Lamp bead arrangement structure and display screen

Abstract

The utility model discloses a lamp bead arrangement structure and a display screen, and relates to the technical field of LED display, the lamp bead arrangement structure comprises a plurality of virtual pixel separation devices, the virtual pixel separation devices comprise a plurality of light-emitting wafers, different light-emitting wafers on the same virtual pixel separation device can form pixel point units, and the pixel point units are arranged on the same virtual pixel separation device. The different light-emitting wafers on the adjacent virtual pixel separation devices can also form the pixel point units. According to the MIP lamp bead, the multiple virtual pixel separation devices are arranged, the different light-emitting wafers on the same virtual pixel separation device can form the pixel point units, the different light-emitting wafers on the adjacent virtual pixel separation devices can also form the pixel point units, and therefore the problem that virtual pixel multiplexing cannot be achieved through the MIP lamp bead is solved.

Description

Technical Field

[0001] This utility model relates to the field of LED display technology, specifically to a lamp bead arrangement structure and a display screen. Background Technology

[0002] LED arrangement refers to the arrangement of red, green, and blue sub-pixels in an RGB screen. Different arrangements will affect the display effect and screen resolution.

[0003] For example, Chinese patent CN220106529U discloses a chip arrangement structure and LED chips. In this structure, one chip in the first chip group forms a pixel unit with two adjacent chips in the second chip group, or two adjacent chips in the first chip group forms a pixel unit with one chip in the second chip group. The three chips in each pixel unit emit different colors. By arranging RGB chips in a specific way, every three chips form a pixel unit, thereby forming multiple real and virtual pixel units. This achieves the effect of virtual pixel reuse, thus improving resolution. The structure is simple and the cost is low.

[0004] MIP (Micro-In-Package) LED chips are a new type of LED packaging technology, primarily used in the field of micro-pitch LED displays, suitable for small-size displays and micro-pitch LED screen markets. MIP technology adheres to a basic structure comprising a complete pixel in its packaging. MIP is a typical independent LED chip package, compatible with downstream surface-mount manufacturing processes, making it more flexible in testing, repair, and process tolerance.

[0005] However, some current MIP LEDs cannot form virtual pixel units and therefore cannot achieve the effect of virtual pixel reuse.

[0006] Therefore, there is an urgent need to develop a lamp bead arrangement structure and display screen to solve the problems in the existing technology. Utility Model Content

[0007] The purpose of this invention is to provide a lamp bead arrangement structure and a display screen, which solves the problem mentioned in the background art that MIP lamp beads cannot form virtual pixel units by setting up a number of virtual pixel separation devices.

[0008] To achieve the above objectives, this utility model provides the following technical solution:

[0009] A lamp bead arrangement structure includes several virtual pixel separation devices. The virtual pixel separation devices include a variety of light-emitting wafers. Different types of light-emitting wafers on the same virtual pixel separation device can form a pixel unit. Different types of light-emitting wafers on adjacent virtual pixel separation devices can also form the pixel unit.

[0010] Each type of light-emitting chip is equidistant from its adjacent different types of light-emitting chips. The adjacent different types of light-emitting chips include different types of light-emitting chips located on the same virtual pixel separation device, as well as different types of light-emitting chips located on different virtual pixel separation devices.

[0011] Furthermore, the shape and size of the pixel units are all the same.

[0012] Furthermore, the shape of the pixel unit is an equilateral triangle;

[0013] The center point distance between adjacent virtual pixel separation devices is twice the center point distance between adjacent pixel units.

[0014] Furthermore, the light-emitting chip includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit.

[0015] Furthermore, the upper surface of the virtual pixel separation device is shaped like an equilateral triangle;

[0016] The light-emitting chips include red LED chips, blue LED chips, and green LED chips.

[0017] Furthermore, the side length of the upper surface of the virtual pixel separation device satisfies:

[0018] ;

[0019] Where A is the side length of the upper surface of the virtual pixel separation device, and P is the distance between the center points of adjacent virtual pixel separation devices;

[0020] The distance between the center points of adjacent light-emitting wafers satisfies:

[0021] .

[0022] Furthermore, the virtual pixel separation device also includes:

[0023] The substrate on which the light-emitting chip is disposed is provided.

[0024] The pads are electrically connected to the light-emitting wafer.

[0025] Furthermore, at least one of the pads is located in the middle of the lower surface of the substrate; during die bonding, the die bonder's pins contact the pad.

[0026] Furthermore, the virtual pixel separation device also includes a transparent epoxy resin layer disposed on the substrate, the thickness of the transparent epoxy resin layer being less than 500 μm.

[0027] A display screen including the aforementioned LED arrangement structure.

[0028] Compared with the prior art, the beneficial effects of this utility model are: by setting up a number of virtual pixel separation devices, and enabling different types of light-emitting chips on the same virtual pixel separation device to form pixel units, and different types of light-emitting chips on adjacent virtual pixel separation devices to form the pixel units, the problem that MIP LEDs cannot achieve virtual pixel reuse is solved.

[0029] Furthermore, different types of light-emitting chips on the same virtual pixel separation device are arranged in a triangle so that a metal pad can be set in the middle position of the lower surface of the substrate, so that when the die bonding machine is applied, the pins of the die bonding machine will contact the pad, thus avoiding damage to the substrate.

[0030] Other features and advantages of this utility model will be disclosed in detail in the following specific embodiments and accompanying drawings. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0032] Figure 2 This is a schematic diagram of the structure of a pixel unit;

[0033] Figure 3 This is a schematic diagram of the upper surface structure of the virtual pixel separation device;

[0034] Figure 4 This is a schematic diagram of the lower surface structure of the virtual pixel separation device;

[0035] Figure 5 This is a schematic diagram of the circuit principle of the virtual pixel separation device.

[0036] The markings in the diagram are as follows: 11, substrate; 12, first light-emitting unit; 13, second light-emitting unit; 14, third light-emitting unit; 15, pad; 2, pixel unit. Detailed Implementation

[0037] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0038] A type of LED chip arrangement structure, such as Figure 1 As shown, the device includes several virtual pixel separation devices, and each virtual pixel separation device includes multiple light-emitting chips. Specifically, in this embodiment, one virtual pixel separation device includes three types of light-emitting chips: a first light-emitting unit 12, a second light-emitting unit 13, and a third light-emitting unit 14. The first light-emitting unit 12, the second light-emitting unit 13, and the third light-emitting unit 14 are LED chips of different colors. In this embodiment, the first light-emitting unit 12 is a red LED chip, the second light-emitting unit 13 is a blue LED chip, and the third light-emitting unit 14 is a green LED chip. Specifically, the color of the light-emitting chips can be set as needed.

[0039] Different types of light-emitting wafers on the same virtual pixel separator can form pixel units 2, and different types of light-emitting wafers on adjacent virtual pixel separators can also form pixel units 2. In this embodiment, each type of light-emitting wafer is equidistant from its adjacent different types of light-emitting wafers. The adjacent different types of light-emitting wafers include different types of light-emitting wafers located on the same virtual pixel separator, as well as different types of light-emitting wafers on different virtual pixel separators. Specifically, the distance can be the distance after considering the light-emitting wafers as points, or it can be the spacing between the center points of the light-emitting wafers.

[0040] Specifically, such as Figure 2 As shown, in clockwise order, a blue LED chip can form a pixel unit 2 with a green LED chip and a red LED chip on the same virtual pixel separator.

[0041] It can form a pixel unit 2 with the red LED chip on the same virtual pixel separator and the green LED chip on the second virtual pixel separator;

[0042] It can form a pixel unit 2 with the green LED chip on the second virtual pixel separator and the red LED chip on the third virtual pixel separator;

[0043] It can form a pixel unit 2 with the red LED chip on the third virtual pixel separator and the green LED chip on the third virtual pixel separator;

[0044] It can form a pixel unit 2 with the green LED chip on the third virtual pixel separator and the red LED chip on the fourth virtual pixel separator;

[0045] It can form a pixel unit 2 with the red LED chip on the fourth virtual pixel separator and the green LED chip on the same virtual pixel separator.

[0046] In this configuration, all pixel units 2 have the same shape and size, and the distance between the center points of adjacent pixel units 2 is the same. The distance between adjacent virtual pixel separation devices is P, and the distance between the center points of adjacent pixel units 2 is P / 2.

[0047] Specifically, in this embodiment, the upper surface of the virtual pixel separator is an equilateral triangle, the lower surface of the virtual pixel separator is also an equilateral triangle, and the virtual pixel separator is a triangular prism. Optionally, the virtual pixel separator may have chamfers or rounded corners. In this embodiment, the upper surface of the virtual pixel separator is the surface on which the light-emitting wafer is disposed, and the lower surface of the virtual pixel separator is the side opposite to the upper surface.

[0048] like Figure 3 As shown, when the upper surface of the virtual pixel separator is equilateral triangle, the side length of the upper surface of the virtual pixel separator satisfies:

[0049] ;

[0050] Where A is the side length of the upper surface of the virtual pixel separation device, and P is the distance between the center points of adjacent virtual pixel separation devices;

[0051] The distance between the center points of adjacent light-emitting wafers satisfies:

[0052] ;

[0053] Wherein, B is the center-to-center distance between adjacent light-emitting wafers, and P is the center-to-center distance between adjacent virtual pixel separation devices.

[0054] In this embodiment, as Figure 4 As shown, the virtual pixel separation device further includes:

[0055] A substrate 11, the substrate 11 including an upper surface and a lower surface, wherein the light-emitting wafer is disposed on the upper surface of the substrate 11;

[0056] The substrate 11 is further provided with several pads 15, each of which is electrically connected to the light-emitting chip. The pads 15 are disposed on the lower surface, with at least one pad 15 located at the center of the lower surface.

[0057] In this embodiment, as Figure 4 and Figure 5As shown, a total of four pads 15 are provided, three of which correspond to three light-emitting chips, and the remaining pad 15 is located in the middle of the lower surface. The middle pad 15 is the positive input, and the three pads 15 corresponding to the light-emitting chips are the negative outputs.

[0058] The virtual pixel separation device further includes a transparent epoxy resin layer disposed on the substrate 11, the thickness of the transparent epoxy resin layer being less than 500 μm.

[0059] During die bonding, small LED chips need to be lifted by the die bonder's pins and then sucked up and fixed onto the display screen by a negative pressure nozzle. In ordinary LED chips, the bottom center is a substrate 11, made of resin or BT board. When the LED chip is lifted by the pins and the negative pressure nozzle presses down, the force on the center is high, making the substrate 11 prone to damage and affecting the chip's performance. The pads 15 are generally metal. This application addresses this by placing at least one pad 15 in the center of the lower surface, so that when the pins lift the chip, they contact the metal pad 15, which is harder than resin or BT and less prone to breakage.

[0060] Furthermore, the light-emitting wafers on the virtual pixel separation device of this application are arranged in a triangular pattern to facilitate the placement of the pad 15 in the middle position, which helps to simplify the processing technology.

[0061] A display screen including the aforementioned LED arrangement structure.

[0062] This utility model provides an LED bead arrangement structure and a display screen, which is simple in structure, easy to use, and highly reliable.

[0063] Although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A lamp bead arrangement structure, characterized in that, It includes several virtual pixel separation devices, each of which includes a variety of light-emitting wafers. Different types of light-emitting wafers on the same virtual pixel separation device can form pixel units, and different types of light-emitting wafers on adjacent virtual pixel separation devices can also form pixel units. The light-emitting wafers on the virtual pixel separation device are arranged in a triangular pattern.

2. The lamp bead arrangement structure according to claim 1, characterized in that, The pixel units are all identical in shape and size; each type of light-emitting chip is equidistant from its adjacent, different types of light-emitting chips.

3. The lamp bead arrangement structure according to claim 2, characterized in that, The shape of the pixel unit is an equilateral triangle; The center point distance between adjacent virtual pixel separation devices is twice the center point distance between adjacent pixel units.

4. The lamp bead arrangement structure according to any one of claims 1-3, characterized in that, The light-emitting chip includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit.

5. The LED bead arrangement structure according to claim 4, characterized in that, The upper surface of the virtual pixel separation device is shaped like an equilateral triangle; The light-emitting chips include red LED chips, blue LED chips, and green LED chips.

6. The lamp bead arrangement structure according to claim 4, characterized in that, The side length of the upper surface of the virtual pixel separation device satisfies: ； Where A is the side length of the upper surface of the virtual pixel separation device, and P is the distance between the center points of adjacent virtual pixel separation devices; The distance between the center points of adjacent light-emitting wafers satisfies: 。 7. The lamp bead arrangement structure according to any one of claims 1-3 or 5-6, characterized in that, The virtual pixel separation device also includes: The substrate on which the light-emitting chip is disposed is provided. The pads are electrically connected to the light-emitting wafer.

8. The lamp bead arrangement structure according to claim 7, characterized in that, At least one of the pads is located in the middle of the lower surface of the substrate; during die bonding, the die bonder pins contact the pad.

9. The lamp bead arrangement structure according to claim 7, characterized in that, The virtual pixel separation device further includes a transparent epoxy resin layer disposed on the substrate, the thickness of the transparent epoxy resin layer being less than 500 μm.

10. A display screen, characterized in that, Includes the lamp bead arrangement structure as described in any one of claims 1-9.

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