Base plate for circuit board lamination

Abstract

The utility model relates to the field of circuit board lamination, in particular to a base plate for circuit board lamination, which comprises a bottom plate, a mounting plate, a material table, a positioning plate, a guide groove and the like. A cavity is formed in the lower portion of the bottom plate, the bottom plate is firmly installed on a lower pressing plate of the laminating machine through a connecting piece, an installation plate is arranged on the inner side of the bottom plate, the top of the installation plate is flush with the top of the bottom plate, an installation groove is formed in the installation plate, a material table is arranged in the installation groove, and guide grooves are formed in the four corners of the bottom plate. According to the utility model, the movable positioning plates are arranged, so that a positioning plate placing tool convenient for positioning and stacking the multilayer plates is formed among the plurality of positioning plates under the condition of not influencing the plate pressing of the laminating machine, and a worker carries out plate placing work at an accurate position on the basis, so that the abnormal processing caused by the deviation of the placement of the multilayer plates is avoided.

Description

Technical Field

[0001] This utility model relates to a pad, and more particularly to a pad for circuit board lamination. Background Technology

[0002] Circuit board lamination is one of the important processes in manufacturing multilayer PCBs, and its purpose is to bond the various circuit boards together into a whole.

[0003] Before lamination, multiple layers of copper foil and substrate material need to be stacked correctly in sequence. The stacked multilayer boards are then fed into a laminator for pressing, bonding the multilayer boards together to form a whole. In this process, the rapid and accurate stacking of multilayer boards before lamination is crucial to ensuring process efficiency and quality. This step is usually completed by operators stacking the prepared boards on the lower platen of the laminator. The upper platen of the laminator presses down under a series of conditions to form the board. The lower platen usually has a visual marking area for placing the boards, but there is no positioning tooling to assist. It mainly relies on the operator's visual judgment and manual alignment to the preset placement area. The accuracy is difficult to guarantee, and deviations are prone to occur, which may lead to unstable stacking quality, affecting production quality and subsequent processes. Utility Model Content

[0004] To overcome the shortcomings of existing equipment that uses visual marking areas for board placement on the lower pressing platform but lacks positioning fixtures, relying mainly on operators' visual judgment and manual alignment to the preset placement area, resulting in difficulty in ensuring accuracy, easy deviation, and potential instability in stacking quality, thus affecting production quality and subsequent processes, the purpose of this utility model is to provide a board pad for circuit board lamination to solve the above problems.

[0005] The technical implementation scheme of this utility model is as follows: A pad for circuit board lamination includes a base plate, a mounting plate, a material platform, a positioning plate, a guide groove, a connecting rod, a rotary drive component, a rotary disk, and a rotating arm. The base plate has a cavity at its lower part and is securely mounted on the lower platen of the laminator via a connector. A mounting plate is provided inside the base plate, with its top flush with the top of the base plate. A mounting groove is provided within the mounting plate, and a material platform is located within the mounting groove. Guide grooves are provided at the four corners of the base plate, and sliders are installed within each guide groove, with positioning elements mounted on each slider. The bottom of the mounting plate and the positioning plate are in sliding contact with the base plate. A plate placement area is formed between the four positioning plates. A rotary drive component is provided at the bottom of the mounting plate. A rotating disk is connected to the bottom of the rotary drive component. The rotating disk rotates under the drive of the rotary drive component. Four rotating arms are evenly spaced on the rotating disk. A connecting rod is hinged to each rotating arm. The other end of each connecting rod is hinged to a slider in a guide groove. There is an angle of less than 90 degrees between the rotating arm and the connecting rod. When the rotating disk rotates clockwise, it will simultaneously open the four positioning plates through the rotating arms and connecting rods.

[0006] Optionally, the top of the material platform is slightly higher than the top of the mounting plate, with a height difference of 1.5cm-2cm. The upper surface of the material platform is flat and smooth, without any protrusions or pits.

[0007] Optionally, it also includes locating pins and springs. Circular holes are opened on the edge of the mounting plate near the mounting groove. Locating pins are slidably installed in the circular holes. Springs are connected to the bottom of the locating pins, and the other end of the springs is connected to the base plate.

[0008] Optionally, it also includes a circulation pipe and a liquid flow connector. The circulation pipe is arranged inside the material platform. The circulation pipe has two pipe openings located on the same side. The pipe path between the two pipe openings forms a circulation loop. One end of each pipe opening extends outward from inside the material platform and passes through the mounting plate and the base plate. A liquid flow connector is connected to the pipe opening.

[0009] Optionally, it also includes an air nozzle and an air connector. An air nozzle is installed on one side of the top of the base plate, with the air inlet of the air nozzle facing the top of the material platform. An air connector is connected to and connected to the air nozzle.

[0010] The present invention has the following advantages: The present invention is equipped with a movable positioning plate, which forms a positioning and placement fixture between multiple positioning plates without affecting the laminator plate, making it easy to position and stack multi-layer boards. Based on this, the worker can perform precise placement work and avoid processing abnormalities caused by multi-layer board placement deviation.

[0011] This invention uses a circulating pipeline within the feeding platform to rapidly cool the hot-pressed multilayer board, shortening the pressing cycle and improving production efficiency. It also helps the adhesive to function better, enhancing the bonding effect between the layers of the multilayer board, while reducing the internal temperature difference and thus lowering the board's internal stress.

[0012] This invention uses a blower nozzle to help separate and remove the pressed boards from the material table, preventing the boards from sticking to the material table and ensuring a smooth board removal process. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0014] Figure 2 This is a bottom view of the present invention.

[0015] Figure 3 This is a three-dimensional structural diagram of the positioning mechanism of this utility model.

[0016] Figure 4 This is a three-dimensional structural diagram of the mounting plate, material platform, and components thereon of this utility model.

[0017] Figure 5 This is a three-dimensional structural diagram of the circulation pipeline of this utility model.

[0018] The meanings of the reference numerals in the figure are as follows: 1: base plate, 2: mounting plate, 3: material platform, 4: positioning plate, 41: guide groove, 42: connecting rod, 43: rotary drive component, 44: rotary disk, 441: rotating arm, 5: positioning pin, 51: spring, 6: circulation pipe, 61: liquid flow connector, 7: air nozzle, 71: air connector. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the following will describe this utility model in further detail with reference to the accompanying drawings. It is hereby declared that the terms "up," "down," "left," "right," "front," "back," "inner," and "outer," etc., appearing or about to appear in this document, are based solely on the accompanying drawings and are not intended to specifically limit this utility model.

[0020] Example 1: A pad for circuit board lamination, such as Figure 1 As shown, it includes a base plate 1, which is rectangular in shape with a connecting part at its outer edge. The connecting part has mounting holes, through which the base plate is securely installed on the lower platen inside the laminator. The base plate is made of high-strength metal material and has strong support performance. A cavity is opened in the lower part of the base plate 1 for component installation and wiring layout. A detachable mounting plate 2 is provided on the inner side of the base plate 1. The top of the mounting plate 2 is at the same height as the top of the base plate 1. The mounting plate 2 has a mounting groove, and a material platform 3 is provided in the mounting groove. The material platform 3 is a multilayer board stacking platform. The top height of the material platform 3 is slightly higher than the top height of the mounting plate 2, forming a height difference between 1.5cm and 2cm. The upper surface of the material platform 3 is flat and smooth, without protrusions or pits. The material platform 3 should be directly opposite the upper platen of the laminator, and the edge shape of the material platform 3 is customized according to the concave surface in the mold of the upper platen of the laminator. When the upper platen is pressed down, the edge of the material platform 3 will be covered by the mold of the upper platen.

[0021] Among them, such as Figure 1-3 As shown, guide grooves 41 are provided at the four corners of the base plate 1. All four guide grooves are inclined, and each guide groove 41 contains a slider. A positioning plate 4 is mounted on each slider, and the bottom of each positioning plate 4 slides in contact with the base plate 1. See details [link to documentation]. Figure 3When the four positioning plates 4 are not moved, their inner edges will be in contact with the edge of the material platform 3, surrounding the material platform 3. The four positioning plates 4 do not contact each other. The cavity formed between the four positioning plates 4 is used for plate placement and positioning. When placing the plate, the multi-layer board is placed on the material platform 3 between the positioning plates 4 in the set order. The inner edge of the positioning plate 4 will contact the edge of the multi-layer board to achieve the positioning effect. The mounting plate 2 is provided with a rotary drive 43 at the bottom. The rotary drive 43 can be a motor or a rotary cylinder. The lower part of the rotary drive 43 is connected to a rotating disk 44. The rotary drive 43 drives the rotating disk 44 to rotate. The rotating disk 44 is provided with four rotating arms 441 evenly spaced. Each rotating arm 441 is hinged with a connecting rod 42. The other end of each connecting rod 42 is connected to a guide. The slider in the groove 41 is hinged, and there is an angle of less than 90 degrees between the rotating arm 441 and the connecting rod 42. Specifically, when the rotating disk 44 rotates clockwise, it will drive the rotating arm 441 to rotate clockwise. The distance between the rotating arm 441 and a certain slider connected to the same connecting rod 42 will be shortened. Since the slider can move, the shortened distance will be transmitted to the slider through the angle change of the hinge point of the connecting rod 42, thereby pushing the slider to slide outward. At this time, the four positioning plates 4 are opened at the same time, and the positioning plates 4 are disengaged from the material table 3. The purpose of opening the positioning plates 4 is to ensure that when the upper platen of the laminator moves down and contacts the material table 3, there is no interference from other parts, ensuring the fit between the upper platen and the material table 3, and performing the pressing and forming work of the multilayer board through high temperature and high pressure.

[0022] Example 2: Based on Example 1, such as Figure 1 and Figure 4 As shown, it also includes positioning pins 5 and springs 51. Circular holes are opened on the edge of the mounting plate 2 near the mounting groove. Positioning pins 5 are elastically connected to each circular hole via springs 51. When the positioning pins 5 are pressed, they are pressed into the circular holes, and the positioning pins 5 contact the edge of the material platform 3. That is, when a board is placed on the material platform 3, the positioning pins 5 will contact the edge of the board. A pin hole for mounting the positioning pins 5 should be provided at the corresponding position on the upper platen of the laminator. Before the upper platen moves downwards and contacts the material platform 3 on the lower platen, the positioning pins 5 will pass through the pin hole. The pin hole is relatively shallow, and the pin hole is close to the positioning pin. While the positioning pin 5 remains in contact, it will partially press the positioning pin 5 into the mounting plate 2. The purpose of setting the positioning pin 5 is to guide the upper platen of the laminator to press down along the correct path, and to provide stable support through multi-point connection. This effectively limits the lateral movement or unnecessary shaking of the upper platen during the pressing process, ensuring the uniformity and continuity of the force on the board. At the same time, the positioning pin 5 set on the edge of the material table 3 can keep the board in the material table 3 in a position-restricted positioning state when the positioning plate 4 is opened, reducing the occurrence of board displacement caused by external factors.

[0023] In a preferred embodiment: such as Figure 1 , Figure 4 and Figure 5 As shown, it also includes a circulation pipe 6 and a liquid flow connector 61. The circulation pipe 6 is arranged inside the material platform 3. The circulation pipe 6 is used to circulate the cooling medium. The circulation pipe 6 has two pipe openings, which are located on the same side. One end of each pipe opening extends outward from inside the material platform 3 and passes through the mounting plate 2 and the base plate 1. Each pipe opening is connected to a liquid flow connector 61, which connects to an external circulating cooling device. A circulation loop is formed in the pipe path between the two pipe openings. When the cooling medium enters from one pipe opening, it will exit from the other pipe opening. Specifically, after the laminate is pressed and formed, the low-temperature medium is continuously circulated in the circulation pipe 6 through the circulating cooling device. The low temperature is transferred to the material platform through the pipe wall to quickly cool the hot-pressed multilayer board and shorten the pressing and forming cycle.

[0024] In a preferred embodiment: such as Figure 1 As shown, it also includes an air nozzle 7 and an air connector 71. An air nozzle 7 is installed on one side of the top of the base plate 1. The air nozzle 7 is connected to and connected to the air connector 71. The air connector 71 is connected to an external high-pressure air source. The air source is controlled by a solenoid valve in the air source path. The air outlet of the air nozzle 7 faces the top of the material platform 3. When the gas is emitted from the air nozzle 7, it blows towards the joint between the board and the material platform 3. Specifically, after the multi-layer boards on the material platform 3 are pressed together by the laminator, the gas in the joint between the board and the material platform 3 may be squeezed out, forming a negative pressure area, causing the board to stick to the material platform 3. This results in the board not being easily removed from the material platform 3. At this time, by controlling the airflow to be discharged from the air nozzle 7, when the gas is emitted from the air nozzle 7, it blows out in a specific direction, directly pointing to the joint between the board and the material platform 3. The gas rushing out from the height enters the joint between the board and the material platform 3, causing the board to separate from the material platform 3.

[0025] The above embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Therefore, all equivalent changes made based on the content described in the claims of the present utility model should be included within the scope of the claims of the present utility model.

Claims

1. A pad for circuit board lamination, comprising a base plate (1), the base plate (1) having a cavity in its lower part, and the base plate (1) being securely mounted on the lower platen of a laminator via connectors. Its characteristics are: It also includes a mounting plate (2), a material platform (3), a positioning plate (4), a guide groove (41), a connecting rod (42), a rotary drive component (43), a rotary disk (44), and a rotating arm (441). The mounting plate (2) is provided on the inner side of the base plate (1). The top of the mounting plate (2) is flush with the top of the base plate (1). The mounting plate (2) is provided with a mounting groove, and the material platform (3) is provided in the mounting groove. The four corners of the base plate (1) are provided with guide grooves (41). The guide grooves (41) are provided with sliders, and the sliders are all equipped with positioning plates (4). The bottom of the positioning plates (4) are in sliding contact with the base plate (1). A plate placement area is formed between the four positioning plates (4). The mounting plate (2) is equipped with a rotary drive (43) at the bottom. The rotary drive (43) is connected to a rotating disk (44) at the bottom. The rotating disk (44) rotates under the drive of the rotary drive (43). Four rotating arms (441) are evenly spaced on the rotating disk (44). Each rotating arm (441) is hinged with a connecting rod (42). The other end of each connecting rod (42) is hinged to a slider in a guide groove (41). There is an angle of less than 90 degrees between the rotating arm (441) and the connecting rod (42). When the rotating disk (44) rotates clockwise, it will simultaneously open the four positioning plates (4) through the rotating arms (441) and the connecting rod (42).

2. A circuit board laminating pad according to claim 1, characterized in that: The top height of the material platform (3) is slightly higher than the top height of the mounting plate (2), with a height difference between 1.5cm and 2cm. The upper surface of the material platform (3) is flat and smooth, without any protrusions or pits.

3. A circuit board laminating pad according to claim 2, characterized in that: It also includes a positioning pin (5) and a spring (51). There are round holes on the edge of the mounting plate (2) near the mounting groove. The positioning pin (5) is slidably installed in the round hole. The bottom of the positioning pin (5) is connected to a spring (51). The other end of the spring (51) is connected to the base plate (1).

4. A circuit board laminating pad according to claim 3, characterized in that: It also includes a circulation pipe (6) and a liquid flow connector (61). The circulation pipe (6) is arranged inside the material platform (3). The circulation pipe (6) has two pipe openings. The two pipe openings are located on the same side. The pipe path between the two pipe openings forms a circulation loop. One end of each pipe opening extends outward from inside the material platform (3) and passes through the mounting plate (2) and the bottom plate (1). A liquid flow connector (61) is connected to the pipe opening.

5. A circuit board laminating pad according to claim 4, characterized in that: It also includes an air nozzle (7) and an air connector (71). An air nozzle (7) is installed on one side of the top of the base plate (1). The air outlet of the air nozzle (7) faces the top of the material platform (3). An air connector (71) is connected to and communicates with the air nozzle (7).

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