Optical communication module packaging tube shell

Abstract

The utility model relates to the technical field of packaging tube shells, and discloses an optical communication module packaging tube shell which comprises a tube shell body, a substrate is fixedly connected to the inner wall of the tube shell body, a mounting groove is formed in the outer wall of the substrate, a module chip is mounted on the outer wall of the mounting groove, and a plurality of welding spots are arranged on the outer walls of the two sides of the module chip. The inner walls of the two sides of the tube shell body are each provided with a plurality of pins, the pins correspond to the welding spots in a one-to-one mode, gold threads are arranged between the pins and the welding spots, the gold threads are connected with the welding spots and the pins, a sealing groove is formed in the outer wall of the tube shell body, and a cover plate is installed on the outer wall of the sealing groove. The optical communication module can timely dissipate heat generated in the optical communication module, effectively reduces the temperature of internal devices, improves the stability of the devices, and prolongs the service life of the devices. And meanwhile, internal precise photoelectric devices can be protected from being polluted and damaged, and stable transmission quality of optical signals is ensured.

Description

Technical Field

[0001] This application relates to the field of packaging technology, and in particular to a packaging shell for an optical communication module. Background Technology

[0002] In today's information society, the amount of data is growing explosively, constantly increasing the demands on communication bandwidth and transmission rates. Optical communication, with its advantages of high speed, high bandwidth, and low latency, has become the cornerstone of modern communication networks, and optical communication modules are the key components for realizing optical communication.

[0003] Regarding the aforementioned technologies, the inventors believe that during the operation of an optical communication module, the internal optoelectronic devices generate a large amount of heat. If heat cannot be dissipated in time, it will lead to a decrease in device performance or even damage, affecting the stability and lifespan of the optical communication module. On the other hand, the sealing performance of the casing is not ideal, and external dust, moisture, etc. can easily enter the casing, causing contamination and damage to the delicate optoelectronic devices, thereby affecting the transmission quality of optical signals. Therefore, an optical communication module encapsulation casing is proposed to solve the above problems.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Utility Model Content

[0005] To address the aforementioned issues, this application provides a packaging shell for an optical communication module.

[0006] The optical communication module packaging shell provided in this application adopts the following technical solution:

[0007] An optical communication module packaging shell includes a shell body, a substrate fixedly connected to the inner wall of the shell body, a mounting groove formed on the outer wall of the substrate, a module chip mounted on the outer wall of the mounting groove, a plurality of solder joints on both sides of the outer wall of the module chip, a plurality of pins formed on both sides of the inner wall of the shell body, and a plurality of pins corresponding one-to-one with a plurality of solder joints, a gold wire provided between the pins and the solder joints, and the gold wire connected to the solder joints and the pins, a sealing groove formed on the outer wall of the shell body, and a cover plate installed on the outer wall of the sealing groove.

[0008] Preferably, multiple mounting stickers are provided on both sides of the substrate, and a heat-conducting plate assembly for heat dissipation is provided above the module chip, and the heat-conducting plate assembly is adapted to the multiple mounting stickers.

[0009] Preferably, the outer wall of the mounting groove is provided with a silver paste adhesive layer, and the mounting groove is installed and fixed to the module chip through the silver paste adhesive layer.

[0010] Preferably, an epoxy resin sealant and a fluororubber sealing ring are provided between the cover plate and the sealing groove for sealing and fixing.

[0011] In summary, this application includes the following beneficial technical effects:

[0012] The mounting slots and silver paste adhesive layer allow the module chip to be mounted onto the substrate via the mounting slots and silver paste adhesive layer. The substrate is made of ceramic to facilitate heat dissipation from the module chip. A heat-conducting plate assembly is then installed on the module chip to further dissipate heat, improving the device's heat dissipation performance. Epoxy resin sealant is applied to the sealing slots, allowing the fluororubber sealing ring to mate with the slots. Finally, the cover plate is installed onto the sealing slots, improving the device's sealing performance. Compared to existing technologies, this method effectively dissipates heat generated inside the optical communication module, reducing the temperature of internal components and improving device stability and lifespan. It also protects the delicate internal optoelectronic components from contamination and damage, ensuring stable optical signal transmission quality. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the interior of the main body of the tube in Embodiment 1 of the application;

[0014] Figure 2 This is an overall schematic diagram of Embodiment 1 of the application;

[0015] Figure 3 This is a schematic diagram of the module chip structure of Embodiment 1.

[0016] Figure 4 This is a schematic diagram of the mounting slot structure in Embodiment 1 of the application.

[0017] Figure 5 for Figure 3 Enlarged schematic diagram of the structure at point A in the middle.

[0018] Explanation of reference numerals in the attached drawings: 1. Tube shell body; 2. Cover plate; 4. Module chip; 5. Mounting sticker; 6. Pin; 7. Solder joint; 8. Gold wire; 9. Silver paste adhesive layer; 10. Substrate; 11. Heat-conducting plate assembly; 12. Mounting groove; 13. Sealing groove. Detailed Implementation

[0019] The following is in conjunction with the appendix Figure 1 - Figure 5 This application will be described in further detail.

[0020] Example 1:

[0021] An optical communication module packaging shell includes a shell body 1, with a substrate 10 fixedly connected to the inner wall of the shell body 1. The substrate 10 is made of aluminum nitride ceramic material to improve the heat dissipation of the device. A mounting groove 12 is formed on the outer wall of the substrate 10, and a module chip 4 is mounted on the outer wall of the mounting groove 12. The mounting groove 12 facilitates the installation of the module chip 4. Several solder points 7 are provided on both sides of the outer wall of the module chip 4. Several pins 6 are provided on both sides of the inner wall of the shell body 1, and the several pins 6 correspond one-to-one with the several solder points 7. A gold wire 8 is provided between the pins 6 and the solder points 7, and the gold wire 8 is connected to the solder points 7 and the pins 6. The solder points 7 on both sides of the module chip 4 are connected to the pins 6 through the gold wire 8, thereby facilitating the operation of the module chip 4. A sealing groove 13 is formed on the outer wall of the shell body 1, and a cover plate 2 is installed on the outer wall of the sealing groove 13. The cover plate 2 and the sealing groove 13 are installed to improve the internal sealing performance and prevent damage to the internal components.

[0022] Multiple mounting stickers 5 are provided on both sides of the substrate 10. The multiple mounting stickers 5 facilitate the fixed installation of the heat conduction plate assembly 11. A heat conduction plate assembly 11 for heat dissipation is provided on the top of the module chip 4. The heat conduction plate assembly 11 is compatible with the multiple mounting stickers 5. The heat conduction plate assembly 11 facilitates further heat dissipation of the module chip 4, ensuring the protection of the operation of internal components.

[0023] The outer wall of the mounting slot 12 is provided with a silver paste adhesive layer 9, and the mounting slot 12 is installed and fixed to the module chip 4 through the silver paste adhesive layer 9. The silver paste adhesive layer 9 facilitates the installation of the module chip 4.

[0024] The cover plate 2 and the sealing groove 13 are provided with epoxy resin sealant and fluororubber sealing ring for sealing and fixing. By applying epoxy resin sealant to the sealing groove 13 and then installing the fluororubber sealing ring, the cover plate 2 is installed on the sealing groove 13, thereby improving the sealing performance of the device and preventing external dust, moisture and other substances from entering the tube shell.

[0025] The implementation principle of the optical communication module packaging shell according to the present application is as follows: First, the module chip 4 is installed and pasted into the mounting groove 12 by the silver paste adhesive layer 9. At the same time, the solder joints 7 on both sides of the module chip 4 are connected to the pins 6 on both sides by gold wires 8 to facilitate the operation of the module chip 4. Then, the heat conduction plate assembly 11 is brought into contact with the module chip 4 and installed into the shell body 1. At the same time, the heat conduction plate assembly 11 is fixed by multiple mounting stickers 5, thereby improving the heat dissipation of the module chip 4, improving the stability and service life of the device. Then, epoxy resin sealant is applied to the sealing groove 13, and the cover plate 2 is connected to the sealing groove 13 by installing the fluororubber sealing ring, thereby completing the installation of the cover plate 2 and realizing the sealing operation of the device, effectively ensuring the stable transmission quality of optical signals.

[0026] The foregoing description, with reference to preferred embodiments, illustrates an exemplary implementation of an optical communication module packaging shell provided by this disclosure. However, those skilled in the art will understand that various modifications and alterations can be made to the above specific embodiments without departing from the spirit of this disclosure, and various combinations can be made to the various technical features and structures proposed in this disclosure without exceeding the protection scope of this disclosure, the protection scope of which is determined by the appended claims.

Claims

1. A housing for an optical communication module, comprising a housing body (1), characterized in that: The inner wall of the tube shell body (1) is fixedly connected to a substrate (10). The outer wall of the substrate (10) is provided with an installation groove (12). A module chip (4) is installed on the outer wall of the installation groove (12). Several solder points (7) are provided on both sides of the outer wall of the module chip (4). Several pins (6) are provided on both sides of the inner wall of the tube shell body (1). Several pins (6) correspond one-to-one with several solder points (7). A gold wire (8) is provided between the pins (6) and the solder points (7). The gold wire (8) is connected to the solder points (7) and the pins (6). A sealing groove (13) is provided on the outer wall of the tube shell body (1). A cover plate (2) is installed on the outer wall of the sealing groove (13).

2. The optical communication module packaging shell according to claim 1, characterized in that: Multiple mounting stickers (5) are provided on both sides of the substrate (10), and a heat-conducting plate assembly (11) for heat dissipation is provided above the module chip (4), and the heat-conducting plate assembly (11) is adapted to the multiple mounting stickers (5).

3. The optical communication module packaging shell according to claim 1, characterized in that: The outer wall of the mounting groove (12) is provided with a silver paste adhesive layer (9), and the mounting groove (12) is installed and fixed to the module chip (4) through the silver paste adhesive layer (9).

4. The optical communication module packaging shell according to claim 1, characterized in that: An epoxy resin sealant and a fluororubber sealing ring are provided between the cover plate (2) and the sealing groove (13) for sealing and fixing.

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