Photovoltaic bypass module and junction box

Abstract

The utility model discloses a photovoltaic bypass module and a junction box, comprising a first conductor used for bearing a chip and a second conductor located at one side of the first conductor, and an insulation gap is arranged between the first conductor and the second conductor; the chip is arranged on the first conductor, one end of the metal interconnection sheet is connected with the chip, and the other end of the metal interconnection sheet is connected with the second conductor; the structure further comprises a packaging body, the packaging body is arranged outside the chip and the metal interconnection piece, so that the chip and the metal interconnection piece are packaged in the packaging body, and in the structure, the first bus bar penetrating hole and the second bus bar penetrating hole are formed in the upper side or the lower side of the extension line of the packaging body in the X-axis direction; therefore, the chip can be far away from the bus bar connecting area, heat dissipation of the chip can be accelerated, and heat dissipation uniformity is improved.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic modules, and in particular to a photovoltaic bypass module and junction box. Background Technology

[0002] A photovoltaic bypass module is an important component of a photovoltaic module, primarily used to improve the reliability and efficiency of the photovoltaic system. When a cell in a photovoltaic string experiences current mismatch due to shading, damage, or performance degradation, the bypass module provides a low-resistance bypass path for that cell, allowing current to flow around the faulty cell. This reduces hot spot effects, protects other normally functioning cells from damage, and maintains the overall power generation efficiency of the photovoltaic module.

[0003] These modules typically contain one or more bypass protection modules, designed to conduct under specific conditions to bypass affected battery cells. In recent years, with technological advancements, the design of bypass modules has increasingly focused on heat dissipation performance and miniaturization to meet the application requirements of high-power photovoltaic modules.

[0004] At present, the structure of the conductors is mostly as disclosed in CN213212157U. The two conductors of the bypass protection module are rectangular, and the busbar perforation is opened on both sides of the package. When the photovoltaic bypass module is working, the chip inside the package will generate a lot of heat. This heat will be dissipated through the two conductors. The busbar perforation is very close to the chip, and the heat is very high here. However, there is no conductive material here, so the heat will bypass the busbar perforation and diffuse from the side, resulting in slow heat dissipation and easy chip burnout. Utility Model Content

[0005] The technical problem solved by this utility model is to provide a photovoltaic bypass module that can accelerate heat dissipation.

[0006] The technical solution adopted by this utility model to solve its technical problem is: a photovoltaic bypass module, including a first conductor for carrying a chip and a second conductor located on one side of the first conductor, with an insulating gap provided between the first conductor and the second conductor; it also includes a chip and a metal interconnect piece, the chip being disposed on the first conductor, one end of the metal interconnect piece being connected to the chip, and the other end of the metal interconnect piece being connected to the second conductor; it also includes a package, the package being disposed outside the chip and the metal interconnect piece, so that the chip and the metal interconnect piece are encapsulated in the package.

[0007] It also includes a first busbar through-hole and a second busbar through-hole, which are located on the upper or lower side of the package body along the extension line of the X-axis direction.

[0008] Furthermore, the first conductor has a first protrusion on the side facing the second conductor, and the second conductor has a second protrusion on the side facing the first conductor, such that the first conductor and the first protrusion together form a first L-shaped structure, and the second conductor and the second protrusion together form a second L-shaped structure. The first protrusion and the second protrusion are respectively disposed on the same side of the first conductor and the second conductor, and an insulating gap is provided between the first protrusion and the second protrusion.

[0009] The chip is disposed on the first protrusion, one end of the metal interconnect is connected to the chip, and the other end of the metal interconnect is connected to the second protrusion.

[0010] Furthermore, a first groove is formed between the first conductor, the package body, and the second conductor for the busbar to pass through. The first groove is a through hole for the first busbar and a through hole for the second busbar. The busbar includes a first busbar and a second busbar. The first busbar and the second busbar pass through the first groove and are electrically connected to the first conductor and the second conductor, respectively.

[0011] Furthermore, the first conductor includes a first main body portion, on which a first through hole is formed for the busbar to pass through. The second conductor includes a second main body portion, on which a second through hole is formed for the busbar to pass through. The first through hole is the first busbar through hole, and the second through hole is the second busbar through hole. The busbar includes a first busbar and a second busbar. The first busbar and the second busbar pass through the first through hole and the second through hole, respectively, and are electrically connected to the first conductor and the second conductor.

[0012] Furthermore, the area of ​​the first protrusion is larger than the area of ​​the second protrusion.

[0013] Furthermore, anti-pull-out structures are provided on both sides of the first and second conductors, and the anti-pull-out structures include groove structures capable of accommodating encapsulation materials.

[0014] Furthermore, a bump is provided below one end of the metal interconnect sheet, and the bump abuts against the upper surface of the chip. The end of the metal interconnect sheet closer to the first bump is the first end, and the end of the metal interconnect sheet farther from the first bump is the second end. The first end is connected to the chip 3, and the second end is electrically connected to the second conductor. The first end and the second end are connected by an arc-shaped bend.

[0015] Furthermore, a first waterproof groove is provided on at least one surface of the upper or lower surface of the first conductor, and the first waterproof groove is located on the outside of the metal interconnect sheet;

[0016] A second waterproof groove is provided on at least one surface of the upper or lower surface of the second conductor, and the second waterproof groove is located on the outside of the metal interconnect sheet;

[0017] The first and second waterproof grooves are located inside the package.

[0018] The present invention also discloses a junction box including the photovoltaic bypass module described above, including a box body, a top cover provided on the box body, the box body and the top cover forming an accommodating space, the photovoltaic bypass module being disposed in the accommodating space, a first through hole for the busbar to pass through the bottom of the box body, the first busbar and the second busbar passing through the first through hole and the first groove to connect with the first conductor and the second conductor.

[0019] Furthermore, the second groove is provided with first guide portions on both sides, which extend obliquely along the bottom outer surface towards the receiving space, and the spacing between the first guide portions gradually decreases from the bottom surface of the box to the receiving space.

[0020] The present invention also discloses a junction box, including the photovoltaic bypass module described above, including a box body, a top cover provided on the box body, the box body and the top cover forming an accommodating space, the photovoltaic bypass module being disposed in the accommodating space, and a second through hole and a third through hole provided at the bottom of the box body for the busbar to pass through, such that the first busbar passes through the second through hole and the first through hole in sequence to connect with the first conductor, and the second busbar passes through the third through hole and the second through hole in sequence to connect with the second conductor;

[0021] The second and third through holes are respectively provided with a second guide portion and a third guide portion extending obliquely along the bottom outer surface towards the receiving space. The distance between the second guide portion and the third guide portion gradually decreases from the bottom surface of the box to the receiving space.

[0022] The beneficial effects of this utility model are:

[0023] 1. In this structure, by setting the first busbar through-hole and the second busbar through-hole at the upper or lower side of the extension line along the X-axis of the package, the chip can be moved away from the busbar connection area, thereby accelerating the heat dissipation of the chip and improving the uniformity of heat dissipation.

[0024] 2. In this structure, by offsetting the first protrusion and the second protrusion, the chip is moved away from the busbar connection area, which can accelerate the heat dissipation of the chip and improve the uniformity of heat dissipation.

[0025] 3. In this structure, the first groove allows the first busbar and the second busbar to pass directly through the first groove and connect to the first conductor and the second conductor, thereby reducing the need for perforations.

[0026] 4. The anti-drag structure in this structure can increase the bonding area at the connection between the first conductor, the second conductor and the encapsulation structure, thereby improving the connection strength.

[0027] 5. The first and second waterproof grooves in this structure can block water vapor, thereby extending the time that water vapor comes into contact with the chip. Attached Figure Description

[0028] Figure 1 This is an exploded view of a photovoltaic bypass module according to an embodiment of this application.

[0029] Figure 2 This is a schematic diagram of the internal structure of a photovoltaic bypass module according to an embodiment of this application.

[0030] Figure 3 This is a schematic diagram of the structure of a photovoltaic bypass module according to an embodiment of this application.

[0031] Figure 4 This is a schematic diagram of the structure of the metal interconnect sheet of a photovoltaic bypass module according to an embodiment of this application.

[0032] Figure 5 This is an exploded view of the photovoltaic bypass module according to the second embodiment of this application.

[0033] Figure 6 This is a schematic diagram of the structure of a junction box according to an embodiment of this application.

[0034] Figure 7 This is a schematic diagram of the bottom structure of a junction box according to an embodiment of this application.

[0035] Figure 8 This is a schematic diagram of the structure of a junction box according to a second embodiment of this application.

[0036] Figure 9 This is a schematic diagram of the bottom structure of a junction box according to a second embodiment of this application.

[0037] The components in the diagram are labeled as follows: First conductor 1, First protrusion 11, First main body 12, First through hole 121, First serrated structure 13, First waterproof groove 14, Second conductor 2, Second protrusion 21, Second main body 22, Second through hole 221, Second serrated structure 23, Second waterproof groove 24, Chip 3, Metal interconnect sheet 4, Bump 41, First end 4a, Second end 4b, Arc-shaped bend 42, Package 5, First groove 6, First busbar 71, Second busbar 72, Box 10, Top cover 20, Accommodation space 30, First through hole 101, First guide 102, Second guide 103, Third guide 104, Second through hole 105, Third through hole 106. Detailed Implementation

[0038] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0039] like Figures 1 to 3 As shown, an embodiment of this application discloses a photovoltaic bypass module, including a first conductor 1 for carrying a chip 3 and a second conductor 2 located on one side of the first conductor 1, with an insulating gap between the first conductor 1 and the second conductor 2; it also includes a chip 3 and a metal interconnect 4, the chip 3 being disposed on the first conductor 1, one end of the metal interconnect 4 being connected to the chip 3, and the other end of the metal interconnect 4 being connected to the second conductor 2; it also includes a package 5, the package 5 being disposed outside the chip 3 and the metal interconnect 4, such that the chip 3 and the metal interconnect 4 are encapsulated in the package 5.

[0040] It also includes a first busbar perforation and a second busbar perforation, which are located on the upper or lower side of the extension line of the package body 5 along the X-axis direction.

[0041] Specifically, when chip 3 dissipates heat during use, the heat can be directly dissipated from the first conductor 1 and the location of the first conductor 1 on the X-axis extension line of the package 5, without needing to bypass the busbar. Therefore, in this structure, by offsetting the first busbar through-hole and the second busbar through-hole, chip 3 is moved away from the busbar connection area, thereby accelerating the heat dissipation of chip 3 and improving the uniformity of heat dissipation.

[0042] An embodiment of this application discloses a photovoltaic bypass module, including a first conductor 1 for carrying a chip 3 and a second conductor 2 located on one side of the first conductor 1. The first conductor 1 is provided with a first protrusion 11 on the side facing the second conductor 2, and the second conductor 2 is provided with a second protrusion 21 on the side facing the first conductor 1, such that the first conductor 1 and the first protrusion 11 together form a first L-shaped structure, and the second conductor 2 and the second protrusion 21 together form a second L-shaped structure. The first protrusion 11 and the second protrusion 21 are respectively provided on the same side of the first conductor 1 and the second conductor 2, and an insulating gap is provided between the first protrusion 11 and the second protrusion 21.

[0043] The chip 3 is disposed on the first protrusion 11, one end of the metal interconnect 4 is connected to the chip 3, and the other end of the metal interconnect 4 is connected to the second protrusion 21;

[0044] It should be explained that the first L-shaped structure and the second L-shaped structure mentioned above can be... and The state can also be and Even if the chip 3 and the busbar are not on the same horizontal line, when the chip 3 dissipates heat during use, the heat can be directly dissipated from the conductors at the positions of the first protrusion 11 and the second protrusion 21, without having to bypass the busbar. Therefore, by biasing the first protrusion 11 and the second protrusion 21 in this structure, the chip 3 is moved away from the busbar connection area, thereby accelerating the heat dissipation of the chip 3 and improving the uniformity of heat dissipation.

[0045] In this embodiment, as Figure 1 As shown, a first groove 6 is formed between the first conductor 1, the package 5, and the second conductor 2 for the busbar to pass through. The first groove 6 is a through hole for the first busbar and a through hole for the second busbar. The busbar includes a first busbar 71 and a second busbar 72. The first busbar 71 and the second busbar 72 pass through the first groove 6 and are electrically connected to the first conductor 1 and the second conductor 2, respectively.

[0046] Specifically, due to the setting of the first groove 6 in this structure, the first bus 71 and the second bus 72 can directly pass through the first groove 6 to connect with the first conductor 1 and the second conductor 2, so that there is no need to set additional through holes, thereby reducing the process of through holes on the first conductor 1 and the second conductor 2, and also reducing the obstruction effect on heat dissipation of the chip 3.

[0047] Specifically, there are also the following embodiments, such as Figure 5 As shown, the first conductor 1 includes a first main body portion, on which a first through hole 121 for the busbar to pass through is provided. The second conductor 2 includes a second main body portion 22, on which a second through hole 221 for the busbar to pass through is provided. The first through hole 121 is the through hole for the first busbar, and the second through hole 221 is the through hole for the second busbar. The busbar includes a first busbar 71 and a second busbar 72. The first busbar 71 and the second busbar 72 pass through the first through hole 121 and the second through hole 221 respectively and are electrically connected to the first conductor 1 and the second conductor 2.

[0048] In the above structure, the first through hole 121 and the second through hole 221 can be used to position the first busbar 71 and the second busbar 72, and at the same time reduce the obstruction of heat dissipation of chip 3.

[0049] In this embodiment, the area of ​​the first protrusion 11 is larger than the area of ​​the second protrusion 21.

[0050] The above structure allows the first conductor 1, where chip 3 is located, to have a larger area, thereby enabling faster heat dissipation when chip 3 generates heat.

[0051] In this embodiment, as Figure 1 and Figure 2 As shown, the first conductor 1 and the second conductor 2 are provided with anti-pull-out structures on both sides, and the anti-pull-out structure includes a groove structure that can accommodate the encapsulation material.

[0052] Specifically, the anti-pull-out structure can be provided on the first conductor 1, or only on the second conductor 2. Preferably, the first conductor 1 and the second conductor 2 are provided with anti-pull-out structures on both sides. The anti-pull-out structure can be a first serrated structure 13, which is provided on both sides of the first protrusion 11. The anti-pull-out structure can be a second serrated structure 23, which is provided on both sides of the second protrusion 21.

[0053] The anti-drag structure in this structure can increase the bonding area at the connection between the first conductor 1, the second conductor 2 and the encapsulation structure, thereby improving the connection strength.

[0054] In this embodiment, as Figure 4 As shown, a bump 41 is provided below one end of the metal interconnect 4. The bump 41 abuts against the upper surface of the chip 3. The end of the metal interconnect 4 near the first bump 41 is the first end 4a, and the end of the metal interconnect 4 away from the first bump 41 is the second end 4b. The first end 4a is connected to the chip 3, and the second end 4b is electrically connected to the second conductor 2. The first end 4a and the second end 4b are connected by an arc-shaped bend 42.

[0055] Specifically, the first end 4a and the second end 4b in this structure are connected by an arc-shaped bend 42, so that the first end 4a can be higher than the second end 4b. That is, the position where the first end 4a is higher than the second end 4b can be used to accommodate the chip 3, so that the first end 4a and the second end 4b can be horizontal, thereby making the connection between the first end 4a and the second end 4b and the first conductor 1 and the second conductor 2 more stable and firm.

[0056] In this embodiment, as Figure 2 As shown, a first waterproof groove 14 is provided on at least one surface of the upper or lower surface of the first conductor 1. The first waterproof groove 14 is located on the outer side of the metal interconnect sheet 4, or / and...

[0057] A second waterproof groove 24 is provided on at least one of the upper or lower surfaces of the second conductor 2, and the second waterproof groove 24 is located outside the metal interconnect sheet 4; the first waterproof groove 14 and the second waterproof groove 24 are located inside the package 5.

[0058] In this structure, when water vapor is immersed in the package 5, the water vapor will sink and flow into the first waterproof groove 14 or the second waterproof groove 24 through the setting of the first waterproof groove 14 or the second waterproof groove 24, thereby blocking the water vapor and preventing the water vapor from entering the chip 3 and damaging the chip 3.

[0059] The present invention also discloses a junction box, such as Figure 6 and Figure 7 As shown, the first embodiment includes the photovoltaic bypass module described above, and also includes a housing 10. The housing 10 is provided with a top cover 20. The housing 10 and the top cover 20 form a receiving space 30. The photovoltaic bypass module is disposed in the receiving space 30. The bottom of the housing 10 is provided with a first through hole 101 for the busbar to pass through. The first busbar 71 and the second busbar 72 pass through the first through hole 101 and the first groove 6 and are connected to the first conductor 1 and the second conductor 2.

[0060] In this structure, the first through hole 101 and the first groove 6 cooperate to facilitate the connection of the first busbar 71 and the second busbar 72 with the first conductor 1 and the second conductor 2.

[0061] Meanwhile, the second groove is provided with first guide portions 102 extending obliquely along the bottom outer surface towards the receiving space 30 on both sides, and the spacing of the first guide portions 102 gradually decreases from the bottom surface of the box 10 to the receiving space 30.

[0062] The first guide portion 102 is provided so that when the first busbar 71 and the second busbar 72 are installed, the first guide portion 102 can play a guiding role, so that the first busbar 71 and the second busbar 72 can be smoothly inserted into the first through hole 101 without special alignment.

[0063] The present invention also discloses a junction box, such as Figure 8 and Figure 9 As shown, the second embodiment is: a junction box, including the photovoltaic bypass module described above, and also including a box body 10, the box body 10 is provided with a top cover 20, the box body 10 and the top cover 20 form an accommodating space 30, the photovoltaic bypass module is provided in the accommodating space 30, the bottom of the box body 10 is provided with a second through hole 105 and a third through hole 106 for the busbar to pass through, so that the first busbar 71 passes through the second through hole 105 and the first through hole 121 in sequence and is connected to the first conductor 1, and the second busbar 72 passes through the third through hole 106 and the second through hole 221 in sequence and is connected to the second conductor 2;

[0064] The second through hole 105 and the third through hole 106 are respectively provided with a second guide portion 103 and a third guide portion 104 extending obliquely along the bottom outer surface towards the receiving space 30. The distance between the second guide portion 103 and the third guide portion 104 gradually decreases from the bottom surface of the box 10 towards the receiving space 30.

[0065] In this structure, the second through hole 105 cooperates with the first through hole 121, and the third through hole 106 cooperates with the second through hole 221, so that the first busbar 71 and the second busbar 72 can be easily connected to the first conductor 1 and the second conductor 2. At the same time, the second guide part 103 and the third guide part 104 can play a guiding role when installing the first busbar 71 and the second busbar 72, so that the first busbar 71 and the second busbar 72 can be smoothly inserted into the second through hole 105 and the third through hole 106 without special alignment.

[0066] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above descriptions are merely specific embodiments of this utility model and are not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A photovoltaic bypass module, characterized in that: The device includes a first conductor (1) for carrying the chip (3) and a second conductor (2) located on one side of the first conductor (1), with an insulating gap between the first conductor (1) and the second conductor (2); it also includes the chip (3) and a metal interconnect (4), the chip (3) being disposed on the first conductor (1), one end of the metal interconnect (4) being connected to the chip (3), and the other end of the metal interconnect (4) being connected to the second conductor (2); it also includes a package (5), the package (5) being disposed outside the chip (3) and the metal interconnect (4), such that the chip (3) and the metal interconnect (4) are encapsulated in the package (5); It also includes a first busbar perforation and a second busbar perforation, which are located on the upper or lower side of the package body (5) along the X-axis extension line.

2. The photovoltaic bypass module as described in claim 1, characterized in that: The first conductor (1) is provided with a first protrusion (11) on the side facing the second conductor (2), and the second conductor (2) is provided with a second protrusion (21) on the side facing the first conductor (1), so that the first conductor (1) and the first protrusion (11) together form a first L-shaped structure, and the second conductor (2) and the second protrusion (21) together form a second L-shaped structure. The first protrusion (11) and the second protrusion (21) are respectively provided on the same side of the first conductor (1) and the second conductor (2), and an insulating gap is provided between the first protrusion (11) and the second protrusion (21). The chip (3) is disposed on the first protrusion (11), one end of the metal interconnect (4) is connected to the chip (3), and the other end of the metal interconnect (4) is connected to the second protrusion (21).

3. The photovoltaic bypass module as described in claim 1, characterized in that: A first groove (6) for passing through a busbar is formed between the first conductor (1), the package (5), and the second conductor (2). The first groove (6) is a through hole for the first busbar and a through hole for the second busbar. The busbar includes a first busbar (71) and a second busbar (72). The first busbar (71) and the second busbar (72) pass through the first groove (6) and are electrically connected to the first conductor (1) and the second conductor (2) respectively.

4. The photovoltaic bypass module as described in claim 1, characterized in that: The first conductor (1) includes a first main body portion, on which a first through hole (121) for the busbar to pass through is provided. The second conductor (2) includes a second main body portion (22), on which a second through hole (221) for the busbar to pass through is provided. The first through hole (121) is the first busbar through hole, and the second through hole (221) is the second busbar through hole. The busbar includes a first busbar (71) and a second busbar (72). The first busbar (71) and the second busbar (72) pass through the first through hole (121) and the second through hole (221) respectively and are electrically connected to the first conductor (1) and the second conductor (2).

5. The photovoltaic bypass module as described in claim 1, characterized in that: The first conductor (1) and the second conductor (2) are provided with anti-pull-out structures on both sides, and the anti-pull-out structures include groove structures that can accommodate encapsulation materials.

6. The photovoltaic bypass module as described in claim 1, characterized in that: A bump (41) is provided below one end of the metal interconnect sheet (4). The bump (41) abuts against the upper surface of the chip (3). The end of the metal interconnect sheet (4) closer to the first bump (41) is the first end (4a), and the end of the metal interconnect sheet (4) away from the first bump (41) is the second end (4b). The first end (4a) is connected to the chip (3), and the second end (4b) is electrically connected to the second conductor (2). The first end (4a) and the second end (4b) are connected by an arc-shaped bend (42).

7. The photovoltaic bypass module as described in claim 1, characterized in that: A first waterproof groove (14) is provided on at least one surface of the upper or lower surface of the first conductor (1), and the first waterproof groove (14) is located on the outside of the metal interconnect sheet (4). A second waterproof groove (24) is provided on at least one surface of the upper or lower surface of the second conductor (2), and the second waterproof groove (24) is located on the outside of the metal interconnect sheet (4); The first waterproof groove (14) and the second waterproof groove (24) are located inside the encapsulation body (5).

8. A junction box comprising a photovoltaic bypass module as described in any one of claims 1 to 7, characterized in that: The device includes a housing (10), on which a top cover (20) is provided. The housing (10) and the top cover (20) form a receiving space (30). The photovoltaic bypass module is provided in the receiving space (30). The bottom of the housing (10) is provided with a first through hole (101) for the busbar to pass through. The first busbar (71) and the second busbar (72) pass through the first through hole (101) and the first groove (6) and are connected to the first conductor (1) and the second conductor (2).

9. The junction box as described in claim 8, characterized in that: The first groove is provided with a first guide portion (102) on both sides, which extends obliquely along the bottom outer surface towards the receiving space (30). The spacing of the first guide portions (102) gradually decreases from the bottom surface of the box (10) to the receiving space (30).

10. A junction box comprising the photovoltaic bypass module according to any one of claims 1 to 7, characterized in that: The device includes a housing (10), on which a top cover (20) is provided. The housing (10) and the top cover (20) form a receiving space (30). The photovoltaic bypass module is provided in the receiving space (30). The bottom of the housing (10) is provided with a second through hole (105) and a third through hole (106) for the busbar to pass through, so that the first busbar (71) passes through the second through hole (105) and the first through hole (121) in sequence and is connected to the first conductor (1). The second busbar (72) passes through the third through hole (106) and the second through hole (221) in sequence and is connected to the second conductor (2). The second through hole (105) and the third through hole (106) are respectively provided with a second guide part (103) and a third guide part (104) extending obliquely along the bottom outer surface towards the receiving space (30). The distance between the second guide part (103) and the third guide part (104) gradually decreases from the bottom surface of the box (10) to the receiving space (30).

Images