Display device and display

Abstract

The utility model relates to a display device and a display. The display device provided by the utility model comprises a bonding pad, at least one light-emitting chip, a solid-state clamping groove and packaging glue, the light-emitting chip is fixed on the board surface of the bonding pad through the solid-state clamping groove, and the packaging glue covers the board surface of the bonding pad where the light-emitting chip is located so as to complete packaging. According to the display device, the light-emitting chip is fixed through the solid-state clamping groove, and the display device has the advantages that deviation is not prone to occurring when the chip is installed, the requirement for machining precision is effectively lowered, and the product display effect is good.

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a display device and a display. Background Technology

[0002] With the continuous development of technology, through-hole displays, which are characterized by high energy consumption and narrow viewing angles, are gradually being replaced by surface-mount displays. Existing surface-mount displays consist of numerous LED beads arranged at a specific pixel pitch, with the light-emitting chips arranged in a straight line. Red, green, and blue chips at different positions emit light of varying brightness to achieve color mixing and thus produce the desired color. However, existing surface-mount displays require high manufacturing precision, and after prolonged use, they are prone to display defects, such as the appearance of dotted or patchy patterns, necessitating repair or even replacement of the display, causing inconvenience to users. Utility Model Content

[0003] Therefore, the purpose of this utility model is to provide a display device and a display.

[0004] A display device includes: pads, at least one light-emitting chip, a solid-state slot, and encapsulating adhesive; the light-emitting chip is fixed to the surface of the pads via the solid-state slot, and the encapsulating adhesive covers the surface of the pads containing the light-emitting chip to complete encapsulation.

[0005] The display device described in this utility model uses a solid-state slot to fix the light-emitting chip, which has the advantages of not easily causing misalignment during chip installation, effectively reducing the requirements for processing precision, and producing a good display effect.

[0006] Furthermore, the light-emitting chip includes a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip. Projected along the board surface direction perpendicular to the pad, each solid-state slot is a semi-enclosed structure with an opening at one end and is attached to the board surface of the pad. The red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip are inserted into the solid-state slot through the opening.

[0007] Through the above technical solution, the solid-state card slot semi-encloses the light-emitting chip, and the contact area is relatively increased, making the light-emitting chip more firmly fixed. This can prevent the light-emitting chip from shifting during bonding and fixing, which would result in poor display effect after packaging.

[0008] Furthermore, the solid-state card slot includes a first card slot, a second card slot, and a third card slot arranged sequentially in a straight line, and the red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip are respectively inserted into the first card slot, the second card slot, and the third card slot.

[0009] Furthermore, the first slot is a silver paste conductive component, while the second and third slots are adhesive paste insulating components.

[0010] With the above technical solution, the positive electrode of the commonly used red light-emitting chip is set on the front and the negative electrode is set on the bottom. The two electrodes of the green and blue light-emitting chips are both set on the front, which can adapt to the wiring requirements of different chips and avoid short circuits.

[0011] Furthermore, the display device also includes an anti-oxidation film, which covers the outer sides of the first slot, the second slot, and the third slot, and encapsulates the red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip within them, respectively.

[0012] Through the above technical solution, the anti-oxidation film isolates the first, second, and third card slots from the outside world, preventing the material from activating and reacting with the outside world during long-term use, which would affect the fixing effect of the light-emitting chip and cause the light-emitting chip to shift, thus affecting the display effect.

[0013] Furthermore, the pad protrudes with a plurality of insulating portions and divides the pad surface into mutually independent chip soldering areas, first bonding wire areas, second bonding wire areas, and third bonding wire areas; the red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip are fixed on the chip soldering areas, and their anodes and cathodes are electrically connected to the chip soldering areas, the first bonding wire areas, the second bonding wire areas, and the third bonding wire areas, respectively.

[0014] Through the above technical solution, the insulating part separates the chip welding area, the first bonding wire area, the second bonding wire area and the third bonding wire area, so as to avoid them contacting each other and causing short circuits. At the same time, it forms a physical barrier to prevent light crosstalk between different areas, thereby achieving a better display effect.

[0015] Furthermore, the first bonding area is a common anode area, connected to the anodes of the red, green, and blue light-emitting chips; the second bonding area is connected to the cathode of the green light-emitting chip; and the third bonding area is connected to the cathode of the blue light-emitting chip.

[0016] With the above technical solution, the positive and negative terminals of each chip are connected to the nearest bonding wire area, which reduces costs on the one hand and avoids short circuits caused by wires coming into contact with each other when the misaligned bridging is used on the other hand.

[0017] Furthermore, the display device also includes a reflective cup surrounding the pad surface, enclosing the light-emitting chip, the first bonding wire area, the second bonding wire area, the third bonding wire area, and the chip welding area, with the encapsulating adhesive filling the area enclosed by the reflective cup.

[0018] Through the above technical solution, the bowl-shaped structure formed by the reflective cups can concentrate light on the front, resulting in better contrast between light and dark.

[0019] Furthermore, the surfaces of the pads and the reflector cup are also provided with a blackening treatment layer.

[0020] The above technical solutions can improve the light emission contrast of the product, resulting in better display effects.

[0021] A display includes: a substrate and an array of a plurality of the aforementioned display devices on the substrate, wherein circuitry is laid on the substrate and each display device is electrically connected to its respective circuitry. Attached Figure Description

[0022] Figure 1 A front view of the display device provided by this utility model projected along the vertical direction;

[0023] Figure 2 A schematic diagram of the display device provided by this utility model before the light-emitting chip is installed;

[0024] Figure 3 A schematic diagram of the display device provided by this utility model after installing the light-emitting chip;

[0025] Figure 4 A schematic diagram illustrating the structural fit between the solder pad and the reflector cup provided by this utility model;

[0026] Figure 5 This is a schematic diagram of the solid-state card slot used to fix the light-emitting chip according to the present invention.

[0027] In the figure, 1 is the substrate; 2 is the display device; 21 is the pad; 211 is the first insulating part; 212 is the second insulating part; 213 is the chip bonding area; 214 is the first bonding wire area; 215 is the second bonding wire area; 216 is the third bonding wire area; 22 is the light-emitting chip; 221 is the red light-emitting chip; 222 is the green light-emitting chip; 223 is the blue light-emitting chip; 23 is the solid-state card slot; 231 is the first card slot; 232 is the second card slot; 233 is the third card slot; 24 is the anti-oxidation film; 25 is the encapsulating adhesive; and 26 is the reflector cup. Detailed Implementation

[0028] The applicant researched existing surface-mount displays and discovered that the reason for display defects after prolonged use is that the red, green, and blue LEDs are traditionally mounted to the soldering area using liquid adhesive. However, the blue LED emits short-wavelength, high-energy light, generating significant heat. Over time, this can activate surrounding materials and cause chemical reactions, reducing the adhesive's bonding strength and leading to misalignment of the red and / or blue and / or green LEDs, resulting in display problems such as misaligned content. Based on this, the applicant proposes a display device and monitor that uses solid-state slots to fix the LEDs. A cationic anti-oxidation film is used to cover the solid-state slots, isolating them from external environments and preventing reactions. Furthermore, the solid-state slots facilitate chip positioning and reduce the likelihood of chip misalignment, thus lowering the precision requirements for manufacturing processes.

[0029] To better understand and implement this invention, the following detailed description is provided in conjunction with the accompanying drawings.

[0030] Please refer to Figures 1 to 5 , Figure 1 A front view of the display device provided by this utility model projected along the vertical direction; Figure 2 A schematic diagram of the display device provided by this utility model before the light-emitting chip is installed; Figure 3 A schematic diagram of the display device provided by this utility model after installing the light-emitting chip; Figure 4 A schematic diagram illustrating the structural fit between the solder pad and the reflector cup provided by this utility model; Figure 5 This is a schematic diagram of the solid-state card slot used to fix the light-emitting chip according to the present invention.

[0031] This utility model provides a display, including a substrate 1 and a plurality of display devices 2 arrayed on the substrate 1.

[0032] The substrate 1 is provided with circuitry, and each display device 2 is electrically connected to its circuitry.

[0033] The display device 2 includes a pad 21, at least one light-emitting chip 22, a solid-state slot 23, an anti-oxidation film 24, and encapsulating adhesive 25.

[0034] Specifically, the pads 21 are disposed on the substrate 1. Depending on the processing method, the pads 21 can be embedded in the surface of the substrate 1, that is, the top surface of the pads 21 is flush with the surface of the substrate 1; or the pads 21 can be located on the surface of the substrate 1, that is, the top surface of the pads 21 is higher than the surface of the substrate 1. The pads 21 are provided with a plurality of insulating portions to divide them into multiple regions with different functions. In this embodiment, the pad 21 is provided with a first insulating portion 211 and a second insulating portion 212, projected along a direction perpendicular to the surface of the pad 21. One end of the first insulating portion 211 and the second insulating portion 212 are embedded in the pad 21, and the other end extends along a direction perpendicular to the surface of the pad 21, dividing the pad 21 into a chip bonding area 213 located in the middle and a first bonding area 214, a second bonding area 215, and a third bonding area 216 located at the upper left, lower right, and upper right corners, respectively. The first bonding area 214, the second bonding area 215, the third bonding area 216, and the chip bonding area 213 are connected to the cathode or anode of an external power supply as needed. The chip bonding area 213, the first bonding area 214, the second bonding area 215, and the third bonding area 216 are separated and independent by the first insulating portion 211 and the second insulating portion 212, which can avoid problems such as short circuits. At the same time, the first insulating portion 211 and the second insulating portion 212 form a physical barrier to prevent light crosstalk between different bonding areas, resulting in better display effects for the display device. Preferably, the height of the first insulating portion 211 and the second insulating portion 212 is 0.04-0.06 mm.

[0035] The light-emitting chip 22 is mounted on the chip bonding area 213 via the solid-state slot 23 using bonding or other methods. The first bonding area 214, the second bonding area 215, and the third bonding area 216 serve as support electrodes and are connected to the light-emitting chip 22 via wires. To meet the space requirements for fixing the light-emitting chip 22, the area ratio of the chip bonding area 213 on the pad 21 is greater than the area ratio of the first bonding area 214, the second bonding area 215, or the third bonding area 216 on the pad 21. The light-emitting chip 22 includes a red light-emitting chip 221, a green light-emitting chip 222, and a blue light-emitting chip 223.

[0036] Projected along a direction perpendicular to the surface of the pad 21, the solid-state slot 23 is a semi-enclosed structure with an opening at one end, including a first slot 231, a second slot 232, and a third slot 233. The openings of the first slot 231, the second slot 232, and the third slot 233 face the same direction and are arranged in a straight line. The red light-emitting chip 221, the green light-emitting chip 222, and the blue light-emitting chip 223 are respectively inserted into the first slot 231, the second slot 232, and the third slot 233. Compared to directly adhering the light-emitting chip 22 to the board surface of the chip welding area 213 using liquid adhesive, the solid-state slot 23 is pre-positioned on the board surface of the chip welding area 213, and then the light-emitting chip 22 is installed into the solid-state slot 23. This structure allows the solid-state slot 23 to semi-enclose the light-emitting chip 22, increasing the contact area and making the fixation of the light-emitting chip 22 more secure. This can prevent the light-emitting chip 22 from shifting during the bonding and fixing process, which would result in poor display effect after packaging.

[0037] Furthermore, in this embodiment, the side facing away from the pad 21 is considered the front surface, and the side facing the pad 21 is considered the bottom surface. The red light-emitting chip 221 adopts an opposite polarity structure with the anode on the front surface and the cathode on the bottom surface. The green light-emitting chip 222 and the blue light-emitting chip 223 adopt a same polarity structure with both the anode and cathode on the front surface. The first slot 231 is a conductive component made of silver paste, and the second slot 232 and the third slot 233 are insulating components made of adhesive paste. The first bonding area 214 serves as a common anode area and is connected to the anode of an external power supply. The anodes of the red light-emitting chip 221, the green light-emitting chip 222, and the blue light-emitting chip 223 are electrically connected to the first bonding area 214 via wires. The first slot 231 is electrically connected to the chip soldering area 213. The chip soldering area 213 is electrically connected to the pins located on the side of the pad 21 facing away from the chip soldering area 213 and connected to the cathode of the external power supply. This enables the cathode of the red light-emitting chip 221 to be directly electrically connected to the cathode of the external power supply through the first slot 231. The cathodes of the green light-emitting chip 222 and the blue light-emitting chip 223 are respectively electrically connected to the second bonding area 215 and the third bonding area 216, which are respectively connected to the cathode of the external power supply, through wires.

[0038] Furthermore, any one of the red light-emitting chip 221, the green light-emitting chip 222, or the blue light-emitting chip 223 can be selected as having an anode on the front and a cathode on the bottom, with opposite polarity. The remaining chips can be selected as having an anode and cathode on the front, with the same polarity. Correspondingly, the slots for chips with opposite polarity are silver paste conductive parts, and the slots for chips with same polarity are adhesive insulating parts, but this is not a limitation.

[0039] Preferably, the first bonding area 214 is disposed above the red light-emitting chip 221, the green light-emitting chip 222, or the blue light-emitting chip 223, and the second bonding area 215 and the third bonding area 216 are located on the same side of the green light-emitting chip 222 or the blue light-emitting chip 223. On the one hand, each chip is bridged with the nearest bonding area, which can reduce costs; on the other hand, it avoids short circuits caused by wires coming into contact with each other when misaligned bridging is used.

[0040] The anti-oxidation film 24 covers the outer sides of the first slot 231, the second slot 232, and the third slot 233, respectively, enclosing the first slot 231, the second slot 232, and the third slot 233 along with the red light-emitting chip 221, the green light-emitting chip 222, or the blue light-emitting chip 223. This isolates the red light-emitting chip 221, the green light-emitting chip 222, or the blue light-emitting chip 223 from the outside environment, preventing chemical reactions when the blue light-emitting chip 223 emits light from affecting the fixation of the red light-emitting chip 221, the green light-emitting chip 222, and the blue light-emitting chip 223, thus avoiding problems such as misalignment. This ensures consistent display performance for display devices with different operating times. Preferably, the anti-oxidation film 24 is a cationic film with good barrier properties.

[0041] The encapsulating adhesive 25 fills and covers the pad 21, encapsulating the solid-state slot 23 and the light-emitting chip 22 within it, thus isolating the light-emitting chip 22 from the outside environment and preventing contact with external moisture to avoid short circuits. The light-emitting chip 22 emits light through the top of the encapsulating adhesive 25. Preferably, the encapsulating adhesive 25 is a cationic encapsulating adhesive such as a cationic epoxy adhesive, thereby avoiding a repulsive reaction with the anti-oxidation film 24.

[0042] Preferably, the display device 2 further includes a reflector cup 26, which is disposed on the surface of the pad 21 away from the substrate 1, forming a bowl shape with the pad 21. The light-emitting chip 22, the first bonding wire area 214, the second bonding wire area 215, the third bonding wire area 216, and the chip welding area 213 are surrounded by the reflector cup 26. The encapsulating adhesive 25 fills the area surrounded by the reflector cup 26. The structure surrounding the reflector cup 26 can prevent light from scattering in all directions, concentrate the light on the front, ensure that the light-emitting surface is unique, and thus improve the resolution of the display made therefrom, and its brightness contrast is better.

[0043] Preferably, the substrate 1, the pads 21, and the reflector cup 26 are further provided with a blackening treatment layer (not shown in the figure) to better improve the light emission contrast of the product and make the display effect better. Specifically, the blackening treatment layer is formed on the surfaces of the substrate 1 and the reflector cup 26 by printing black ink, and the blackening treatment layer is formed on the surface of the pads 21 by fully reacting nickel and silver elements.

[0044] Compared with the prior art, the display device provided by this utility model has the following advantages:

[0045] (1) Fix the light-emitting chip 22 through the solid card slot 23 to prevent the light-emitting chip 22 from shifting during fixing and affecting the display effect.

[0046] (2) The nickel and silver elements react fully on the pad 21 to form a blackening treatment layer that completely covers the surface of the pad 21. This avoids the problem that when the sulfur-containing encapsulating adhesive 25 reacts with the pad 21 to produce a blackening treatment layer, the reaction is incomplete, resulting in an incomplete blackening treatment layer that affects the display effect.

[0047] (3) The surface of the solid card slot 23 is covered with an anti-oxidation film 24 to isolate the solid card slot 23 from the outside world and prevent the silver paste and adhesive from reacting with the outside world and affecting the display effect.

[0048] The embodiments described above are merely examples of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and this utility model also intends to include these modifications and variations.

Claims

1. A display device, characterized in that, include: The components include a pad (21), at least one light-emitting chip (22), a solid-state slot (23), and encapsulating adhesive (25). The light-emitting chip (22) is fixed to the surface of the pad (21) via the solid-state slot (23), and the encapsulating adhesive (25) covers the surface of the pad (21) where the light-emitting chip (22) is located to complete the encapsulation.

2. The display device according to claim 1, characterized in that: The light-emitting chip (22) includes a red light-emitting chip (221), a green light-emitting chip (222), and a blue light-emitting chip (223). Projected along a direction perpendicular to the surface of the pad (21), each solid-state slot (23) is a semi-enclosed structure with an opening at one end and is attached to the surface of the pad (21). The red light-emitting chip (221), the green light-emitting chip (222), and the blue light-emitting chip (223) are inserted into the solid-state slot (23) through the opening.

3. The display device according to claim 2, characterized in that: The solid card slot (23) includes a first card slot (231), a second card slot (232) and a third card slot (233) arranged in a straight line in sequence. The red light-emitting chip (221), the green light-emitting chip (222) and the blue light-emitting chip (223) are respectively inserted into the first card slot (231), the second card slot (232) and the third card slot (233).

4. The display device according to claim 3, characterized in that: The first slot (231) is a silver paste conductive component, and the second slot (232) and the third slot (233) are adhesive insulating components.

5. The display device according to claim 3, characterized in that: It also includes an anti-oxidation film (24), which covers the outside of the first card slot (231), the second card slot (232) and the third card slot (233) respectively, and encapsulates the red light-emitting chip (221), the green light-emitting chip (222) and the blue light-emitting chip (223) inside respectively.

6. The display device according to claim 3, characterized in that: The pad (21) is provided with a plurality of insulating parts, and the surface of the pad (21) is divided into an independent chip bonding area (213), a first bonding area (214), a second bonding area (215) and a third bonding area (216); the red light-emitting chip (221), the green light-emitting chip (222), and the blue light-emitting chip (223) are fixed on the chip bonding area (213), and their anodes and cathodes are electrically connected to the chip bonding area (213), the first bonding area (214), the second bonding area (215) and the third bonding area (216) respectively.

7. The display device according to claim 6, characterized in that: The first bonding area (214) is a common anode area, which is connected to the anode of the red light-emitting chip (221), the green light-emitting chip (222) and the blue light-emitting chip (223); the second bonding area (215) is connected to the cathode of the green light-emitting chip (222); and the third bonding area (216) is connected to the cathode of the blue light-emitting chip (223).

8. The display device according to claim 6, characterized in that: It also includes a reflective cup (26) that surrounds the surface of the pad (21) and encloses the light-emitting chip (22), the first bonding area (214), the second bonding area (215), the third bonding area (216), and the chip welding area (213). The encapsulating adhesive (25) fills the area enclosed by the reflective cup (26).

9. The display device according to claim 8, characterized in that: The surfaces of the pad (21) and the reflector cup (26) are also provided with a blackening treatment layer.

10. A display, characterized in that, include: The substrate (1) and the array of several display devices (2) according to any one of claims 1-9 are on the substrate (1), wherein circuits are laid on the substrate (1) and each display device (2) is electrically connected to its circuits.

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