Miniature circuit board structure suitable for high-speed signal propagation

Abstract

The utility model discloses a miniature circuit board structure suitable for high-speed signal propagation. The miniature circuit board structure comprises a base, a heat dissipation assembly is arranged on the side wall of the bottom of the base, a plurality of control keys are welded to the side wall of the top of the base, a change-over switch is welded to the side wall of the top of the base, and a plurality of remote control board sockets are welded to the side wall of the top of the base. A plurality of power sources are welded to the side wall of the top of the base, a driving chip is welded to the side wall of the top of the base, the heat dissipation base, the fixing plate, the motor and the heat dissipation blades are arranged, the working temperature of the circuit board and electronic elements on the circuit board can be effectively reduced, the overheating phenomenon is prevented, the LED lamp works within the proper temperature range, and the service life of the LED lamp is prolonged. The performance of electronic components is more stable, the stable system environment is beneficial to stable transmission of high-speed signals, the signals are gradually attenuated in the high-frequency transmission process, and the heat dissipation design is beneficial to reducing the path loss of the signals and improving the transmission efficiency of the signals, so that the high-speed signals can be stably and reliably transmitted.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit technology, and more specifically, to a micro circuit board structure suitable for high-speed signal propagation. Background Technology

[0002] Micro-circuit boards, also known as micro-boards or high-density interconnect (HDI) boards, are small and precisely designed circuit boards used to connect various electronic components, such as integrated circuits, capacitors, and resistors.

[0003] With the rapid development of microelectronics technology and the increasing miniaturization of electronic devices, the market demand for micro-circuit boards continues to grow. Because micro-circuit boards typically employ a multi-layer design, complex electrical connections can be achieved by stacking layers with different functions. Therefore, they are widely used in miniaturized, high-performance electronic devices such as smartphones, tablets, wearable devices, and medical electronics.

[0004] Through long-term use and observation, it was found that when micro-circuit boards are connected and used, the heat generated by the circuit boards will accelerate the aging of electronic components on the micro-circuit boards and affect the overall performance of the circuit.

[0005] Therefore, this utility model provides a miniature circuit board structure suitable for high-speed signal propagation. Utility Model Content

[0006] To address the shortcomings of existing technologies, this invention provides a micro-circuit board structure suitable for high-speed signal propagation.

[0007] This utility model discloses a microcircuit board structure suitable for high-speed signal propagation, comprising a base, a heat dissipation component on the bottom sidewall of the base, multiple control buttons welded to the top sidewall of the base, a selector switch welded to the top sidewall of the base, multiple remote control sockets welded to the top sidewall of the base, multiple power supplies welded to the top sidewall of the base, a driver chip welded to the top sidewall of the base, multiple indicator lights welded to the top sidewall of the base, a microcontroller welded to the top sidewall of the base, multiple expansion interfaces welded to the top sidewall of the base, a dustproof component on the top sidewall of the heat dissipation component, a cleaning component on the bottom sidewall of the dustproof component, and an illumination component in the middle of the base sidewall. The thermal assembly includes a heat sink fixed to the bottom of a base. A fixing plate is fixed to the middle of the inner sidewall of the heat sink. Multiple motors are mounted on the middle of the sidewall of the fixing plate. Multiple heat dissipation blades are fixed to the output end of each motor. This step, by setting up the heat sink, fixing plate, motors, and heat dissipation blades, can effectively reduce the operating temperature of the circuit board and its electronic components, prevent overheating, and ensure that the electronic components operate within a suitable temperature range. This results in more stable performance of the electronic components. A stable system environment contributes to the stable transmission of high-speed signals. Furthermore, signals gradually attenuate during high-frequency transmission. The heat dissipation design helps reduce signal path loss and improve signal transmission efficiency, enabling stable and reliable transmission of high-speed signals.

[0008] Preferably, the dustproof component includes a heat sink plate installed between the base and the heat sink seat. Multiple sieve holes are formed in the middle of the side wall of the heat sink plate, and a pair of insert plates are fixedly connected to the middle of the side wall of the heat sink plate. A pair of grooves are formed in the middle of the side wall of the heat sink seat, with the grooves and insert plates corresponding to each other. This step, by setting up the heat sink plate, sieve holes, insert plates, and grooves, can prevent dust, fine particles, and other impurities from entering the circuit board. In an air-cooled heat dissipation system, the rotation of the heat sink blades generates airflow, causing dust and other impurities to enter the circuit board area with the airflow and deposit on the electronic components and circuit board. This design can effectively prevent these impurities from entering, protecting the circuit board and electronic components from dust damage.

[0009] Preferably, the cleaning component includes multiple springs arranged in a linear array on the inner wall of the heat sink. The other end of each spring is fixed to a wiping pad, which is located below the heat sink. Multiple elastic ropes are fixed to the middle of the side wall of the wiping pad. This step, by setting up the springs, wiping pad, and elastic ropes, can clean the heat sink, remove the dust accumulated on its surface, and allow for smooth airflow, thereby maintaining the heat dissipation efficiency of the air-cooled heat dissipation system.

[0010] Preferably, the lighting assembly includes a light strip fixed to the side wall of the base. This step, by setting the light strip, can improve the visibility of the work area, allowing workers to see the details on the circuit board more clearly, thereby completing the connection work more accurately.

[0011] Preferably, a guide plate is fixed to the middle of the side wall of the heat dissipation blade. The guide plate is located inside the heat dissipation base. This step can improve the airflow distribution and flow efficiency of the heat dissipation blade by setting the guide plate, which helps to improve the heat dissipation performance of the heat dissipation blade, so that it can more effectively reduce the temperature of the circuit board, reduce the aging of components caused by high temperature, extend the service life of the circuit board, and enable the long-term stable operation of the high-speed signal transmission system.

[0012] Preferably, the top side wall of the base is equipped with a handle, which is located above the light strip. This step, by setting a handle, allows the staff to easily move the circuit board, improving the convenience of operation during installation, debugging, or maintenance.

[0013] Preferably, all of the heat dissipation blades are made of metal. This step uses light steel as the heat dissipation blade material. Unlike PBT plastic, which has problems such as aging and creep, metal fan blades are much more rigid, more resistant to high temperatures, and more durable.

[0014] The beneficial effects of this application are as follows: by setting up a heat sink, a fixing plate, a motor and heat dissipation blades, the operating temperature of the circuit board and its electronic components can be effectively reduced, preventing overheating. The electronic components operate within a suitable temperature range, resulting in more stable performance. A stable system environment helps to ensure stable transmission of high-speed signals. Furthermore, since signals gradually attenuate during high-frequency transmission, the heat dissipation design helps to reduce signal path loss and improve signal transmission efficiency, enabling high-speed signals to be transmitted stably and reliably. Attached Figure Description

[0015] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0016] Figure 1 This is a perspective view of the present utility model;

[0017] Figure 2 This is a cross-sectional view of the heat sink in this utility model;

[0018] Figure 3 This is a schematic diagram of the cooperation structure between the heat sink and the heat sink blades in this utility model;

[0019] Figure 4This is a schematic diagram of the mating structure of the heat dissipation blades and the wiping pad in this utility model;

[0020] Figure 5 This is a schematic diagram of the cooperation structure between the motor and the heat dissipation blades in this utility model.

[0021] In the attached diagram: 1. Base; 11. Control button; 12. Changeover switch; 13. Remote control panel socket; 14. Power supply; 15. Driver chip; 16. Indicator light; 17. Microcontroller; 18. Expansion interface; 2. Heat sink; 21. Fixing plate; 22. Motor; 23. Heat dissipation blades; 3. Heat dissipation plate; 31. Screen hole; 32. Insert plate; 33. Groove; 4. Spring; 41. Wiping pad; 42. Elastic rope; 5. LED strip; 6. Air guide plate; 7. Handle. Detailed Implementation

[0022] The following drawings will disclose several embodiments of this utility model. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this utility model. That is, in some embodiments of this utility model, these practical details are not essential. In addition, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0023] It should be noted that all directional indicators in this utility model embodiment, such as up, down, left, right, front, back, etc., are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicator will also change accordingly.

[0024] Furthermore, in this utility model, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the utility model. They are merely used to distinguish items or operations described with the same technical terminology and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, such a combination should be considered non-existent and not within the scope of protection claimed by this utility model.

[0025] To further understand the utility model's content, features, and effects, the following embodiments are provided, along with detailed descriptions in conjunction with the accompanying drawings:

[0026] Reference Figure 1 and Figure 2 The system includes a base 1, with a heat dissipation assembly on the bottom side wall of the base 1. Multiple control buttons 11, a selector switch 12, multiple remote control sockets 13, multiple power supplies 14, a driver chip 15, multiple indicator lights 16, a microcontroller 17, and multiple expansion interfaces 18 are welded to the top side wall of the base 1. A dustproof assembly is located on the top side wall of the heat dissipation assembly, and a cleaning assembly is located on the bottom side wall of the dustproof assembly. A lighting assembly is located in the middle of the side wall of the base 1. During operation, the operator will connect the control buttons 11, the selector switch 12, and the remote control... The socket 13, power supply 14, driver chip 15, indicator light 16, microcontroller 17, and expansion interface 18 are soldered to the top of the base 1 to form a micro circuit board. Then, the lighting component is turned on, and each component and control button 11, changeover switch 12, remote control socket 13, power supply 14, driver chip 15, indicator light 16, microcontroller 17, and expansion interface 18 are inserted accordingly. When the circuit board gets hot during use, the staff will activate the heat dissipation component to cool the circuit board. At the same time, the dustproof component will prevent dust from entering the circuit board from the heat dissipation component. When too much dust accumulates inside the dustproof component, the staff will use the cleaning component to clean the dustproof component and restore its dustproof function.

[0027] Reference Figures 1 to 5 The heat dissipation assembly includes a heat sink 2, which is fixed to the bottom of the base 1. A fixing plate 21 is fixed to the middle of the inner side wall of the heat sink 2. Multiple motors 22 are mounted on the middle of the side wall of the fixing plate 21. Multiple heat dissipation blades 23 are fixed to the output end of the motors 22. During operation, when the circuit board gets hot during use, the operator starts the multiple motors 22. At this time, the motors 22 will rotate the multiple heat dissipation blades 23 fixed to the output end. When the heat dissipation blades 23 rotate, the airflow will flow to the circuit board under the filtration of the dustproof component. This step, by setting up the heat sink 2, fixing plate 21, motors 22 and heat dissipation blades 23, can effectively reduce the operating temperature of the circuit board and its electronic components, prevent overheating, and ensure that the electronic components operate within a suitable temperature range. The performance of the electronic components is more stable. A stable system environment helps the stable transmission of high-speed signals. Moreover, the signal will gradually attenuate during high-frequency transmission. The heat dissipation design helps to reduce the path loss of the signal and improve the transmission efficiency of the signal, so that the high-speed signal can be transmitted stably and reliably.

[0028] Reference Figures 2 to 4The dustproof component includes a heat sink 3, which is installed between the base 1 and the heat sink 2. Multiple sieve holes 31 are formed in the middle of the side wall of the heat sink 3. A pair of insert plates 32 are fixedly connected to the middle of the side wall of the heat sink 3. A pair of grooves 33 are formed in the middle of the side wall of the heat sink 2. The grooves 33 and the insert plates 32 are correspondingly arranged. During operation, because the insert plates 32 and the grooves 33 are correspondingly arranged, the operator inserts the pair of insert plates 32 into the grooves 33, so that the heat sink 3 can be stably installed between the base 1 and the heat sink 2. When multiple heat dissipation blades 23 apply heat to the circuit board... When using air cooling, the multiple sieve holes 31 on the side wall of the heat sink 3 prevent dust from directly entering the circuit board. This step, by setting up the heat sink 3, sieve holes 31, insert plate 32 and groove 33, can prevent dust, fine particles and other impurities from entering the circuit board. In the air cooling system, the rotation of the heat sink blades 23 will generate airflow, which will cause dust and other impurities to enter the circuit board area with the airflow and be deposited on the electronic components and circuit board. This setting can effectively prevent these impurities from entering and protect the circuit board and electronic components from dust damage.

[0029] Reference Figures 1 to 4 The cleaning component includes multiple springs 4 arranged in a linear array on the inner wall of the heat sink 2. A wiping pad 41 is fixed to the other end of each spring 4. The wiping pad 41 is located below the heat sink 3. Multiple elastic ropes 42 are fixed to the middle of the side wall of the wiping pad 41. During operation, when the heat dissipation capacity of the heat sink component decreases, it is observed whether the inside of the sieve holes 31 is blocked by dust or other particles. When excessive dust accumulates inside the sieve holes 31, the operator pulls the multiple elastic ropes 42. The elastic ropes 42 then pull the wiping pad 41, causing it to clean the surface of the heat sink 3. After cleaning, the operator releases the control of the elastic ropes 42, and the wiping pad 41 returns to its original position under the action of the multiple springs 4. This step, through the use of springs 4, wiping pads 41, and elastic ropes 42, cleans the heat sink 3, removing accumulated dust from its surface, ensuring smooth airflow, and thus maintaining the heat dissipation efficiency of the air-cooled heat dissipation system.

[0030] Reference Figure 1 and Figure 2 The lighting component includes a light strip 5, which is fixed to the side wall of the base 1. During operation, when the surrounding environment is relatively dark during the connection of the circuit board, the staff turns on the light strip 5, which illuminates the entire circuit board. This step, by setting the light strip 5, can improve the visibility of the work area, allowing the staff to see the details on the circuit board more clearly and thus complete the connection work more accurately.

[0031] Reference Figures 3 to 5A guide plate 6 is fixed to the middle of the side wall of the heat dissipation blade 23. The guide plate 6 is located inside the heat dissipation base 2. This step can improve the airflow distribution and flow efficiency of the heat dissipation blade 23 by setting the guide plate 6, which helps to improve the heat dissipation performance of the heat dissipation blade 23, so that it can more effectively reduce the temperature of the circuit board, reduce the aging of components caused by high temperature, extend the service life of the circuit board, and enable the long-term stable operation of the high-speed signal transmission system.

[0032] Reference Figure 1 The top side wall of the base 1 is equipped with a handle 7, which is located above the light strip 5. This step allows the staff to easily move the circuit board by setting the handle 7, which can improve the convenience of operation during installation, debugging or maintenance.

[0033] Reference Figure 5 All of the aforementioned heat dissipation blades 23 are made of metal. This step uses light steel as the heat dissipation blade material. Unlike PBT plastic, which has problems such as aging and creep, metal fan blades are much more rigid, more resistant to high temperatures, and more durable.

[0034] In summary: The operator solders control buttons 11, changeover switches 12, remote control sockets 13, power supplies 14, driver chips 15, indicator lights 16, microcontrollers 17, and expansion interfaces 18 to the top of base 1 to form a micro-circuit board. Then, the lighting assembly is connected, and each component and its corresponding components are inserted. When the circuit board gets hot during use, the operator activates the heat dissipation assembly to cool it. Simultaneously, the dustproof assembly prevents dust from entering the circuit board through the heat dissipation assembly. When too much dust accumulates inside the dustproof assembly, the operator uses a cleaning assembly to clean it and restore its dustproof function. When the circuit board gets hot during use, the operator activates multiple motors 22. These motors 22 rotate multiple heat dissipation blades 23 fixed to their output terminals. As the heat dissipation blades 23 rotate… Airflow will flow to the circuit board after being filtered by the dustproof components. Because the plug 32 and the groove 33 are set accordingly, the staff inserts a pair of plugs 32 into the groove 33, so that the heat sink 3 can be stably installed between the base 1 and the heat sink 2. When multiple heat sink blades 23 perform air cooling on the circuit board, multiple sieve holes 31 opened on the side wall of the heat sink 3 will prevent dust from directly entering the circuit board. When it is found that the heat dissipation capacity of the heat sink component has decreased, observe whether the inside of the sieve holes 31 is blocked by dust or other particles. When it is found that too much dust has accumulated inside the sieve holes 31, the staff pulls multiple elastic ropes 42. At this time, the elastic ropes 42 will pull the wiping pad 41, so that the wiping pad 41 cleans the surface of the heat sink 3. After the cleaning work is completed, the staff releases the control of the elastic ropes 42. At this time, the wiping pad 41 returns to its original position under the action of multiple springs 4. When the surrounding environment is relatively dark during the connection of the circuit board, the staff turns on the light strip 5. At this time, the light strip 5 will illuminate the entire circuit board.

[0035] The above are merely embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.

Claims

1. A micro-circuit board structure suitable for high-speed signal propagation, comprising a base (1), characterized in that: The base (1) has a heat dissipation component on its bottom side wall, multiple control buttons (11) are welded to the top side wall of the base (1), a changeover switch (12) is welded to the top side wall of the base (1), multiple remote control sockets (13) are welded to the top side wall of the base (1), multiple power supplies (14) are welded to the top side wall of the base (1), a driver chip (15) is welded to the top side wall of the base (1), multiple indicator lights (16) are welded to the top side wall of the base (1), a microcontroller (17) is welded to the top side wall of the base (1), multiple expansion interfaces (18) are welded to the top side wall of the base (1), a dustproof component is provided on the top side wall of the heat dissipation component, a cleaning component is provided on the bottom side wall of the dustproof component, and a lighting component is provided in the middle of the side wall of the base (1).

2. The microcircuit board structure suitable for high-speed signal propagation according to claim 1, characterized in that: The heat dissipation assembly includes a heat dissipation base (2), which is fixed to the bottom of the base (1). A fixing plate (21) is fixed in the middle of the inner side wall of the heat dissipation base (2). Multiple motors (22) are assembled in the middle of the side wall of the fixing plate (21). Multiple heat dissipation blades (23) are fixed to the output end of the motors (22).

3. The microcircuit board structure suitable for high-speed signal propagation according to claim 1, characterized in that: The dustproof component includes a heat sink (3), which is installed between the base (1) and the heat sink (2). The heat sink (3) has multiple sieve holes (31) in the middle of its side wall. A pair of insert plates (32) are fixedly connected to the middle of the side wall of the heat sink (3). A pair of grooves (33) are opened in the middle of the side wall of the heat sink (2). The grooves (33) and the insert plates (32) are correspondingly arranged.

4. A microcircuit board structure suitable for high-speed signal propagation according to claim 1, characterized in that: The cleaning component includes multiple springs (4) arranged in a linear array on the inner wall of the heat sink (2). The other end of each spring (4) is fixed with a wiping pad (41). The wiping pad (41) is located below the heat sink (3). Multiple elastic ropes (42) are fixed in the middle of the side wall of the wiping pad (41).

5. A microcircuit board structure suitable for high-speed signal propagation according to claim 1, characterized in that: The lighting assembly includes a light strip (5) which is fixed to the side wall of the base (1).

6. A microcircuit board structure suitable for high-speed signal propagation according to claim 2, characterized in that: A guide plate (6) is fixed to the middle of the side wall of the heat dissipation blade (23), and the guide plate (6) is located inside the heat dissipation base (2).

7. A microcircuit board structure suitable for high-speed signal propagation according to claim 5, characterized in that: The base (1) is fitted with a handle (7) on the top side wall, and the handle (7) is located above the light strip (5).

8. A microcircuit board structure suitable for high-speed signal propagation according to claim 2, characterized in that: All of the heat dissipation blades (23) are made of metal.

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