Laser module

Abstract

The utility model relates to a laser module. The laser module comprises a circuit carrier plate which comprises a hard plate layer and a flexible plate layer, a part of the flexible plate layer and the hard plate layer are stacked to form a hard plate part of the circuit carrier plate, and a part of the flexible plate layer is located outside the hard plate layer to form a flexible plate part of the circuit carrier plate, the flexible plate part is provided with a first electrode used for being electrically connected with an external element. The laser chip is arranged on the hard plate part and is electrically connected with the first electrode through the hard plate part and the flexible plate part; and the lens assembly is arranged on the hard plate part and corresponds to the laser chip. According to the laser module, the preparation process of the laser module is simplified, and the influence of high temperature in the welding process on the structure and performance reliability of the lens assembly and the laser chip is reduced.

Description

Technical Field

[0001] This application relates to the field of laser application technology, and in particular to a laser module. Background Technology

[0002] Line laser modules typically include lenses for optical shaping, sleeves for mounting the lenses, and a chip carrier for placing the chips. The sleeves are attached to the chip carrier using adhesive. In traditional line laser modules, the chip carrier is usually made of ceramic substrate. Ceramic substrates are not easily electrically interconnected with the circuit boards of other components. Typically, a terminal wire or flexible circuit board needs to be soldered onto the ceramic substrate to facilitate electrical connection with other component circuit boards. However, the high temperatures during the soldering process can easily cause problems such as lens deformation or adhesive failure, affecting the structural and performance reliability of the line laser module. Utility Model Content

[0003] Therefore, it is necessary to provide a laser module to improve the structural and performance reliability of line laser modules.

[0004] A laser module, comprising:

[0005] A circuit board includes a rigid board layer and a flexible board layer. A portion of the flexible board layer is stacked with the rigid board layer to form the rigid board portion of the circuit board. A portion of the flexible board layer is located outside the rigid board layer to form the flexible board portion of the circuit board. The flexible board portion is provided with a first electrode for electrical connection with external components.

[0006] A laser chip is disposed on the rigid plate portion and electrically connected to the first electrode through the rigid plate portion and the flexible plate portion; and,

[0007] A lens assembly is disposed on the rigid plate portion and corresponds to the laser chip.

[0008] The aforementioned laser module uses a rigid-flex integrated board, comprising a flexible board portion and a rigid board portion, as the circuit carrier board for supporting the laser chip and lens assembly. The rigid board portion can meet the load-bearing strength requirements of the laser chip and lens assembly, while the first electrode on the flexible board portion can be electrically connected to external components to achieve electrical connection between the laser chip and external components. Therefore, the electrical connection requirements can be met without welding terminal wires or flexible circuit boards to the rigid board portion, which helps to simplify the manufacturing process of the laser module, omits a welding process, and reduces the impact of high temperatures during the welding process on the structural and performance reliability of the lens assembly and laser chip, thereby improving the structural and performance reliability of the laser module.

[0009] In one embodiment, the lens assembly includes a sleeve, a collimating lens, and a diffuser lens. The laser module further includes an adhesive structure. The sleeve is bonded to the rigid plate portion through the adhesive structure and is disposed around the laser chip. The collimating lens and the diffuser lens are disposed inside the sleeve and are disposed opposite to the laser chip.

[0010] In one embodiment, the adhesive structure is disposed on the surface of the rigid plate portion where the laser chip is located, and surrounds the laser chip. The radial dimension of the sleeve is smaller than the radial dimension of the rigid plate portion on the sleeve. The end face of the sleeve facing the rigid plate portion is bonded to the adhesive structure, and the orthographic projection of the lens assembly onto the rigid plate portion falls within the rigid plate portion. This improves the overall structural reliability of the laser module, facilitates the lead-out of the flexible plate portion, reduces the complexity of the electrical connection structure, and simplifies the manufacturing process.

[0011] In one embodiment, the flexible board layer includes a flexible cover layer, a flexible conductive layer, a flexible insulating layer, a flexible conductive layer, and a flexible cover layer stacked sequentially. The circuit board includes two rigid board layers, which are respectively stacked on the two flexible cover layers. In the direction from the flexible board layer to the rigid board layer, the rigid board layer includes a rigid insulating layer and a rigid conductive layer stacked sequentially.

[0012] In one embodiment, the rigid plate layer further includes an electroplated conductive layer disposed on the rigid conductive layer facing away from the flexible plate layer; and / or,

[0013] The circuit board also includes a solder resist layer stacked on the side of the rigid board layer facing away from the flexible board layer.

[0014] In one embodiment, the rigid insulation layer comprises an epoxy fiberglass cloth laminate, a bismaleimide-triazine resin board, or a metal-based reinforcing board, and the flexible insulation layer comprises polyimide or polyester.

[0015] In one embodiment, the first electrode includes a first positive electrode and a first negative electrode. The rigid plate portion has a first surface and a second surface disposed opposite to each other. The circuit board further includes a patch structure and a second positive electrode disposed on the first surface, and a second negative electrode and a test positive electrode disposed on the second surface. The laser chip is disposed on the patch structure. The patch structure, the second positive electrode, the test positive electrode and the first positive electrode are electrically connected to each other. The patch structure, the second negative electrode and the first negative electrode are electrically connected to each other.

[0016] In one embodiment, the rigid plate portion has a first through hole and a second through hole penetrating the rigid plate portion. The circuit board further includes a first conductive layer disposed on the inner wall surface of the first through hole and a second conductive layer disposed on the inner wall surface of the second through hole. The first conductive layer is electrically connected to the second positive electrode and the test positive electrode on the first surface and the second surface, and the second conductive layer is electrically connected to the patch structure and the second negative electrode on the first surface and the second surface. Providing the first and second through holes in the rigid plate portion, and achieving electrical connections between the electrodes through the first and second conductive layers on the inner walls of the first and second through holes, simplifies the circuit structure of the circuit board, reduces the size of the circuit board, and also improves the heat dissipation efficiency of the circuit board through the through holes.

[0017] In one embodiment, the circuit board further includes a heat dissipation structure filling the first through-hole and the second through-hole.

[0018] In one embodiment, the circuit board further includes a solder resist layer disposed on the rigid board portion. The solder resist layer covers the portions of the first and second surfaces corresponding to the patch structure, the second positive electrode, the second negative electrode, and the test positive electrode. The circuit board also includes electroplated caps covering the two opposite ends of the heat dissipation structure. The electroplated caps seal the first and second through holes and are flush with the surface of the solder resist layer facing away from the rigid board portion. This improves the surface flatness of the circuit board, facilitating better load-bearing and electrical connection functions, while also enhancing the internal sealing performance and performance stability of the circuit board. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the laser module structure in some embodiments.

[0020] Figure 2 for Figure 1 The diagram shows the structure of the laser module from another angle.

[0021] Figure 3 for Figure 2 The diagram shows a cross-sectional view of the laser module along the AA direction.

[0022] Figure 4 This is a cross-sectional schematic diagram of the circuit board in some embodiments.

[0023] Figure 5 This is a schematic diagram of the structure of one side of the first surface of the circuit board in some embodiments.

[0024] Figure 6 This is a schematic diagram of the structure of one side of the second surface of the circuit board in some embodiments.

[0025] Figure 7 This is a block diagram of the internal structure of the circuit board in some embodiments.

[0026] Figure 8 This is another block diagram of the circuit board in some embodiments.

[0027] Figure 9 for Figure 8 The diagram shows a cross-sectional view of the circuit board along the BB direction.

[0028] Figure label:

[0029] 10. Laser module; 11. Circuit board; 111. Rigid board layer; 1111. Rigid insulating layer; 1112. Rigid conductive layer; 1113. Electroplated conductive layer; 112. Flexible board layer; 1121. Flexible cover layer; 1122. Flexible conductive layer; 1123. Flexible insulating layer; 113. Rigid board portion; 1131. First surface; 1132. Second surface; 1133. First through hole; 1134. Second through hole; 1135. 1136 First conductive layer; 1137 Heat dissipation structure; 1138 Positioning mark; 114 Flexible board section; 1151 First positive electrode; 1152 First negative electrode; 1153 Solder resist layer; 1154 Patch structure; 1155 Second positive electrode; 1156 Second negative electrode; 1157 Test positive electrode; 12 Laser chip; 13 Lens assembly; 131 Sleeve; 132 Collimating lens; 133 Diffusion lens; 134 Adhesive structure. Detailed Implementation

[0030] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0031] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0032] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0033] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0034] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0035] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0036] Please see Figure 1 , Figure 2 and Figure 3 , Figure 1 and Figure 2 The following are schematic diagrams of the laser module 10 at different angles in some embodiments. Figure 3 for Figure 2 The diagram shows a cross-sectional view of the laser module 10 along the AA direction. The laser module 10 provided in this application can be used to emit lasers. The laser spot emitted by the laser module 10 includes, but is not limited to, a line laser. The laser module 10 can be used in any applicable field, including, but not limited to, cutting, welding, measurement, scanning, and experimental research.

[0037] In some embodiments, the laser module 10 includes a circuit board 11, a laser chip 12, and a lens assembly 13. The laser chip 12 serves as the light source of the laser module 10, used to emit laser light. The type of laser chip 12 includes, but is not limited to, any applicable type of laser such as a vertical cavity surface-emitting laser, an edge-emitting laser, or a horizontal cavity surface-emitting laser. The wavelength of the laser emitted by the laser chip 12 is also not limited, and can be specifically designed according to the application scenario requirements of the laser module 10. The laser chip 12 is disposed on the circuit board 11 and electrically connected to the circuit board 11. The circuit board 11 is also used for electrical connection with external components, such as external components used to power and / or control the laser chip 12, so as to realize the power supply and control of the laser chip 12 by external components. That is to say, the circuit board 11 plays the role of structural support and electrical connection for the laser chip 12.

[0038] Lens assembly 13 is disposed on circuit board 11 and corresponds to laser chip 12. Lens assembly 13 may include sleeve 131 disposed on circuit board 11 and one or more lenses disposed within sleeve 131. Sleeve 131 is disposed on circuit board 11 and surrounds laser chip 12. Lens is opposite to laser chip 12 and is used to optically shape the light emitted by laser chip 12 before it is emitted. The number and type of lenses in lens assembly 13 are not limited and can be set according to the optical shaping requirements of laser module 10. For example, when laser module 10 is used to emit line laser, lens assembly 13 may include collimating lens 132 and diffuser lens 133. Collimating lens 132 and diffuser lens 133 are both opposite to the light-emitting side of laser chip 12. Diffuser lens 133 is disposed on the side of collimating lens 132 that is away from laser chip 12. The laser emitted by laser chip 12 is emitted after being shaped by collimating lens 132 and diffuser lens 133 in sequence. The collimating lens 132 includes, but is not limited to, a plano-convex lens, a biconvex lens, etc., used to collimate the light emitted by the laser chip 12 so that the light tends to be a parallel beam. The diffuser lens 133 includes, but is not limited to, a concave lens, a microlens array, a wave mirror, a holographic diffuser, etc., used to diffuse the laser, for example, to diffuse in one direction to form a line laser.

[0039] Furthermore, combined Figure 4 and Figure 5 As shown, in some embodiments, the circuit carrier 11 includes a rigid board layer 111 and a flexible board layer 112. At least a portion of the rigid board layer 111 is made of a rigid material, and at least a portion of the flexible board layer 112 is made of a flexible material. The flexible board layer 112 is divided into two parts in the extending direction. One part is stacked with the rigid board layer 111 to form the rigid board portion 113 of the circuit carrier 11 together with the rigid board layer 111. The other part is located outside the rigid board layer 111 and forms the flexible board portion 114 of the circuit carrier 11. It can be understood that the circuit carrier 11 can be divided into two parts in the extending direction: the rigid board portion 113 and the flexible board portion 114. The rigid board portion 113 is rigid overall due to the presence of the rigid board layer 111, while the flexible board portion 114 is flexible and has flexible deformation capability. Since the flexible board portion 114 and the flexible board layer 112 in the rigid board portion 113 are an integral structure, the flexible board portion 114 and the rigid board portion 113 can also be regarded as an integral structure, so the circuit board 11 is a rigid-flexible integrated board.

[0040] Both the laser chip 12 and the lens assembly 13 are disposed on the rigid plate layer 111 of the rigid plate portion 113, which serves as the structural carrier for the laser chip 12 and the lens assembly 13. A first electrode for electrical connection with external components is provided on the flexible plate portion 114. The laser chip 12 is electrically connected to the first electrode through the rigid plate portion 113 and the flexible plate portion 114, facilitating electrical connection with external components via the first electrode. In some embodiments, the laser module 10 further includes an adhesive structure 134, which is disposed on the rigid plate portion 113 and surrounds the laser chip 12. The adhesive structure 134 is located between the end face of the sleeve 131 and the rigid plate portion 113 to adhere the sleeve 131 to the rigid plate portion 113.

[0041] The aforementioned laser module 10 uses a rigid-flexible integrated board, including a flexible plate portion 114 and a rigid plate portion 113, as the circuit carrier board 11 that carries the laser chip 12 and the lens assembly 13. The rigid plate portion 113 can meet the load-bearing strength requirements of the laser chip 12 and the lens assembly 13, while the first electrode on the flexible plate portion 114 can be electrically connected to external components to realize the electrical connection between the laser chip 12 and external components. Therefore, it is not necessary to weld terminal wires or flexible circuit boards on the rigid plate portion 113 to achieve the electrical connection requirements, which helps to simplify the manufacturing process of the laser module 10, omitting a welding process. At the same time, it also helps to avoid the failure of the adhesion structure 134 caused by the high temperature of welding, which affects the adhesion between the sleeve 131 and the circuit carrier board 11, or causes lens deformation, etc., thereby reducing the impact of the high temperature during the welding process on the structure and performance reliability of the lens assembly 13 and the laser chip 12, which helps to improve the structure and performance reliability of the laser module 10.

[0042] In this application, the cross-sectional shape of the rigid plate portion 113 and the flexible plate portion 114 includes, but is not limited to, any applicable shape such as square or circle, and can be designed according to installation requirements.

[0043] In some embodiments, the first electrode includes a first positive electrode 1151 and a first negative electrode 1152. The first electrode may be formed of a copper layer and may be electrically connected to an external component by any applicable method such as plugging or snapping. It should be noted that in some embodiments, the first positive electrode 1151 and the first negative electrode 1152 may also be electrically connected to the external component by welding. The first positive electrode 1151 and the first negative electrode 1152 may be formed at the end of the flexible plate portion 114 away from the rigid plate portion 113. Since the first electrode is away from the rigid plate portion 113, the welding temperature is not easily conducted to the lens assembly 13 during the welding process of the first electrode, thereby making it less likely for the adhesive structure 134 to fail or the lens to deform.

[0044] In some embodiments, the radial dimension of the sleeve 131 is smaller than the radial dimension of the rigid plate portion 113 in the sleeve 131. The end face of the sleeve 131 facing the rigid plate portion 113 is bonded to the bonding structure 134, and the orthographic projection of the lens assembly 13 onto the rigid plate portion 113 falls within the rigid plate portion 113. That is, the lens assembly 13 is entirely disposed on one side of the rigid plate portion 113. Compared with the traditional method of embedding the circuit board into the sleeve 131, this is beneficial to improving the overall structural reliability of the laser module 10, while also facilitating the extraction of the flexible plate portion 114, reducing the complexity of the electrical connection structure, and simplifying the manufacturing process.

[0045] refer to Figure 4 As shown, in some embodiments, the flexible board layer 112 includes a flexible cover layer 1121, a flexible conductive layer 1122, a flexible insulating layer 1123, and the flexible cover layer 1121 stacked sequentially. The flexible insulating layer 1123 serves as the base layer of the flexible board layer 112, playing a major supporting role. The material of the flexible insulating layer 1123 includes, but is not limited to, any suitable flexible insulating material such as polyimide (PI) or polyethylene terephthalate (PET). The flexible conductive layer 1122 includes, but is not limited to, a copper layer. The flexible conductive layer 1122 may have circuit patterns, serving as the circuit layer of the flexible board layer 112. The flexible cover layer 1121 is made of, but is not limited to, any suitable flexible insulating material such as PI or PET, and serves as an insulating and protective layer for the flexible conductive layer 1122.

[0046] In some embodiments, a first electrode can be formed by partially retracting the flexible cover layer 1121 to expose a portion of the flexible conductive layer 1122. The flexible plate layer 112 with the above-described layer structure can simplify the process of setting the first electrode and facilitate the electrical connection between the circuit board 11 and other components.

[0047] In some embodiments, the circuit board 11 includes two rigid board layers 111, which are respectively stacked on two flexible cover layers 1121, i.e., respectively disposed on opposite sides of the flexible board layers 1121. The two rigid board layers 111 can provide effective support and protection for the flexible board layers 112 of the rigid board portion 113, thereby improving the structural reliability of the circuit board 11.

[0048] In some embodiments, in the direction from the flexible plate layer 112 to the rigid plate layer 111, the rigid plate layer 111 includes a rigid insulating layer 1111 and a rigid conductive layer 1112 stacked sequentially. The rigid insulating layer 1111 serves as the base layer of the rigid plate layer 111, playing a primary supporting role within the rigid plate layer 111. The rigid insulating layer 1111 includes, but is not limited to, any suitable rigid insulating material such as FR4 fiberglass cloth laminate, bismaleimide-triazine resin board (BT), or metal-based reinforcing plate. When a metal-based reinforcing plate is used as the rigid insulating layer 1111, the metal substrate includes, but is not limited to, aluminum or copper, which helps improve the heat dissipation efficiency of the rigid plate portion 113, thereby improving the overall heat dissipation performance of the laser module 10 and enhancing the performance stability and lifespan of the laser module 10. The rigid conductive layer 1112 may have circuit patterns, serving as the circuit layer of the rigid plate layer 111. The material of the rigid conductive layer 1112 includes, but is not limited to, copper.

[0049] In some embodiments, the rigid board layer 111 further includes an electroplated conductive layer 1113 disposed on the rigid conductive layer 1112 facing away from the flexible board layer 112. The material of the electroplated conductive layer 1113 includes, but is not limited to, copper. The electroplated conductive layer 1113 is deposited on the outermost side of the rigid board layer 111 through an electroplating process, which helps improve the overall surface flatness of the circuit board 11, thereby facilitating better structural support and electrical connection of the circuit board 111, and also enhancing the heat dissipation function of the circuit board 111. The single-layer thickness of the electroplated conductive layer 1113 and the overall thickness of the two layers of the rigid conductive layer 1112 can be greater than or equal to 2 oz, so that heat can spread and dissipate rapidly in the rigid board layer 111, effectively improving the heat dissipation efficiency of the circuit board 111.

[0050] In some embodiments, the circuit board 11 further includes a solder resist layer 1153 stacked on the side of the rigid board layer 111 facing away from the flexible board layer 112. The solder resist layer 1153 is made of any applicable material, including but not limited to epoxy resin, acrylic resin, ink, etc. The solder resist layer 1153 is used to provide protection for the circuit board 11 and reduce the risk of short circuits, corrosion, oxidation, etc.

[0051] Please see Figure 5 and Figure 6As shown, in some embodiments, the rigid board portion 113 has a first surface 1131 and a second surface 1132 disposed opposite to each other, and the laser chip 12 and the lens assembly 13 may be disposed on one side of the first surface 1131 of the rigid board portion 113. The circuit board 11 also includes a patch structure 1154 and a second positive electrode 1155 disposed on the first surface 1131, and a second negative electrode 1156 and a test positive electrode 1157 disposed on the second surface 1132. The patch structure 1154 is electrically connected to the second positive electrode 1155 via any suitable conductive material such as gold wire, and is used to mount the laser chip 12. The laser chip 12 can be fixed to the patch structure 1154 by any suitable method such as silver paste bonding. The patch structure 1154, the second positive electrode 1155, the second negative electrode 1156, and the test positive electrode 1157 can all be any suitable conductive layer such as a copper layer disposed on the surface of the rigid plate portion 113, or the rigid conductive layer 1112 of the rigid plate portion 113 can be partially exposed. The patch structure 1154, the second positive electrode 1155, the test positive electrode 1157, and the first positive electrode 1151 are electrically connected to each other, and the patch structure 1154, the second negative electrode 1156, and the first negative electrode 1152 are electrically connected to each other. Understandably, when the first positive electrode 1151 and the first negative electrode 1152 are electrically connected to external components, the laser chip 12 forms an electrical connection circuit with the first positive electrode 1151 and the first negative electrode 1152 through the patch structure 1154, thereby achieving electrical connection with external components. A test positive electrode 1157 is provided on the second surface 1132, facilitating testing of the laser chip 12 through the test positive electrode 1157 and the second negative electrode 1156 on the second surface 1132 during the testing phase of the laser module 10, reducing testing difficulty and cost.

[0052] Furthermore, combined Figure 4 , Figure 7 , Figure 8 and Figure 9As shown, the rigid board portion 113 has a first through hole 1133 and a second through hole 1134 penetrating the rigid board portion 113. The circuit carrier board 11 also includes a first conductive layer 1135 disposed on the inner wall surface of the first through hole 1133 and a second conductive layer (not shown) disposed on the inner wall surface of the second through hole 1134. The first conductive layer 1135 is electrically connected to the second positive electrode 1155 and the test positive electrode 1157 on the first surface 1131 and the second surface 1132. The first conductive layer 1135 is also electrically connected to the flexible conductive layer 1122 in the flexible board layer 112 on the inner wall surface of the first through hole 1133, thereby making the second positive electrode 1155 electrically connected to the first positive electrode 1151. The second conductive layer is electrically connected to the patch structure 1154 and the second negative electrode 1156 on the first surface 1131 and the second surface 1132. The second conductive layer is also electrically connected to the flexible conductive layer 1122 in the flexible plate layer 112 on the inner wall of the second through hole 1134, thereby making the patch structure 1154, the second negative electrode 1156 and the first negative electrode 1152 electrically connected. The first through hole 1133 and the second through hole 1134 are provided in the rigid plate portion 113, and the electrical connection between each electrode is realized through the first conductive layer 1135 and the second conductive layer on the inner wall of the first through hole 1133 and the second through hole 1134. This helps to simplify the circuit structure of the circuit carrier 11, reduce the size of the circuit carrier 11, and also helps to improve the heat dissipation efficiency of the circuit carrier 11 through the setting of the through holes.

[0053] In some embodiments, the circuit board 11 further includes a heat dissipation structure 1136 filling the first through hole 1133 and the second through hole 1134. The material of the heat dissipation structure 1136 includes, but is not limited to, any suitable insulating and thermally conductive material such as epoxy resin, silicone, and graphite, so as to further improve the heat dissipation efficiency of the circuit board 11.

[0054] Combination Figure 4 , Figure 5 and Figure 6 As shown, in some embodiments, the solder resist layer 1153 on the surface of the rigid board portion 113 can bypass conductive structures such as the patch structure 1154, the second positive electrode 1155, the second negative electrode 1156, and the test electrode. The solder resist layer 1153 covers the portions of the first surface 1131 and the second surface 1132 other than the patch structure 1154, the second positive electrode 1155, the second negative electrode 1156, and the test positive electrode 1157, so as to improve the performance reliability of the circuit carrier 11 without affecting the electrical connection performance of the circuit carrier 11.

[0055] In some embodiments, the circuit board 11 further includes electroplated caps covering the two opposite end faces of the heat dissipation structure 1136. The electroplated caps seal the first through hole 1133 and the second through hole 1134, and are flush with the surface of the patch structure 1154, the second positive electrode 1155, the second negative electrode 1156, or the test positive electrode 1157 facing away from the rigid board portion 113. This improves the surface flatness of the circuit board 11, which is beneficial for the circuit board 11 to better fulfill its load-bearing and electrical connection functions. It also improves the internal sealing performance of the circuit board 11 and enhances performance stability. The material of the electroplated cap is, but is not limited to, copper. It is understood that one or more of the patch structure 1154, the second positive electrode 1155, the second negative electrode 1156, the test positive electrode 1157, and the electroplated cap can be formed by the same electroplated copper layer. For example, after the heat dissipation structure 1136 is filled into the first through hole 1133 and the second through hole 1134, the electroplated conductive layer 1113 of the rigid board layer 111 is formed by the electroplated copper layer. After the solder mask layer 1153 is set, the part of the electroplated conductive layer 1113 exposed in the solder mask layer 1153 forms different electrode or cap structures, which helps to simplify the preparation process of the circuit board 11 and reduce the preparation cost.

[0056] The number and arrangement order of the first through hole 1133 and the second through hole 1134 are not limited, refer to Figures 7-9 As shown, in some embodiments, the first through-hole 1133 and the second through-hole 1134 are each provided with multiple spaced-apart ones. The first conductive layer 1135 and the second conductive layer disposed in the first through-hole 1133 and the second through-hole 1134 can directly contact and conduct with the corresponding electrodes on the first surface 1131 and the second surface 1132, or they can be electrically connected to the corresponding electrodes through the circuit layer. Providing multiple first through-holes 1133 and second through-holes 1134 can improve the reliability of the electrical connection performance of the circuit board 11, and at the same time further improve the heat dissipation efficiency of the circuit board 11.

[0057] Please see again. Figure 5 In some embodiments, the circuit board 11 further includes a positioning mark 1137 disposed on the first surface 1131. The positioning mark 1137 is disposed adjacent to the laser chip 12 and is used to provide a positioning reference for the placement operation of the laser chip 12 on the patch structure 1154 and the assembly operation of the lens assembly 13 on the circuit board 11, thereby improving positioning accuracy and efficiency. The positioning mark 1137 includes, but is not limited to, any applicable shape such as a circle, or a marker point, as long as it can serve as a positioning reference. Figure 5In the illustrated embodiment, the positioning mark 1137 is exemplified by two spaced-apart circles. The positioning mark 1137 can be formed by exposing a portion of the copper conductive layer to adapt to the structure of the circuit board 11 and simplify the manufacturing process of the positioning mark 1137. Of course, the positioning mark 1137 can also be formed by any applicable structure additionally provided on the circuit board 11.

[0058] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A laser module, characterized in that, include: A circuit board includes a rigid board layer and a flexible board layer. A portion of the flexible board layer is stacked with the rigid board layer to form the rigid board portion of the circuit board. A portion of the flexible board layer is located outside the rigid board layer to form the flexible board portion of the circuit board. The flexible board portion is provided with a first electrode for electrical connection with external components. A laser chip is disposed on the rigid plate portion and electrically connected to the first electrode through the rigid plate portion and the flexible plate portion; and, A lens assembly is disposed on the rigid plate portion and corresponds to the laser chip.

2. The laser module according to claim 1, characterized in that, The lens assembly includes a sleeve, a collimating lens, and a diffuser lens. The laser module also includes an adhesive structure. The sleeve is bonded to the rigid plate portion through the adhesive structure and is arranged around the laser chip. The collimating lens and the diffuser lens are disposed inside the sleeve and are arranged opposite to the laser chip.

3. The laser module according to claim 2, characterized in that, The adhesive structure is disposed on the surface of the rigid plate portion on which the laser chip is disposed, and is disposed around the laser chip. The radial dimension of the sleeve is smaller than the radial dimension of the rigid plate portion on the sleeve. The end face of the sleeve facing the rigid plate portion is bonded to the adhesive structure. The orthographic projection of the lens assembly on the rigid plate portion falls into the rigid plate portion.

4. The laser module according to claim 1, characterized in that, The flexible board layer includes a flexible cover layer, a flexible conductive layer, a flexible insulating layer, a flexible conductive layer, and a flexible cover layer stacked sequentially. The circuit board includes two rigid board layers, which are stacked on the two flexible cover layers respectively. In the direction from the flexible board layer to the rigid board layer, the rigid board layer includes a rigid insulating layer and a rigid conductive layer stacked sequentially.

5. The laser module according to claim 4, characterized in that, The rigid plate layer further includes an electroplated conductive layer disposed on the rigid conductive layer facing away from the flexible plate layer; and / or, The circuit board also includes a solder resist layer stacked on the side of the rigid board layer facing away from the flexible board layer.

6. The laser module according to claim 4, characterized in that, The rigid insulation layer includes an epoxy fiberglass cloth laminate, a bismaleimide-triazine resin board, or a metal-based reinforcing board, and the flexible insulation layer is made of polyimide or polyester.

7. The laser module according to any one of claims 1-6, characterized in that, The first electrode includes a first positive electrode and a first negative electrode. The rigid plate portion has a first surface and a second surface disposed opposite to each other. The circuit board also includes a patch structure and a second positive electrode disposed on the first surface, and a second negative electrode and a test positive electrode disposed on the second surface. The laser chip is disposed on the patch structure. The patch structure, the second positive electrode, the test positive electrode and the first positive electrode are electrically connected to each other. The patch structure, the second negative electrode and the first negative electrode are electrically connected to each other.

8. The laser module according to claim 7, characterized in that, The rigid board portion is provided with a first through hole and a second through hole that penetrate the rigid board portion. The circuit board further includes a first conductive layer disposed on the inner wall surface of the first through hole and a second conductive layer disposed on the inner wall surface of the second through hole. The first conductive layer is electrically connected to the second positive electrode and the test positive electrode on the first surface and the second surface, and the second conductive layer is electrically connected to the patch structure and the second negative electrode on the first surface and the second surface.

9. The laser module according to claim 8, characterized in that, The circuit board also includes a heat dissipation structure filling the first through hole and the second through hole.

10. The laser module according to claim 9, characterized in that, The circuit board further includes a solder resist layer disposed on the rigid board portion. The solder resist layer covers the portions of the first surface and the second surface corresponding to the patch structure, the second positive electrode, the second negative electrode, and the test positive electrode. The circuit board further includes electroplated caps covering the two end faces opposite to the heat dissipation structure. The electroplated caps seal the first through hole and the second through hole and are flush with the surfaces of the patch structure, the second positive electrode, the second negative electrode, and the test positive electrode facing away from the rigid board portion.

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