Modeling structure based on integrated circuit board

Abstract

The utility model discloses a modeling structure based on an integrated circuit board, which comprises the integrated circuit board, an electronic component, a connecting wire harness and a cover plate support, the electronic component, the connecting wire harness and the cover plate support are arranged on the integrated circuit board, and the connecting wire harness is isolated from the electronic component. The two connecting wire harnesses are respectively connected with the electronic component through the integrated circuit board, the cover plate support covers the outside of the electronic component, and the edge of the cover plate support is provided with an avoiding groove for the connecting wire harnesses to pass through. According to the utility model, the cover plate support is utilized to cover the electronic component, so that the electronic component is protected, and meanwhile, the traditional reinforcing and glue filling processes are replaced, so that the reinforcing achieves the purpose of canceling the glue filling process, the manufacturing process is reduced, and the generation of defects in the subsequent glue dispensing process is also reduced.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuits, specifically a structural design based on an integrated circuit board. Background Technology

[0002] In an integrated circuit board, electronic components are mounted on the board. To protect these electronic components, such as... Figure 1 As shown, the existing technology involves reinforcing the outside of electronic components with FR4 material, placing the electronic components inside a cavity formed by FR4 material, and then potting glue into the cavity after the product is finished to protect the components. Protecting electronic components through reinforcement and potting increases the cost of the process and reduces production efficiency. However, because of the added process, it also increases the defect rate of the product manufacturing process. In addition, in the traditional process, the bonding area is small, so the adhesion at the joint is weak, and there is a risk of detachment in subsequent processes. Utility Model Content

[0003] In order to overcome the defects in the prior art, this utility model provides a shape structure based on an integrated circuit board, which is used to solve one or more of the above-mentioned problems.

[0004] This application discloses a structural design based on an integrated circuit board, comprising an integrated circuit board and electronic components, connecting wire harnesses, and a cover plate bracket disposed on the integrated circuit board, wherein the connecting wire harnesses are isolated from the electronic components, two connecting wire harnesses are respectively connected to the electronic components through the integrated circuit board, the cover plate bracket covers the outside of the electronic components, and the edge of the cover plate bracket has a clearance groove for the connecting wire harnesses to pass through.

[0005] Furthermore, it also includes a protective enclosure, which is disposed on the integrated circuit board and surrounds the electronic components. The inner wall of the protective enclosure is isolated from the electronic components.

[0006] Furthermore, the height of the protective enclosure in the thickness direction of the integrated circuit board is greater than the height of the electronic component in the thickness direction of the integrated circuit board.

[0007] Furthermore, the enclosure protection component is located inside the cover plate bracket, and there is a clearance space between the upper surface of the enclosure protection component and the cover plate bracket.

[0008] Furthermore, the outer wall surface of the enclosure protective component located outside the electronic component is perpendicular to the integrated circuit board, and the three outer walls of the enclosure protective component abut against the inner wall of the cover plate bracket.

[0009] Furthermore, the portion of the cover plate bracket located between the two connecting harnesses has an inwardly recessed portion.

[0010] Furthermore, the electronic component is a resistance temperature sensor.

[0011] The beneficial effects of this utility model are as follows:

[0012] 1. By using a cover plate bracket to cover electronic components, the traditional processes of reinforcement and potting are replaced while protecting the electronic components. This allows the reinforcement process to eliminate the need for potting, reducing the number of manufacturing processes and the occurrence of defects in the subsequent dispensing process.

[0013] 2. Compared with the previous potting process, the contact area between the cover plate bracket and the integrated circuit board in this structure is greatly increased, and the adhesion between the cover plate bracket covering the electronic components and the integrated circuit board is greatly increased, reducing the risk of detachment in subsequent processes and thus improving the overall yield in the production process.

[0014] 3. The dual protection provided by the enclosure and cover plate brackets for electronic components can provide better protection for electronic components and improve the overall yield in the production process.

[0015] To make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a structural schematic diagram of the shape structure in the prior art embodiment;

[0018] Figure 2 This is a schematic diagram of the external structure of an integrated circuit board-based shaped structure in an embodiment of this application;

[0019] Figure 3 This is a schematic diagram of the internal structure of an integrated circuit board-based structural design in an embodiment of this application;

[0020] The reference numerals in the above figures are as follows: 1. Integrated circuit board; 2. Electronic components; 3. Connecting wire harness; 4. Cover plate bracket; 41. Clearance groove; 42. Recess; 5. Enclosure protection component. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] like Figures 2 to 3 As shown in the embodiment of this application, a structure based on an integrated circuit board includes an integrated circuit board 1 and electronic components 2, connecting wire harnesses 3, and a cover plate bracket 4 disposed on the integrated circuit board 1. The connecting wire harnesses 3 are isolated from the electronic components 2 to avoid mutual interference. Two connecting wire harnesses 3 are respectively connected to the electronic components 2 through the integrated circuit board 1, thus establishing a connection between the connecting wire harnesses 3 and the electronic components 2. The cover plate bracket 4 covers the outside of the electronic components 2, thereby protecting the internal electronic components 2 and improving the yield and stability of the electronic components 2 during use. In this embodiment, the cover plate bracket 4 is hot-pressed onto the integrated circuit board 1. Of course, in other optional embodiments, the cover plate bracket 4 can adopt other connection methods that can stably be disposed on the integrated circuit board 1. The cover plate bracket 4 has a clearance groove 41 on its edge for the passage of the connecting wire harness 3. The two clearance grooves 41 are used to allow the two connecting wire harnesses 3 to pass through respectively, so that part of the connecting wire harness 3 is located inside the cover plate bracket 4, while the other part of the connecting wire harness 3 is located outside the cover plate bracket 4, thereby protecting the connecting wire harness 3 while avoiding interference with the connecting wire harness 3.

[0023] In this embodiment, the electronic components 2 and the connecting wire harness 3 are first placed on the integrated circuit board 1, and then the cover plate bracket 4 is placed over the electronic components 2, so that the cover plate bracket 4 protects the electronic components 2 located on the integrated circuit board 1, thus obtaining this shape structure.

[0024] With the above structure, the cover plate bracket 4 covers the electronic component 2, protecting the electronic component 2 while replacing the traditional reinforcement and potting processes. This eliminates the need for potting, reducing the number of manufacturing processes and the occurrence of defects in subsequent dispensing. In addition, compared with the previous potting process, the contact area between the cover plate bracket 4 and the integrated circuit board 1 is greatly increased, and the adhesion between the cover plate bracket 4 covering the electronic component 2 and the integrated circuit board 1 is greatly increased, reducing the risk of detachment in subsequent processes and thus improving the overall yield in the production process.

[0025] Specifically, such as Figure 3 As shown, it also includes a protective enclosure 5, which is disposed on the integrated circuit board 1. In this embodiment, the protective enclosure 5 is made of FR4 material, so that the protective enclosure 5 can provide FR4 reinforcement for the electronic component 2 located on the integrated circuit board 1, resulting in better protection for the electronic component 2. Of course, in other optional embodiments, the material of the protective enclosure 5 can be adjusted according to actual needs. The protective enclosure 5 surrounds the electronic component 2, and the inner wall of the protective enclosure 5 is isolated from the electronic component 2, so that the protective enclosure 5 can protect the electronic component 2 from all sides. The mutual isolation also avoids the influence of the protective enclosure 5 on the electronic component 2, improving the product yield. With the above structure, the dual protection provided by the protective enclosure 5 and the cover plate bracket 4 for the electronic component 2 can achieve a better protection effect for the electronic component 2, improving the overall yield in the production process.

[0026] Specifically, the height of the protective enclosure 5 in the thickness direction of the integrated circuit board 1 is greater than the height of the electronic component 2 in the thickness direction of the integrated circuit board 1, so that the protective enclosure 5 can also protect the electronic component 2 in the thickness direction of the integrated circuit board 1, thereby further improving the protection effect of the electronic component 2 on the integrated circuit board 1.

[0027] Specifically, such as Figure 2 and Figure 3 As shown, the protective enclosure 5 is located inside the cover plate bracket 4, so that the cover plate bracket 4 can simultaneously protect the protective enclosure 5 and the electronic component 2. There is a clearance space between the upper surface of the protective enclosure 5 and the cover plate bracket 4. The existence of the clearance space can avoid friction between the upper surface of the protective enclosure 5 and the cover plate bracket 4 during installation, thus providing a better protection effect for both the protective enclosure 5 and the cover plate bracket 4.

[0028] Specifically, such as Figure 3 As shown, the outer wall of the protective enclosure 5 located outside the electronic component 2 is perpendicular to the integrated circuit board 1. This ensures that the protective enclosure 5 can achieve the optimal height with the same material, thereby ensuring that the protective enclosure 5 has a good protective effect on the electronic component 2. The three outer walls of the protective enclosure 5 abut against the inner wall of the cover plate bracket 4. In this embodiment, the cross-sectional shape of the protective enclosure 5 is rectangular. The two opposing outer walls can be used to support the inner sidewall of the cover plate bracket 4, thereby giving the cover plate bracket 4 good support. The abutment between the third surface, which is perpendicular to and connected to the two opposing surfaces, and the cover plate bracket 4 allows the three outer walls of the protective enclosure 5 to stabilize the cover plate bracket 4, improving the stability of the cover plate bracket 4.

[0029] Specifically, such as Figure 2 As shown, the portion of the cover plate bracket 4 located between the two connecting wire harnesses 3 has a recessed portion 42 that is recessed inward. The presence of the recessed portion 42 increases the contact area between the cover plate bracket 4 and the integrated circuit board 1, thereby improving the bonding effect between the cover plate bracket 4 and the integrated circuit board 1.

[0030] Specifically, the electronic component 2 is a resistance temperature sensor, which enables it to collect thermal conductivity temperature data, making it suitable for acquiring voltage, temperature, and other signals in electronic products such as new energy vehicles, fuel vehicles, and home appliances. Of course, in other optional embodiments, the electronic component 2 can be adjusted according to actual needs.

[0031] This utility model uses specific embodiments to illustrate the principle and implementation of the utility model. The above description of the embodiments is only for the purpose of helping to understand the method and core idea of ​​the utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​the utility model. Therefore, the content of this specification should not be construed as a limitation of the utility model.

Claims

1. A structural design based on an integrated circuit board, characterized in that, The device includes an integrated circuit board and electronic components, connecting wire harnesses, and a cover plate bracket disposed on the integrated circuit board. The connecting wire harnesses are isolated from the electronic components. Two connecting wire harnesses are respectively connected to the electronic components through the integrated circuit board. The cover plate bracket covers the outside of the electronic components, and the edge of the cover plate bracket has a clearance groove for the connecting wire harnesses to pass through.

2. The shape structure based on an integrated circuit board according to claim 1, characterized in that, It also includes a protective enclosure, which is disposed on the integrated circuit board and surrounds the electronic components. The inner wall of the protective enclosure is isolated from the electronic components.

3. The shape structure based on an integrated circuit board according to claim 2, characterized in that, The height of the protective enclosure in the thickness direction of the integrated circuit board is greater than the height of the electronic component in the thickness direction of the integrated circuit board.

4. The shape structure based on an integrated circuit board according to claim 2, characterized in that, The protective enclosure is located inside the cover plate bracket, and there is a clearance space between the upper surface of the protective enclosure and the cover plate bracket.

5. The shape structure based on an integrated circuit board according to claim 4, characterized in that, The outer wall of the enclosure protective component is perpendicular to the integrated circuit board, and the three outer walls of the enclosure protective component abut against the inner wall of the cover plate bracket.

6. The shape structure based on an integrated circuit board according to claim 1, characterized in that, The portion of the cover plate bracket located between the two connecting harnesses has an inwardly recessed portion.

7. The shape structure based on an integrated circuit board according to claim 1, characterized in that, The electronic component is a resistance temperature sensor.

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