Microphone and electronic device
By setting a separator in the microphone to divide the mounting cavity into independent chambers, and placing the speaker and pickup module separately, the problem of the microphone taking up a large amount of space is solved, and the effect of reducing size and feedback is achieved.
Patent Information
- Application Number
- CN202422851890.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-11-21
AI Technical Summary
Existing feedback active noise-canceling microphones occupy a large space, making it difficult to effectively reduce their size.
The speaker module, pickup module, and signal processing module are all housed in a single mounting cavity, which is then divided into a first cavity and a second cavity by a partition. The speaker and pickup module are located in different cavities, making full use of the space and reducing feedback.
It effectively reduces the size of the microphone, while also reducing speaker feedback, improving space utilization and noise reduction.
Smart Images
Figure CN223502994U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of MEMS microphone technology, and in particular to a microphone and electronic device. Background Technology
[0002] Currently, mainstream active noise cancellation technologies can be broadly categorized into three types based on the placement of the microphone: feedforward active noise cancellation, feedback active noise cancellation, and hybrid active noise cancellation. Feedback active noise cancellation typically places the microphone inside the earphone, as close as possible to the speaker. The microphone picks up internal noise, and the captured noise signal is transmitted to a digital signal processor (DSP). The DSP analyzes and processes these signals, generating a sound wave signal with the opposite phase to the noise—an inverse sound wave. This inverse sound wave signal is then sent to the earphone's speaker, which emits these inverse sound waves. These inverse sound waves superimpose with the noise inside the ear, and because they are out of phase, they cancel each other out, reducing or eliminating the audible noise. However, existing feedback active noise cancellation microphones occupy a relatively large space. Utility Model Content
[0003] The main purpose of this invention is to propose a microphone and electronic device that aims to solve the problem of how to reduce the space occupied by the microphone.
[0004] To achieve the above objectives, the microphone proposed in this utility model includes:
[0005] substrate;
[0006] A housing, wherein the housing is disposed on one side of the substrate and forms a mounting cavity with the substrate;
[0007] A separator is disposed within the housing and used to divide the mounting cavity into a first cavity and a second cavity that are independent of each other. The housing has a sound hole that communicates with the first cavity, and the substrate has a pickup hole that communicates with the second cavity.
[0008] A speaker module, wherein the speaker module is located in the first cavity;
[0009] The pickup module is located in the second cavity;
[0010] The signal processing module, the speaker module, the pickup module and the signal processing module are all disposed on the substrate, and the speaker module and the pickup module are communicatively connected to the signal processing module.
[0011] In one embodiment, the signal processing module is located in the second cavity.
[0012] In one embodiment, the first cavity and the second cavity are arranged along a first direction, and the signal processing module and the pickup module are arranged at intervals along a second direction to form a gap. The gap is positioned on the side facing the first cavity toward the speaker module, and the first direction is perpendicular to the second direction.
[0013] In one embodiment, the separator has a clearance hole for avoiding the signal processing module, and the two parts of the signal processing module located outside the clearance hole are respectively located in the first cavity and the second cavity.
[0014] In one embodiment, the signal processing module is located in the first cavity.
[0015] In one embodiment, the pickup hole is positioned facing the pickup module.
[0016] In one embodiment, the number of sound holes is multiple, and the multiple sound holes are spaced apart from each other.
[0017] In one embodiment, the signal processing module includes an ASIC chip, and both the speaker module and the pickup module are communicatively connected to the ASIC chip.
[0018] In one embodiment, the signal processing module is electrically connected to the pickup module via a gold wire.
[0019] In one embodiment, the pickup module and the separator are spaced apart;
[0020] And / or, the pickup module is spaced apart from the housing;
[0021] And / or, the speaker module is spaced apart from the separator;
[0022] And / or, the speaker module is spaced apart from the housing.
[0023] This utility model also proposes an electronic device, which includes a housing and the microphone described above, with the substrate connected to the housing.
[0024] The technical solution of this utility model fully utilizes the space of the mounting cavity and effectively reduces the size of the microphone by placing the speaker module, the pickup module and the signal processing module inside the mounting cavity. The mounting cavity is divided into an independent first cavity and a second cavity by a separator, and the speaker module and the pickup module are respectively placed in the first cavity and the second cavity, thereby effectively reducing the phenomenon of speaker feedback. Attached Figure Description
[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0026] Figure 1 A schematic diagram of the structure of an embodiment of the microphone provided by this utility model;
[0027] Figure 2 for Figure 1 A schematic diagram of the microphone's left-side structure;
[0028] Figure 3 for Figure 1 A schematic diagram of the microphone's structure viewed from below;
[0029] Figure 4 A schematic diagram of another embodiment of the microphone provided by this utility model;
[0030] Figure 5 A schematic diagram of the structure of an embodiment of the separator provided by this utility model;
[0031] Figure 6 This is a schematic diagram of another embodiment of the microphone provided by this utility model.
[0032] Explanation of icon numbers:
[0033] 100. Microphone; 1. Substrate; 11. Sound pickup hole; 2. Housing; 21. Mounting cavity; 211. First cavity; 212. Second cavity; 22. Sound hole; 3. Separator; 31. Clearance hole; 4. Speaker module; 5. Sound pickup module; 6. Signal processing module; 7. Gold wire.
[0034] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0035] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.
[0036] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.
[0037] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.
[0038] Currently, mainstream active noise cancellation technologies can be broadly categorized into three types based on the placement of the microphone: feedforward active noise cancellation, feedback active noise cancellation, and hybrid active noise cancellation. Feedback active noise cancellation typically places the microphone inside the earphone, as close as possible to the speaker. The microphone picks up internal noise, and the captured noise signal is transmitted to a digital signal processor (DSP). The DSP analyzes and processes these signals, generating a sound wave signal with the opposite phase to the noise—an inverse sound wave. This inverse sound wave signal is then sent to the earphone's speaker, which emits these inverse sound waves. These inverse sound waves superimpose with the noise inside the ear, and because they are out of phase, they cancel each other out, reducing or eliminating the audible noise. However, existing feedback active noise cancellation microphones occupy a relatively large space.
[0039] The inventors discovered that existing microphone structures typically consist of two housings connected to a base plate to form two independent mounting cavities. The microphone and speaker are each housed in one of these cavities, resulting in a relatively large overall space requirement for the microphone.
[0040] In view of this, the present invention proposes a microphone and electronic device, aiming to solve the problem of how to reduce the space occupied by the microphone as a whole.
[0041] Please see Figures 1 to 3In one embodiment of this utility model, the microphone 100 includes a substrate 1, a housing 2, a separator 3, a speaker module 4, a pickup module 5, and a signal processing module 6. The housing 2 is disposed on one side of the substrate 1 and forms a mounting cavity 21 with the substrate 1. The separator 3 is disposed inside the housing 2 and is used to divide the mounting cavity 21 into a first cavity 211 and a second cavity 212 that are independent of each other. The housing 2 has a sound hole 22 that communicates with the first cavity 211, and the substrate 1 has a pickup hole 11 that communicates with the second cavity 212. The speaker module 4 is located in the first cavity 211. The pickup module 5 is located in the second cavity 212. The speaker module 4, the pickup module 5, and the signal processing module 6 are all disposed on the substrate 1, and the speaker module 4 and the pickup module 5 are all communicatively connected to the signal processing module 6.
[0042] Compared to existing configurations, this embodiment places the speaker module 4, the pickup module 5, and the signal processing module 6 all within a mounting cavity 21. This fully utilizes the space of the mounting cavity 21, improving its space utilization rate and effectively reducing the size of the microphone 100. Furthermore, this embodiment uses a separator 3 to divide the mounting cavity 21 into two independent cavities: a first cavity 211 and a second cavity 212. The speaker module 4 and the pickup module 5 are respectively located within the first cavity 211 and the second cavity 212. Although both the speaker module 4 and the pickup module 5 are located within the mounting cavity 21, they are situated in two separate cavities. This not only improves the space utilization rate of the mounting cavity 21 but also effectively reduces the possibility of feedback from the speaker module 4 if the speaker module 4 and the pickup module 5 are placed together. It should be noted that feedback, also known as acoustic feedback or howling, occurs when sound is captured by the pickup module 5, amplified and played back by the speaker module 4, and then captured again by the pickup module 5, forming a closed loop. If the gain (amplification factor) in this loop is high enough, it will produce a continuous, high-volume, piercing sound, i.e., a howling sound. It should also be noted that the speaker module 4 can be powered by an external power supply or by the baseboard 1 and signal processing module 6; this is not limited here. Furthermore, the pickup module 5 is used to pick up noise inside the ear. The noise signal captured by the pickup module 5 is transmitted to the signal processing module 6. The signal processing module 6 analyzes and processes these signals, generating a sound wave signal with the opposite phase to the noise, i.e., an anti-phase sound wave. The anti-phase sound wave signal calculated by the signal processing module 6 is then sent to the speaker module 4. The speaker module 4 plays these anti-phase sound waves. When the anti-phase sound waves emitted by the speaker module 4 meet the noise inside the ear, because they are out of phase, they cancel each other out after superposition, resulting in a reduction or disappearance of the noise heard by the user, thus achieving noise reduction.
[0043] In one embodiment, the signal processing module 6 is located in the second cavity 212. By placing the signal processing module 6 in the second cavity 212, it facilitates electrical connection between the signal processing module 6 and the pickup module 5. It should be noted that the signal processing module 6 can be connected to the pickup module 5 via a gold wire 7.
[0044] In one embodiment, the first cavity 211 and the second cavity 212 are arranged along a first direction, and the signal processing module 6 and the pickup module 5 are arranged at intervals along a second direction, forming a gap. The side of the gap facing the first cavity 211 is positioned towards the speaker module 4, and the first direction is perpendicular to the second direction. By placing the speaker module 4 on the rear side of the gap, the speaker module 4 can be positioned close to the pickup module 5. It should be noted that both the pickup module 5 and the speaker module 4 are positioned close to the separator 3 but at intervals from it. It should also be noted that the first direction is... Figure 1 The front and back directions are shown, and the second direction is... Figure 1 The left and right directions are shown.
[0045] Please see Figure 4 and Figure 5 In one embodiment, the separator 3 has a clearance hole 31 for avoiding the signal processing module 6. The two parts of the signal processing module 6 located outside the clearance hole 31 are located in the first cavity 211 and the second cavity 212, respectively. A part of the structure of the signal processing module 6 extends into the first cavity 211 through the clearance hole 31, so that both the first cavity 211 and the second cavity 212 have part of the structure of the signal processing module 6, thereby facilitating the connection between the speaker module 4 and the pickup module 5 and the signal processing module 6.
[0046] Please see Figure 6 In one embodiment, the signal processing module 6 is located in the first cavity 211. Placing the signal module in the first cavity 211 facilitates connection between the signal processing module 6 and the speaker module 4. It should be noted that the signal processing module 6 can be connected to the pickup module 5 via a gold wire, i.e., the gold wire 7 passes through the separator 3, with both ends of the gold wire 7 connected to the signal processing module 6 and the pickup module 5 respectively. The signal processing module 6 can also communicate with the pickup module 5 via the substrate 1.
[0047] Please see Figures 1 to 3 In one embodiment, the pickup hole 11 is positioned facing the pickup module 5. Positioning the pickup hole 11 towards the pickup module 5 facilitates the pickup module 5 in picking up noise signals.
[0048] In one embodiment, there are multiple sound holes 22, which are spaced apart from each other. By providing multiple sound holes 22, the diffusion of sound is improved and the focusing of sound is reduced, making the sound sound more natural and uniform.
[0049] In one embodiment, the signal processing module 6 includes an ASIC chip, and the speaker module 4 and the pickup module 5 are both communicatively connected to the ASIC chip. The ASIC chip internally contains a digital signal processor to process the noise signal picked up by the pickup module 5.
[0050] In one embodiment, the signal processing module 6 is electrically connected to the pickup module 5 via a gold wire 7. One end of the gold wire 7 is connected to the signal processing module 6, and the other end of the gold wire 7 is connected to the pickup module 5, thereby realizing the electrical connection between the two.
[0051] In one embodiment, the pickup module 5 is spaced apart from the separator 3, thereby reducing the occurrence of poor noise pickup performance of the pickup module 5 due to vibration of the separator 3.
[0052] In one embodiment, the pickup module 5 is spaced apart from the housing 2; thereby reducing the occurrence of poor noise pickup effect of the pickup module 5 due to vibration of the housing 2.
[0053] In one embodiment, the speaker module 4 and the separator 3 are spaced apart; thereby reducing the phenomenon that the vibration of the speaker causes the separator 3 to vibrate.
[0054] In one embodiment, the speaker module 4 is spaced apart from the housing 2. This reduces the occurrence of vibrations in the speaker causing the housing 2 to vibrate.
[0055] This utility model also proposes an electronic device, which includes a housing and the aforementioned microphone 100, with the substrate 1 connected to the housing. Since the electronic device employs all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated upon here. The electronic device can be a mobile phone or a headset.
[0056] The above are merely exemplary embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the technical concept of this utility model and the contents of the specification and drawings of this utility model, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.
Claims
1. A microphone, characterized in that, include: substrate; A housing, wherein the housing is disposed on one side of the substrate and forms a mounting cavity with the substrate; A separator is disposed within the housing and used to divide the mounting cavity into a first cavity and a second cavity that are independent of each other. The housing has a sound hole that communicates with the first cavity, and the substrate has a pickup hole that communicates with the second cavity. A speaker module, wherein the speaker module is located in the first cavity; The pickup module is located in the second cavity; The signal processing module, the speaker module, the pickup module and the signal processing module are all disposed on the substrate, and the speaker module and the pickup module are communicatively connected to the signal processing module.
2. The microphone as described in claim 1, characterized in that, The signal processing module is located in the second cavity.
3. The microphone as described in claim 2, characterized in that, The first cavity and the second cavity are arranged along a first direction, and the signal processing module and the pickup module are arranged at intervals along a second direction to form a gap. The side of the gap facing the first cavity is positioned towards the speaker module, and the first direction is perpendicular to the second direction.
4. The microphone as claimed in claim 1, characterized in that, The separator has a clearance hole for avoiding the signal processing module. The two parts of the signal processing module located outside the clearance hole are located in the first cavity and the second cavity, respectively.
5. The microphone as claimed in claim 1, characterized in that, The signal processing module is located in the first cavity.
6. The microphone as claimed in any one of claims 1 to 5, characterized in that, The pickup hole is positioned facing the pickup module.
7. The microphone as claimed in any one of claims 1 to 5, characterized in that, The number of sound holes is multiple, and the multiple sound holes are arranged at intervals between each other.
8. The microphone as claimed in any one of claims 1 to 5, characterized in that, The signal processing module includes an ASIC chip, and both the speaker module and the pickup module are communicatively connected to the ASIC chip.
9. The microphone as claimed in any one of claims 1 to 5, characterized in that, The signal processing module is electrically connected to the pickup module via a gold wire.
10. The microphone as claimed in any one of claims 1 to 5, characterized in that, The pickup module and the separator are spaced apart; And / or, the pickup module is spaced apart from the housing; And / or, the speaker module is spaced apart from the separator; And / or, the speaker module is spaced apart from the housing.
11. An electronic device, characterized in that, The electronic device includes a housing and a microphone as claimed in any one of claims 1 to 10, wherein the substrate is connected to the housing.