Raised radiator and circuit assembly
Raised heat sinks solve the problems of low efficiency and difficult installation of planar heat sinks by setting raised components and staggered heat dissipation channels on a fixed base plate, achieving efficient heat transfer and space utilization, and ensuring stable chip operation.
Patent Information
- Application Number
- CN202422787830.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-14
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-11-14
AI Technical Summary
Existing planar heat sinks are easily obstructed in air convection channels, resulting in low heat transfer and dissipation efficiency. Furthermore, they are difficult to install in space-constrained or irregularly shaped devices, which limits their application.
The design employs a raised heatsink, which forms multiple staggered heat dissipation channels by setting raised components and heat dissipation components on a fixed base plate, increasing the air contact area and dissipating heat through heat conduction, heat convection and heat radiation. At the same time, locking components are used in the circuit components to ensure tight contact between the chip and the heatsink.
It improves heat dissipation efficiency, avoids local overheating, ensures that the chip operates within a suitable temperature range, prevents performance degradation or damage, and maximizes space utilization without increasing device size.
Smart Images
Figure CN223503228U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic technology, and in particular to a raised heat sink and circuit assembly. Background Technology
[0002] In existing technologies, most heat sinks adopt a planar heat dissipation structure. Planar structures are not conducive to forming complex air convection channels; airflow is easily obstructed, making smooth convection difficult and affecting the rapid transfer and dissipation of heat, thus reducing heat dissipation efficiency. Furthermore, due to their planar shape, planar heat sinks may be difficult to install in devices with limited space or irregular shapes, and cannot fully utilize the limited space to achieve optimal heat dissipation, limiting their application in certain special scenarios. Utility Model Content
[0003] Therefore, it is necessary to provide a raised heat sink and circuit assembly to address the issue of using a planar structure for the heat sink.
[0004] A raised radiator includes: a fixed base plate having a first mounting hole and a fixed idle opening, the number of which is multiple, and the multiple first mounting holes and multiple fixed idle openings corresponding one-to-one; a raised component disposed on the fixed base plate; and a heat dissipation component having multiple heat dissipation components, the multiple heat dissipation components being spaced apart along the length direction of the fixed base plate and the raised components to form multiple first heat dissipation channels, the heat dissipation component having multiple second heat dissipation channels, and the multiple first heat dissipation channels and the multiple second heat dissipation channels being interconnected.
[0005] The above discloses a raised radiator. By mounting the raised components on a fixed base plate, the fixed base plate provides a solid attachment foundation for the raised components, ensuring the integrity of the radiator structure. Multiple heat dissipation components are mounted on the fixed base plate and the raised components, and each heat dissipation component has multiple first heat dissipation slots and multiple second heat dissipation slots. These slots are interconnected and interwoven. Firstly, the distribution of multiple heat dissipation components on the fixed base plate and the raised components significantly increases the surface area of the radiator in contact with the air. Heat dissipation mainly occurs through heat conduction, heat convection, and heat radiation, and increasing the contact area with the air effectively improves the efficiency of heat convection. The presence of the first and second heat dissipation slots further increases this surface area. These slots make the surface of the heat dissipation components no longer flat, but with more edges and corners, allowing air to better contact these complex surfaces and carry away more heat. Secondly, the interwoven design of the first and second heat dissipation slots creates a complex and orderly path for airflow. When air flows through the heat dissipation components, this interwoven slot structure guides the air to form complex flow patterns inside and on the surface of the heat dissipation components. Air does not simply pass through in a straight line, but travels between the slots, extending the time air spends in the heat sink. This allows heat to be dissipated into the air more effectively, improving heat dissipation efficiency, preventing localized overheating, and ensuring stable chip operation.
[0006] In one embodiment, there are multiple protruding components, which are disposed on both sides of the fixed base plate, forming multiple raised heat dissipation grooves with the fixed base plate. By placing multiple protruding components on both sides of the fixed base plate and forming multiple raised heat dissipation grooves with the fixed base plate, the heat dissipation area is significantly increased. Heat is conducted from the fixed base plate to the protruding components, and the presence of the raised heat dissipation grooves allows air to come into contact with more heat dissipation surfaces. At the same time, the raised heat dissipation grooves can guide airflow, forming more effective thermal convection, making it easier for hot air to rise and be discharged from the grooves, while allowing cool air to smoothly enter the grooves for replenishment, thereby improving heat dissipation efficiency.
[0007] In one embodiment, the protruding component is provided with grooves. By providing grooves on the protruding component, the shape and distribution of the grooves can guide the placement of the fingers, allowing the fingers to better conform to the surface of the protruding component. This conformation helps to distribute the grip force applied by the hand more evenly on the contact surface, further enhancing the stability of the grip. Simultaneously, when picking up the radiator, the hand muscles need to exert force on the radiator through the fingers to overcome its gravity; the presence of the grooves allows the fingers to accurately find the point of force application, effectively transferring the force to the radiator.
[0008] In one embodiment, the plurality of heat dissipation components comprises a plurality of first heat sinks and a plurality of second heat sinks. One end of each first heat sink is disposed on the raised component, and the other end of each first heat sink is disposed opposite to the fixed idle opening. The second heat sinks are disposed on the fixed base plate with both ends located on the raised component. A plurality of first heat dissipation slots penetrate the plurality of first heat sinks and the plurality of second heat sinks, and the spacing between adjacent first heat sinks and / or second heat sinks forms the second heat dissipation slots. By configuring the heat dissipation components with first heat sinks and a plurality of second heat sinks, the first heat sinks can better adapt to the shape of the fixed base plate. The shape of the first heat sink ensures that the fixed base plate has space for the fixed idle opening, ensuring that the raised heat sink can be securely fixed to the circuit board. The second heat sinks are relatively large, and the larger heat dissipation area can maximize the dissipation of heat absorbed by the fixed base plate, preventing heat accumulation on the fixed base plate. This would prevent the chip in contact with the fixed base plate from being unable to dissipate heat, affecting the chip's operating state and shortening its lifespan. Multiple first and second heat dissipation channels allow hot air to flow out quickly while cool air can be replenished in a timely manner, forming a good heat exchange. This accelerates the transfer of heat from the chip heat sink to the external environment, preventing excessive heat accumulation on the heat sink. As a result, the chip is kept within a suitable operating temperature range, ensuring stable chip performance and preventing overheating that could lead to frequency reduction or even damage.
[0009] In one embodiment, the first heat sink includes a first heat sink, a second heat sink, a third heat sink, and a first connecting block. The first heat sink is disposed on the fixed base plate and the protruding assembly, the second heat sink is disposed on the fixed base plate, and the third heat sink is disposed on the fixed base plate and opposite to the fixed unused opening. Multiple first connecting blocks are used to sequentially connect the first, second, and third heat sinks. By disposing the first heat sink on the fixed base plate and the protruding assembly, the second heat sink on the fixed base plate, and the third heat sink on the fixed base plate opposite to the fixed unused opening, this layout represents a layered space utilization method. The heat sinks occupy different positions; the first heat sink utilizes the space of the fixed base plate and the protruding assembly, the second heat sink increases the heat dissipation area on the plane of the fixed base plate, and the third heat sink is positioned specifically for the fixed unused opening. This layout maximizes the use of internal space to arrange the heat sinks without increasing the overall size of the device, thereby improving heat dissipation capacity. By using multiple first connecting blocks to connect the first, second, and third heat sinks in sequence, a more efficient heat conduction path is formed. This coordinated heat conduction method allows heat to be distributed more evenly among the different heat sinks, avoiding a situation where one heat sink overheats while the others do not perform their functions effectively.
[0010] In one embodiment, the second heat sink includes edge heat sinks, intermediate heat sinks, and second connecting blocks. Multiple edge heat sinks are disposed on the fixed base plate and the protruding assembly. Multiple intermediate heat sinks are disposed on the fixed base plate. Multiple second connecting blocks connect the edge and intermediate heat sinks sequentially. By placing multiple edge heat sinks on the fixed base plate and the protruding assembly, and multiple intermediate heat sinks on the fixed base plate, the heat dissipation area is significantly increased. The different positions of the edge and intermediate heat sinks diversify the heat conduction paths. The fixed base plate, as the basic component for heat conduction, can transfer heat from the heat source to the edge and intermediate heat sinks. Because the edge heat sinks are located at the edges of the fixed base plate and the protruding assembly, they can dissipate heat to the edges of the device and the external space; the intermediate heat sinks focus on dissipating heat near the center of the fixed base plate. This multi-path heat conduction method can dissipate heat more efficiently and avoid heat accumulation.
[0011] In one embodiment, the raised assembly includes a connecting plate and an extension plate. The connecting plate is disposed on the fixed base plate, and the extension plate is disposed on the connecting plate. The heat dissipation assembly is disposed on both the connecting plate and the extension plate. By placing the connecting plate on the fixed base plate and the extension plate on the connecting plate, the stability of the extension plate is enhanced, and the spatial layout of the raised heat sink on the circuit board is optimized. By placing the heat dissipation assembly on the connecting plate and the extension plate, the heat absorbed by the raised heat sink can be transferred to the extension plate through the connecting plate. The extension plate increases the contact area with the air, and according to the principle of heat exchange, heat is more easily dissipated into the surrounding air, preventing heat accumulation in certain sensitive areas of the circuit board and extending the lifespan of circuit components.
[0012] A second aspect of this application discloses a circuit assembly comprising: the aforementioned raised heat sink; a chip heat sink; a circuit board, wherein the raised heat sink and the chip heat sink are disposed on the circuit board; a chip sandwiched between the raised heat sink, the chip heat sink, and the circuit board; a plurality of locking components, wherein the plurality of locking components are respectively disposed through the raised heat sink and the chip heat sink and respectively fixed on the circuit board; and electronic components disposed on the circuit board.
[0013] The second aspect disclosed above discloses a circuit assembly that uses multiple locking components to mount multiple chip heat sinks and raised heat sinks on a circuit board, and clamps multiple chips between the circuit board and the chip heat sinks. This ensures tight, direct contact between the chips and the heat sinks, providing excellent conditions for heat conduction. The heat generated by the chips during operation can be quickly transferred to the heat sinks via conduction, while reducing thermal resistance and effectively dissipating the heat generated by the chips. Furthermore, multiple chips on a circuit board typically generate uneven heat distribution. By equipping each chip with a corresponding chip heat sink, the heat generated by each chip can be handled separately. The heat sink absorbs and dissipates the heat from the chip, preventing heat accumulation around the chip. This effectively disperses heat, effectively controls the chip's operating temperature, and prevents performance degradation, malfunction, or even damage due to overheating. It also prevents the performance of the entire circuit board from being affected by overheating of a single chip. The chip heat sinks also provide some heat dissipation for the electronic components mounted on the circuit board, ensuring their normal operation.
[0014] In one embodiment, the chip heat sink includes: a chassis with multiple second mounting holes; a fourth heat sink assembly disposed on the chassis, having multiple fourth heat sink slots and a notch opposite to the second mounting holes; and a fifth heat sink assembly disposed on the chassis with multiple fifth heat sink slots. The fourth heat sink assembly has multiple fourth heat sink assemblies, which are distributed on both sides of the fifth heat sink assembly. The chassis, the fourth heat sink assembly, and the fifth heat sink assembly are integrally formed. By mounting the fourth heat dissipation component on the chassis, which serves as the basic support structure of the device, a good heat conduction path is provided. The chassis, equipped with a second mounting hole, allows for precise positioning of the chip heatsink. When the heatsink is mounted on the circuit board, the second mounting hole aligns precisely with the corresponding mounting point, ensuring good contact between the heatsink and the chip. This allows for direct collection of heat conducted from the chip to the chassis, improving heat dissipation efficiency. Furthermore, the fourth heat dissipation component features a fourth heat dissipation channel, which facilitates natural air convection around the chip. This channel precisely draws in cool air, which absorbs heat through the heat dissipation component and other structures before being expelled, creating a good thermal convection cycle and further enhancing the overall heat dissipation efficiency. The fourth heat dissipation channel also helps to quickly dissipate hot air, preventing it from accumulating on the chip. The fifth heat dissipation component, mounted on the fourth heatsink and the chassis, completes the structure of the chip heatsink, forming an organic whole that promotes stable heat conduction and dissipation between components. This also constitutes a multi-layer heat dissipation structure. Because the fifth heat dissipation component has a fifth heat dissipation channel, the heat dissipation area is expanded, improving heat dissipation efficiency and preventing localized overheating of the chip. This layout enhances heat dissipation capacity without increasing the device size. By distributing multiple fourth heat dissipation components on both sides of the fifth heat dissipation component, the heat dissipation area is significantly expanded. The distribution of multiple fourth heat dissipation components on both sides of the fifth heat dissipation component increases the contact area between the heat dissipation components and the surrounding air. Heat exchange mainly occurs on the surface of the heat dissipation components; the larger the contact area, the more air can be exchanged. Simultaneously, this structure better balances heat distribution, preventing overheating due to excessive heat concentration in localized areas, ensuring that all parts of the chip operate within a suitable temperature range.By setting multiple fourth and fifth heat dissipation channels, more paths are provided for airflow. During thermal convection, cool air continuously enters through these channels, carrying away the heat absorbed by the fourth and fifth heat dissipation components. The hot air is then quickly expelled, effectively accelerating heat dissipation. Each heat dissipation channel can be considered a small heat dissipation area. Multiple channels increase the total contact area between the heat dissipation components and the air. Heat exchange primarily occurs on the air-contact surfaces of the fourth and fifth heat dissipation components; more channels mean more areas involved in heat exchange, thus improving overall heat dissipation efficiency and more effectively handling the large amounts of heat generated by the chip. The notch provides a location for the second mounting holes. The multiple second mounting holes offer more options and flexibility for chip heat sink installation, while also ensuring a more secure mounting of the chip heat sink onto the circuit board.
[0015] In one embodiment, the fourth heat dissipation component includes a fourth heat dissipation base and a fourth heat sink. The fourth heat dissipation base is disposed on the chassis, and there are multiple fourth heat sinks spaced apart along the length of the fourth heat dissipation base, forming fourth heat dissipation channels between adjacent fourth heat sinks. By arranging multiple fourth heat sinks spaced apart along the length of the fourth heat dissipation base, and these intervals forming multiple fourth heat dissipation channels, favorable conditions for heat convection are created. The fourth heat dissipation channels provide a direct passage for cold air to enter between the heat sinks. Cold air can penetrate deep into the area between the heat sinks along these channels, fully contact the fourth heat sinks, absorb heat, and become hot air. The hot air rises due to increased temperature and decreased density, and then is discharged from other vents or the top of the device. This natural heat convection cycle can continuously remove heat, making the heat dissipation process more efficient. At the same time, the heat distribution generated by the chip during operation may be uneven. By spaced out multiple fourth heat sinks, the heat can be distributed more evenly inside the fourth heat dissipation component. Heat is conducted from the fourth heat sink base to each of the fourth heat sinks. Since the heat sinks are spaced apart, the heat is not concentrated in one area, but is distributed across multiple fourth heat sinks. This balanced heat distribution can prevent local overheating and ensure the stable performance of the entire chip heat sink.
[0016] In one embodiment, the fifth heat dissipation component includes a fifth heat dissipation base and a fifth heat sink. The fifth heat dissipation base is disposed on the fourth heat dissipation component and / or the chassis. Multiple fifth heat sinks are spaced apart along the length of the fifth heat dissipation base, forming fifth heat dissipation channels between adjacent fifth heat sinks. By arranging multiple fifth heat sinks spaced apart along the length of the fifth heat dissipation base, and these intervals forming multiple fifth heat dissipation channels, favorable conditions for heat convection are created. The fifth heat dissipation channels provide a direct passage for cold air to enter between the heat sinks. Cold air can penetrate deep into the area between the heat sinks along these channels, fully contacting the fifth heat sinks, absorbing heat, and becoming hot air. The hot air rises due to increased temperature and decreased density, and then is discharged from other vents or the top of the device. This natural heat convection cycle can continuously remove heat, making the heat dissipation process more efficient. Simultaneously, the heat distribution generated by the chip during operation may be uneven. By spaced out multiple fifth heat sinks, the heat distribution within the fifth heat dissipation component can be made more uniform. Heat is conducted from the fifth heat sink base to each of the fifth heat sinks. Since the heat sinks are spaced apart, the heat is not concentrated in one area, but is distributed across multiple fifth heat sinks. This balanced heat distribution can prevent local overheating and ensure the stable performance of the entire chip heat sink.
[0017] In one embodiment, the locking assembly includes a locking member and a spring. The spring is disposed on the locking member, which passes through the raised heat sink, the chip heat sink, and the circuit board. By placing the spring on the locking member and then using the locking member to fix the chip heat sink to the circuit board, the spring provides cushioning for the chip heat sink. When the device is subjected to unexpected physical impact or vibration, the chip heat sink is connected to the spring through the locking member. The elastic deformation of the spring reduces the direct transmission of impact force to the chip heat sink and the chip on the circuit board. This effectively prevents the chip heat sink from being damaged by sudden, strong impacts and protects the chip from physical damage, ensuring that the normal function of the chip is not affected. Secondly, the locking member can easily and firmly fix the chip heat sink to the circuit board, effectively preventing the chip heat sink from shifting during device operation, ensuring that the heat sink is always in the correct position. This fixing structure is not easily damaged by the heat sink and helps maintain stable heat dissipation. Attached Figure Description
[0018] Figure 1 The first perspective view of the raised radiator;
[0019] Figure 2 This is a second perspective view of a raised radiator;
[0020] Figure 3 This is a third perspective view of a raised radiator;
[0021] Figure 4 A 3D view of the circuit components;
[0022] Figure 5 This is a first perspective view of the chip heat sink;
[0023] Figure 6 This is a second perspective view of the chip heat sink;
[0024] Figure 7 This is a third-dimensional view of the chip heat sink.
[0025] The correspondence between the reference numerals and the component names is as follows:
[0026] 1. Fixed base plate; 101. First assembly hole; 102. Fixed idle opening;
[0027] 2 raised components, 21 connecting plate, 22 extension plate, 201 raised heat dissipation groove, 202 recess;
[0028] 3 heat dissipation components, 31 first heat dissipation component, 311 first heat dissipation fin, 312 second heat dissipation fin, 313 third heat dissipation fin, 314 first connecting block, 32 second heat dissipation component, 321 edge heat dissipation fin, 322 middle heat dissipation fin, 323 second connecting block, 301 first heat dissipation channel, 302 second heat dissipation channel;
[0029] 100-chip heatsink;
[0030] 4. Chassis, 401 second assembly hole;
[0031] 5 Fourth heat dissipation component, 51 Fourth heat dissipation base, 52 Fourth heat dissipation fin, 501 Fourth heat dissipation channel, 502 Notch;
[0032] 6 Fifth heat dissipation component, 61 Fifth heat dissipation base, 62 Fifth heat sink, 601 Fifth heat dissipation channel;
[0033] 7 circuit boards;
[0034] 8 chips;
[0035] 9. Locking assembly, 91. Locking element, 92. Spring;
[0036] 10. Electronic components. Detailed Implementation
[0037] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.
[0038] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.
[0039] The raised heat sink and circuit components of this utility model are described below with reference to the accompanying drawings.
[0040] Example 1
[0041] like Figures 1 to 3 As shown, this embodiment discloses a raised heat sink, including: a fixed base plate 1, which has a first mounting hole 101 and a fixed idle opening 102, and the number of the first mounting holes 101 and the fixed idle openings 102 is multiple, with the multiple first mounting holes 101 and the multiple fixed idle openings 102 corresponding to each other; a raised component 2, which is disposed on the fixed base plate 1; and a heat dissipation component 3, which is multiple, and the multiple heat dissipation components 3 are spaced apart along the length direction of the fixed base plate 1 and the raised component 2 to form multiple first heat dissipation channels 301, and the heat dissipation components 3 have multiple second heat dissipation channels 302, with the multiple first heat dissipation channels 301 and the multiple second heat dissipation channels 302 being interconnected.
[0042] This application discloses a raised radiator. The raised component 2 is mounted on a fixed base plate 1, which provides a solid foundation for the raised component 2, ensuring the integrity of the radiator structure. Multiple heat dissipation components 3 are mounted on the fixed base plate 1 and the raised component 2. Each heat dissipation component 3 has multiple first heat dissipation channels 301 and multiple second heat dissipation channels 302, which are interconnected and interleaved. The distribution of multiple heat dissipation components 3 on the fixed base plate 1 and the raised component 2 significantly increases the surface area of the radiator in contact with the air. Heat dissipation mainly occurs through heat conduction, heat convection, and heat radiation. Increasing the surface area in contact with the air effectively improves the efficiency of heat convection. The presence of the first and second heat dissipation channels 301 further increases this surface area. These channels make the surface of the heat dissipation component 3 no longer flat, but with more edges and corners, allowing air to better contact these complex surfaces and carry away more heat. Secondly, the staggered design of the first heat dissipation channel 301 and the second heat dissipation channel 302 creates a complex yet orderly path for airflow. When air flows through the heat dissipation component 3, this staggered channel structure guides the air to form complex flow patterns inside and on the surface of the heat dissipation component 3. The air does not simply flow in a straight line, but shuttles between the channels, prolonging the residence time of the air in the heat sink, allowing heat to be better dissipated into the air, improving heat dissipation efficiency, avoiding local overheating, and ensuring the stable operation of the chip.
[0043] like Figure 1 and Figure 2 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the number of protruding components 2 is multiple, and the multiple protruding components 2 are respectively disposed on both sides of the fixed base plate 1, forming multiple protruding heat dissipation grooves 201 with the fixed base plate 1. By arranging multiple protruding components 2 on both sides of the fixed base plate 1, and forming multiple protruding heat dissipation grooves 201 with the fixed base plate 1, the heat dissipation area is significantly increased. Heat is conducted from the fixed base plate 1 to the protruding components 2, and the presence of the protruding heat dissipation grooves 201 allows air to contact more heat dissipation surfaces. At the same time, the protruding heat dissipation grooves 201 can guide airflow, forming more effective thermal convection, making it easier for hot air to rise and be discharged from the grooves, while allowing cool air to smoothly enter the grooves for replenishment, thereby improving heat dissipation efficiency.
[0044] like Figure 1 and Figure 2As shown, in addition to the features of the above embodiments, this embodiment further specifies that the protruding component 2 is provided with a groove 202. By providing the groove 202 on the protruding component 2, the shape and distribution of the groove 202 can guide the placement of the fingers, allowing the fingers to better fit against the surface of the protruding component 2. This fitting method helps to distribute the grip force applied by the hand more evenly on the contact surface, further enhancing the stability of the grip. At the same time, when picking up the radiator, the hand muscles need to act on the radiator through the fingers to overcome the gravity of the radiator. The presence of the groove 202 allows the fingers to accurately find the point of force application and effectively transfer the force to the radiator.
[0045] like Figure 1 and Figure 3 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the multiple heat dissipation components 3 are multiple first heat dissipation elements 31 and multiple second heat dissipation elements 32. One end of the first heat dissipation element 31 is disposed on the protruding component 2, and the other end of the first heat dissipation element 31 is disposed opposite to the fixed idle opening 102. The second heat dissipation elements 32 are disposed on the fixed base plate 1 and both ends are located on the protruding component 2. Multiple first heat dissipation channels 301 penetrate the multiple first heat dissipation elements 31 and the multiple second heat dissipation elements 32. The spacing between adjacent first heat dissipation elements 31 and / or second heat dissipation elements 32 forms a second heat dissipation channel 302. By setting the heat dissipation components 3 with first heat dissipation elements 31 and multiple second heat dissipation elements 32, the first heat dissipation element 31 can better adapt to the shape of the fixed base plate 1. The shape of the first heat dissipation element 31 can ensure that the fixed base plate 1 can leave space for the fixed idle opening 102, ensuring that the protruding heat sink can be stably fixed on the circuit board. The second heat sink 32 is relatively large, and its larger heat dissipation area can maximize the dissipation of heat absorbed by the mounting base 1, preventing heat accumulation on the mounting base 1. This would prevent the chip in contact with the mounting base 1 from being unable to dissipate heat, affecting the chip's operating status and shortening its lifespan. Multiple first heat dissipation channels 301 and multiple second heat dissipation channels 302 allow hot air to flow out quickly while cool air can replenish it in a timely manner, forming good heat exchange. This accelerates the transfer of heat from the chip heat sink to the external environment, preventing excessive heat accumulation on the heat sink, thus maintaining the chip within a suitable operating temperature range, ensuring stable chip performance, and preventing frequency throttling or even damage due to overheating.
[0046] like Figure 1 and Figure 3As shown, in addition to the features of the above embodiments, this embodiment further defines that: the first heat sink 31 includes a first heat sink 311, a second heat sink 312, a third heat sink 313 and a first connecting block 314. The first heat sink 311 is disposed on the fixed base plate 1 and the protruding component 2. The second heat sink 312 is disposed on the fixed base plate 1. The third heat sink 313 is disposed on the fixed base plate 1 and is disposed opposite to the fixed idle port 102. There are multiple first connecting blocks 314, and multiple first connecting blocks 314 connect the first heat sink 311, the second heat sink 312 and the third heat sink 313 in sequence. By placing the first heat sink 311 on the fixed base plate 1 and the protruding component 2, the second heat sink 312 on the fixed base plate 1, and the third heat sink 313 on the fixed base plate 1 and opposite to the fixed unused opening 102, this layout is a layered space utilization method. Each heat sink occupies a different position. The first heat sink 311 utilizes the space between the fixed base plate 1 and the protruding component 2, the second heat sink 312 increases the heat dissipation area on the plane of the fixed base plate 1, and the third heat sink 313 is positioned specifically for the fixed unused opening 102. This layout maximizes the use of internal space for heat sink placement without increasing the overall size of the device, thus improving heat dissipation capacity. Multiple first connecting blocks 314 sequentially connect the first heat sink 311, the second heat sink 312, and the third heat sink 313, forming a more efficient heat conduction path. This coordinated heat conduction method allows for a more even distribution of heat among the different heat sinks, preventing one heat sink from overheating while others are underutilized.
[0047] like Figure 1 and Figure 3As shown, in addition to the features of the above embodiments, this embodiment further defines the following: the second heat sink 32 includes edge heat sinks 321, intermediate heat sinks 322, and second connecting blocks 323. There are multiple edge heat sinks 321, which are disposed on the fixed base plate 1 and the protruding assembly 2. There are also multiple intermediate heat sinks 322, which are disposed on the fixed base plate 1. There are also multiple second connecting blocks 323, which sequentially connect the multiple edge heat sinks 321 and the multiple intermediate heat sinks 322. By disposing of multiple edge heat sinks 321 on the fixed base plate 1 and the protruding assembly 2, and multiple intermediate heat sinks 322 on the fixed base plate 1, the heat dissipation area is significantly increased. The different positions of the edge heat sinks 321 and the intermediate heat sinks 322 diversify the heat conduction paths. The fixed base plate 1, as the basic component for heat conduction, can transfer heat from the heat source to the edge heat sinks 321 and the intermediate heat sinks 322. The edge heat sink 321, located at the edge of the fixed base plate 1 and the raised component 2, can dissipate heat to the edge of the device and the external space; the middle heat sink 322 focuses on heat dissipation near the center area of the fixed base plate 1. This multi-path heat conduction method can dissipate heat more efficiently and avoid heat accumulation.
[0048] like Figure 1 and Figure 2 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the protruding component 2 includes a connecting plate 21 and an extension plate 22. The connecting plate 21 is disposed on the fixed base plate 1, the extension plate 22 is disposed on the connecting plate 21, and the heat dissipation component 3 is disposed on the connecting plate 21 and the extension plate 22. By disposing the connecting plate 21 on the fixed base plate 1 and the extension plate 22 on the connecting plate 21, the stability of the extension plate 22 is enhanced, and the spatial layout of the protruding heat sink on the circuit board can also be optimized. By disposing the heat dissipation component 3 on the connecting plate 21 and the extension plate 22, the heat absorbed by the protruding heat sink can be transferred to the extension plate 22 through the connecting plate 21. The extension plate 22 increases the contact area with the air, and according to the principle of heat exchange, the heat is more easily dissipated into the surrounding air, avoiding the accumulation of heat in certain sensitive areas on the circuit board and extending the service life of the circuit components.
[0049] Example 2
[0050] like Figures 4 to 7As shown, this embodiment discloses a circuit assembly, including: the aforementioned raised heat sink; a chip heat sink 100; a circuit board 7, on which the raised heat sink and the chip heat sink 100 are disposed; a chip 8, which is sandwiched between the raised heat sink, the chip heat sink 100, and the circuit board 7; a locking assembly 9, of which there are multiple locking assemblies 9, which are respectively passed through the raised heat sink and the chip heat sink 100 and respectively fixed to the circuit board 7; and an electronic component 10, which is disposed on the circuit board 7.
[0051] The second aspect of this application discloses a circuit assembly in which multiple chip heat sinks 100 and raised heat sinks are mounted on a circuit board 7 using multiple locking components 9, and multiple chips 8 are correspondingly clamped between the circuit board 7 and the chip heat sinks 100. This ensures tight, direct contact between the chips 8 and the heat sinks, providing excellent conditions for heat conduction. The heat generated by the chips 8 during operation can be quickly transferred to the heat sinks via conduction, while reducing thermal resistance and effectively dissipating the heat generated by the chips. Furthermore, multiple chips 8 typically generate uneven heat distribution on the circuit board 7. By equipping each chip 8 with a corresponding chip heat sink 100, the heat generated by each chip 8 can be handled separately. The heat sinks can absorb and dissipate the heat from the chips 8, preventing heat accumulation around them. This effectively disperses heat, effectively controls the operating temperature of the chips 8, and prevents performance degradation, malfunctions, or even damage due to overheating. It also prevents the performance of the entire circuit board 7 from being affected by overheating of a single chip 8 in a localized area. The chip heat sink 100 also provides heat dissipation for the electronic components 10 mounted on the circuit board 7, ensuring that the electronic components 10 can also be used normally.
[0052] like Figures 5 to 7As shown, in addition to the features of the above embodiments, this embodiment further defines: the chip heat sink 100 includes: a chassis 4, the chassis 4 having a second mounting hole 401, the number of the second mounting holes 401 being multiple; a fourth heat sink component 5, the fourth heat sink component 5 being disposed on the chassis 4, the fourth heat sink component 5 having a fourth heat sink channel 501, the number of the fourth heat sink channel 501 being multiple, the fourth heat sink component 5 having a notch 502, the notch 502 being disposed opposite to the second mounting hole 401; a fifth heat sink component 6, the fifth heat sink component 6 being disposed on the chassis 4, the fifth heat sink component 6 having a fifth heat sink channel 601, the number of the fifth heat sink channel 601 being multiple; the number of the fourth heat sink components 5 is multiple, the multiple fourth heat sink components 5 being disposed on both sides of the fifth heat sink component 6; the chassis 4, the fourth heat sink component 5 and the fifth heat sink component 6 are integrally formed. By mounting the fourth heat dissipation component 5 on the chassis 4, which serves as the basic support structure of the device, a good heat conduction path can be provided. The chassis 4, equipped with a second mounting hole 401, provides precise positioning for the chip heat sink 100. When the chip heat sink 100 is mounted on the circuit board, the second mounting hole 401 can be precisely aligned with the corresponding mounting point, ensuring good contact between the chip heat sink 100 and the chip. This allows for direct collection of heat conducted from the chip to the chassis 4, improving heat dissipation efficiency. Furthermore, the fourth heat dissipation component 5 has a fourth heat dissipation channel 501, which facilitates natural convection of air around the chip. The fourth heat dissipation channel 501 can more precisely draw in cool air, which, after absorbing heat through the fourth heat dissipation component 5 and other structures, is then expelled, forming a good thermal convection cycle and further improving the overall heat dissipation efficiency of the device. Moreover, the fourth heat dissipation channel 501 also helps to quickly dissipate hot air during exhaust, preventing hot air accumulation on the chip. The fifth heat dissipation component 6 is placed on the fourth heat dissipation component 5 and the chassis 4, forming the structure of the entire chip heat sink 100, creating an organic whole that facilitates stable heat conduction and dissipation between components. It also constitutes a multi-layer heat dissipation structure. Because the fifth heat dissipation component 6 has a fifth heat dissipation channel 601, the heat dissipation area is expanded, improving heat dissipation efficiency and preventing localized overheating of the chip. This layout enhances heat dissipation capacity without increasing the device size. By distributing multiple fourth heat dissipation components 5 on both sides of the fifth heat dissipation component 6, the heat dissipation area is significantly expanded. The distribution of multiple fourth heat dissipation components 5 on both sides of the fifth heat dissipation component 6 increases the contact area between the heat dissipation components and the surrounding air. Heat exchange mainly occurs on the surface of the heat dissipation components; the larger the contact area, the more air can exchange heat. Simultaneously, this structure better balances heat distribution, preventing overheating in localized areas due to excessive heat concentration, ensuring that all parts of the chip operate within a suitable temperature range.By providing multiple fourth and fifth heat dissipation channels 501 and 601, more paths are provided for airflow. During thermal convection, cool air continuously enters through these channels, carrying away the heat absorbed by the fourth and fifth heat dissipation components 5 and 6. The hot air is then quickly expelled, effectively accelerating heat dissipation. Each heat dissipation channel can be considered a small heat dissipation area. Multiple channels increase the total contact area between the heat dissipation components and the air. Heat exchange primarily occurs on the surfaces of the fourth and fifth heat dissipation components 5 and 6 in contact with the air. More channels mean more areas participating in heat exchange, thus improving overall heat dissipation efficiency and more effectively handling the large amount of heat generated by the chip. The notch 502 provides a location for the second mounting hole 401. The multiple second mounting holes 401 provide more options and flexibility for installing the chip heat sink 100, while also ensuring a more secure mounting of the chip heat sink 100 onto the circuit board.
[0053] like Figure 5 and Figure 6 As shown, in addition to the features of the above embodiments, this embodiment further defines: the fourth heat dissipation component 5 includes a fourth heat dissipation base 51 and fourth heat dissipation fins 52. The fourth heat dissipation base 51 is disposed on the chassis 4. There are multiple fourth heat dissipation fins 52, which are spaced apart along the length direction of the fourth heat dissipation base 51, and fourth heat dissipation channels 501 are formed between adjacent fourth heat dissipation fins 52. By arranging multiple fourth heat dissipation fins 52 spaced apart along the length direction of the fourth heat dissipation base 51, and these intervals forming multiple fourth heat dissipation channels 501, favorable conditions for heat convection are created. The fourth heat dissipation channels 501 provide a channel for cold air to directly enter between the heat dissipation fins. The cold air can penetrate deep into the area between the heat dissipation fins along these channels, fully contact the fourth heat dissipation fins 52, absorb heat and become hot air. The hot air rises due to the increase in temperature and decrease in density, and then is discharged from other vents or the top of the equipment. This natural heat convection cycle can continuously remove heat, making the heat dissipation process more efficient. Meanwhile, the heat generated by the chip during operation may be unevenly distributed. By spaced out multiple fourth heat sinks 52, the heat can be distributed more evenly within the fourth heat dissipation component 5. Heat is conducted from the fourth heat sink base 51 to each of the fourth heat sinks 52. Because the heat sinks are spaced out, the heat is not concentrated in one area, but is dispersed across multiple fourth heat sinks 52. This balanced heat distribution can prevent localized overheating and ensure the stable performance of the entire chip heat sink 100.
[0054] like Figure 5 and Figure 7As shown, in addition to the features of the above embodiments, this embodiment further defines: the fifth heat dissipation component 6 includes a fifth heat dissipation base 61 and a fifth heat dissipation fin 62. The fifth heat dissipation base 61 is disposed on the fourth heat dissipation component 5 and / or the chassis 4. Multiple fifth heat dissipation fins 62 are spaced apart along the length of the fifth heat dissipation base 61, and a fifth heat dissipation channel 601 is formed between adjacent fifth heat dissipation fins 62. By arranging multiple fifth heat dissipation fins 62 spaced apart along the length of the fifth heat dissipation base 61, and these intervals forming multiple fifth heat dissipation channels 601, favorable conditions for heat convection are created. The fifth heat dissipation channels 601 provide a direct channel for cold air to enter between the heat dissipation fins. Cold air can penetrate deep into the area between the heat dissipation fins along these channels, fully contact the fifth heat dissipation fins 62, absorb heat, and become hot air. The hot air rises due to increased temperature and decreased density, and then is discharged from other vents or the top of the equipment. This natural heat convection cycle can continuously remove heat, making the heat dissipation process more efficient. Meanwhile, the heat generated by the chip during operation may be unevenly distributed. By spaced out multiple fifth heat sinks 62, the heat can be distributed more evenly within the fifth heat dissipation component 6. Heat is conducted from the fifth heat sink base 61 to each of the fifth heat sinks 62. Because the heat sinks are spaced out, the heat is not concentrated in one area but is dispersed across multiple fifth heat sinks 62. This balanced heat distribution can prevent localized overheating and ensure the stable performance of the entire chip heat sink 100.
[0055] like Figure 4 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the locking assembly 9 includes a locking member 91 and a spring 92, the spring 92 is disposed on the locking member 91, and the locking member 91 passes through the raised heat sink, the chip heat sink 100, and the circuit board 7 respectively. By disposing of the spring 92 on the locking member 91, and then using the locking member 91 to fix the chip heat sink 100 to the circuit board 7, the presence of the spring 92 can firstly provide cushioning for the chip heat sink 100. When the device is subjected to unexpected physical impact or vibration, the chip heat sink 100 is connected to the spring 92 through the locking member 91. The elastic deformation of the spring 92 can reduce the impact force directly transmitted to the chip heat sink 100 and the chip 8 on the circuit board 7. This can effectively prevent the chip heat sink 100 from being damaged by sudden and strong impact, and also protect the chip 8 from physical damage, ensuring that the normal function of the chip 8 is not affected. Secondly, the locking component 91 can easily and firmly fix the chip heat sink 100 to the circuit board 7, which can effectively prevent the chip heat sink 100 from shifting during the operation of the device, ensuring that the heat sink is always in the correct position. This fixing structure is not easy to damage the heat sink and helps to maintain stable heat dissipation function.
[0056] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0057] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A raised radiator, characterized in that, The raised radiator includes: A fixed base plate (1) is provided with a first assembly hole (101) and a fixed idle port (102). The number of the first assembly hole (101) and the fixed idle port (102) is multiple, and the multiple first assembly holes (101) and the multiple fixed idle ports (102) are matched one-to-one. A protruding component (2) is disposed on the fixed base plate (1); The heat dissipation assembly (3) is a plurality of such heat dissipation assemblies (3). The plurality of heat dissipation assemblies (3) are spaced apart along the length direction of the fixed base plate (1) and the protruding assembly (2) to form a plurality of first heat dissipation channels (301). The heat dissipation assembly (3) is provided with a plurality of second heat dissipation channels (302). The plurality of first heat dissipation channels (301) and the plurality of second heat dissipation channels (302) are interconnected in an alternating manner.
2. The raised radiator according to claim 1, characterized in that, The number of the protruding components (2) is multiple, and the multiple protruding components (2) are respectively disposed on both sides of the fixed base plate (1). The multiple protruding components (2) and the fixed base plate (1) form multiple protruding heat dissipation grooves (201). And / or the protruding component (2) is provided with a groove (202).
3. The raised radiator according to claim 1, characterized in that, The plurality of heat dissipation components (3) are a plurality of first heat dissipation components (31) and a plurality of second heat dissipation components (32). One end of the first heat dissipation component (31) is disposed on the protruding component (2), and the other end of the first heat dissipation component (31) is disposed opposite to the fixed idle port (102). The second heat dissipation component (32) is disposed on the fixed base plate (1) and both ends are located on the protruding component (2). A plurality of first heat dissipation channels (301) penetrate the plurality of first heat dissipation components (31) and the plurality of second heat dissipation components (32). The interval between adjacent first heat dissipation components (31) and / or second heat dissipation components (32) forms the second heat dissipation channels (302).
4. The raised radiator according to claim 3, characterized in that, The first heat sink (31) includes a first heat sink (311), a second heat sink (312), a third heat sink (313), and a first connecting block (314). The first heat sink (311) is disposed on the fixed base plate (1) and the protruding assembly (2). The second heat sink (312) is disposed on the fixed base plate (1). The third heat sink (313) is disposed on the fixed base plate (1) and is disposed opposite to the fixed idle port (102). There are multiple first connecting blocks (314). Multiple first connecting blocks (314) connect the first heat sink (311), the second heat sink (312), and the third heat sink (313) in sequence. And / or the second heat sink (32) includes an edge heat sink (321), an intermediate heat sink (322), and a second connecting block (323). There are multiple edge heat sinks (321), which are disposed on the fixed base plate (1) and the protruding assembly (2). There are multiple intermediate heat sinks (322), which are disposed on the fixed base plate (1). There are multiple second connecting blocks (323), which connect the multiple edge heat sinks (321) and the multiple intermediate heat sinks (322) in sequence.
5. The raised radiator according to claim 1, characterized in that, The protrusion assembly (2) includes a connecting plate (21) and an extension plate (22). The connecting plate (21) is disposed on the fixed base plate (1), and the extension plate (22) is disposed on the connecting plate (21). The heat dissipation assembly (3) is disposed on the connecting plate (21) and the extension plate (22).
6. A circuit component, characterized in that, The circuit components include: The raised radiator according to any one of claims 1 to 5; Chip heat sink (100); Circuit board (7), the raised heat sink and the chip heat sink (100) are disposed on the circuit board (7); Chip (8), the chip (8) is sandwiched between the raised heat sink and the chip heat sink (100) and the circuit board (7); Locking components (9), there are multiple locking components (9), and the multiple locking components (9) are respectively inserted through the protruding heat sink and the chip heat sink (100) and respectively fixed on the circuit board (7); Electronic component (10) is disposed on the circuit board (7).
7. The circuit assembly according to claim 6, characterized in that, The chip heat sink (100) includes: The chassis (4) is provided with a second mounting hole (401), and the number of the second mounting holes (401) is multiple; The fourth heat dissipation component (5) is disposed on the chassis (4). The fourth heat dissipation component (5) is provided with a fourth heat dissipation channel (501). The number of the fourth heat dissipation channel (501) is multiple. The fourth heat dissipation component (5) is provided with a notch (502). The notch (502) is disposed opposite to the second mounting hole (401). The fifth heat dissipation component (6) is disposed on the chassis (4). The fifth heat dissipation component (6) is provided with a fifth heat dissipation channel (601). The number of the fifth heat dissipation channel (601) is multiple. The number of the fourth heat dissipation components (5) is multiple, and the multiple fourth heat dissipation components (5) are respectively disposed on both sides of the fifth heat dissipation component (6); The chassis (4), the fourth heat dissipation component (5), and the fifth heat dissipation component (6) are integrally formed.
8. The circuit assembly according to claim 7, characterized in that, The fourth heat dissipation component (5) includes a fourth heat dissipation base (51) and a fourth heat dissipation fin (52). The fourth heat dissipation base (51) is disposed on the chassis (4). There are multiple fourth heat dissipation fins (52), which are spaced apart along the length of the fourth heat dissipation base (51). The fourth heat dissipation channel (501) is formed between adjacent fourth heat dissipation fins (52).
9. The circuit assembly according to claim 7, characterized in that, The fifth heat dissipation component (6) includes a fifth heat dissipation base (61) and a fifth heat dissipation fin (62). The fifth heat dissipation base (61) is disposed on the fourth heat dissipation component (5) and / or the chassis (4). There are multiple fifth heat dissipation fins (62), which are spaced apart along the length of the fifth heat dissipation base (61). The fifth heat dissipation channel (601) is formed between adjacent fifth heat dissipation fins (62).
10. The circuit assembly according to claim 9, characterized in that, The locking assembly (9) includes a locking member (91) and a spring (92). The spring (92) is disposed on the locking member (91). The locking member (91) passes through the raised heat sink, the chip heat sink (100), and the circuit board (7).