to the USB-C transmission protocol, includes:

[0055] The first transmission conductor group welding portion 31, arranged in the Z-axis direction, includes two first high-frequency differential transmission conductor welding portions 311 and at least one first grounding transmission conductor welding portion 312 disposed between each of the first high-frequency differential transmission conductor welding portions 311; and

[0056] The second transmission conductor group welding portion 32, located on one side of the first transmission conductor group welding portion 31 and in the Y-axis direction, is arranged in the Z-axis direction. The second transmission conductor group welding portion 32 includes two second high-frequency differential transmission conductor welding portions 321 and at least one second grounding transmission conductor welding portion 322 disposed between each of the second high-frequency differential transmission conductor welding portions 321.

[0057] The electrical connector in this case is a side-mounted electrical connector.

[0058] The first transmission conductor group soldering part 31 and the second transmission conductor group soldering part 32 are either dual in-line package (DIP) or surface mount technology (SMT). This embodiment takes the surface mount technology (SMT) as an example.

[0059] In this embodiment, one of the first grounding transmission conductor welding part 312 and the second grounding transmission conductor welding part 322 is taken as an example.

[0060] Each of the first high-frequency differential transmission conductor welding portions 311 has a first outer grounding transmission conductor welding portion 313 and a first inner power transmission conductor welding portion 314 on both sides, while each of the second high-frequency differential transmission conductor welding portions 321 has a second outer grounding transmission conductor welding portion 323 and a second inner power transmission conductor welding portion 324 on both sides.

[0061] The first grounding transmission conductor welding part 312 is located between each of the first inner power transmission conductor welding parts 314, and a first low frequency transmission conductor welding part 315 is provided on one side of the first grounding transmission conductor welding part 312. The second grounding transmission conductor welding part 322 is located between each of the second inner power transmission conductor welding parts 324, and a second low frequency transmission conductor welding part 325 is provided on one side of the second grounding transmission conductor welding part 322.

[0062] When the power connector is inserted into the insertion port 11 of the shielding housing 1, electrical connection is established between the power connector and the transmission conductor group 3 on the insulating colloid group 2. At this time, the first high-frequency differential transmission conductor butt welding part 311, the first outer ground transmission conductor butt welding part 313, the first inner power transmission conductor butt welding part 314, and the first low-frequency transmission conductor butt welding part 315 of the first transmission conductor group welding part 31, and the second high-frequency differential transmission conductor butt welding part 321, the second outer ground transmission conductor butt welding part 323, the second inner power transmission conductor butt welding part 324, and the second low-frequency transmission conductor butt welding part 325 of the second transmission conductor group welding part 32 all begin transmission operation. However, during operation, each of the first high-frequency differential transmission conductor butt welding parts 311... Crosstalk interference occurs between the first high-frequency differential transmission conductor solder joint 311 and each of the second high-frequency differential transmission conductor solder joints 321, causing instability in the characteristics of the high-frequency signal during transmission. This can result in issues such as misidentification as other signals, signal abnormalities (error codes), packet loss, reduced network speed, disordered sequences, or sequence retransmissions. Therefore, this invention addresses this issue by using the first grounding transmission conductor solder joint 312 and the first outer grounding transmission conductor solder joint 313 to isolate the noise generated by the first high-frequency differential transmission conductor solder joint 311 when crosstalk interference occurs between the first high-frequency differential transmission conductor solder joint 311 and the second high-frequency differential transmission conductor solder joint 322 and the second outer grounding transmission conductor solder joint 323. This effectively allows the first high-frequency differential transmission conductor solder joint 311 and the second high-frequency differential transmission conductor solder joint 321 to operate normally without being affected by each other's interference.

[0063] Please refer to Figure 3 The figure shown is a perspective view of the second preferred embodiment of the present invention. As can be clearly seen from the figure, the difference between this embodiment and the first preferred embodiment is that, in this embodiment, two of the first grounding transmission conductor welding portions 312 and two of the second grounding transmission conductor welding portions 322 are used respectively. Therefore, when crosstalk interference occurs between two first high-frequency differential transmission conductor welding portions 311 or two second high-frequency differential transmission conductor welding portions 321, multiple first grounding transmission conductor welding portions 312 can be used to isolate the two first high-frequency differential transmission conductor welding portions 311, and multiple second grounding transmission conductor welding portions 322 can be used to isolate the two second high-frequency differential transmission conductor welding portions 321, thereby solving the high-frequency crosstalk interference problem and stabilizing the high-frequency transmission speed.

[0064] Please refer to Figure 4The figure shown is an exploded perspective view of the third preferred embodiment of the present invention. As can be clearly seen from the figure, the difference between this embodiment and the first preferred embodiment lies in that the electrical connector in this embodiment is disposed on a circuit board 4. The circuit board 4 has a first-side circuit conductor group 41 connected to the first transmission conductor group welding portion 31, and a second-side circuit conductor group 42 disposed on one side of the first-side circuit conductor group 41 and connected to the second transmission conductor group welding portion 32. The first-side circuit conductor group 41 has two first-side high-frequency differential conductor portions 411 electrically connected to each of the first high-frequency differential transmission conductor welding portions 311, and at least one first-side grounding conductor portion 412 disposed between each of the first-side high-frequency differential transmission conductor portions 411. The second-side circuit conductor group 42 has two second-side high-frequency differential conductor portions 421 electrically connected to each of the second high-frequency differential transmission conductor welding portions 321, and at least one second-side grounding conductor portion 421 disposed between each of the second-side high-frequency differential transmission conductor portions 421. 22. Furthermore, each of the first-side high-frequency differential conductor portions 411 is provided with a first outer ground conductor portion 413 and a first inner power conductor portion 414 on both sides, while each of the second-side high-frequency differential conductor portions 421 is provided with a second outer ground conductor portion 423 and a second inner power conductor portion 424 on both sides. The first-side ground conductor portion 412 is located between each of the first inner power conductor portions 414, and a first-side low-frequency conductor portion 415 is provided on one side of the first-side ground conductor portion 412. The second-side ground conductor portion 422 is located between each of the second inner power conductor portions 424, and a second-side low-frequency conductor portion 425 is provided on one side of the second-side ground conductor portion 422. In this way, crosstalk interference between the two first-side high-frequency differential conductor portions 411 can be isolated by the first outer ground conductor portion 413 and the first-side ground conductor portion 412, and the two second-side high-frequency differential conductor portions 421 can be isolated by the first outer ground conductor portion 413 and the first-side ground conductor portion 412. Crosstalk interference 1 can be isolated by the second outer grounding conductor 423 and the second side grounding conductor 422. Therefore, through the design of the first side grounding conductor 412 and the second side grounding conductor 422, interference between the two first side high-frequency differential conductors 411 can be prevented. Similarly, interference between the two second side high-frequency differential conductors 421 can also be prevented, thereby solving the high-frequency crosstalk interference problem and achieving the advantage of stabilizing the high-frequency transmission speed. In this embodiment, one of each of the first side grounding conductor 412 and the second side grounding conductor 422 is used as an example.

[0065] Please refer to Figure 5The diagram shown is a circuit board diagram of the fourth preferred embodiment of the present invention. As can be clearly seen from the diagram, the difference between this embodiment and the third preferred embodiment is that, in this embodiment, the first side grounding conductor 412 and the second side grounding conductor 422 are each two in number. This design can better alleviate the problem of crosstalk interference.

[0066] Please refer to Figure 6 The diagram shown is a circuit board diagram of the fifth preferred embodiment of the present invention. As can be clearly seen from the diagram, the difference between this embodiment and the fourth preferred embodiment is that the first side grounding conductor 412 and the second side grounding conductor 422 are connected to each other in this embodiment, thus forming a larger grounding area and achieving a better anti-crosstalk interference effect.

[0067] Please refer to Figure 7 The diagram shown is a circuit board diagram of the sixth preferred embodiment of the present invention. As can be clearly seen from the diagram, the difference between this embodiment and the fifth preferred embodiment is that at least one intermediate grounding conductor 43 is provided between the first side circuit conductor group 41 and the second side circuit conductor group 42 in this embodiment. The intermediate grounding conductor 43 is connected to the first side grounding conductor 412 and the second side grounding conductor 422. In this embodiment, two intermediate grounding conductors 43 are used as an example, which are respectively connected to the first side grounding conductor 412 and the second side grounding conductor 422. Through this design, the crosstalk interference isolation effect between the first side high-frequency differential conductor 411 and the second side high-frequency differential conductor 421 can be enhanced, thereby achieving better high-frequency transmission characteristics.

[0068] Please refer to Figure 8 The diagram shown is a circuit board diagram of the seventh preferred embodiment of the present invention. As can be clearly seen from the diagram, the difference between this embodiment and the sixth preferred embodiment is that the intermediate grounding conductor 43 in this embodiment is taken as one example, thereby representing that the number of intermediate grounding conductors 43 in this invention is not limited, and a single intermediate grounding conductor 43 can achieve a better crosstalk interference isolation effect.

[0069] Please refer to Figure 9 The figure shows a circuit board diagram of the eighth preferred embodiment of the present invention. As can be clearly seen from the figure, the difference between this embodiment and the seventh preferred embodiment is that the circuit board 4 of this embodiment is provided with at least one conductor area 44 for the shielding shell to contact and vent noise. By means of the design of the conductor area 44, noise can be quickly guided from the shielding shell to the conductor area 44 for venting. Moreover, because the area of ​​the conductor area 44 is large, it can provide a venting path for larger noise.

[0070] Please refer to Figure 10The figure shown is an exploded perspective view of the ninth preferred embodiment of the present invention. As can be clearly seen from the figure, it includes:

[0071] The shielding housing 1 has an insertion port 11 extending in the X-axis direction;

[0072] An insulating colloid assembly 2 is housed within the shielding housing 1;

[0073] The transmission conductor group 3, which is disposed on the insulating colloid group 2 and conforms to the USB-C transmission protocol, includes:

[0074] The first transmission conductor group welding section 31, arranged in the Z-axis direction, includes two first high-frequency differential transmission conductor welding sections 311, and at least one first grounding transmission conductor welding section 312 disposed between each of the first high-frequency differential transmission conductor welding sections 311; and

[0075] The second transmission conductor group welding part 32 is located on one side of the first transmission conductor group welding part 31 and in the Y-axis direction, and is arranged in the Z-axis direction. The second transmission conductor group welding part 32 includes two second high-frequency differential transmission conductor welding parts 32 1.

[0076] The electrical connector is disposed on the circuit board 4 and has a first side circuit conductor group 41 connected to the first transmission conductor group welding part 31, and a second side circuit conductor group 42 disposed on one side of the first side circuit conductor group 41 and connected to the second transmission conductor group welding part 32.

[0077] The first side circuit conductor group 41 has two first side high-frequency differential conductor portions 411 electrically connected to each of the first high-frequency differential transmission conductor welding portions 311, and at least one first side grounding conductor portion 412 disposed between each of the first side high-frequency differential conductor portions 411.

[0078] The second-side circuit conductor group 42 has two second-side high-frequency differential conductor portions 421 electrically connected to each of the second high-frequency differential transmission conductor welding portions 321, and at least one second-side grounding conductor portion 422 disposed between each of the second-side high-frequency differential conductor portions 421, and each first-side grounding conductor portion 412 is interconnected with each corresponding second-side grounding conductor portion 422.

[0079] Therefore, the difference between the electrical connector in this embodiment and the electrical connector in the first preferred embodiment is that this embodiment lacks a second grounding transmission conductor solder joint. That is, the manufacturing process and cost can be optimized without losing the technical feature of isolating crosstalk interference. In short, when the first grounding transmission conductor solder joint 312 is connected to the first side grounding conductor joint 412, an isolation barrier is generated between the first high-frequency differential transmission conductor solder joint 311. Even if there is no second grounding transmission conductor solder joint between the two second high-frequency differential transmission conductor solder joints 321, an invisible isolation barrier can still be generated between the two second high-frequency differential transmission conductor solder joints 321 by the change of magnetic field guided from the first side grounding conductor joint 412 to the second side grounding conductor joint 422, thereby solving the high-frequency crosstalk interference problem and stabilizing the high-frequency transmission speed.

[0080] However, although various embodiments of the present invention have been shown and illustrated herein, preferred embodiments are provided by way of example only. Any operational theories or advantages provided herein are merely illustrative aids to the present invention; such theories and explanations should not limit the scope of the claims formed by practicing the present invention. It is common for those skilled in the art to conceive of numerous variations, modifications, or alternatives without departing from the present invention. It should be understood that any simple modifications and equivalent structural changes made by way of example using the description and drawings of the present invention should similarly be included within the patent scope of the present invention, as hereby stated.

Claims

1. An electrical connector, characterized in that, The electrical connector includes: The shielding housing has an insertion port extending in the X-axis direction; An insulating colloid assembly housed within the shielding housing; A transmission conductor assembly disposed on the insulating colloid assembly and conforming to the USB-C transmission protocol includes: The first transmission conductor group welding section arranged in the Z-axis direction includes two first high-frequency differential transmission conductor welding sections and at least one first grounding transmission conductor welding section disposed between each of the first high-frequency differential transmission conductor welding sections; and The second transmission conductor group welding part is located on one side of the first transmission conductor group welding part and in the Y-axis direction, and is arranged in the Z-axis direction. The second transmission conductor group welding part includes two second high-frequency differential transmission conductor welding parts.

2. The electrical connector as claimed in claim 1, characterized in that, The second transmission conductor group welding portion has at least one second ground transmission conductor welding portion disposed between each of the second high-frequency differential transmission conductor pair welding portions.

3. The electrical connector as described in claim 1, characterized in that, The electrical connector is disposed on a circuit board and has a first side circuit conductor group connected to the soldering portion of the first transmission conductor group, and a second side circuit conductor group disposed on one side of the first side circuit conductor group and connected to the soldering portion of the second transmission conductor group.

4. The electrical connector as described in claim 3, characterized in that, The first side circuit conductor group has two first side high-frequency differential conductor portions electrically connected to the welding portions of each of the first high-frequency differential transmission conductors, and at least one first side grounding conductor portion disposed between each of the first side high-frequency differential conductor portions.

5. The electrical connector as described in claim 4, characterized in that, The second side circuit conductor group has two second side high-frequency differential conductor portions electrically connected to the welding portions of each of the second high-frequency differential transmission conductors, and at least one second side grounding conductor portion disposed between each of the second side high-frequency differential conductor portions.

6. The electrical connector as claimed in claim 5, characterized in that, At least one intermediate grounding conductor is provided between the first side circuit conductor group and the second side circuit conductor group, and the intermediate grounding conductor is connected to the first side grounding conductor and the second side grounding conductor.

7. The electrical connector as claimed in claim 5, characterized in that, Each of the first side high-frequency differential conductor portions has a first outer ground conductor portion and a first inner power conductor portion on both sides, and each of the second side high-frequency differential conductor portions has a second outer ground conductor portion and a second inner power conductor portion on both sides. The first side ground conductor portion is located between each of the first inner power conductor portions, and a first side low-frequency conductor portion is located on one side of the first side ground conductor portion. The second side ground conductor portion is located between each of the second inner power conductor portions, and a second side low-frequency conductor portion is located on one side of the second side ground conductor portion.

8. The electrical connector as claimed in claim 3, characterized in that, The circuit board has at least one conductive area that the shielding housing can contact to vent noise.

9. The electrical connector as claimed in claim 1, characterized in that, The first high-frequency differential transmission conductor pair welding part is provided with a first outer grounding transmission conductor welding part and a first inner power transmission conductor welding part on both sides, and the second high-frequency differential transmission conductor pair welding part is provided with a second outer grounding transmission conductor welding part and a second inner power transmission conductor welding part on both sides.

10. The electrical connector as claimed in claim 9, characterized in that, The first grounding transmission conductor welding part is located between each of the first inner power transmission conductor welding parts, and a first low-frequency transmission conductor welding part is provided on one side of the first grounding transmission conductor welding part. The second grounding transmission conductor welding part is located between each of the second inner power transmission conductor welding parts, and a second low-frequency transmission conductor welding part is provided on one side of the second grounding transmission conductor welding part.

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